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August 1996
NDT014L
N-Channel Logic Level Enhancement Mode Field Effect Transistor
General Description
Features
2.8 A, 60 V. R
DS(ON)
= 0.2
W
@ V
GS
= 4.5
V
These N-Channel logic level enhancement mode power field
effect transistors are produced using Fairchild’s proprietary,
high cell density, DMOS technology.This very high density
process is especially tailored to minimize on-state resistance,
provide superior switching performance, and withstand high
energy pulses in the avalanche and commutation
modes.Thesedevices are particularly suited for low voltage
applications such as DC motor control and DC/DC
conversion where fast
switching, low in-line
power loss, and
resistance to transients
are needed.
R
DS(ON)
= 0.16
W
@ V
GS
= 10 V.
High density cell design for extremely low R
DS(ON)
.
High power and current handling capability in a widely used
surface mount package.
_________________________________________________________________________________
D
D
S
G
D
S
G
Absolute Maximum Ratings
T
A
= 25°C unless otherwise noted
Symbol Parameter
NDT014L
60
Units
V
DSS
V
GSS
I
D
Drain-Source Voltage
Gate-Source Voltage
V
V
A
± 20
Drain Current
– Continuous
– Pulsed
(Note 1a)
(Note 1a)
± 2.8
± 10
Maximum Power Dissipation
3
W
P
D
(Note 1b)
(Note 1c)
1.3
1.1
T
J
,T
STG
Operating and Storage Temperature Range
-65 to 150
°C
THERMAL CHARACTERISTICS
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
(Note 1a)
(Note 1)
42
12
°C/W
°C/W
R
JA
q
R
JC
q
©
1
997
F
a
i
r
c
h
i
ld
S
em
i
c
onductor Corporat
i
o
n
NDT014L Rev.D
Electrical Characteristics
(T
A
= 25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
OFF CHARACTERISTICS
BV
DSS
I
DSS
Drain-Source Breakdown Voltage
V
GS
= 0
V, I
D
= 250 µA
V
DS
= 60
V, V
GS
= 0
V
60
V
Zero Gate Voltage
Drain Current
25
µA
µA
nA
nA
250
100
-100
T
J
= 55°C
I
GSSF
I
GSSR
Gate – Body Leakage, Forward
Gate – Body Leakage, Reverse
V
GS
= 20
V, V
DS
= 0
V
V
GS
= -20
V, V
DS
= 0
V
ON CHARACTERISTICS
(Note 2)
V
GS(th)
Gate Threshold Voltage
V
DS
= V
GS
, I
D
= 250
µA
V
GS
= 4.5 V, I
D
= 2.8
A
1
1.5
1.1
3
V
0.8
2
T
J
= 125°C
T
J
= 125°C
Static Drain-Source On-Resistance
0.17
0.22
0.12
0.2
0.36
0.16
R
DS(ON)
W
V
GS
= 10 V,
I
D
= 3.4 A
V
GS
= 4.5
V , V
DS
= 5
V
V
GS
= 10 V, V
DS
= 5
V
V
GS
= 5 V,
I
D
= 2.8 A
I
D(on)
On-State Drain Current
5
A
S
10
G
FS
Forward Transconductance
4.2
DYNAMIC CHARACTERISTICS
Input Capacitance
214
70
pF
pF
pF
C
iss
C
oss
C
rss
V
DS
= 30 V,
V
GS
= 0 V,
f = 1.0 MHz
Output Capacitance
Reverse Transfer Capacitance
27
SWITCHING CHARACTERISTICS
(Note 2)
Turn – On Delay Time
Turn – On Rise Time
Turn – Off Delay Time
Turn – Off Fall Time
Total Gate Charge
6
12
25
28
18
5
ns
ns
t
D(on)
t
r
t
D(off)
t
f
V
DD
= 30 V, I
D
= 3 A,
V
GEN
= 10 V, R
GEN
= 12
W
14
15
10
3.6
0.8
1.4
ns
ns
nC
nC
nC
Q
g
Q
gs
Q
gd
V
DS
= 10 V,
I
D
= 2.8 A, V
GS
= 4.5 V
Gate-Source Charge
Gate-Drain Charge
NDT014L Rev.D
Electrical Characteristics
(T
A
= 25°C unless otherwise noted)
Symbol Parameter
Conditions
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
Min
Typ
Max
Units
I
S
Maximum Continuous Drain-Source Diode Forward Current
2.3
1.3
A
V
Drain-Source Diode Forward Voltage
Reverse Recovery Time
0.85
V
SD
V
GS
= 0 V, I
S
= 2.3
A
(Note 2)
t
rr
V
GS
= 0
V, I
F
= 2.3 A
dI
F
/dt = 100 A/µs
140
ns
Notes:
T
R
–
T
T
–
T
J
J
A
A
( )
2
( )
=
I
D
t
´
R
DS
(
ON
)
@
T
R
q
JA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the
J
( )
t
1.
P
D
t
=
=
( )
t
R
+
R
q
JA
q
JC
q
CA
solder mounting surface of the drain pins. R
q
JC
is guaranteed by design while R
q
CA
is defined by users. For general reference: Applications on 4.5″x5″ FR-4 PCB under still air environment, typical
R
q
JA
is found to be:
a. 42
o
C/W with 1 in
2
of 2 oz copper mounting pad.
b. 95
o
C/W with 0.066 in
2
of 2 oz copper mounting pad.
c. 110
o
C/W with 0.0123 in
2
of 2 oz copper mounting pad.
1c
1b
1a
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.
NDT014L Rev.D
Typical Electrical Characteristics
2
1.75
1.5
10
V
GS
= 10V
6.0
5.0
4.5
4.0
8
6
4
2
0
V
GS
=3.0V
3.5
3.5
1.25
1
4.0
4.5
3.0
5.0
6.0
8
0.75
0.5
10
2.5
0
2
4
6
10
0
1
2
3
4
5
I
, DRAIN CURRENT (A)
V
, DRAIN-SOURCE VOLTAGE (V)
DS
D
Figure 2. On-Resistance Variation with Gate
Voltage and Drain Current.
Figure 1. On-Region Characteristics.
1.75
2
V
GS
= 4.5V
I
D
= 2.8A
T =
125°C
J
1.75
1.5
1.25
1
V
GS
= 4.5V
1.5
1.25
1
25°C
0.75
0.5
-55°C
0.75
0.5
-50
-25
0
25
50
75
100
125
150
0
2
4
6
8
10
T
, JUNCTION TEMPERATURE (°C)
I
, DRAIN CURRENT (A)
J
D
Figure 3. On-Resistance Variation with
Temperature.
Figure 4. On-Resistance Variation with Drain
Current and Temperature.
1.2
10
8
T
J
= -55°C
V
DS
= V
GS
V
DS
= 5V
25°C
125°C
I
D
= 250µA
1.1
1
0.9
0.8
0.7
6
4
2
0
0
1
2
3
4
5
6
-50
-25
0
25
50
75
100
125
150
V
, GATE TO SOURCE VOLTAGE (V)
T ,
JUNCTION TEMPER
A
T
URE (°C)
GS
J
Figure 5. Transfer Characteristics.
Figure 6. Gate Threshold Variation with
Temperature.
NDT014L Rev.D
Typical Electrical Characteristics
10
1
1.12
V
GS
= 0V
I
D
= 250µA
1.08
1.04
1
T
= 125°C
J
0.1
25°C
0.01
0.001
0.0001
-55°C
0.96
0.92
-50
-25
0
25
50
75
100
125
150
0.2
0.4
0.6
0.8
1
1.2
T
, JUNCTION TEMPERATURE (°C)
J
V
, BODY DIODE FORWARD VOLTAGE (V)
SD
Figure 8. Body Diode Forward Voltage Variation
Figure 7. Breakdown Voltage Variation with
Temperature.
with Current and Temperature
.
10
700
500
V
DS
= 5V
I
D
= 2.8A
10V
20V
C
8
6
4
2
0
iss
200
C
oss
100
50
C
rss
f = 1 MHz
V
GS
= 0V
20
10
0.1
0.2
0.5
V
1
2
5
10
20
40 60
0
2
4
6
8
10
, DRAIN TO SOURCE VOLTAGE (V)
Q
, GATE CHARGE (nC)
DS
g
Figure 9. Capacitance Characteristics.
Figure 10. Gate Charge Characteristics.
t
o
n
t
off
V
DD
t
d(off)
t
d(on)
t
r
t
f
R
L
V
IN
90%
90%
D
V
O
UT
V
V
G
S
OUT
R
GEN
10%
10%
DUT
G
INVERTED
90%
S
V
50%
50%
IN
10%
PULSE WIDTH
Figure 11. Switching Test Circuit
.
Figure 12. Switching Waveforms
.
NDT014L Rev.D
Typical Thermal Characteristics
3.5
3
8
V
DS
= 5V
1a
T =
-55°C
J
6
4
2
0
2.5
2
25°C
125°C
1.5
1
1b
1c
4.5″x5″ FR-4 Board
T
A
25
o
Still Air
=
C
0.5
0
0.2
0.4
0.6
0.8
1
0
2
4
6
8
10
2
2oz COPPER MOUNTING PAD AREA (in
)
I
, DRAIN CURRENT (A)
D
Figure 14. SOT-223 Maximum Steady- State
Power Dissipation versus Copper
Mounting Pad Area.
Figure 13. Transconductance Variation with Drain
Current and Temperature.
20
10
5
4
3
2
1
0
1a
1
1 b
0.5
1c
V
GS
= 4.5V
SINGLE PULSE
0.1
4 .5″x5″
FR-4 Board
T
A
2
5
o
Still Air
4.5V
R
JA
=See Note1c
T
A
= 25°C
q
=
C
0.05
V
=
GS
0.01
0.1
0
0.1
0.2
0.3
0.4
0.5
0.5
V
1
2
5
10
30
50
80
2
2oz COPPER MOUNTING PAD AREA (in
)
, DRAIN-SOURCE VOLTAGE (V)
DS
Figure 15. Maximum Steady- State Drain
Current versus Copper Mounting Pad
Area.
Figure 16. Maximum Safe Operating Area
.
1
0.5
D = 0.5
0.2
0.2
0.1
R
(t) = r(t)
* R
JA
JA
q
q
0.1
R
= See Note 1 c
JA
q
0.05
0.05
P(pk)
0.02
0.01
0.02
0.01
t
1
t
2
0.005
T
– T
= P
* R
(t)
J
A
JA
Single Pulse
q
Duty Cycle, D = t
1
/
t
2
0.002
0.001
0.0001
0.001
0.01
0.1
, TIME (sec)
1
10
100
300
t
1
Figure 17. Typical Transient Thermal Impedance Curve
.
Remark: Thermal characterization performed under the conditions of Note 1c.
Should better thermal design employs, R
q
JA
will be
lower and reach thermal equivalent sooner.
NDT014L Rev.D
SOT-223 Tape and Reel Data and Package Dimensions
SOT-223 Packaging
Configuration:
Figure 1.0
Customized Label
Packaging Description:
SOT-223 parts are shipped in tape. The carrier tape is
made from
dissipative (carbon filled) polycarbonate
a
resin. The cover tape is a multilayer film (Heat Activated
Adhesive in nature) primarily composed of polyester film,
adhesive layer, sealant, and anti-static sprayed agent.
These reeled parts in standard option are shipped with
2,500 units per 13″ or 330cm diameter reel. The reels are
dark blue in color and is made of polystyrene plastic (anti-
static coated). Other option comes in 500 units per 7″ or
177cm diameter reel. This and some other options are
further described in the Packaging Information table.
F63TNR Label
Antistatic Cover Tape
These full reels are individually barcode labeled and
placed inside
a standard intermediate box (illustrated in
figure 1.0) made of recyclable corrugated brown paper.
One box contains two reels maximum. And these boxes
are placed inside
a barcode labeled shipping box which
comes in different sizes depending on the number of parts
shipped.
Static Dissipative
Embossed Carrier Tape
852
F
852
F
852
F
852
F
014
014
014
014
SOT-223 Packaging Information
Standard
(no flow code)
Packaging Option
D84Z
SOT-223 Unit Orientation
Packaging type
TNR
TNR
500
Qty per Reel/Tube/Bag
Reel Size
2,500
13″ Dia
7″ Dia
Box Dimension (mm)
Max qty per Box
343x64x343 184x187x47
5,000
0.1246
0.7250
1,000
0.1246
0.1532
343mm x 342mm x 64mm
Weight per unit (gm)
Weight per Reel (kg)
F63TNR Label
Intermediate box for Standard
Note/Comments
F63TNR Label
F63TNR Label sample
184mm x 184mm x 47mm
Pizza Box for D84Z Option
LOT: CBVK741B019
QTY: 3000
SPEC:
FSID: PN2222A
SOT-223 Tape Leader and Trailer
Configuration:
Figure 2.0
D/C1: D9842
D/C2:
QTY1:
QTY2:
SPEC REV:
CPN:
N/F: F
(F63TNR)3
Carrier Tape
Cover Tape
Components
Trailer Tape
Leader Tape
300mm minimum or
38 empty pockets
500mm minimum or
62 empty pockets
September 1999, Rev. B
SOT-223 Tape and Reel Data and Package Dimensions, continued
SOT-223 Embossed Carrier Tape
Configuration:
Figure 3.0
P0
D0
T
E1
E2
F
W
K0
Wc
B0
Tc
A0
D1
P1
User Direction of Feed
Dimensions are in millimeter
A0
B0
W
D0
D1
E1
E2
F
P1
P0
K0
T
Wc
Tc
Pkg type
0.292
+/-
0.0130
SOT-223
(12mm)
6.83
+/-0.10
7.42
+/-0.10
12.0
+/-0.3
1.55
+/-0.05
1.50
+/-0.10
1.75
+/-0.10
10.25
min
5.50
+/-0.05
8.0
+/-0.1
4.0
+/-0.1
1.88
+/-0.10
9.5
+/-0.025
0.06
+/-0.02
Notes: A0,
B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481
rotational and lateral movement requirements (see sketches A, B, and C).
0.5mm
maximum
20 deg maximum
Typical
component
cavity
center line
0.5mm
maximum
B0
20 deg maximum component rotation
Typical
component
center line
Sketch A (Side or Front Sectional View)
Component Rotation
Sketch C (Top View)
Component lateral movement
A0
Sketch B (Top View)
Component Rotation
SOT-223 Reel Configuration:
Figure 4.0
W1 Measured at Hub
Dim A
Max
Dim A
max
See detail AA
Dim N
7
“
D
iameter Option
B Min
Dim C
See detail AA
Dim D
min
W3
13″ Diameter Option
W2 max Measured at Hub
DETAIL AA
Dim W2
Dimensions are in inches and millimeters
Reel
Option
Tape Size
12mm
Dim A
Dim B
Dim C
Dim D
Dim N
Dim W1
Dim W3 (LSL-USL)
7.00
177.8
0.059
1.5
512 +0.020/-0.008
13 +0.5/-0.2
0.795
20.2
5.906
150
0.488 +0.078/-0.000
12.4 +2/0
0.724
18.4
0.469 – 0.606
11.9 – 15.4
7″ Dia
13.00
330
0.059
1.5
512 +0.020/-0.008
13 +0.5/-0.2
0.795
20.2
7.00
178
0.488 +0.078/-0.000
12.4 +2/0
0.724
18.4
0.469 – 0.606
11.9 – 15.4
12mm
13″ Dia
July 1999, Rev. B
6.70
6.20
B
0.10
C B
3.10
2.90
3.25
4
1.90
A
3.70
3.30
6.10
1.90
1
3
0.84
0.60
2.30
2.30
0.95
4.60
0.10
C B
LAND PATTERN RECOMMENDATION
SEE DETAIL A
1.80 MAX
7.30
6.70
0.08
C
C
0.10
0.00
NOTES: UNLESS OTHERWISE SPECIFIED
A) DRAWING
BASED ON JEDEC REGISTRATION
TO-261C, VARIATION AA.
B) ALL
DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE BURRS
OR MOLD FLASH. MOLD FLASH OR BURRS
DOES NOT EXCEED 0.10MM.
D) DIMENSIONING AND TOLERANCING PER
ASME Y14.5M-2009.
R0.15±0.05
R0.15±0.05
10°
5°
GAGE
PLANE
0.35
0.20
E) LANDPATTERN
NAME: SOT230P700X180-4BN
F) DRAWING
FILENAME: MKT-MA04AREV3
10°
0°
TYP
0.25
10°
5°
0.60 MIN
SEATING
PLANE
1.70
DETAIL A
SCALE: 2:1
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