onsemi-MMBT2907ALT3G

Part #onsemi-MMBT2907ALT3G
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onsemi-MMBT2907ALT3G
MMBT2907AL,  
SMMBT2907AL  
General Purpose
T
r
ansistors  
PNP Silicon  
Features  
•
S Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AEC−Q101 Qualified and  
PPAP Capable  
COLLECTOR  
3
•
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
1
BASE  
Compliant  
MAXIMUM RATINGS  
2
EMITTER  
Rating  
Symbol  
Value  
−60  
Unit  
Vdc  
Collecto
r
−
E
mitter Voltage  
Collecto
r
−
B
ase Voltage  
V
CEO  
V
CBO  
V
EBO  
−60  
Vdc  
3
SOT−23 (TO−236AB)  
CASE 318  
Emitte
r
−
B
ase Voltage  
−5.0  
Vdc  
1
Collector Current − Continuous  
I
C
−600  
−1200  
mAdc  
mAdc  
STYLE 6  
2
I
CM  
THERMAL CHARACTERISTICS  
Characteristic  
MARKING DIAGRAM  
Symbol  
Max  
Unit  
T
o
tal Device Dissipation − FR
−
5
B
oard  
P
D

(Note 1) @T

= 25
°
C  
225  
1.8  
mW  
mW/
°
C  
A
2F M
G  
Derate above 25
°
C  
G
Thermal Resistance, Junction−to−Ambient  
R
556  
°
C/W  
ꢀ
JA  
1
T
o
tal Device Dissipation − Alumina  
P
D
2F =
 
Device Code  
300  
2.4  
mW  
mW/
°
C  
A
M
= Date Code*  
Derate above 25

C  
G
= Pb−Free Package  
Thermal Resistance, Junction−to−Ambient  
R
417  
°
C/W  
ꢀ
JA  
(Note: Microdot may be in either location)  
*Date Code orientation and/or overbar may  
vary depending upon manufacturing location.  
T
o
tal Device Dissipation − Heat Spreader  
P
D
350  
357  
mW  
°
C/W  
°
C  
A
Thermal Resistance, Junction−to−Ambient  
Junction and Storage
T
e
mperature  
R
ꢀ
JA  
T , T  
J
−55 to +150  
stg  
ORDERING INFORMATION  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. FR
−
5
 
=
1
.0
ꢀ
0.75
ꢀ
0.062 in.  
†
Device  
Package  
Shipping  
MMBT2907A
L
T
1G  
SMMBT2907A
L
T
1G (Pb−Free)  
SOT−23  
3000 /
T
a
pe &  
Reel  
2. Alumina
 
= 0.4
ꢀ
0.3
ꢀ
0.024 in. 99.5% alumina.  
3. Reference
 
SOA curve.  
MMBT2907A
L
T
3G SOT−23  
SMMBT2907A
L
T
3G (Pb−Free)  
2
10,000 /
T
a
pe &  
Reel  
4. Heat
 
Spreader or equivalent = 450 mm
 
, 2 oz.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our
T
a
pe and Reel Packaging Specifications  
Brochure, BRD8011/D.  
©
Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
October, 2016 − Rev. 15  
MMBT2907A
L
T
1/D  
 

MMBT2907AL, SMMBT2907AL  
ELECTRICAL CHARACTERISTICS
(T =
 
25
°
C unless otherwise noted)  
A
Characteristic  
Symbol  
Min  
Max  
Unit  
OFF CHARACTERISTICS  
Collecto
r
−Emitter Breakdown Voltage
 

(I =
 
−1.0 mAdc, I
 
= 0)  
V
Vdc  
(BR)CEO  
−60  
−60  
−
−
C
B
(I =
 
−10 mAdc, I
 
= 0)  
C
B
Collecto
r
−
B
ase Breakdown Voltage (I
 
= −10
ꢁ
Adc, I
 
= 0)  
V
V
−60  
−5.0  
−
−
−
Vdc  
Vdc  
C
E
(BR)CBO  
Emitte
r
−
B
ase Breakdown Voltage (I
 
= −10
ꢁ
Adc, I
 
= 0)  
E
C
(BR)EBO  
Collector Cutoff Current (V
 
= −30 Vdc, V  
= −0.5 Vdc)  
I
−50  
nAdc  
ꢁ
Adc  
CE  
EB(off)  
CEX  
Collector Cutoff Current  
I
CBO  
−
−
−0.010  
−10  
(V =
 
−50 Vdc, I
 
= 0)  
CB  
E
(V =
 
−50 Vdc, I
 
= 0, T
 
= 125
°
C)  
CB  
E
A
Base Cutoff Current (V
 
= −30 Vdc, V  
= −0.5 Vdc)  
I
BL  
−
−50  
nAdc  
−
CE  
EB(off)  
ON CHARACTERISTICS  
DC Current Gain  
h
FE  
(I =
 
−0.1 mAdc, V
 
= −10 Vdc)  
75  
100  
100  
100  
50  
−
−
−
300  
−
C
CE  
(I =
 
−1.0 mAdc, V
 
= −10 Vdc)  
C
CE  
(I =
 
−10 mAdc, V
 
= −10 Vdc)  
C
CE  
(I =
 
−150 mAdc, V
 
= −10 Vdc)  
C
CE  
(I =
 
−500 mAdc, V
 

C
CE  
Collecto
r
−
E
mitter Saturation V

(I =
 
−150 mAdc, I
 

V
Vdc  
Vdc  
CE(sat)  
−
−
−0.4  
−1.6  
C
B
(I =
 
−500 mAdc, I
 
= −50 mAdc)  
C
B
Bas
e
−
E
mitter Saturation V

(I =
 
−150 mAdc, I
 
= −15 mAdc)  
V
BE(sat)  
−
−
−1.3  
−2.6  
C
B
(I =
 
−500 mAdc, I
 
= −50 mAdc)  
C
B
SMALL
−
S
IGNAL CHARACTERISTICS  
f
200  
−
MHz  
pF  
T
(I =
 
−50 mAdc, V
 
= −20 Vdc, f = 100 MHz)  
C
CE  
Output Capacitance (V
 
= −10 Vdc, I
 
= 0, f = 1.0 MHz)  
C
obo  
−
−
8.0  
30  
CB  
E
Input Capacitance (V
 
= −2.0 Vdc, I
 
= 0, f = 1.0 MHz)  
C
EB  
C
ibo  
SWITCHING CHARACTERISTICS  
Turn−On Time  
Delay Time  
Rise Time  
t
−
−
−
−
−
−
45  
10  
on  
(V =
 
−30 Vdc, I
 
= −150 mAdc,  
CC  
C
t
d
I
B1  
= −15 mAdc)  
t
r
40  
ns  
Turn−Off Time  
Storage Time  
Fall Time  
t
100  
80  
off  
(V =
 
−6.0 Vdc, I
 
= −150 mAdc,  
CC  
C
t
s
I
B1  
= I
 
= −15 mAdc)  
B2  
t
f
30  
5. Pulse
 
T
e
st: Pulse Width
v
300
ꢁ
s, Duty Cycle
v
2.0%.  
6. f is
 
defined as the frequency at which |h
 
| extrapolates to unity.  
T
fe  
INPUT  
INPUT  
Z =
 
50  
+15 V
 
-6.0 V  
-30 V  
200  
Z =
 
50  
o
ꢂ
ꢂ
o
PRF = 150 PPS  
RISE TIME
≤
2.0 ns  
P
.
W. < 200 ns  
PRF = 150 PPS  
RISE TIME
≤
2.0 ns  
P
.
W. < 200 ns  
1.0 k  
37  
1.0 k  
1.0 k  
TO OSCILLOSCOPE  
RISE TIME
≤
5.0 ns  
TO OSCILLOSCOPE  
RISE TIME
≤
5.0 ns  
0
0
50  
-16 V  
-30 V  
50  
1N916  
200 ns  
200 ns  
Figure 1. Delay and Rise Time Test Circuit  
Figure 2. Storage and Fall Time Test Circuit  
2
 

MMBT2907AL, SMMBT2907AL  
TYPICAL CHARACTERISTICS  
1000  
100  
10  
V
CE  
= 10 V  
T =
 
150
°
C  
J
25
°
C  
-ꢀ55
°
C  
1.0  
10  
100  
1000  
I ,
 
COLLECTOR CURRENT (mA)  
C
Figure 3. DC Current Gain  
-1.0  
-0.8  
-0.6  
-0.4  
-0.2  
0
I
C
= -1.0 mA  
-10 mA  
-100 mA  
-500 mA  
-0.005 -0.01  
-0.02 -0.03
 
-0.05 -0.07 -0.1  
-0.2 -0.3
 
-0.5 -0.7
 
-1.0  
-3.0  
-30  
-20  
-2.0  
-5.0 -7.0
 
-10  
-50  
I ,
 
BASE CURRENT (mA)  
B
Figure 4. Collector Saturation Region  
300  
200  
500  
300  
V
CC  
I /I
 
= 10  
= -30 V  
V
CC  
I /I
 
= 10  
= -30 V  
200  
C
B
C
B
t
r
100  
70  
I =
 
I  
B1 B2  
T =
 
25
°
C  
J
t
f
T =
 
25
°
C  
J
100  
70  
50  
30  
20  
50  
t
′
= t
 
– 1/8 t  
f
s
s
30  
20  
t @
 
V  
d
= 0 V  
BE(off)  
10  
7.0  
5.0  
10  
2.0 V  
7.0  
5.0  
3.0  
-5.0 -7.0
 
-10  
-20 -30  
-50 -70 -100  
-200 -300
 
-500  
-5.0 -7.0
 
-10  
-20 -30  
-50 -70
 
-100  
-200 -300
 
-500  
I ,
 
COLLECTOR CURRENT  
C
I ,
 
COLLECTOR CURRENT (mA)  
C
Figure 5. Turn−On Time  
Figure 6. Turn−Off Time  
3

MMBT2907AL, SMMBT2907AL  
TYPICAL SMALL
−
S
IGNAL Characteristics  
NOISE FIGURE  
V
CE  
= 10 Vdc, T
 
= 25
°
C  
A
10  
8.0  
6.0  
4.0  
2.0  
0
10  
f = 1.0 kHz  
8.0  
I
= -1.0 mA, R
 
= 430
ꢂ  
s
C
6.0  
4.0  
I
= -50
ꢁ
A  
C
-500
ꢁ
A, R
 
= 560  
s
ꢂ
-100
ꢁ
A  
-500
ꢁ
A  
-1.0 mA  
-50
ꢁ
A, R
 
= 2.7 k  
s
ꢂ
-100
ꢁ
A, R
 
= 1.6 k  
s
ꢂ
R =
 
OPTIMUM SOURCE RESISTANCE  
s
2.0  
0
0.01 0.02
 
0.05 0.1
 
0.2 0.5
 
1.0 2.0
 
5.0 10
 
20 50
 
100  
50 100 200  
500 1.0
 
k 2.0
 
k  
5.0 k
 
10 k
 
20 k  
50 k  
f, FREQUENCY (kHz)  
R , SOURCE RESISTANCE (OHMS)  
s
Figure 7. Frequency Effects  
Figure 8. Source Resistance Effects  
30  
400  
300  
20  
C
eb  
200  
10  
100  
80  
7.0  
5.0  
V
= -20 V  
CE  
T =
 
25
°
C  
J
60  
C
cb  
40  
30  
3.0  
2.0  
20  
-0.1  
-0.2 -0.3
 
-0.5  
-1.0  
-2.0 -3.0
 
-5.0  
-10  
-20 -30  
-1.0 -2.0  
-5.0 -10 -20  
-50 -100
 
-200  
-500 -1000  
REVERSE VOLTAGE (VOLTS)  
I ,
 
COLLECTOR CURRENT (mA)  
C
Figure 9. Capacitances  
Figure 10. Current−Gain − Bandwidth Product  
1
1.1  
I /I
 
= 10  
C
B
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
I /I
 
= 10  
C
B
150
°
C  
−55
°
C  
25
°
C  
−55
°
C  
25
°
C  
0.1  
150
°
C  
0.3  
0.2  
0.01  
0.001  
0.01  
0.1  
1
0.001  
0.01  
0.1  
1
I ,
 
COLLECTOR CURRENT (A)  
C
I ,
 
COLLECTOR CURRENT (A)  
C
Figure 11. Collector Emitter Saturation Voltage  
vs. Collector Current  
Figure 12. Base Emitter Saturation Voltage vs.  
Collector Current  
4

MMBT2907AL, SMMBT2907AL  
TYPICAL SMALL
−
S
IGNAL Characteristics  
NOISE FIGURE  
V
CE  
= 10 Vdc, T
 
= 25
°
C  
A
+0.5  
0
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
V
CE  
= 1 V  
R
for V  
CE(sat)  
ꢀ
VC  
−55
°
C  
25
°
C  
-0.5  
-1.0  
-1.5  
-2.0  
-2.5  
150
°
C  
R
for V  
ꢀ
VB  
BE  
0.3  
0.2  
0.001  
0.01  
0.1  
1
-0.1 -0.2 -0.5
 
-1.0 -2.0
 
-5.0 -10 -20
 
-50 -100
 
-200 -500  
I ,
 
COLLECTOR CURRENT (mA)  
C
I ,
 
COLLECTOR CURRENT (A)  
C
Figure 13. Base Emitter Voltage vs. Collector  
Current  
Figure 14. Temperature Coefficients  
10  
1 s  
10 ms  
100 ms  
100
ꢁ
s 10
 
ꢁ
s  
1 ms  
1
0.1  
0.01  
Single Pulse
T
e
st  
@ T
 
= 25
°
C  
A
0.001  
0.01  
0.1  
1
10  
100  
V
CE  
(Vdc)  
Figure 15. Safe Operating Area  
5

MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SOT
−
23 (TO
−
236)  
CASE 318
−
08  
ISSUE AS  
DATE 30 JAN 2018  
SCALE 4:1  
NOTES:  
D
1. DIMENSIONING
 
AND TOLERANCING PER ASME Y14.5M, 1994.  
2. CONTROLLING
 
DIMENSION: MILLIMETERS.  
3. MAXIMUM
 
LEAD THICKNESS INCLUDES LEAD FINISH.  
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF  
THE BASE MATERIAL.  
0.25  
3
4. DIMENSIONS
 
D AND E DO NOT INCLUDE MOLD FLASH,  
PROTRUSIONS, OR GATE BURRS.  
T
H
E
E
1
2
MILLIMETERS  
INCHES  
DIM  
A
A1  
b
c
D
E
e
L
MIN  
0.89  
0.01  
0.37  
0.08  
2.80  
1.20  
1.78  
0.30  
0.35  
2.10  
0
°
 
NOM  
1.00  
0.06  
0.44  
0.14  
2.90  
1.30  
1.90  
0.43  
0.54  
2.40  
−−−  
MAX  
MIN  
0.035  
0.000  
0.015  
0.003  
0.110  
0.047  
0.070  
0.012  
0.014  
0.083  
0
°  
NOM  
0.039  
0.002  
0.017  
0.006  
0.114  
0.051  
0.075  
0.017  
0.021  
0.094  
−−−  
MAX  
0.044  
0.004  
0.020  
0.008  
0.120  
0.055  
0.080  
0.022  
0.027  
0.104  
10
°  
L
1.11  
0.10  
0.50  
0.20  
3.04  
1.40  
2.04  
0.55  
0.69  
2.64  
10
°  
3X  
b
L1  
VIEW C  
e
TOP VIEW  
L1  
A
H
E
T
c
A1  
SEE VIEW C  
SIDE VIEW  
GENERIC  
MARKING DIAGRAM*  
END VIEW  
RECOMMENDED  
SOLDERING FOOTPRINT  
XXXM
G  
G
1
3X  
0.90  
XXX = Specific Device Code  
2.90  
M
= Date Code  
G
= Pb
−
Free Package  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
Pb
−
Free indicator, “G” or microdot “
G
”,  
may or may not be present.  
3X  
0.95  
0.80  
PITCH  
DIMENSIONS: MILLIMETERS  
STYLE 1 THRU 5:  
CANCELLED  
STYLE 6:  
STYLE 7:  
PIN 1.
 
EMITTER  
2. BASE  
STYLE 8:  
PIN 1.
 
BASE  
2. EMITTER  
3. COLLECTOR  
PIN 1.
 
ANODE  
2. NO
 
CONNECTION  
3. CATHODE  
3. COLLECTOR  
STYLE 9:  
PIN 1.
 
ANODE  
2. ANODE  
STYLE 10:  
STYLE 11:  
STYLE 12:  
STYLE 13:  
PIN 1.
 
SOURCE  
2. DRAIN  
STYLE 14:  
PIN 1.
 
CATHODE  
2. GATE  
PIN 1.
 
DRAIN  
2. SOURCE  
3. GATE  
PIN 1.
 
ANODE  
PIN 1.
 
CATHODE  
2. CATHODE  
3. ANODE  
2. CATHODE  
3. CATHODE
−
ANODE  
3. CATHODE  
3. GATE  
3. ANODE  
STYLE 15:  
STYLE 16:  
STYLE 17:  
PIN 1.
 
NO CONNECTION  
2. ANODE  
STYLE 18:  
STYLE 19:  
STYLE 20:  
PIN 1.
 
GATE  
2. CATHODE  
3. ANODE  
PIN 1.
 
ANODE  
2. CATHODE  
3. CATHODE  
PIN 1.
 
NO CONNECTION
 
PIN 1.
 
CATHODE  
PIN 1.
 
CATHODE  
2. ANODE  
3. GATE  
2. CATHODE  
3. ANODE  
2. ANODE  
3. CATHODE
−
ANODE  
3. CATHODE  
STYLE 21:  
STYLE 22:  
STYLE 23:  
PIN 1.
 
ANODE  
2. ANODE  
STYLE 24:  
STYLE 25:  
STYLE 26:  
PIN 1.
 
GATE  
2. SOURCE  
3. DRAIN  
PIN 1.
 
RETURN  
2. OUTPUT  
3. INPUT  
PIN 1.
 
GATE  
2. DRAIN  
PIN 1.
 
ANODE  
2. CATHODE  
3. GATE  
PIN 1.
 
CATHODE  
2. ANODE  
3. SOURCE  
3. NO
 
CONNECTION  
3. CATHODE  
STYLE 27:  
STYLE 28:  
PIN 1.
 
CATHODE  
2. CATHODE  
3. CATHODE  
PIN 1.
 
ANODE  
2. ANODE  
3. ANODE  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions
 
are uncontrolled
 
except when stamped
 
“CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98ASB42226B  
SOT
−
23 (TO
−
236)  
PAGE 1 OF 1  
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