onsemi-MJD122-1G

Part #onsemi-MJD122-1G
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onsemi-MJD122-1G
MJD122, NJVMJD122  
(NPN), MJD127,  
NJVMJD127 (PNP)  
Complementary Darlington  
Power
T
r
ansistor  
DPAK For Surface Mount Applications  
SILICON  
POWER TRANSISTOR  
8 AMPERES  
Designed for general purpose amplifier and low speed switching  
applications.  
100 VOLTS, 20 WATTS  
Features  
•
Lead Formed for Surface Mount Applications in Plastic Sleeves  
•
Surface Mount Replacements for 2N6040−2N6045 Series,  
TIP120−TIP122 Series, and TIP125−TIP127 Series  
DPAK  
CASE 369C  
STYLE 1  
•
Monolithic Construction With Built−in Base−Emitter Shunt Resistors  
•
High DC Current Gain: h
 
= 2500 (Typ) @ I
 
= 4.0 Adc  
FE  
C
•
Epoxy Meets UL 94 V−0 @ 0.125 in  
COLLECTOR 2, 4  
•
ESD Ratings:  
♦
Human Body Model, 3B > 8000 V  
♦
Machine Model, C > 400 V  
BASE  
1
•
NJV Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AEC−Q101  
Qualified and PPAP Capable  
EMITTER 3  
•
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
MARKING DIAGRAM  
AYWW  
J12xG  
A
Y
= Assembly Location  
=
Y
e
ar  
WW =
 
Work Week  
x
= 2 or 7  
G
= Pb−Free Package  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on

©
Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
September, 2016 − Rev. 15  
MJD122/D  

MJD122, NJVMJD122
 
(NPN), MJD127,
 
NJVMJD127 (PNP)  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
100  
100  
5
Unit  
Vdc  
Vdc  
Vdc  
Adc  
Collector−Emitter Voltage  
Collector−Base Voltage  
Emitter−Base Voltage  
V
CEO  
V
CB  
EB  
V
Collector Current  
Continuous  
Peak  
I
C
8
16  
Base Current  
I
B
120  
mAdc  
T
o
tal Power Dissipation  
P
D
W
W/
°
C  
@ T
 
= 25
°
C  
20  
0.16  
C
Derate above 25
°
C  
P
D
@ T
 
= 25
°
C  
1.75  
0.014  
W
W/
°
C  
A
Derate above 25
°
C  
Operating and Storage Junction
T
e
mperature Range  
T , T  
−65 to +150  
°
C  
J
stg  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
THERMAL CHARACTERISTICS  
Characteristic  
Thermal Resistance, Junction−to−Case  
Symbol  
Max  
6.25  
71.4  
Unit  
°
C/W  
°
C/W  
R
q
JC  
JA  
R
q
1. These
 
ratings are applicable when surface mounted on the minimum pad sizes recommended.  
2
 

MJD122, NJVMJD122
 
(NPN), MJD127,
 
NJVMJD127 (PNP)  
ELECTRICAL CHARACTERISTICS
(T =
 
25
_
C unless otherwise noted)  
C
Characteristic  
Symbol  
Min  
Max  
Unit  
OFF CHARACTERISTICS  
Collector−Emitter Sustaining Voltage  
V
Vdc  
m
Adc  
m
Adc  
mAdc  
CEO(sus)  
(I =
 
30 mAdc, I
 
= 0)  
100  
−
−
10  
10  
2
C
B
Collector Cutoff Current  
(V =
 
50 Vdc, I
 
= 0)  
I
I
CEO  
CBO  
CE  
B
Collector Cutoff Current  
(V =
 
100 Vdc, I
 
= 0)  
−
CB  
E
Emitter Cutoff Current  
(V =
 
5 Vdc, I
 
= 0)  
I
EBO  
−
BE  
C
ON CHARACTERISTICS  
DC Current Gain  
h
FE  
−
(I =
 
4 Adc, V
 
= 4 Vdc)  
C
CE  
1000  
100  
12,000  
−
(I =
 
8 Adc, V
 
= 4 Vdc)  
C
CE  
Collector−Emitter Saturation Voltage  
(I =
 
4 Adc, I
 
= 16 mAdc)  
V
V
Vdc  
CE(sat)  
C
B
−
−
2
4
(I =
 
8 Adc, I
 
= 80 mAdc)  
C
B
Base−Emitter Saturation V

(I =
 
8 Adc, I
 
= 80 mAdc)  
Vdc  
Vdc  
BE(sat)  
−
−
4.5  
2.8  
C
B
Base−Emitter On Voltage  
(I =
 
4 Adc, V
 
= 4 Vdc)  
V
BE(on)  
C
CE  
DYNAMIC CHARACTERISTICS  
Current−Gain−Bandwidth Product  
|h |  
MHz  
pF  
fe  
(I =
 
3 Adc, V
 
= 4 Vdc, f = 1 MHz)  
4
−
C
CE  
Output Capacitance  
(V =
 
10 Vdc, I
 
= 0, f = 0.1 MHz)  
C
ob  
CB  
E
MJD127, NJVMJD127  
MJD122, NJVMJD122  
−
−
300  
200  
Small−Signal Current Gain  
h
fe  
−
(I =
 
3 Adc, V
 
= 4 Vdc, f = 1 kHz)  
300  
−
C
CE  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
2. Pulse
 
T
e
st: Pulse Width
v
300
m
s, Duty Cycle
v
2%.  
T
A
T
C
2.5 25  
2
20  
T
C
1.5 15  
T
A
1
0.5  
0
10  
5
SURFACE  
MOUNT  
0
25  
50  
75  
100  
125  
150  
T, TEMPERATURE (
°
C)  
Figure 1. Power Derating  
3
 

MJD122, NJVMJD122
 
(NPN), MJD127,
 
NJVMJD127 (PNP)  
TYPICAL ELECTRICAL CHARACTERISTICS  
PNP MJD127  
NPN MJD122  
20,000  
20,000  
V
CE  
= 4 V  
V
CE  
= 4 V  
10,000  
7000  
10,000  
5000  
5000  
T =
 
150
°
C  
J
T =
 
150
°
C  
J
3000  
2000  
3000  
2000  
25
°
C  
25
°
C  
1000  
1000  
500  
700  
500  
-ꢀ55
°
C  
-ꢀ55
°
C  
300  
200  
300  
200  
0.1  
0.2 0.3  
0.5 0.7  
1
2
3
5
7
10  
0.1  
0.2 0.3  
0.5 0.7  
1
2
3
5
7
10  
I ,
 
COLLECTOR CURRENT (AMP)  
C
I ,
 
COLLECTOR CURRENT (AMP)  
C
Figure 2. DC Current Gain  
3
2.6  
2.2  
1.8  
3
T =
 
25
°
C  
J
T =
 
25
°
C  
J
2.6  
2.2  
1.8  
I
C
= 2 A  
4 A  
6 A  
I
C
= 2 A  
4 A  
6 A  
1.4  
1
1.4  
1
0.3  
0.5 0.7  
1
2
3
5
7
10  
20 30  
0.3  
0.5 0.7  
1
2
3
5
7
10  
20 30  
I ,
 
BASE CURRENT (mA)  
B
I ,
 
BASE CURRENT (mA)  
B
Figure 3. Collector Saturation Region  
3
2.5  
2
3
T =
 
25
°
C  
J
T =
 
25
°
C  
J
2.5  
2
V
V
@ I
 
/I =
 
250  
C B  
BE(sat)  
1.5  
V
@ V
 
= 4 V  
CE  
1.5  
BE  
V
@ V
 
= 4 V  
CE  
BE  
V
@ I
 
/I =
 
250  
C B  
BE(sat)  
1
1
@ I
 
/I =
 
250  
C B  
CE(sat)  
V
@ I
 
/I =
 
250  
C B  
CE(sat)  
0.5  
0.1  
0.5  
0.1  
0.2 0.3  
0.5 0.7  
1
2
3
5
7
10  
0.2 0.3  
0.5 0.7  
1
2
3
5
7
10  
I ,
 
COLLECTOR CURRENT (AMP)  
C
I ,
 
COLLECTOR CURRENT (AMP)  
C
Figure 4. “On” Voltages  
4

MJD122, NJVMJD122
 
(NPN), MJD127,
 
NJVMJD127 (PNP)  
TYPICAL ELECTRICAL CHARACTERISTICS  
NPN MJD122  
PNP MJD127  
+ꢀ5  
+ꢀ4  
+ꢀ3  
+ꢀ2  
+ꢀ5  
+ꢀ4  
+ꢀ3  
+ꢀ2  
+ꢀ1  
0
*I /I
 
≤
h  
*I /I
 
≤
h  
C B  
FE/3  
C B  
FE/3  
25
°
C to 150
°
C  
-ꢀ55
°
C to 25
°
C  
+ꢀ1  
0
25
°
C to 150
°
C  
*
q
for V  
VC CE(sat)  
-ꢀ1  
-ꢀ1  
q
for V  
CE(sat)  
VC  
-ꢀ2  
-ꢀ3  
-ꢀ2  
-ꢀ3  
-ꢀ55
°
C to 25
°
C  
25
°
C to 150
°
C  
25
°
C to 150
°
C  
q
for V  
BE  
-ꢀ55
°
C to 25
°
C  
VB  
q
for V  
VB  
BE  
-ꢀ55
°
C to 25
°
C  
-ꢀ4  
-ꢀ5  
-ꢀ4  
-ꢀ5  
0.1  
0.2 0.3  
0.5 0.7  
1
2
3
5
7
10  
0.1  
0.2 0.3  
0.5  
1
2
3
5
7
10  
I ,
 
COLLECTOR CURRENT (AMP)  
C
I ,
 
COLLECTOR CURRENT (AMP)  
C
Figure 5. Temperature Coefficients  
5
5
10  
10  
REVERSE  
FORWARD  
REVERSE  
FORWARD  
4
4
3
2
1
10  
10  
10  
10  
10  
V
= 30 V  
V
= 30 V  
3
2
1
CE  
CE  
10  
10  
10  
10  
T =
 
150
°
C  
J
T =
 
150
°
C  
J
100
°
C  
25
°
C  
0
100
°
C  
25
°
C  
0
10  
-1  
-1  
10  
10  
-ꢀ0.6 -ꢀ0.4 -ꢀ0.2  
V
0
+ꢀ0.2 +ꢀ0.4
 
+ꢀ0.6 +ꢀ0.8
 
+ꢀ1 +ꢀ1.2
 
+ꢀ1.4  
+ꢀ0.6 +ꢀ0.4 +ꢀ0.2  
V
0
-ꢀ0.2 -ꢀ0.4 -ꢀ0.6 -ꢀ0.8
 
-ꢀ1 -ꢀ1.2
 
-ꢀ1.4  
, BASE-EMITTER VOLTAGE (VOLTS)  
, BASE-EMITTER VOLTAGE (VOLTS)  
BE  
BE  
Figure 6. Collector Cut−Off Region  
10,000  
5000  
300  
200  
T =
 
25
°
C  
J
3000  
2000  
1000  
C
ob  
500  
T
= 25
°
C  
= 4 Vdc  
CE  
C
100  
70  
300  
200  
V
I
C
= 3 Adc  
100  
C
5
ib  
50  
30  
20  
50  
PNP  
NPN  
PNP  
NPN  
30  
10  
0.1 0.2  
0.5  
1
2
10  
20  
50 100  
1
2
5
10  
20  
50 100
 
200  
500 1000  
V ,
 
REVERSE VOLTAGE (VOLTS)  
R
f, FREQUENCY (kHz)  
Figure 8. Capacitance  
Figure 7. Small−Signal Current Gain  
5

MJD122, NJVMJD122
 
(NPN), MJD127,
 
NJVMJD127 (PNP)  
5
PNP  
NPN  
t
s
R
& R
 
VARIED TO OBTAIN DESIRED CURRENT LEVELS  
C
ꢃD ,
 
MUST BE FAST RECOVERY TYPE, e.g.:  
V
CC  
-ꢀ30 V  
B
3
2
1
ꢃꢃ1N5825 USED ABOVE I
 
≈
100 mA  
B
ꢃꢃMSD6100 USED BELOW I
 
≈
100 mA  
B
R
t
f
C
SCOPE  
1
TUT  
0.7  
0.5  
V
2
R
B
APPROX  
+ꢀ8 V  
0.3  
0.2  
≈
8 k
 
≈
120  
D
51  
1
0
t
r
V
= 30 V  
I /I
 
= 250  
V
1
CC  
APPROX  
-12 V  
C B  
+ 4 V  
0.1  
0.07  
0.05  
I
= I  
B1 B2  
25
m
s  
t @
 
V  
d
= 0 V  
BE(off)  
T =
 
25
°
C  
J
FOR t
 
AND t , D
 
IS DISCONNECTED  
1
d
AND V
 
= 0  
r
t , t
 
≤
10 ns  
r
f
DUTY CYCLE = 1%  
2
0.1  
0.3  
0.5 0.7  
1
2
3
5
7
10  
0.2  
FOR NPN TEST CIRCUIT REVERSE ALL POLARITIES.  
I ,
 
COLLECTOR CURRENT (AMP)  
C
Figure 9. Switching Times Test Circuit  
Figure 10. Switching Times  
1
0.7  
0.5  
D = 0.5  
0.2  
0.3  
0.2  
0.1  
0.05  
P
(pk)  
R
R
= r(t) R  
q
JC  
q
q
JC(t)  
0.1  
0.07  
0.05  
= 6.25
°
C/W  
JC  
D CURVES APPLY FOR POWER  
PULSE TRAIN SHOWN  
READ TIME AT t  
0.01  
t
1
t
1
2
0.03  
0.02  
SINGLE PULSE  
0.02 0.03
 
0.05  
T
– T
 
= P
 
q  
C (pk)
 
JC(t)  
J(pk)  
DUTY CYCLE, D = t
 
/t  
1 2  
0.01  
0.01  
0.1  
0.2 0.3
 
0.5  
1
2
3
5
10  
20 30  
50  
100  
200 300
 
500  
1000  
t, TIME OR PULSE WIDTH (ms)  
Figure 11. Thermal Response  
20  
15  
10  
There are two limitations on the power handling ability of  
a transistor: average junction temperature and second  
500ꢂ
m  
σ
100ꢂ
m  
σ
breakdown. Safe operating area curves indicate I
 
− V  
C
CE  
5
limits of the transistor that must be observed for reliable  
operation; i.e., the transistor must not be subjected to greater  
dissipation than the curves indicate.  
3
2
1ꢂms  
T =
 
150
°
C  
J
1
5ꢂms  
variable depending on conditions. Second breakdown pulse  
limits are valid for duty cycles to 10% provided T  
= 150
_
C; T
 
is  
J(pk)  
C
0.5  
0.3  
0.2  
BONDING WIRE LIMIT  
THERMAL LIMIT  
J(pk)  
dc  
T
= 25
°
C (SINGLE PULSE)  
SECOND BREAKDOWN LIMIT  
0.1  
< 150
_
C.  
T
may be calculated from the data in  
C
J(pk)  
Figure

. At high case temperatures, thermal limitations  
will reduce the power that can be handled to values less than  
the limitations imposed by second breakdown.  
0.05  
0.03  
0.02  
CURVES APPLY BELOW RATED V  
CEO  
1
2
3
5
7
10  
20 30  
50 70
 
100  
V
CE  
, COLLECTOR-EMITTER VOLTAGE (VOLTS)  
Figure 12. Maximum Forward Bias  
Safe Operating rea  
6
 

MJD122, NJVMJD122
 
(NPN), MJD127,
 
NJVMJD127 (PNP)  
COLLECTOR  
COLLECTOR  
PNP  
NPN  
BASE  
BASE  
≈
8 k  
≈
120  
≈
8 k  
≈
120  
EMITTER  
EMITTER  
Figure 13. Darlington Schematic  
ORDERING INFORMATION  
†
Device  
Package Type  
Shipping  
MJD122G  
DPAK  
(Pb−Free)  
75 Units / Rail  
2,500 /
T
a
pe & Reel  
2,500 /
T
a
pe & Reel  
75 Units / Rail  
MJD122T4G  
DPAK  
(Pb−Free)  
NJVMJD122T4G*  
MJD127G  
DPAK  
(Pb−Free)  
DPAK  
(Pb−Free)  
MJD127T4G  
DPAK  
(Pb−Free)  
2,500 /
T
a
pe & Reel  
2,500 /
T
a
pe & Reel  
NJVMJD127T4G*  
DPAK  
(Pb−Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our
T
a
pe and Reel Packaging  
Specifications Brochure, BRD8011/D.  
*NJV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP  
Capable  
7

MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
DPAK (SINGLE GAUGE)  
CASE 369C  
4
ISSUE F  
2
1
DATE 21 JUL 2015  
3
SCALE 1:1  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ASME  
Y14.5M, 1994.  
2. CONTROLLING DIMENSION: INCHES.  
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-  
MENSIONS b3, L3 and Z.  
A
D
E
C
A
b3  
B
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH, PROTRUSIONS, OR BURRS. MOLD  
FLASH, PROTRUSIONS, OR GATE BURRS SHALL  
NOT EXCEED 0.006 INCHES PER SIDE.  
5. DIMENSIONS D AND E ARE DETERMINED AT THE  
OUTERMOST EXTREMES OF THE PLASTIC BOD
Y
.  
6. DATUMS A AND B ARE DETERMINED AT DATUM  
PLANE H.  
c2  
4
2
L3  
Z
DETAIL A  
H
1
3
7. OPTIONAL MOLD FEATURE.  
INCHES  
DIM MIN
 
MAX  
0.086 0.094  
A1
0.000 0.005  
0.025 0.035  
b2
0.028 0.045  
b3
0.180 0.215  
MILLIMETERS  
L4  
b2  
e
NOTE 7  
MIN  
2.18  
0.00  
0.63  
0.72  
4.57  
0.46  
0.46  
5.97  
6.35  
MAX  
2.38  
0.13  
0.89  
1.14  
5.46  
0.61  
0.61  
6.22  
6.73  
c
BOTTOM VIEW  
A
SIDE VIEW  
b
b
M
0.005 (0.13)  
C
TOP VIEW  
c
0.018 0.024  
c2
0.018 0.024  
Z
Z
D
E
e
0.235 0.245  
0.250 0.265  
0.090 BSC  
H
2.29 BSC  
9.40 10.41  
1.40 1.78  
2.90 REF  
0.51 BSC  
0.89 1.27  
GAUGE  
SEATING  
PLANE  
H
L
L1  
L2  
0.370 0.410  
0.055 0.070  
0.114 REF  
L2  
PLANE  
C
0.020 BSC  
L3
0.035 0.050  
L
BOTTOM VIEW  
A1  
L4  
Z
−−−
0.040  
0.155
−−−  
−−−  
3.93  
1.01  
−−−  
L1  
ALTERNATE  
CONSTRUCTIONS  
DETAIL A  
ROTATED 9
0
5
CW  
GENERIC  
MARKING DIAGRAM*  
STYLE 1:  
PIN 1.
 
BASE  
STYLE 2:  
PIN 1.
 
GATE  
2. DRAIN  
STYLE 3:  
PIN 1.
 
ANODE  
STYLE 4:  
STYLE 5:  
PIN 1.
 
GATE  
PIN 1.
 
CATHODE  
2. ANODE  
2. COLLECTOR  
2. CATHODE  
3. ANODE  
4. CATHODE  
2. ANODE  
3. CATHODE  
4. ANODE  
3. EMITTER  
3. SOURCE  
4. DRAIN  
3. GATE  
XXXXXXG  
ALYWW  
AYWW  
XXX  
4. COLLECTOR  
4. ANODE  
STYLE 6:  
PIN 1.
 
MT1  
2. MT2  
STYLE 7:  
STYLE 8:  
PIN 1.
 
N/C  
STYLE 9:  
PIN 1.
 
ANODE  
2. CATHODE  
STYLE 10:  
PIN 1.
 
CATHODE  
2. ANODE  
XXXXXG  
PIN 1.
 
GATE  
2. COLLECTOR  
2. CATHODE  
3. GATE  
4. MT2  
3. EMITTER  
3. ANODE  
4. CATHODE  
3. RESISTOR
 
ADJUST  
4. CATHODE  
3. CATHODE  
4. ANODE  
4. COLLECTOR  
IC  
Discrete  
SOLDERING FOOTPRINT*  
XXXXXX =
 
Device Code  
A
L
Y
WW  
G
= Assembly Location  
= Wafer Lot  
=
Y
e
ar  
= Work Week  
= Pb
−
Free Package  
6.20  
0.244  
3.00  
0.118  
2.58  
0.102  
5.80  
0.228  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
Pb
−
Free indicator, “G” or microdot “
G
”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
1.60  
0.063  
6.17  
0.243  
mm  
inches  
ǒ
Ǔ
SCALE 3:1  
*For additional information on our Pb
−
Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting
T
e
chniques Reference Manual, SOLDERRM/D.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions
 
are uncontrolled
 
except when stamped
 
“CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON10527D  
DPAK (SINGLE GAUGE)  
PAGE 1 OF 1  
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