onsemi-MMBFJ309LT1G
| Part # | onsemi-MMBFJ309LT1G |
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MMBFJ309L, MMBFJ310L,
SMMBFJ309L, SMMBFJ310L
JFET – VHF/UHF Amplifier
Transistor
N
−
Channel
Features
2 SOURCE
•
Drain and Source are Interchangeable
•
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC
−
Q101 Qualified and
PPAP Capable
3
GATE
•
These Devices are Pb
−
Free, Halogen Free/BFR Free and are RoHS
1 DRAIN
Compliant
MAXIMUM RATINGS
3
Rating
Drain
−
Source Voltage
Symbol
Value
25
Unit
Vdc
SOT
−
23 (TO
−
236)
CASE 318
V
DS
1
STYLE 10
2
Gate
−
Source Voltage
V
GS
25
Vdc
Gate Current
I
G
10
mAdc
THERMAL CHARACTERISTICS
MARKING DIAGRAM
Characteristic
Symbol
Max
Unit
T
o
tal Device Dissipation FR
−
5 Board,
P
D
225
1.8
mW
6x M
G
A
Derate above 25
°
C
mW/
°
C
G
1
Thermal Resistance, Junction
−
to
−
Ambient
Junction and Storage
T
e
mperature
R
556
°
C/W
°
C
q
JA
T , T
−
55 to +150
J
stg
6x =
Device Code
x = U for MMBFJ309L, SMMBFJ309L
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR
−
5 = 1.0 x 0.75 x 0.062 in.
x = T for MMBFJ310L, SMMBFJ310L
= Date Code*
= Pb
−
Free Package
M
G
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
†
Device
Package
Shipping
MMBFJ309
L
T
1G,
SMMBFJ309
L
T
1G (Pb
−
Free)
SOT
−
23
3,000 /
T
a
pe &
Reel
MMBFJ310
L
T
1G, SOT
−
23
SMMBFJ310
L
T
1G (Pb
−
Free)
3,000 /
T
a
pe &
Reel
SMMBFJ310
L
T
3G SOT
−
23
(Pb
−
Free)
10,000 /
T
a
pe &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our
T
a
pe and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
October, 2013
−
Rev. 7
MMBFJ309
L
T
1/D
MMBFJ309L, MMBFJ310L, SMMBFJ309L, SMMBFJ310L
ELECTRICAL CHARACTERISTICS
(T =
25
°
C unless otherwise noted)
A
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Gate
−
Source Breakdown Voltage
(I =
−
1.0
m
Adc, V
= 0)
V
−
25
−
−
Vdc
(BR)GSS
G
DS
Gate Reverse Current (V
=
−
15 Vdc)
I
−
−
−
−
−
1.0
−
1.0
nAdc
m
Adc
GS
GSS
Gate Reverse Current
(V =
−
15 Vdc, T
= 125
°
C)
GS
A
Gate Source Cutoff Voltage
MMBFJ309
MMBFJ310, SMMBFJ310
V
GS(off)
−
1.0
−
2.0
−
−
−
4.0
−
6.5
Vdc
(V =
10 Vdc, I
= 1.0 nAdc)
DS
D
ON CHARACTERISTICS
Zero
−
Gate
−
Voltage Drain Current
MMBFJ309
MMBFJ310, SMMBFJ310
I
12
24
−
−
30
60
mAdc
Vdc
DSS
(V =
10 Vdc, V
= 0)
DS
GS
Gate
−
Source Forward Voltage
(I =
1.0 mAdc, V
= 0)
V
−
−
1.0
GS(f)
G
DS
SMALL
−
SIGNAL CHARACTERISTICS
Forward Transfer Admittance
|Y |
8.0
−
−
−
18
250
5.0
2.5
−
mmhos
m
mhos
pF
fs
(V =
10 Vdc, I
= 10 mAdc, f = 1.0 kHz)
DS
D
Output Admittance
|y
|
os
(V =
10 Vdc, I
= 10 mAdc, f = 1.0 kHz)
DS
D
Input Capacitance
C
−
−
iss
rss
(V =
−
10 Vdc, V
= 0 Vdc, f = 1.0 MHz)
GS
DS
Reverse Transfer Capacitance
(V =
−
10 Vdc, V
= 0 Vdc, f = 1.0 MHz)
C
−
−
pF
GS
DS
Equivalent Short
−
Circuit Input Noise Voltage
(V =
10 Vdc, I
= 10 mAdc, f = 100 Hz)
e
n
−
10
Ǹ
nV
ń
Hz
DS
D
2
MMBFJ309L, MMBFJ310L, SMMBFJ309L, SMMBFJ310L
70
60
50
40
30
20
10
0
70
60
V
= 10 V
I
T =
-ꢀ55
°
C
A
DS
50
40
30
20
10
+ꢀ25
°
C
DSS
+ꢀ25
°
C
+150
°
C
+150
°
C
+ꢀ25
°
C
-ꢀ55
°
C
-1.0
0
-5.0
-4.0
-3.0
-2.0
I
D
– V
, GATE-SOURCE VOLTAGE (VOLTS)
GS
I
– V
, GATE-SOURCE CUTOFF VOLTAGE (VOLTS)
GS
DSS
Figure 1. Drain Current and Transfer
Characteristics versus Gate
−
Source Voltage
100 k
10 k
10
120
96
72
48
24
0
1.0 k
100
R
DS
Y
fs
Y
fs
7.0
C
gs
4.0
V
V
= -ꢀ2.3 V =
= -ꢀ5.7 V =
10
1.0 k
100
GS(off)
Y
os
GS(off)
C
gd
1.0
0
1.0
0.01
0.1 0.2 0.3 0.5
1.0 2.0
3.0 5.0
10 20
30 50
100
10 9.0 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0
0
I ,
DRAIN CURRENT (mA)
D
V
GS
, GATE SOURCE VOLTAGE (VOLTS)
Figure 2. Common
−
Source Output
Admittance and Forward Transconductance
versus Drain Current
Figure 3. On Resistance and Junction
Capacitance versus Gate
−
Source Voltage
3
MMBFJ309L, MMBFJ310L, SMMBFJ309L, SMMBFJ310L
|S |,
|S
|
11
|S |,
|S |
12 22
21
0.85 0.45
0.79 0.39
0.73 0.33
0.67 0.27
0.61 0.21
0.55 0.15
0.060 1.00
0.048 0.98
0.036 0.96
0.024 0.94
0.012 0.92
0.90
30
24
18
12
6.0
0
3.0
2.4
1.8
1.2
0.6
S
22
V
= 10 V
= 10 mA
DS
I
D
S
21
T =
25
°
C
A
Y
11
V
= 10 V
= 10 mA
DS
I
D
T =
25
°
C
A
Y
Y
21
S
11
22
S
12
Y
12
100
200
300
500 700
1000
100
200
300
500 700
1000
f, FREQUENCY (MHz)
f, FREQUENCY (MHz)
Figure 4. Common
−
Gate Y Parameter
Figure 5. Common
−
Gate S Parameter
Magnitude versus Frequency
Magnitude versus Frequency
q
,
q
21 11
q
,
q
12 22
q
,
q
11 12
q
,
q
21 22
180
°
50
°
170
°
40
°
160
°
30
°
150
°
20
°
140
°
10
°
-ꢀ2
0
°
87
°
-ꢀ20
°
-ꢀ20
°
120
°
-ꢀ40
°
100
°
-ꢀ60
°
80
°
-ꢀ80
°
60
°
-ꢀ100
°
40
°
-ꢀ120
°
20
°
0
q
11
q
22
q
21
-ꢀ40
°
86
°
-ꢀ60
°
q
-ꢀ20
°
-ꢀ40
°
-ꢀ60
°
-ꢀ80
°
-ꢀ100
°
22
q
21
-ꢀ80
°
85
°
-ꢀ100
°
-ꢀ120
°
84
°
-ꢀ140
°
q
21
q
12
q
q
12
11
V
I
= 10 V
V
I
= 10 V
= 10 mA
DS
= 10 mA
-ꢀ160
°
83
°
-ꢀ180
°
DS
q
11
D
D
T =
25
°
C
A
T =
25
°
C
A
130
°
0
°
100
-ꢀ200
°
82
°
200
300
500 700
1000
100
200
300
500 700
1000
f, FREQUENCY (MHz)
f, FREQUENCY (MHz)
Figure 6. Common
−
Gate Y Parameter
Phase
−
Angle versus Frequency
Figure 7. S Parameter Phase
−
Angle
versus Frequency
4
MMBFJ309L, MMBFJ310L, SMMBFJ309L, SMMBFJ310L
PACKAGE DIMENSIONS
SOT
−
23 (TO
−
236)
CASE 318
−
08
ISSUE AP
NOTES:
1. DIMENSIONING
AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING
DIMENSION: INCH.
D
3. MAXIMUM
LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
SEE VIEW C
3
4. DIMENSIONS
D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
H
E
MILLIMETERS
INCHES
E
DIM
A
A1
b
c
D
E
e
L
L1
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
0
°
NOM
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.20
0.54
2.40
−−−
MAX
MIN
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
0
°
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.094
−−−
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
10
°
1.11
0.10
0.50
0.18
3.04
1.40
2.04
0.30
0.69
2.64
10
°
c
1
2
b
0.25
e
q
H
A
E
q
L
STYLE 10:
A1
L1
VIEW C
PIN 1.
DRAIN
2. SOURCE
3. GATE
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
mm
inches
ǒ
Ǔ
SCALE 10:1
0.8
0.031
*For additional information on our Pb
−
Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting
T
e
chniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).
SCILLC reserves the right to make changes without further notice
to any products herein.
SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.
All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.
SCILLC does not convey any license under its patent rights
nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.
Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.
SCILLC is an Equal
Opportunity/Affirmative Action Employer.
This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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T
:
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−
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−
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o
ll Free
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−
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−
5817
−
1050
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.
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: 303
−
675
−
2175 or 800
−
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−
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o
ll Free USA/Canada
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−
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−
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o
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: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
MMBFJ309LT1/D
