onsemi-MMBT4401LT1G

Part #onsemi-MMBT4401LT1G
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onsemi-MMBT4401LT1G
MMBT4401L, SMMBT4401L  
Switching
T
r
ansistor  
NPN Silicon  
Features  
•
These Devices are Pb
−
Free, Halogen Free/BFR Free and are RoHS  
Compliant  
COLLECTOR  
3
•
AEC
−
Q101 Qualified and P
P
A
P Capable  
•
S Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements  
1
BASE  
MAXIMUM RATINGS  
2
Rating  
Collecto
r
−
Emitter Voltage  
Collecto
r
−
Base Voltage  
Emitte
r
−
Base Voltage  
Symbol  
Value  
40  
Unit  
Vdc  
EMITTER  
V
CEO  
V
CBO  
V
EBO  
60  
Vdc  
3
6.0  
Vdc  
SOT
−
23 (TO
−
236)  
CASE 318  
STYLE 6  
Collector Current
−
Continuous  
Collector Current
−
Peak  
I
C
600  
900  
mAdc  
mAdc  
1
2
I
CM  
THERMAL CHARACTERISTICS  
Characteristic  
MARKING DIAGRAM  
Symbol  
Max  
Unit  
T
o
tal Device Dissipation FR
−
5 Board  
P
D
(Note 1) @T
 
= 25
°
C  
225  
1.8  
mW  
mW/
°
C  
A
2X M
G  
Derate above 25
°
C  
G
Thermal Resistance, Junction
−
to
−
Ambient  
R
556  
°
C/W  
q
JA  
1
T
o
tal Device Dissipation Alumina  
P
D
2X =
 
Specific Device Code  
Substrate (Note 2) @T
 
= 25
°
C  
300  
2.4  
mW  
mW/
°
C  
A
Derate above 25
°
C  
M
= Date Code*  
G
= Pb
−
Free Package  
(Note: Microdot may be in either location)  
Thermal Resistance, Junction
−
to
−
Ambient  
Junction and Storage
T
e
mperature  
R
417  
°
C/W  
°
C  
q
JA  
T , T  
J
−
55 to +150  
*Date Code orientation and/or overbar may  
vary depending upon manufacturing location.  
stg  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
*Transient pulses must not cause the junction temperature to be exceeded.  
1. FR
−
5 = 1.0
ꢀ
0.75
ꢀ
0.062 in.  
ORDERING INFORMATION  
2. Alumina
 
= 0.4
ꢀ
0.3
ꢀ
0.024 in. 99.5% alumina.  
†
Device  
Package  
Shipping  
MMBT4401
L
T
1G  
SMMBT4401
L
T
1G  
SOT
−
23  
(Pb
−
Free)  
3000 /
T
a
pe &  
Reel  
MMBT4401
L
T
3G  
SOT
−
23  
(Pb
−
Free)  
10,000 /
T
a
pe &  
Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our
T
a
pe and Reel Packaging Specifications  
Brochure, BRD8011/D.  
©
Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
October, 2011
−
Rev. 10  
MMBT4401
L
T
1/D  

MMBT4401L, SMMBT4401L  
ELECTRICAL CHARACTERISTICS
(T =
 
25
°
C unless otherwise noted)  
A
Characteristic  
Symbol  
Min  
Max  
Unit  
OFF CHARACTERISTICS  
Collecto
r
−
Emitter Breakdown Voltage (Note 3)  
Collecto
r
−
Base Breakdown Voltage  
Emitte
r
−
Base Breakdown Voltage  
Base Cutoff Current  
(I =
 
1.0 mAdc, I
 
= 0)  
V
40  
60  
6.0  
−
−
−
Vdc  
Vdc  
C
B
(BR)CEO  
(BR)CBO  
(BR)EBO  
(I =
 
0.1 mAdc, I
 
= 0)  
V
V
C
E
(I =
 
0.1 mAdc, I
 
= 0)  
−
Vdc  
E
C
(V =
 
35 Vdc, V
 
= 0.4 Vdc)  
I
0.1  
0.1  
m
Adc  
m
Adc  
CE  
EB  
BEV  
Collector Cutoff Current  
(V =
 
35 Vdc, V
 
= 0.4 Vdc)  
I
−
CE  
EB  
CEX  
ON CHARACTERISTICS
(Note 3)  
DC Current Gain  
h
FE  
(I =
 
0.1 mAdc, V
 
= 1.0 Vdc)  
20  
40  
−
−
−
C
CE  
(I =
 
1.0 mAdc, V
 
= 1.0 Vdc)  
C
CE  
(I =
 
10 mAdc, V
 
= 1.0 Vdc)  
80  
−
C
CE  
(I =
 
150 mAdc, V
 
= 1.0 Vdc)  
100  
40  
300  
−
C
CE  
(I =
 
500 mAdc, V
 
= 2.0 Vdc)  
C
CE  
Collecto
r
−
Emitter Saturation Voltage  
Bas
e
−
Emitter Saturation Voltage  
V
Vdc  
Vdc  
CE(sat)  
(I =
 
150 mAdc, I
 
= 15 mAdc)  
−
−
0.4  
C
B
(I =
 
500 mAdc, I
 
= 50 mAdc)  
0.75  
C
B
V
BE(sat)  
(I =
 
150 mAdc, I
 
= 15 mAdc)  
0.75  
−
0.95  
1.2  
C
B
(I =
 
500 mAdc, I
 
= 50 mAdc)  
C
B
SMALL
−
SIGNAL CHARACTERISTICS  
Curren
t
−
Gain
−
Bandwidth Product  
Collector
−
Base Capacitance  
Emitter
−
Base Capacitance  
Input Impedance  
(I =
 
20 mAdc, V
 
= 10 Vdc, f = 100 MHz)  
f
T
250  
−
−
MHz  
pF  
C
CE  
(V =
 
5.0 Vdc, I
 
= 0, f = 1.0 MHz)  
C
cb  
C
eb  
6.5  
30  
CB  
E
(V =
 
0.5 Vdc, I
 
= 0, f = 1.0 MHz)  
−
pF  
EB  
C
(I =
 
1.0 mAdc, V
 
= 10 Vdc, f = 1.0 kHz)  
h
1.0  
0.1  
40  
1.0  
15  
k
W  
C
CE  
ie  
re  
fe  
−
4  
Voltage Feedback Ratio  
Smal
l
−
Signal Current Gain  
Output Admittance  
(I =
 
1.0 mAdc, V
 
= 10 Vdc, f = 1.0 kHz)  
h
h
8.0  
500  
30  
X 10  
−
C
CE  
(I =
 
1.0 mAdc, V
 
= 10 Vdc, f = 1.0 kHz)  
C
CE  
(I =
 
1.0 mAdc, V
 
= 10 Vdc, f = 1.0 kHz)  
h
oe  
m
mhos  
C
CE  
SWITCHING CHARACTERISTICS  
Delay Time  
t
−
−
−
−
15  
20  
d
(V =
 
30 Vdc, V
 
= 2.0 Vdc,  
CC  
EB  
ns  
ns  
I
= 150 mAdc, I
 
= 15 mAdc)  
C
B1  
Rise Time  
t
r
Storage Time  
t
225  
30  
s
(V =
 
30 Vdc, I
 
= 150 mAdc,  
CC  
C
I
B1  
= I
 
= 15 mAdc)  
B2  
Fall Time  
t
f
3. Pulse
 
T
e
st: Pulse Width
≤
300
m
s, Duty Cycle
≤
2.0%.  
SWITCHING TIME EQUIVALENT TEST CIRCUITS  
+ꢀ30 V  
200
W  
+ꢀ30 V  
1.0 to 100
m
s,  
1.0 to 100
m
s,  
200
W  
+16 V  
DUTY CYCLE
≈
2.0%  
+16 V  
0
DUTY CYCLE
≈
2.0%  
0
1.0 k
W  
-14 V  
1.0 k
W  
C *
 
< 10 pF  
S
-ꢀ2.0 V  
C *
 
< 10 pF  
S
< 20 ns  
< 2.0 ns  
-ꢀ4.0 V  
Scope rise time < 4.0 ns  
*
T
o
tal shunt capacitance of test jig connectors, and oscilloscope  
Figure 1. Turn
−
On Time  
Figure 2. Turn
−
Off Time  
2

MMBT4401L, SMMBT4401L  
TRANSIENT CHARACTERISTICS  
25
°
C  
100
°
C  
10  
7.0  
V
= 30 V  
CC  
I /I
 
= 10  
5.0  
C B  
3.0  
2.0  
Q
T
1.0  
0.7  
0.5  
0.3  
0.2  
Q
A
0.1  
10  
20  
30  
50 70 100  
200 300  
500  
I ,
 
COLLECTOR CURRENT (mA)  
C
Figure 3. Charge Data  
100  
70  
100  
I /I
 
= 10  
C B  
V
= 30 V  
70  
50  
CC  
I /I
 
= 10  
t
r
C B  
50  
t @
 
V =
 
30 V  
r
CC  
t @
 
V =
 
10 V  
30  
20  
30  
20  
t
f
r
CC  
t @
 
V =
 
2.0 V  
d
EB  
t @
 
V =
 
0  
d
EB  
10  
7.0  
5.0  
10  
7.0  
5.0  
10  
20  
30  
50 70
 
100  
200 300  
500  
10  
20  
30  
50 70
 
100  
200  
300  
500  
I ,
 
COLLECTOR CURRENT (mA)  
C
I ,
 
COLLECTOR CURRENT (mA)  
C
Figure 4. Turn
−
On Time  
Figure 5. Rise and Fall Times  
300  
200  
100  
70  
t
′
= t
 
– 1/8 t  
f
s
s
V
I
= 30 V  
CC  
I
= I  
B1 B2  
I /I
 
= 10 to 20  
= I  
B1 B2  
C B  
50  
I /I
 
= 20  
C B  
30  
20  
100  
70  
I /I
 
= 10  
C B  
10  
50  
7.0  
5.0  
30  
10  
20  
30  
50 70
 
100  
200 300  
500  
10  
20  
30  
50 70
 
100  
200 300  
500  
I ,
 
COLLECTOR CURRENT (mA)  
C
I ,
 
COLLECTOR CURRENT (mA)  
C
Figure 6. Storage Time  
Figure 7. Fall Time  
3

MMBT4401L, SMMBT4401L  
SMALL
−
SIGNAL CHARACTERISTICS
NOISE FIGURE  
V

CE

= 10 Vdc, T

A

= 25
°
C; Bandwidth = 1.0 Hz  
10  
8.0  
6.0  
10  
I =
 
1.0 mA, R
 
= 150
W  
S
f = 1.0 kHz  
C
I =
 
500
m
A, R
 
= 200
W  
C S  
R =
 
OPTIMUM  
S
RS =
SOURCE  
8.0  
6.0  
I =
 
100
m
A, R
 
= 2.0 k
W  
C S  
I =
 
50
m
A  
C
I =
 
50
m
A, R
 
= 4.0 k
W  
C S  
RS =
RESISTANCE  
I =
 
100
m
A  
C
I =
 
500
m
A  
C
I =
 
1.0 mA  
C
4.0  
4.0  
2.0  
0
2.0  
0
0.01 0.02 0.05 0.1 0.2
 
0.5 1.0 2.0 5.0
 
10 20  
f, FREQUENCY (kHz)  
50 100  
50 100
 
200  
500 1.0ꢁk
 
2.0ꢁk 5.0ꢁk
 
10ꢁk 20ꢁk
 
50ꢁk 100ꢁk  
R ,
 
SOURCE RESISTANCE (OHMS)  
S
Figure 8. Frequency Effects  
Figure 9. Source Resistance Effects  
h PARAMETERS  
= 10 Vdc, f = 1.0 kHz, T
 
= 25
°
C  
V
CE  
A
This group of graphs illustrates the relationship between h
 
and other “h” parameters for this series of transistors. To obtain  
fe  
these curves, a high
−
gain and a low
−
gain unit were selected from the MMBT4401LT1 lines, and the same units were used to  
develop the correspondingly numbered curves on each graph.  
50ꢁk  
MMBT4401LT1 UNIT 1  
MMBT4401LT1 UNIT 2  
20ꢁk  
10ꢁk  
5.0ꢁk  
2.0ꢁk  
1.0ꢁk  
500  
0.1  
0.2 0.3  
0.5 0.7
 
1.0  
2.0 3.0  
5.0 7.0 10  
I ,
 
COLLECTOR CURRENT (mA)  
C
Figure 10. Input Impedance  
100  
10  
7.0  
5.0  
50  
MMBT4401LT1 UNIT 1  
MMBT4401LT1 UNIT 2  
3.0  
2.0  
20  
10  
1.0  
0.7  
0.5  
MMBT4401LT1 UNIT 1  
MMBT4401LT1 UNIT 2  
5.0  
2.0  
1.0  
0.3  
0.2  
0.1  
0.2 0.3  
0.5 0.7
 
1.0  
2.0 3.0  
5.0 7.0
 
10  
0.1  
0.2 0.3  
0.5 0.7 1.0  
2.0 3.0  
5.0 7.0 10  
I ,
 
COLLECTOR CURRENT (mA)  
C
I ,
 
COLLECTOR CURRENT (mA)  
C
Figure 11. Voltage Feedback Ratio  
Figure 12. Output Admittance  
4

MMBT4401L, SMMBT4401L  
STATIC CHARACTERISTICS  
500  
450  
400  
350  
300  
250  
200  
150  
100  
V
CE  
V
CE  
V
CE  
= 5.0 V  
= 2.0 V  
= 1.0 V  
T =
 
150
°
C  
J
25
°
C  
-ꢀ55
°
C  
50  
0
0.01  
0.1  
1
I ,
 
COLLECTOR CURRENT (A)  
C
Figure 13. DC Current Gain  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
100 mA  
I =
 
1.0 mA  
C
500 mA  
10 mA  
300 mA  
0.001  
0.01  
0.1  
1
10  
100  
I ,
 
BASE CURRENT (mA)  
B
Figure 14. Collector Saturation Region  
0.35  
0.30  
0.25  
0.20  
+ꢀ0.5  
0
I /I
 
= 10  
C B  
q
for V  
CE(sat)  
VC  
-ꢀ0.5  
150
°
C  
-ꢀ1.0  
0.15  
0.10  
25
°
C  
-ꢀ1.5  
-ꢀ2.0  
-ꢀ2.5  
-55
°
C  
q
for V  
BE  
0.05  
0
VB  
0.0001  
0.001  
0.01  
0.1  
1
0.1 0.2  
0.5 1.0 2.0  
5.0 10 20  
50 100
 
200 500  
I ,
 
COLLECTOR CURRENT (A)  
C
I ,
 
COLLECTOR CURRENT (mA)  
C
Figure 15. Collector
−
Emitter Saturation  
Figure 16. Temperature Coefficients  
Voltage vs. Collector Current  
5

MMBT4401L, SMMBT4401L  
STATIC CHARACTERISTICS  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
1.0  
I /I
 
= 10  
C
B
V
CE  
= 2.0 V  
0.9  
0.8  
0.7  
0.6  
0.5  
−
55
°
C  
−
55
°
C  
25
°
C  
25
°
C  
150
°
C  
0.4  
0.3  
0.4  
0.3  
150
°
C  
0.0001  
0.001  
0.01  
0.1  
1
0.0001  
0.001  
0.01  
0.1  
1
I ,
 
COLLECTOR CURRENT (A)  
C
I ,
 
COLLECTOR CURRENT (A)  
C
Figure 17. Base
−
Emitter Saturation Voltage vs.  
Figure 18. Base
−
Emitter Turn On Voltage vs.  
Collector Current  
Collector Current  
21  
8.5  
7.5  
6.5  
5.5  
4.5  
3.5  
19  
17  
15  
13  
11  
9
2.5  
1.5  
0
1
2
3
4
5
6
0
5
10 15 20 25 30 35 40 45 50  
V ,
 
COLLECTOR BASE VOLTAGE (V)  
cb  
V
eb  
, EMITTER BASE VOLTAGE (V)  
Figure 19. Input Capacitance vs. Emitter Base  
Voltage  
Figure 20. Output Capacitance vs. Collector  
Base Voltage  
1000  
100  
10  
1
V
= 1.0 V  
CE  
10 msec  
T =
 
25
°
C  
A
1 sec  
0.1  
0.01  
0.001  
1
10  
100  
0.1  
1
10  
100  
1000  
V
CE  
, COLLECTOR EMITTER VOLTAGE (V)  
I ,
 
COLLECTOR CURRENT (mA)  
C
Figure 21. Safe Operating Area  
Figure 22. Current
−
Gain
−
Bandwidth Product  
6

MMBT4401L, SMMBT4401L  
PACKAGE DIMENSIONS  
SOT
−
23 (TO
−
236)  
CASE 318
−
08  
ISSUE AP  
NOTES:  
1. DIMENSIONING
 
AND TOLERANCING PER ANSI Y14.5M,  
1982.  
D
2. CONTROLLING
 
DIMENSION: INCH.  
3. MAXIMUM
 
LEAD THICKNESS INCLUDES LEAD FINISH  
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM  
THICKNESS OF BASE MATERIAL.  
SEE VIEW C  
3
4. DIMENSIONS
 
D AND E DO NOT INCLUDE MOLD FLASH,  
PROTRUSIONS, OR GATE BURRS.  
H
E
MILLIMETERS  
INCHES  
E
DIM  
A
MIN  
0.89  
0.01  
0.37  
0.09  
2.80  
1.20  
1.78  
0.10  
0.35  
NOM  
1.00  
0.06  
0.44  
0.13  
2.90  
1.30  
1.90  
0.20  
0.54  
MAX  
MIN  
NOM  
0.040  
0.002  
0.018  
0.005  
0.114  
0.051  
0.075  
0.008  
0.021  
MAX  
0.044  
0.004  
0.020  
0.007  
0.120  
0.055  
0.081  
0.012  
0.029  
1.11  
0.10  
0.50  
0.18  
3.04  
1.40  
2.04  
0.30  
0.69  
0.035  
0.001  
0.015  
0.003  
0.110  
0.047  
0.070  
0.004  
0.014  
c
A1  
b
c
D
E
e
L
L1  
1
2
b
0.25  
e
q
H
q
2.10  
0
°  
2.40  
−−−  
2.64  
10
°  
0.083  
0
°  
0.094  
−−−  
0.104  
10
°  
A
E
L
STYLE 6:  
PIN 1.
 
BASE  
A1  
L1  
VIEW C  
2. EMITTER  
3. COLLECTOR  
SOLDERING FOOTPRINT*  
0.95  
0.037  
0.95  
0.037  
2.0  
0.079  
0.9  
0.035  
mm  
inches  
ǒ
Ǔ
SCALE 10:1  
0.8  
0.031  
*For additional information on our Pb
−
Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting
T
e
chniques Reference Manual, SOLDERRM/D.  
ON Semiconductor
and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).
 
SCILLC reserves the right to make changes without further notice  
to any products herein.
 
SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.
 
All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.
 
SCILLC does not convey any license under its patent rights  
nor the rights of others.
 
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.
 
Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.
 
SCILLC is an Equal  
Opportunity/Affirmative Action Employer.
 
This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMEN
T
:  
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: 800
−
282
−
9855
T
o
ll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
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−
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