onsemi-MPSA29-D26Z

Part #onsemi-MPSA29-D26Z
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onsemi-MPSA29-D26Z
MPSA29  
NPN Darlington Transistor  
Description  
This device is designed for applications requiring extremely  
high current gain at collector currents to 500 mA. Sourced  
from process 03. See MPSA28 for characteristics.  
TO-92  
1. Emitter  
2. Base  
3. Collector  
1
1
2
2
3
3
Straight Lead  
Bulk Packing  
Bent Lead  
Tape & Reel  
Ammo Packing  
Ordering Information  
Part Number  
MPSA29  
Top Mark  
MPSA29  
MPSA29  
Package  
Packing Method  
TO-92 3L  
TO-92 3L  
Bulk  
MPSA29
–
D26Z  
T
a
pe and Reel  
Absolute Maximum Ratings

(1), (2)  

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-  
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-  
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The  
absolute maximum ratings are stress ratings only. Values are at T

A

= 25°C unless otherwise noted.  
Symbol  
V

CEO  

V

CBO  

V

EBO  

I

C  

Parameter  
Value  
100  
Unit  
V
Collector-Emitter Voltage  
Collector-Base Voltage  
Emitter-Base Voltage  
100  
V
12  
V
Collector Current – Continuous  
800  
mA  
°
C  
T

J

, T

STG

Operating and Storage Junction
T
e
mperature Range  
Notes:  
1.
These ratings are based on a maximum junction temperature of 150
°
C.  
-55 to +150  
2.
These are steady-state limits.
ON
Semiconductor should be consulted on applications involving pulsed or low-  
duty-cycle operations.  
Publication Order Number:  
MPSA29/D  
© 1997
Semiconductor Components Industries, LLC.  
October-2017,
Rev.
2  

Thermal Characteristics

(3)  

Values are at T

A

= 25°C unless otherwise noted.  
Symbol  
Parameter  
Max.  
625  
5.0  
Unit  
mW  
T
o
tal Device Dissipation  
P

D  

Derate Above 25
°
C  
mW/
°
C  
°
C/W  
°
C/W  
R

θ
JC  

R

θ
JA  

Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient  
83.3  
200  
Note:  
3. PCB size: FR-4, 76 mm x 114 mm x 1.57 mm (3.0 inch x 4.5 inch x 0.062 inch) with minimum land pattern size.  
Electrical Characteristics

(4)  

Values are at T

A

= 25°C unless otherwise noted.  
Symbol  
BV

CEO  

BV

CBO  

BV

EBO  

I

CBO  

Parameter  
Conditions  
Min.  
100  
100  
12  
Max.  
Unit  
V
Collector-Emitter Breakdown Voltage
 
I

C

= 100
μ
A, I

B

= 0  
Collector-Base Breakdown Voltage  
Emitter-Base Breakdown Voltage  
Collector Cut-Off Current  
I

C

= 100
μ
A, I

E

= 0  
I

E

= 10
μ
A, I

C

= 0  
V

CB

= 80 V, I

E

= 0  
V

CE

= 80 V, I

E

= 0  
V

EB

= 10 V, I

C

= 0  
V
V
100  
500  
100  
nA  
nA  
nA  
I

CES  

Collector Cut-Off Current  
I

EBO  

Emitter Cut-Off Current  
V

CE

= 5.0
V
,
I

C

= 10 mA  
10,000  
10,000  
h

FE  

DC Current Gain  
V

CE

= 5.0
V
,
I

C

= 100 mA  
I

C

= 10 mA, I

B

= 0.01 mA  
I

C

= 100 mA, I

B

= 0.1 mA  
I

C

= 100 mA, V

CE

= 5.0V  
1.2  
1.5  
2.0  
V

CE

(sat) Collector-Emitter
 
Saturation Voltage  
V
V

BE

(on)  
f

T  

Base-Emitter On Voltage  
V
I

C

= 10 mA, V

CE

= 5.0
V
,  
f = 100 MHz  
Current Gain – Bandwidth Product  
125  
MHz  
V

CB

= 10
V
,
I

E

= 0,  
f = 1.0 MHz  
C

obo  

Output Capacitance  
8.0  
pF  
Note:  
4. Pulse test: pulse width
≤
300
μ
s, duty cycle
≤
2.0%  
2

Physical Dimensions  
Figure 1. 3-Lead, TO-92, Molded, STD Straight Lead, Bulk Type  
3

Physical Dimensions
(Continued)  
Figure 2. 3-Lead, TO-92, Molded, 0.2 In Line Spacing Lead Form, Ammo, Tape and Reel Type  
4

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