onsemi-MMBT6428
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MMBT6428
NPN General Purpose Amplifier
3
•
This device designed for general pupose amplifier applications at
collector currents to 300mA
•
Sourced from process 10.
2
SOT-23
Mark: 1K
1
1. Base
2. Emitter
3. Collector
Absolute Maximum Ratings*
T =25
°
C unless otherwise noted
C
Symbol
Parameter
Value
50
Units
V
V
V
Collector-Emitter Voltage
Collector-Base Voltage
Collector Current
CEO
CBO
60
V
I
– Continuous
500
mA
°
C
C
T , T
Operating and Storage Junction
T
e
mperature Range
– 55 ~ 150
J
STG
* These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
NOTES:
1) These
ratings are based on a maximum junction temperature of 150 degrees C.
Electrical Characteristics
T =25
°
C unless otherwise noted
C
Symbol
Parameter
Test Condition
Min.
Max.
Units
Off Characteristics
V
V
Collector-Emitter Breakdown Voltage *
Collector-Base BreakdownVoltage
Collector Cut-off Current
I
I
= 1.0mA, I
= 0
50
60
V
(BR)CEO
(BR)CBO
CEO
C
C
B
= 100
µ
A, I
= 0
V
E
I
I
I
V
V
V
= 30
V
, I
= 0
0.1
10
10
µ
A
nA
nA
CE
CB
EB
B
Collector Cut-off Current
= 30
V
, I
= 0
E
CBO
Emitter Cut-off Current
= 5.0V, I
= 0
B
EBO
On Characteristics
h
DC Current Gain
V
V
V
V
= 5.0V, I
= 10
µ
A
250
250
250
250
FE
CE
CE
CE
CE
C
= 5.0V, I
= 100
µ
A
650
C
= 5.0V, I
= 1.0mA
C
= 5.0V, I
= 10mA
C
V
V
(sat)
(on)
Collector-Emitter Saturation Voltage
Base-Emitter On Voltage
I
I
= 10mA, I
= 0.5mA
0.2
0.6
V
V
CE
C
C
B
= 100mA, I
= 5.0mA
B
V
= 5.0
V
, I
=
1
.0mA
0.56
100
0.66
BE
CE
C
Small Signal Characteristics
f
Current gain Bandwidth Product
V
= 5.0
V
, I
=
1
.0mA,
700
MHz
T
CE
C
f = 100MHz
C
C
Output Capacitance
Input Capacitance
V
V
= 10
V
, I
=
0
, f = 1.0MHz
3.0
8.0
pF
pF
obo
ibo
CB
EB
E
= 0.5V, I
= 0, f = 1.0MHz
C
*Pulse Test: Pulse Width
≤
300
µ
s, Duty Cycle
≤
2.0%
©2002 Fairchild Semiconductor Corporation
Rev. A, October 2002
Thermal Characteristics
T =25
°
C unless otherwise noted
A
Symbol
Parameter
Max.
Units
P
T
o
tal Device Dissipation
Derate above 25
°
C
350
2.8
mW
mW/
°
C
D
R
R
Thermal Resistance, Junction to Case
°
C/W
°
C/W
θ
JC
θ
JA
Thermal Resistance, Junction to Ambient
357
*Device mounted on FR-4 PCB 1.6″ X 1.6″ X 0.06.”
©2002 Fairchild Semiconductor Corporation
Rev. A, October 2002
Package Dimensions
SOT-23
0.40
±
0.03
0.03~0.10
0.38 REF
+0.05
–0.023
0.40
±
0.03
0.12
0.96~1.14
2.90
±
0.10
0.95
±
0.03
0.95
±
0.03
1.90
±
0.03
0.508REF
Dimensions in Millimeters
©2002 Fairchild Semiconductor Corporation
Rev. A, October 2002
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not
intended to be an exhaustive list of all such trademarks.
ACEx™
FACT™
ImpliedDisconnect™ PACMAN™
SPM™
ActiveArray™
Bottomless™
CoolFET™
CROSSVOLT
™ FRFET™
DOME™
FACT Quiet series™
ISOPLANAR™
POP™
Stealth™
FAST
®
LittleFET™
MicroFET™
MicroPak™
Power247™
PowerTrench
®
QFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
FASTr™
GlobalOptoisolator™ MICROWIRE™
QS™
EcoSPARK™
E
2
CMOS™
EnSigna™
Across the board. Around the world.™
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HiSeC™
I
2
C™
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OCX™
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OPTOLOGIC
®
OPTOPLANAR™
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Quiet Series™
TruTranslation™
RapidConfigure™
RapidConnect™
UHC™
UltraFET
®
SILENT SWITCHER
®
VCX™
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Programmable Active Droop™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR
CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or In
Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Obsolete
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
©2002 Fairchild Semiconductor Corporation
Rev. I1
