onsemi-MMBT4126LT1G

Part #onsemi-MMBT4126LT1G
Download 
onsemi-MMBT4126LT1G
MMBT4126LT1G  
General Purpose
T
r
ansistor  
PNP Silicon  
Features  
•
Moisture Sensitivity Level: 1  
•
ESD Rating: − Human Body Model: > 4000 V  
− Machine Model: > 400 V  
COLLECTOR  
3
•
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
1
BASE  
MAXIMUM RATINGS  
2
EMITTER  
Rating  
Symbol  
Value  
Unit  
Collector−Emitter Voltage  
V
V
V
−25  
Vdc  
CEO  
Collector−Base Voltage  
−25  
−4  
Vdc  
Vdc  
CBO  
EBO  
3
Emitter−Base Voltage  
1
Collector Current−Continuous  
THERMAL CHARACTERISTICS  
Characteristic  
I
−200  
mAdc  
C
2
SOT−23  
CASE 318  
STYLE 6  
Symbol  
Max  
Unit  
T
o
tal Device Dissipation FR
−
5
B
oard  
P
D

(Note 1) @T

= 25
°
C  
225  
1.8  
mW  
mW/
°
C  
A
Derate above 25
°
C  
MARKING DIAGRAM  
Thermal Resistance, Junction−to−Ambient  
(Note

)  
R
556  
°
C/W  
q
JA  
T
o
tal Device Dissipation Alumina  
P
D
300  
2.4  
mW  
mW/
°
C  
A
Derate above 25

C  
C3 M
G  
G
Thermal Resistance, Junction−to−Ambient  
(Note

)  
R
417  
°
C/W  
q
JA  
Junction and Storage
T
e
mperature Range
 
T , T  
−55 to +150  
°
C  
J
stg  
C3 =
 
Device Code  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. FR
−
5
 
=
1
.0
ꢀ
0.75
ꢀ
0.062 in.  
M
= Date Code*  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
*Date Code orientation and/or overbar may  
vary depending upon manufacturing location.  
2. Alumina
 
= 0.4
ꢀ
0.3
ꢀ
0.024 in. 99.5% alumina.  
ORDERING INFORMATION  
†
Device  
Package  
Shipping  
MMBT4126
L
T
1G SOT−23  
(Pb−Free)  
3000/
T
a
pe & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our
T
a
pe and Reel Packaging Specifications  
Brochure, BRD8011/D.  
©
Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
October, 2016 − Rev. 3  
MMBT4126
L
T
1/D  
 

MMBT4126LT1G  
ELECTRICAL CHARACTERISTICS
(T =
 
25
°
C unless otherwise noted)  
A
Characteristic  
OFF CHARACTERISTICS  
Symbol  
Min  
Max  
Unit  
Collecto
r
−
E
mitter Breakdown V

V
Vdc  
Vdc  
(BR)CEO  
(BR)CBO  
(BR)EBO  
(I =
 
−1.0 mAdc, I
 
= 0)  
−25  
−25  
−4  
−
−
C
B
Collector−Base Breakdown Voltage  
V
V
(I =
 
−10
m
Adc, I
 
= 0)  
C
E
Emitter−Base Breakdown Voltage  
Vdc  
(I =
 
−10
m
Adc, I
 
= 0)  
−
E
C
Collector Cutoff Current  
I
nAdc  
CEX  
(V =
 
−30 Vdc, V
 
= −3.0 Vdc)  
−
−50  
CE  
EB  
ON CHARACTERISTICS

DC Current Gain  
H
−
FE  
(I =
 
−2.0 mAdc, V
 
= −1.0 Vdc)  
120  
60  
300  
−
C
CE  
(I =
 
−50 mAdc, V
 
= −1.0 Vdc)  
C
CE  
Collecto
r
−
E
mitter Saturation Voltage  
(I =
 
−50 mAdc, I
 
= −5.0 mAdc)  
V
Vdc  
Vdc  
CE(sat)  
−
−
−0.4  
C
B
Bas
e
−
E
mitter Saturation Voltage  
(I =
 
−50 mAdc, I
 
= −5.0 mAdc)  
V
BE(sat)  
−0.95  
C
B
SMALL
−
S
IGNAL CHARACTERISTICS  
Curren
t
−
G
ain − Bandwidth Product  
f
MHz  
pF  
pF  
−
T
(I =
 
−10 mAdc, V
 
= −20 Vdc, f = 100 MHz)  
250  
−
−
C
CE  
Output Capacitance  
C
obo  
(V =
 
−5.0 Vdc, I
 
= 0, f = 1.0 MHz)  
4.5  
10  
CB  
E
Input Capacitance  
C
ibo  
(V =
 
−0.5 Vdc, I
 
= 0, f = 1.0 MHz)  
−
EB  
C
Smal
l
−
S
ignal Current Gain  
(I =
 
−2.0 mAdc, V
 
= −10 Vdc, f = 1.0 kHz)  
h
fe  
120  
2.5  
480  
−
C
CE  
(I =
 
10 mAdc, V
 
= 20 Vdc, f = 100 MHz)  
C
CE  
Noise Figure  
NF  
dB  
(I =
 
−100
m
Adc, V
 
= −5.0 Vdc, R
 
= 1.0 k
W
, f = 1.0 kHz)  
C
−
4.0  
CE  
S
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
3. Pulse
 
T
e
st: Pulse Width
v
300
m
s, Duty Cycle
v
2.0%.  
TYPICAL TRANSIENT CHARACTERISTICS  
T =
 
25
°
C  
J
T =
 
125
°
C  
J
10  
5000  
V
CC  
I /I
 
= 10  
= 40 V  
3000  
2000  
7.0  
C
B
C
5.0  
obo  
1000  
700  
C
ibo  
500  
3.0  
2.0  
300  
200  
Q
T
Q
A
100  
70  
1.0  
0.1  
50  
0.2 0.3
 
0.5 0.7 1.0  
2.0 3.0
 
5.0 7.0 10  
20 30
 
40  
1.0  
2.0 3.0
 
5.0 7.0
 
10  
20 30
 
50 70 100  
200  
REVERSE BIAS (VOLTS)  
I ,
 
COLLECTOR CURRENT (mA)  
C
Figure 1. Capacitance  
Figure 2. Charge Data  
2
 

MMBT4126LT1G  
TYPICAL AUDIO SMALL
−
S
IGNAL CHARACTERISTICS  
NOISE FIGURE VARIATIONS  
(V

CE

=
−
5
.0 Vdc, T

A

= 25
°
C, Bandwidth = 1.0 Hz)  
5.0  
4.0  
3.0  
2.0  
1.0  
0
12  
SOURCE RESISTANCE = 200
W  
= 1.0 mA  
f = 1.0 kHz  
I
= 1.0 mA  
C
I
C
10  
8
I
C
= 0.5 mA  
SOURCE RESISTANCE = 200
W  
= 0.5 mA  
I
C
SOURCE RESISTANCE = 2.0 k  
= 50
m
A  
6
I
C
4
I
= 50
m
A  
C
SOURCE RESISTANCE = 2.0 k  
= 100
m
A  
I
= 100
m
A  
C
2
I
C
0
0.1 0.2  
0.4  
1.0 2.0 4.0  
10  
20  
40  
100  
0.1 0.2  
0.4  
1.0 2.0  
4.0  
10  
20  
40  
100  
f, FREQUENCY (kHz)  
R ,
 
SOURCE RESISTANCE (k OHMS)  
g
Figure 3.  
Figure 4.  
h PARAMETERS  
(V

CE

=
−
1
0 Vdc, f = 1.0 kHz, T

A

= 25
°
C)  
300  
200  
100  
70  
50  
30  
20  
100  
70  
10  
7
50  
30  
5
0.1  
0.2 0.3  
0.5 0.7
 
1.0  
2.0 3.0  
5.0 7.0 10  
0.1  
0.2 0.3  
0.5 0.7
 
1.0  
2.0 3.0  
5.0 7.0
 
10  
I ,
 
COLLECTOR CURRENT (mA)  
C
I ,
 
COLLECTOR CURRENT (mA)  
C
Figure 5. Current Gain  
Figure 6. Output Admittance  
20  
10  
10  
7.0  
5.0  
7.0  
5.0  
3.0  
2.0  
3.0  
2.0  
1.0  
0.7  
0.5  
1.0  
0.7  
0.5  
0.3  
0.2  
0.1  
0.2 0.3  
0.5 0.7
 
1.0  
2.0 3.0  
5.0 7.0 10  
0.1  
0.2 0.3  
0.5 0.7 1.0  
2.0 3.0  
5.0 7.0
 
10  
I ,
 
COLLECTOR CURRENT (mA)  
C
I ,
 
COLLECTOR CURRENT (mA)  
C
Figure 7. Input Impedance  
Figure 8. Voltage Feedback Ratio  
3

MMBT4126LT1G  
TYPICAL STATIC CHARACTERISTICS  
2.0  
1.0  
T =
 
+125
°
C  
J
V
CE  
= 1.0 V  
+25
°
C  
-ꢀ55
°
C  
0.7  
0.5  
0.3  
0.2  
0.1  
0.1  
0.2  
0.3  
0.5 0.7  
1.0  
2.0  
3.0  
5.0 7.0 10  
20  
30  
50  
70 100  
200  
I ,
 
COLLECTOR CURRENT (mA)  
C
Figure 9. DC Current Gain  
1.0  
0.8  
0.6  
0.4  
T =
 
25
°
C  
J
I
C
= 1.0 mA  
10 mA  
30 mA  
100 mA  
0.2  
0
0.01  
0.02  
0.03  
0.05 0.07 0.1  
0.2  
0.3  
0.5  
0.7  
1.0  
2.0  
3.0  
5.0  
7.0  
10  
I ,
 
BASE CURRENT (mA)  
B
Figure 10. Collector Saturation Region  
1.0  
0.8  
0.6  
1.0  
T =
 
25
°
C  
V
@ I
 
/I =
 
10  
J
BE(sat) C
 
B  
0.5  
+25
°
C TO +125
°
C  
-ꢀ55
°
C TO +25
°
C  
q
FOR V  
CE(sat)  
VC  
V
BE  
@ V
 
= 1.0 V  
CE  
0
-ꢀ0.5  
-ꢀ1.0  
+25
°
C TO +125
°
C  
-ꢀ55
°
C TO +25
°
C  
0.4  
0.2  
0
V
@ I
 
/I =
 
10  
B
CE(sat)  
C
q
FOR V  
BE(sat)  
VB  
-ꢀ1.5  
-ꢀ2.0  
1.0  
2.0 5.0  
10  
20  
50  
100  
200  
0
20  
40  
60  
80 100
 
120 140
 
160 180
 
200  
I ,
 
COLLECTOR CURRENT (mA)  
C
I ,
 
COLLECTOR CURRENT (mA)  
C
Figure 11. “ON” Voltages  
Figure 12. Temperature Coefficients  
4

MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SOT
−
23 (TO
−
236)  
CASE 318
−
08  
ISSUE AS  
DATE 30 JAN 2018  
SCALE 4:1  
NOTES:  
D
1. DIMENSIONING
 
AND TOLERANCING PER ASME Y14.5M, 1994.  
2. CONTROLLING
 
DIMENSION: MILLIMETERS.  
3. MAXIMUM
 
LEAD THICKNESS INCLUDES LEAD FINISH.  
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF  
THE BASE MATERIAL.  
0.25  
3
4. DIMENSIONS
 
D AND E DO NOT INCLUDE MOLD FLASH,  
PROTRUSIONS, OR GATE BURRS.  
T
H
E
E
1
2
MILLIMETERS  
INCHES  
DIM  
A
A1  
b
c
D
E
e
L
MIN  
0.89  
0.01  
0.37  
0.08  
2.80  
1.20  
1.78  
0.30  
0.35  
2.10  
0
°
 
NOM  
1.00  
0.06  
0.44  
0.14  
2.90  
1.30  
1.90  
0.43  
0.54  
2.40  
−−−  
MAX  
MIN  
0.035  
0.000  
0.015  
0.003  
0.110  
0.047  
0.070  
0.012  
0.014  
0.083  
0
°  
NOM  
0.039  
0.002  
0.017  
0.006  
0.114  
0.051  
0.075  
0.017  
0.021  
0.094  
−−−  
MAX  
0.044  
0.004  
0.020  
0.008  
0.120  
0.055  
0.080  
0.022  
0.027  
0.104  
10
°  
L
1.11  
0.10  
0.50  
0.20  
3.04  
1.40  
2.04  
0.55  
0.69  
2.64  
10
°  
3X  
b
L1  
VIEW C  
e
TOP VIEW  
L1  
A
H
E
T
c
A1  
SEE VIEW C  
SIDE VIEW  
GENERIC  
MARKING DIAGRAM*  
END VIEW  
RECOMMENDED  
SOLDERING FOOTPRINT  
XXXM
G  
G
1
3X  
0.90  
XXX = Specific Device Code  
2.90  
M
= Date Code  
G
= Pb
−
Free Package  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
Pb
−
Free indicator, “G” or microdot “
G
”,  
may or may not be present.  
3X  
0.95  
0.80  
PITCH  
DIMENSIONS: MILLIMETERS  
STYLE 1 THRU 5:  
CANCELLED  
STYLE 6:  
STYLE 7:  
PIN 1.
 
EMITTER  
2. BASE  
STYLE 8:  
PIN 1.
 
BASE  
2. EMITTER  
3. COLLECTOR  
PIN 1.
 
ANODE  
2. NO
 
CONNECTION  
3. CATHODE  
3. COLLECTOR  
STYLE 9:  
PIN 1.
 
ANODE  
2. ANODE  
STYLE 10:  
STYLE 11:  
STYLE 12:  
STYLE 13:  
PIN 1.
 
SOURCE  
2. DRAIN  
STYLE 14:  
PIN 1.
 
CATHODE  
2. GATE  
PIN 1.
 
DRAIN  
2. SOURCE  
3. GATE  
PIN 1.
 
ANODE  
PIN 1.
 
CATHODE  
2. CATHODE  
3. ANODE  
2. CATHODE  
3. CATHODE
−
ANODE  
3. CATHODE  
3. GATE  
3. ANODE  
STYLE 15:  
STYLE 16:  
STYLE 17:  
PIN 1.
 
NO CONNECTION  
2. ANODE  
STYLE 18:  
STYLE 19:  
STYLE 20:  
PIN 1.
 
GATE  
2. CATHODE  
3. ANODE  
PIN 1.
 
ANODE  
2. CATHODE  
3. CATHODE  
PIN 1.
 
NO CONNECTION
 
PIN 1.
 
CATHODE  
PIN 1.
 
CATHODE  
2. ANODE  
3. GATE  
2. CATHODE  
3. ANODE  
2. ANODE  
3. CATHODE
−
ANODE  
3. CATHODE  
STYLE 21:  
STYLE 22:  
STYLE 23:  
PIN 1.
 
ANODE  
2. ANODE  
STYLE 24:  
STYLE 25:  
STYLE 26:  
PIN 1.
 
GATE  
2. SOURCE  
3. DRAIN  
PIN 1.
 
RETURN  
2. OUTPUT  
3. INPUT  
PIN 1.
 
GATE  
2. DRAIN  
PIN 1.
 
ANODE  
2. CATHODE  
3. GATE  
PIN 1.
 
CATHODE  
2. ANODE  
3. SOURCE  
3. NO
 
CONNECTION  
3. CATHODE  
STYLE 27:  
STYLE 28:  
PIN 1.
 
CATHODE  
2. CATHODE  
3. CATHODE  
PIN 1.
 
ANODE  
2. ANODE  
3. ANODE  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions
 
are uncontrolled
 
except when stamped
 
“CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98ASB42226B  
SOT
−
23 (TO
−
236)  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
©
Semiconductor Components Industries, LLC, 2019  

ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at

. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMEN
T
:  
Email Requests to:

TECHNICAL SUPPORT  
North American Technical Support:  
Voice Mail: 1 800
−
282
−
9855
T
o
ll Free USA/Canada  
Phone: 011 421 33 790 2910  
Europe, Middle East and Africa Technical Support:  
Phone: 00421 33 790 2910  
For additional information, please contact your local Sales Representative  
ON Semiconductor Website:

◊