onsemi-MPSH17RLRA

MPSH17  

Preferred Device  

CATV Transistor  

NPN Silicon  

Features  

•

Pb−Free Package is Available*  

COLLECTOR  

3

MAXIMUM RATINGS  

Rating  

Collecto

r

−

E

mitter Voltage  

Collecto

r

−

B

ase Voltage  

Emitte

r

−

B

ase Voltage  

Symbol  

Value  

15  

Unit  

Vdc  

Vdc  

Vdc  

1

BASE  

V

CEO  

V

CBO  

V

EBO  

20  

2

3.0  

EMITTER  

T

o

tal Device Dissipation @ T

 

= 25

°

C  

P

350  

2.81  

mW  

mW/

°

C  

A

D

Derate above 25

°

C  

MARKING  

DIAGRAM  

Operating and Storage Junction  

T

e

mperature Range  

T , T  

−55 to +150  

°

C  

J

stg  

THERMAL CHARACTERISTICS  

Characteristic  

Symbol  

Max  

Unit  

MPS  

H17  

Thermal Resistance, Junction to Ambient  

(Printed Circuit Board Mounting)  

R

q

JA  

357  

°

C/W  

AYWW

G  

TO−92  

CASE 29−11  

STYLE 2  

G

Maximum ratings are those values beyond which device damage can occur.  

Maximum ratings applied to the device are individual stress limit values (not  

normal operating conditions) and are not valid simultaneously. If these limits are  

exceeded, device functional operation is not implied, damage may occur and  

reliability may be affected.  

1

2

3

MPSH17 =

 

Device Code  

A

= Assembly Location  

Y

= Year  

WW  

G

= Work Week  

= Pb−Free Package  

(Note: Microdot may be in either location)  

ORDERING INFORMATION  

†

Device  

Package  

Shipping  

MPSH17  

TO−92  

5,000 Units/Box  

5,000 Units/Box  

MPSH17G  

TO−92  

(Pb−Free)  

MPSH17RLRA  

TO−92  

2,000/Tape & Reel  

2,000/Tape & Reel  

MPSH17RLRAG  

TO−92  

(Pb−Free)  

†For information on tape and reel specifications,  

including part orientation and tape sizes, please  

refer to our

T

a

pe and Reel Packaging Specifications  

Brochure, BRD8011/D.  

Preferred

devices are recommended choices for future use  

and best overall value.  

*For additional information on our Pb−Free strategy and soldering details, please  

download the ON Semiconductor Soldering and Mounting

T

e

chniques  

Reference Manual, SOLDERRM/D.  

©

Semiconductor Components Industries, LLC, 2006  

1

Publication Order Number:  

January, 2006 − Rev. 3  

MPSH17/D  

MPSH17  

ELECTRICAL CHARACTERISTICS

(T =

 

25

°

C unless otherwise noted)  

A

Characteristic  

OFF CHARACTERISTICS  

Symbol  

Min  

Typ  

Max  

Unit  

Collecto

r

−

E

mitter Breakdown Voltage  

V

15  

20  

3.0  

−

−

−

−

−

−

−

Vdc  

Vdc  

(BR)CEO  

(BR)CBO  

(BR)EBO  

(I =

 

1.0 mAdc, I

 

= 0)  

C

B

Collecto

r

−

B

ase Breakdown Voltage  

(I =

 

100

m

Adc, I

 

= 0)  

V

V

C

E

Emitte

r

−

B

ase Breakdown Voltage  

−

Vdc  

(I =

 

10

m

Adc, I

 

= 0)  

E

C

Collector Cutoff Current  

I

100  

nAdc  

CBO  

(V =

 

15 Vdc, I

 

= 0)  

CB  

E

ON CHARACTERISTICS  

DC Current Gain  

h

25  

−

−

−

250  

0.5  

−

−

FE  

(I =

 

5.0 mAdc, V

 

= 10 Vdc)  

C

CE  

Collector−Emitter Saturation Voltage  

(I =

 

10 mAdc, I

 

= 1.0 mAdc)  

V

CE(sat)  

C

B

SMALL

−

S

IGNAL CHARACTERISTICS  

Curren

t

−

G

ain − Bandwidth Product  

f

800  

0.3  

30  

−

−

−

−

−

−

0.9  

−

MHz  

pF  

−

T

(I =

 

5.0 mAdc, V

 

= 10 Vdc, f = 100 MHz)  

C

CE  

Collector−Base Capacitance  

C

h

cb  

(V =

 

10 Vdc, f = 1.0 MHz)  

CB  

Small−Signal Current Gain  

fe  

(I =

 

5.0 mAdc, V

 

= 10 Vdc, f = 1.0 kHz)  

C

CE  

Noise Figure  

NF  

6.0  

dB  

(I =

 

5.0 mAdc, V

 

= 12 Vdc, R

 

= 50

W

, f = 200 MHz)  

C

CC  

S

FUNCTIONAL TEST  

Amplifier Power Gain  

G

−

24  

−

dB  

pe  

(I =

 

5.0 mAdc, V

 

= 12 Vdc, R

 

= 50

W

, f = 200 MHz)  

C

CC  

S

2

MPSH17  

PACKAGE DIMENSIONS  

TO−92 (TO−226)  

CASE 29−11  

ISSUE AL  

NOTES:  

1. DIMENSIONING

 

AND TOLERANCING PER ANSI  

Y14.5M, 1982.  

A

B

2. CONTROLLING

 

DIMENSION: INCH.  

3. CONTOUR

 

OF PACKAGE BEYOND DIMENSION R  

IS UNCONTROLLED.  

R

4. LEAD

 

DIMENSION IS UNCONTROLLED IN P AND  

BEYOND DIMENSION K MINIMUM.  

P

L

INCHES  

DIM MIN

 

MAX  

MILLIMETERS  

SEATING  

PLANE  

MIN  

4.45  

4.32  

3.18  

0.407  

1.15  

2.42  

0.39  

MAX  

5.20  

5.33  

4.19  

0.533  

1.39  

2.66  

0.50  

−−−  

K

A

B

C

D

G

H

J

0.175  

0.170  

0.125  

0.016  

0.045  

0.095  

0.015  

0.500  

0.250  

0.080  

0.205  

0.210  

0.165  

0.021  

0.055  

0.105  

0.020  

D

X X  

G

K

L

−−− 12.70  

J

H

V

−−−  

6.35  

2.04  

−−−  

−−−  

N

P

R

V

0.105  

2.66  

2.54  

−−−  

C

−−− 0.100  

SECTION X−X  

0.115  

0.135  

−−−  

−−−  

2.93  

3.43  

1

−−−  

N

STYLE 2:  

PIN 1.

 

BASE  

2. EMITTER  

3. COLLECTOR  

N

ON Semiconductor

and  

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).

 

SCILLC reserves the right to make changes without further notice  

to any products herein.

 

SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.

 

All  

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.

 

SCILLC does not convey any license under its patent rights  

nor the rights of others.

 

SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.

 

Should  

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.

 

SCILLC is an Equal  

Opportunity/Affirmative Action Employer.

 

This literature is subject to all applicable copyright laws and is not for resale in any manner.  

PUBLICATION ORDERING INFORMATION  

LITERATURE FULFILLMEN

T

:  

N. American Technical Support

: 800−282−9855

T

o

ll Free  

USA/Canada  

ON Semiconductor Website

Order Literature

Literature Distribution Center for ON Semiconductor  

P

.

O. Box 61312, Phoenix, Arizona 85082−1312 USA  

Phone

: 480−829−7710 or 800−344−3860

T

o

ll Free USA/Canada  

Fax

: 480−829−7709 or 800−344−3867

T

o

ll Free USA/Canada  

Email

: orderlit@onsemi.com  

Japan

: ON Semiconductor, Japan Customer Focus Center  

2−9−1 Kamimeguro, Meguro−ku,

T

o

kyo, Japan 153−0051  

Phone

: 81−3−5773−3850  

For additional information, please contact your  

local Sales Representative.  

MPSH17/D  

3