onsemi-MMBTA06WT1G

Part #onsemi-MMBTA06WT1G
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onsemi-MMBTA06WT1G
MMBTA06W, SMMBTA06W,  
Driver
T
r
ansistor  
NPN Silicon  
Moisture Sensitivity Level: 1  
ESD Rating: Human Body Model
−
4 kV  
ESD Rating:
Machine Model
−
400 V  
Features  
•
S Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AEC
−
Q101 Qualified and  
P
P
A
P Capable  
•
These Devices are Pb
−
Free, Halogen Free/BFR Free and are RoHS  
SC
−
70  
CASE 419  
STYLE 3  
Compliant*  
COLLECTOR  
3
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
80  
Unit  
Vdc  
Collector
−
Emitter Voltage  
Collector
−
Base Voltage  
V
CEO  
V
CBO  
1
80  
Vdc  
BASE  
Emitter
−
Base Voltage  
V
4.0  
Vdc  
EBO  
2
Collector Current
−
Continuous  
THERMAL CHARACTERISTICS  
Characteristic  
I
C
500  
mAdc  
EMITTER  
MARKING DIAGRAM  
Symbol  
Max  
Unit  
T
o
tal Device Dissipation FR
−
5 Board  
P
D
mW  
T =
 
25
°
C  
150  
A
GM M
G  
G
Thermal Resistance,  
Junction to Ambient  
R
°
C/W  
°
C  
q
JA  
833  
1
Junction and Storage
T
e
mperature  
T , T  
J
−
55 to +150  
stg  
GM  
M
G
= Specific Device Code  
= Date Code  
= Pb
−
Free Package  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommende
d
O
perating Conditions may affect device reliability.  
(Note: Microdot may be in either location)  
*Date Code orientation may vary depending upon  
manufacturin
g
l
ocation.  
ORDERING INFORMATION  
†
Device  
Package  
Shipping  
MMB
T
A
06WT1G  
SC
−
70  
3,000 /  
(Pb
−
Free)  
T
a
pe & Reel  
SMMB
T
A
06WT1G  
SMMB
T
A
06WT3G  
SC
−
70  
(Pb
−
Free)  
3,000 /  
T
a
pe & Reel  
SC
−
70  
10,000 /  
(Pb
−
Free)  
T
a
pe & Reel  
†
For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our
T
a
pe and Reel Packaging Specifications  
Brochure, BRD8011/D.  
*For additional information on our Pb
−
Free strategy and soldering details, please  
downloa
d
t
he ON Semiconductor Soldering and Mounting
T
e
chniques Reference  
Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
Novembe
r
,
2
012
−
Rev. 4  
MMB
T
A
06WT1/D  

MMBTA06W, SMMBTA06W,  
ELECTRICAL CHARACTERISTICS
(T =
 
25
°
C unless otherwise noted)  
A
Characteristic  
Symbol  
Min  
Max  
Unit  
OFF CHARACTERISTICS  
Collector
−
Emitter Breakdown V

)  
(I =
 
1.0 mAdc, I
 
= 0)  
V
Vdc  
Vdc  
(BR)CEO  
80  
4.0  
−
−
C
B
Emitter
−
Base Breakdown Voltage  
(I =
 
100
m
Adc, I
 
= 0)  
V
(BR)EBO  
−
E
C
Collector Cutoff Current  
(V =
 
60 Vdc, I
 
= 0)  
I
m
Adc  
m
Adc  
CES  
0.1  
0.1  
CE  
B
Collector Cutoff Current  
(V =
 
80 Vdc, I
 
= 0)  
I
CBO  
−
CB  
E
ON CHARACTERISTICS  
DC Current Gain  
h
FE  
−
(I =
 
10 mAdc, V
 
= 1.0 Vdc)  
100  
100  
−
−
C
CE  
(I =
 
100 mAdc, V
 
= 1.0 Vdc)  
C
CE  
Collector
−
Emitter Saturation Voltage  
(I =
 
100 mAdc, I
 
= 10 mAdc)  
V
Vdc  
Vdc  
CE(sat)  
−
−
0.25  
1.2  
C
B
Base
−
Emitter On Voltage  
(I =
 
100 mAdc, V
 
= 1.0 Vdc)  
V
BE(on)  
C
CE  
SMALL
−
SIGNAL CHARACTERISTICS  
Current
−
Gain
−

)  
f
T
MHz  
(I =
 
10 mA, V
 
= 2.0
V
, f = 100 MHz)  
100  
−
C
CE  
1. Pulse
 
T
e
st: Pulse Width
≤
300
m
s, Duty Cycle
≤
2.0%.  
2. f is
 
defined as the frequency at which |h
 
| extrapolates to unity.  
T
fe  
TURN-ON TIME  
TURN-OFF TIME  
V
V
+V  
BB  
CC  
CC  
-1.0 V  
+40 V  
+40 V  
5.0
m
s  
100  
R
100  
R
L
L
OUTPUT  
OUTPUT  
+10 V  
0
V
in  
R
V
in  
R
B
B
t =
 
3.0 ns  
r
* C
 
t
6.0 pF  
S
* C
 
t
6.0 pF  
S
5.0
m
F  
5.0
m
F  
100  
100  
5.0
m
s  
t =
 
3.0 ns  
r
*
T
o
tal Shunt Capacitance of
T
e
st Jig and Connectors  
For PNP
T
e
st Circuits, Reverse All Voltage Polarities  
Figure 1. Switching Time Test Circuits  
2
 

MMBTA06W, SMMBTA06W,  
300  
200  
80  
60  
T =
 
25
°
C  
J
V
= 2.0 V  
CE  
T =
 
25
°
C  
J
40  
C
ibo  
20  
100  
70  
10  
8.0  
50  
C
6.0  
obo  
30  
4.0  
2.0 3.0  
5.0 7.0
 
10  
20 30  
50 70
 
100  
200  
0.1 0.2  
0.5 1.0 2.0  
5.0  
10  
20  
50 100  
I ,
 
COLLECTOR CURRENT (mA)  
C
V ,
 
REVERSE VOLTAGE (VOLTS)  
R
Figure 2. Current
−
Gain — Bandwidth Product  
Figure 3. Capacitance  
1.0 k  
1.0 k  
700  
100
m
s  
700  
500  
1.0 ms  
500  
t
s
300  
200  
300  
200  
1.0 s  
T
= 25
°
C  
C
T =
 
25
°
C  
A
100  
70  
100  
70  
t
f
50  
50  
CURRENT LIMIT  
THERMAL LIMIT  
SECOND BREAKDOWN LIMIT  
V
= 40 V  
CC  
30  
20  
30  
20  
I /I
 
= 10  
C
t
B
= I  
r
I
B1 B2  
t @
 
V  
d
= 0.5 V  
BE(off)  
T =
 
25
°
C  
J
10  
10  
5.0 7.0 10  
20 30  
50 70 100  
1.0  
2.0 3.0  
5.0 7.0
 
10  
20 30  
50 70 100  
200 300  
500  
I ,
 
COLLECTOR CURRENT (mA)  
C
V
CE  
, COLLECTOR-EMITTER VOLTAGE (VOLTS)  
Figure 4. Switching Time  
Figure 5. Active
−
Region Safe Operating Area  
400  
200  
1.0  
0.8  
0.6  
0.4  
T =
 
25
°
C  
J
T =
 
125
°
C  
J
V
CE  
= 1.0 V  
V
@ I
 
/I =
 
10  
C B  
BE(sat)  
25
°
C  
V
BE(on)  
@ V
 
= 1.0 V  
CE  
-55
°
C  
100  
80  
0.2  
0
60  
V
@ I
 
/I =
 
10  
C B  
CE(sat)  
40  
0.5 1.0
 
2.0 3.0
 
5.0 10  
20 30
 
50 100
 
200 300 500  
0.5  
1.0 2.0  
5.0  
10  
20  
50  
100 200  
500  
I ,
 
COLLECTOR CURRENT (mA)  
C
I ,
 
COLLECTOR CURRENT (mA)  
C
Figure 6. DC Current Gain  
Figure 7. “ON” Voltages  
3

MMBTA06W, SMMBTA06W,  
1.0  
0.8  
0.6  
-0.8  
T =
 
25
°
C  
J
-1.2  
I
=
I
=
I
=
I =  
C
C
C
C
250 mA  
100 mA  
50 mA  
500 mA  
-1.6  
-2.0  
R
for V  
BE  
q
VB  
0.4  
0.2  
0
I
=
C
10 mA  
-2.4  
-2.8  
0.05 0.1
 
0.2  
0.5  
1.0 2.0  
5.0  
10  
20  
0.5  
1.0 2.0  
5.0  
10  
20  
50  
100 200  
500  
50  
I ,
 
BASE CURRENT (mA)  
B
I ,
 
COLLECTOR CURRENT (mA)  
C
Figure 8. Collector Saturation Region  
Figure 9. Base
−
Emitter Temperature  
Coefficient  
4

MMBTA06W, SMMBTA06W,  
PACKAGE DIMENSIONS  
SC
−
70 (SOT
−
323)  
CASE 419
−
04  
ISSUE N  
NOTES:  
1. DIMENSIONING
 
AND TOLERANCING PER ANSI Y14.5M, 1982.  
2. CONTROLLING
 
DIMENSION: INCH.  
D
e1  
MILLIMETERS  
INCHES  
DIM  
A
A1  
A2  
b
c
D
E
e
e1  
L
MIN  
0.80  
0.00  
NOM  
0.90  
0.05  
0.70 REF  
0.35  
0.18  
2.10  
1.24  
1.30  
0.65 BSC  
0.38  
MAX  
1.00  
0.10  
MIN  
0.032  
0.000  
NOM  
0.035  
0.002  
0.028 REF  
0.014  
0.007  
0.083  
0.049  
0.051  
0.026 BSC  
0.015  
MAX  
0.040  
0.004  
3
E
H
E
1
2
0.30  
0.10  
1.80  
1.15  
1.20  
0.40  
0.25  
2.20  
1.35  
1.40  
0.012  
0.004  
0.071  
0.045  
0.047  
0.016  
0.010  
0.087  
0.053  
0.055  
b
e
0.20  
2.00  
0.56  
2.40  
0.008  
0.079  
0.022  
0.095  
H
2.10  
0.083  
E
STYLE 3:  
c
PIN 1.
 
BASE  
2. EMITTER  
3. COLLECTOR  
A
A2  
0.05 (0.002)  
L
A1  
SOLDERING FOOTPRINT*  
0.65  
0.025  
0.65  
0.025  
1.9  
0.075  
0.9  
0.035  
0.7  
0.028  
mm  
ǒ

inches  

Ǔ
SCALE 10:1  
*For additional information on our Pb
−
Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mountin
g
T
e
chniques Reference Manual, SOLDERRM/D.  
ON Semiconductor
and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).
 
SCILLC reserves the right to make changes without further notice  
to any products herein.
 
SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any  
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental  
damages. “Typical”
 
parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over  
time. All
 
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.
 
SCILLC does not convey any license under  
its patent rights nor the rights of others.
 
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,  
or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death  
may occur.
 
Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,  
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of  
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  
SCILLC is an Equal Opportunity/Affirmative Action Employer.
 
This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLIC
A
T
ION ORDERING INFORMATION  
LITERATURE FULFILLMEN
T
:  
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: 800
−
282
−
9855
T
o
ll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81
−
3
−
5817
−
1050  
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:
ww
w
.
onsemi.com  
Literature Distribution Center for ON Semiconductor  
P
.
O. Box 5163, Denver, Colorado 80217 USA  
Phone
: 303
−
675
−
2175 or 800
−
344
−
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o
ll Free USA/Canada  
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: 303
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−
2176 or 800
−
344
−
3867
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o
ll Free USA/Canada  
Email
: orderlit@onsemi.com  
For additional information, please contact your loca  
Sales Representative  
MMB
T
A
06WT1/D