onsemi-NFA41560R42

Part #onsemi-NFA41560R42
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onsemi-NFA41560R42
DATA SHEET  
Motion SPM

[

45 Series  
NFA41560R42  
General Description  
NFA41560R42 is a Motion SPM 45 module providing a  
fully
−
featured, high
−
performance inverter output stage for AC  
Induction, BLDC, and PMSM motors. These modules integrate  
optimized gate drive of the built
−
in RC
−
IGBTs to minimize EMI and  
losses, while also providing multiple on
−
module protection features  
including under
−
voltage lockouts, over
−
current shutdown, thermal  
monitoring of drive IC, and fault reporting. The built
−
in, high
−
speed  
HVIC requires only a single supply voltage and translates the  
incoming logic
−
level gate inputs to the high
−
voltage, high
−
current  
drive signals required to properly drive the module’s internal IGBTs.  
Separate negative IGBT terminals are available for each phase to  
support the widest variety of control algorithms.  
3D Package Drawing (Click to Activate 3D Content)  
SPMAA
−
C26 / 26LD, PDD STD CERAMIC TYPE,  
LONG LEAD DUAL FORM TYPE  
CASE MODFC  
Features  
•
600 V
−
15 A 3
−
Phase RC
−
IGBT Inverter with Integral Gate Drivers  
and Protection  
•
Low Thermal Resistance Using Ceramic Substrate  
MARKING DIAGRAM  
•
Low
−
Loss, Short
−
Circuit Rated FS4 RC
−
IGBTs  
•
Built
−
In Bootstrap Diodes and Dedicated Vs Pins Simplify PCB  
Layout  
$Y  
NFA41560R42  
XXX  
•
Built
−
In NTC Thermistor for Temperature Monitoring  
YWW  
•
Separate Open
−
Emitter Pins from Low
−
Side RC
−
IGBTs for  
Three
−
Phase Current Sensing  
•
Single
−
Grounded Power Supply  
$Y  
=
onsemi
Logo  
•
Isolation Rating: 2000 V
 
/ Min.  
rms  
NFA41560R42 = Specific Device Code  
XXX  
Y
•
Remove Dummy Pin  
•
This is a Pb
−
Free Device  
= Trace Code  
=
Y
e
ar  
= Work Week  
WW  
Applications  
•
Motion Control
−
Home Appliance / Industrial Motor  
ORDERING INFORMATION  
this data sheet.  
Related Resources  
[
•

−
Smart Power Module, Motion SPM
 
45 H V3 Series  
User
’
s
G
uide  
[
•

−
Smart Power Module Motion SPM
 
in SPM45H  
Thermal Performance Information  
[
•

−
Smart Power Module Motion SPM
 
in SPM45H  
Mounting Guidance  
[
•

−
PCB Design Guidance for SPM  
©
Semiconductor Components Industries, LLC, 2021  
1
Publication Order Number:  
September, 2021
−
Rev. 0  
NFA41560R42/D  

NFA41560R42  
Integrated Power Functions  
•
For inverter low
−
side IGBTs: gate drive circuit,  
Short
−
Circuit Protection (SCP) control supply  
circuit Under
−
V
o
ltage Lock
−
Out Protection  
(UVLO)  
•
Fault signaling: corresponding to UVLO (low
−
side  
supply) and SC faults  
•
600 V
−
15 A IGBT inverter for three
−
phase DC / AC  
Integrated Drive, Protection, and System Control  
Functions  
•
For inverter high
−
side IGBTs: gate drive circuit,  
high
−
voltage isolated high
−
speed level shifting  
control circuit Under
−
V
o
ltage Lock
−
Out  
•
Input interface: active
−
HIGH interface, works with  
3.3 / 5 V logic, Schmitt
−
trigger input  
Protection (UVLO) NOTE: Available bootstrap  
Pin Configuration  
VB(U)(26)  
VS(U)(25)  
TH1(1)  
TH2(2)  
VB(V)(24)  
VS(V)(23)  
P(3)  
U(4)  
VB(W)(22)  
VS(W)(21)  
HIN(U)(20)  
HIN(V)(19)  
HIN(W)(18)  
VDD(H)(17)  
VDD(L)(16)  
VSS(15)  
Case Temperature (
T
c
)  
Detecting Point  
V(5)  
W(6)  
LIN(U)(14)  
LIN(V)(13)  
LIN(W)(12)  
VFO(11)  
NU(7)  
NV(8)  
ITRIP(10)  
NW(9)  
Figure 1. Top View  
2
 

NFA41560R42  
PIN DESCRIPTION  
Pin No.  
1
Pin Name  
Description  
TH1  
TH2  
Thermistor Bias Voltage  
2
Series Resistor for the Use of Thermistor (
T
e
mperature Detection)  
Positive DC
−
Link Input  
3
P
4
U
Output for U
−
Phase  
5
V
Output for V
−
Phase  
6
W
Output for W
−
Phase  
7
NU  
Negative DC
−
Link Input for U
−
Phase  
Negative DC
−
Link Input for V
−
Phase  
Negative DC
−
Link Input for W
−
Phase  
Input for Current Protection  
8
NV  
9
NW  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
ITRIP  
VFO  
Fault Output  
LIN(W)  
LIN(V)  
LIN(U)  
VSS  
Signal Input for Low
−
Side W
−
Phase  
Signal Input for Low
−
Side V
−
Phase  
Signal Input for Low
−
Side U
−
Phase  
Common Supply Ground  
VDD(L)  
VDD(H)  
HIN(W)  
HIN(V)  
HIN(U)  
VS(W)  
VB(W)  
VS(V)  
VB(V)  
VS(U)  
VB(U)  
Low
−
Side Common Bias Voltage for IC and IGB
T
s
D
riving  
High
−
Side Common Bias Voltage for IC and IGB
T
s
D
riving  
Signal Input for High
−
Side W
−
Phase  
Signal Input for High
−
Side V
−
Phase  
Signal Input for High
−
Side U
−
Phase  
High
−
Side Bias Voltage Ground for W
−
Phase IGBT Driving  
High
−
Side Bias Voltage for W
−
Phase IGBT Driving  
High
−
Side Bias Voltage Ground for V
−
Phase IGBT Driving  
High
−
Side Bias Voltage for V
−
Phase IGBT Driving  
High
−
Side Bias Voltage Ground for U
−
Phase IGBT Driving  
High
−
Side Bias Voltage for U
−
Phase IGBT Driving  
3

NFA41560R42  
Internal Equivalent Circuit and Input/Output Pins  
TH1 (1)  
TH2 (2)  
Thermistor  
P (3)  
(26) VB(U)  
UVB  
UVS  
(25) VS(U)  
OUT(UH)  
UVS  
(24) VB(V)  
(23) VS(V)  
U (4)  
VVB  
VVS  
(22) VB(W)  
(21) VS(W)  
WVB  
WVS  
OUT(VH)  
VVS  
(20) HIN(U)  
V (5)  
HIN(U)  
(19) HIN(V)  
(18) HIN(W)  
HIN(V)  
HIN(W)  
VDD  
(17) VDD(H)  
OUT(WH)  
WVS  
VSS  
W (6)  
(16) VDD(L)  
(15) VSS  
VDD  
OUT(UL)  
OUT(VL)  
VSS  
NU (7)  
NV (8)  
NW (9)  
(14) LIN(U)  
(13) LIN(V)  
LIN(U)  
LIN(V)  
(12) LIN(W)  
(11) VFO  
LIN(W)  
VFO  
(10) ITRIP  
ITRIP  
OUT(WL)  
NOTE:  
1. Inverter
 
high
−
side is composed of three RC
−
IGB
T
s
a
nd one control IC for each IGB
T
.  
2. Inverter
 
low
−
side is composed of three RC
−
IGB
T
s
a
nd one control IC for each IGB
T
.
I
t has gate drive and protection functions.  
3. Inverter
 
power side is composed of four inverter DC
−
link input terminals and three inverter output terminals.  
Figure 2. Internal Block Diagram  
4

NFA41560R42  
ABSOLUTE MAXIMUM RATINGS
(Tj = 25
°
C, unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Rating  
Unit  
INVERTER PART  
VPN  
Supply Voltage  
P
−
NU, N
V
,
N
W  
450  
500  
V
V
VPN(surge) Supply
 
Voltage (Surge)  
P
−
NU, N
V
,
N
W  
Vces  
Ic  
Collector
−
Emitter Voltage  
Each IGBT Collector Current  
Each IGBT Collector Current (Peak)  
Collector Dissipation  
600  
V
Tc =
2
5
°
C  
15  
A
Icp  
Pc  
Tj  
Tc =
2
5
°
C, Under 1 ms Pulse Width  
30  
A
45  
W
°
C  
Operating Junction
T
e
mperature  
−
40~150  
CONTROL PART  
VDD  
VBS  
Control Supply Voltage  
VDD(H), VDD(L)
−
VSS  
20  
20  
V
V
High
−
Side Control Bias Voltage  
VB(U)
−
VS(U), VB(V)
−
VS(V),  
VB(W)
−
VS(W)  
VIN  
Input Signal Voltage  
HIN(U), HIN(V), HIN(W),  
LIN(U), LIN(V), LIN(W)
−
VSS  
−
0.3~VDD + 0.3  
V
VFO  
IFO  
Fault Output Supply Voltage  
Fault Output Current  
VFO
−
VSS  
−
0.3~VDD + 0.3  
1
V
mA  
V
Sink Current at VFO pin  
ITRIP
−
VSS  
VITRIP  
Current
−
Sensing Input Voltage  
−
0.3~VDD + 0.3  
BOOTSTRAP DIODE PART  
VRRM  
Maximum Repetitive Reverse Voltage  
600  
0.5  
2.0  
V
A
A
If  
Forward Current  
Tc =
2
5
°
C  
Ifp  
Forward Current (Peak)  
Tc =
2
5
°
C, Under 1 ms Pulse Width  
Tj  
Operating Junction
T
e
mperature  
−
40~150  
°
C  
TOTAL SYSTEM  
VPN(PROT) Self
−
Protection Supply Voltage Limit (Short
−
Circuit  
VDD = VBS = 13.5~16.5 V  
Tj = 150
°
C, Vces < 600 V  
Non
−
Repetitive, < 2
m
s  
400  
V
Protection Capability)  
Tc  
Module Case Operation
T
e
mperature  
Storage
T
e
mperature  
−
40~125  
−
40~125  
2000  
°
C  
°
C  
T
s
tg  
Viso  
Isolation Voltage  
60 Hz, Sinusoidal, AC 1 minute,  
Connection Pins to Heat Sink Plate  
V
rms  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
4. These
 
values had been made an acquisition by the calculation considered to design factor.  
ABSOLUTE MAXIMUM RATINGS
(Tj = 25
°
C, unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
THERMAL RESISTANCE  
Rth(j
−
c)Q Junction
 
to Case Thermal Resistance  
Inverter IGBT Part (per 1/6 module)  
Inverter FWDi Part (per 1/6 module)  
−
−
−
−
2.75  
4.2  
°
C/W  
°
C/W  
Rth(j
−
c)F  
5. For
 
the measurement point of case temperature
T
c
, please refer to Figure

5
 

NFA41560R42  
ELECTRICAL CHARACTERISTICS
(Tj = 25
°
C, unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
INVERTER PART  
VCE(sat)  
Collector
−
Emitter  
VDD = VBS = 15
V
,
I
N =
 
5
V
,
I
c = 15 A, Tj = 25
°
C  
IN = 0
V
,
I
c =
−
15 A, Tj = 25
°
C  
−
1.5  
2.1  
V
Saturation Voltage  
VF  
FWDi Forward Voltage  
Switching Times  
−
−
−
−
−
−
−
−
−
−
−
−
1.75  
0.75  
0.12  
0.85  
0.14  
0.13  
0.80  
0.15  
0.90  
0.14  
0.18  
−
2.35  
−
V
m
s  
m
s  
m
s  
m
s  
m
s  
m
s  
m
s  
m
s  
m
s  
m
s  
mA  
HS  
ton  
tc(on)  
toff  
VPN = 300
V
,
V
DD(H) = VDD(L) = 15
V
,
I
c = 15 A,  
Tj = 25
°
C, IN = 0
↔
5
V
,

−
−
tc(off)  
trr  
−
−
LS  
ton  
VPN = 300
V
,
V
DD(H) = VDD(L) = 15
V
,
I
c = 15 A,  
Tj = 25
°
C, IN = 0
↔
5
V
,

−
tc(on)  
toff  
−
−
tc(off)  
trr  
−
−
Ices  
Collector
−
Emitter  
Leakage Current  
Vce = Vces  
1
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
6. ton
 
and toff include the propagation delay time of the internal drive IC. tc(on) and tc(off) are the switching time of IGBT itself under the given  
gate driving condition internally. For the detailed information,

.  
100% Ic
 
100% Ic  
trr  
Vce  
Ic  
Ic  
Vce  
VIN  
toff  
VIN  
ton  
tc(on)  
tc(off)  
10% Ic  
VIN(on)  
VIN(off)  
10% Vce  
(b) Turn
−
off  
10% Ic  
90% Ic
 
10% Vce  
(a) Turn
−
on  
Figure 3. Switching Time Definitions  
6
 

NFA41560R42  
INDUCTIVE LOAD, VPN = 300
V
,
V
DD = 15
V
,
T
j = 25
°
C  
INDUCTIVE LOAD, VPN = 300
V
,
V
DD = 15
V
,
T
j = 150
°
C  
1000  
800  
600  
400  
1000  
800  
600  
400  
IGBT Turn
−
on, Eon  
IGBT Turn
−
off, Eoff  
FRD Turn
−
off, Erec  
IGBT Turn
−
on, Eon  
IGBT Turn
−
off, Eoff  
FRD Turn
−
off, Erec  
200  
0
200  
0
0
5
10  
15  
0
5
10  
15  
Ic, COLLECTOR CURRENT (A)  
Ic, COLLECTOR CURRENT (A)  
Figure 4. Switching Loss Characteristics (Typical)  
ELECTRICAL CHARACTERISTICS
(Tj = 25
°
C, unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
CONTROL PART  
IQDDH  
IQDDL  
IPDDH  
Quiescent VDD Supply
 
VDD(H) = 15
V
, HIN = 0 V, VDD(H)
−
VSS  
−
−
−
−
−
−
0.10  
2.65  
0.15  
mA  
mA  
mA  
Current  
VDD(L) = 15 V, LIN = 0 V, VDD(L)
−
VSS  
Operating VDD Supply
 
VDD(H) = 15
V
,
f
PWM = 20 kHz, Duty = 50%,  
Current  
Applied to One PWM Signal Input for High
−
Side  
IPDDL  
IQBS  
IPBS  
VDD(L) = 15
V
,
f
PWM = 20 kHz, Duty = 50%,  
−
−
−
−
−
−
4.00  
0.30  
2.00  
mA  
mA  
mA  
Applied to One PWM Signal Input for Low
−
Side  
Quiescent VBS Supply
 
VDD(H) = 15
V
, HIN = 0 V, VB(U)
−
VS(U), VB(V)
−
VS(V),  
Current VB(W)
 
−
VS(W)  
Operating VBS Supply
 
VDD(H) = 15
V
,
f
PWM = 20 kHz, Duty = 50%,  
Current  
Applied to One PWM Signal Input for High
−
Side  
VFOH  
VFOL  
Fault Output Voltage  
VDD = 0
V
,
I
TRIP = 0
V
,
V
FO Circuit: 10 k
W
to 5 V Pull
−
up  
VDD = 0
V
,
I
TRIP = 1
V
,
V
FO Circuit: 10 k
W
to 5 V Pull
−
up  
4.5  
−
−
−
−
V
V
0.5  
VSC(ref)  
UVDDD  
UVDDR  
UVBSD  
UVBSR  
tFOD  
Short Circuit Trip Level
 
VDD = 15 V, ITRIP
−
VSS  
0.45  
10.5  
11.0  
10.0  
10.5  
30  
0.50  
−
0.55  
13.0  
13.5  
12.5  
13.0  
−
V
Supply Circuit  
Under
−
Voltage  
Protection  
Detection Level  
Reset Level  
V
−
V
Supply Circuit  
Under
−
Voltage  
Protection  
Detection Level  
Reset Level  
−
V
−
V
Fault
−
Output Pulse  
Width  
−
m
s  
VIN(ON)  
VIN(OFF)  
RTH  
ON Threshold Voltage  
OFF Threshold Voltage  
HIN
−
VSS, LIN
−
VSS  
−
0.8  
−
−
−
2.6  
−
V
V
Resistance of  
Thermistor  
@ TTH = 25
°
C  
@ TTH = 100
°
C  
47  
2.9  
−
k
W  
k
W  
−
−
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
7. Short
−
circuit current protection is functioning only at the low
−
sides.  
8. TTH
 
is the temperature of thermistor itself.
T
o
k
now case temperature (
T
c
), please make the experiment considering your application.  
7

NFA41560R42  
R
−
T Curve  
600  
550  
500  
450  
400  
350  
300  
250  
200  
150  
100  
50  
R
−
T Curve in 50
°
C~125
°
C  
20  
16  
12  
8
4
0
50  
60  
70  
80  
90 100
 
110 120  
T
e
mperature (
°
C)  
0
−
20
−
10  
0
10  
20  
30  
40  
50  
60  
70  
80  
90 100
 
110 120  
T
e
mperature TTH (
°
C)  
Figure 5. R
−
T Curve of The Built
−
In Thermistor  
ELECTRICAL CHARACTERISTICS
(Tj = 25
°
C, unless otherwise noted)  
Symbol Parameter
 
Conditions  
BOOTSTRAP DIODE PART  
Min  
Typ  
Max  
Unit  
VF  
trr  
Forward Voltage  
If = 0.1 A,
T
c =
2
5
°
C  
−
−
2.5  
80  
−
−
V
Reverse
−
Recovery Time
 
If = 0.1 A, dlf/dt = 50 A/
m
s,
T
c =
2
5
°
C  
ns  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
Built
−
In Bootstrap Diode VF
−
If Characteristic  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
Tc =
2
5
°
C  
0.0  
0
1
2
3
4
5
6
7
8
9 10
 
11 12 13
 
14 15  
VF [V]  
NOTE:  
9. Built
−
in bootstrap diode includes around 15
W
resistance characteristic.  
Figure 6. Built
−
In Bootstrap Diode Characteristics (Typ.)  
8

NFA41560R42  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
VPN  
Parameter  
Supply Voltage  
Conditions  
Min  
−
Typ  
300  
15.0  
15.0  
−
Max  
400  
16.5  
18.5  
1
Unit  
V
P
−
NU, N
V
,
N
W  
VDD  
Control Supply Voltage  
High
−
Side Bias Voltage  
Control Supply Variation  
VDD(H), VDD(L)
−
VSS  
13.5  
13.0  
−
1  
V
VBS  
VB(U)
−
VS(U), VB(V)
−
VS(V), VB(W)
−
VS(W)  
V
dVDD/dt,  
dVBS/dt  
V/
m
s  
tdead  
Blanking Time for Preventing
 
For each input signal  
Arm
−
Short  
1
−
−
m
s  
fPWM  
VSEN  
PWM Input Signal  
−
40
°
C
≤
T
c
≤
125
°
C,
−
40
°
C
≤
Tj
≤
150
°
C  
−
−
−
20  
4
kHz  
V
Voltage for Current Sensing  
Applied between NU, N
V
,
N
W
−
VSS  
(Including Surge
−
Voltage)  
−
4  
PWIN(ON) Minimum
 
Input Pulse Width  
PWIN(OFF)  
VDD = VBS = 15
V
,
I
c
≤
30 A, Wiring Inductance  
between NU, N
V
,
N
W and DC Link N < 10 nH  
1.2  
1.2  
−
−
−
−
−
m
s  
Tj  
Junction
T
e
mperature  
−
40  
150  
°
C  
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond  
the Recommended Operating Ranges limits may affect device reliability.  
10
.
T
his product might not make response if input pulse width is less than the recommended value.  
9
 

NFA41560R42  
MECHANICAL CHARACTERISTICS AND RATINGS  
Parameter  
Device Flatness  
Conditions  
Min  
0
Typ  
−
Max  
+120  
0.8  
Unit  
m
m  
Mounting
T
o
rque  
Mounting Screw: M3  
Recommended 0.7 N · m  
Recommended 7.1 kg · cm  
0.6  
6.2  
−
0.7  
N · m  
kg · cm  
g
7.1  
8.1  
Weight  
11.00  
−
Figure 7. Flatness Measurement Position  
NOTE:  
11. Do not make over torque when mounting screws. Much mounting torque may cause ceramic cracks, as well as bolts and Al heat
−
sink  
destruction.  
12
.
A
void one
−

shows the recommended torque order for mounting screws. Uneven mounting can cause the  
ceramic substrate of package to be damaged. The pre
−
screwing torque is set to 20~30% of maximum torque rating.  
Figure 8. Mounting Screws Torque Order  
10  
 

NFA41560R42  
Time Charts of Protective Function  
Input Signal  
Protection  
Circuit State  
RESET  
a1  
SET  
RESET  
UVDDR  
a6  
UVDDD  
a3  
Control  
Supply Voltage  
a2  
a7  
a4  
Output Current  
a5  
Fault Output Signal  
a1: Control supply voltage rises: After the voltage rises UVDDR, the circuits start to operate when next input is applied.  
a2: Normal operation: IGBT ON and carrying current.  
a3: Under voltage detection (UVDDD).  
a4: IGBT OFF in spite of control input condition.  
a5: Fault output operation starts with a fixed pulse width.  
a6: Under voltage reset (UVDDR).  
a7: Normal operation: IGBT ON and carrying current by triggering next signal from LOW to HIGH.  
Figure 9. Under
−
Voltage Protection (Low
−
Side)  
Input Signal  
Protection  
RESET  
b1  
SET  
RESET  
Circuit State  
UVBSR  
b5  
UVBSD  
b2  
Control  
Supply Voltage  
b3  
b4  
b6  
Output Current  
High
−
level (no fault output)  
Fault Output Signal  
b1: Control supply voltage rises: After the voltage reaches UV  
b2: Normal operation: IGBT ON and carrying current.  
b3: Under voltage detection (UVBSD).  
, the circuits start to operate when next input is applied.  
BSR  
b4: IGBT OFF in spite of control input condition, but there is no fault output signal.  
b5: Under voltage reset (UVBSR).  
b6: Normal operation: IGBT ON and carrying current by triggering next signal from LOW to HIGH.  
Figure 10. Under
−
Voltage Protection (High
−
side)  
11  

NFA41560R42  
Lower Arms  
Control Input  
c6 c7  
Protection  
Circuit State  
SET  
RESET  
Internal IGBT  
Gate
−
Emitter Voltage  
c4  
c3  
c2  
SC  
c1  
c8  
Output Current  
SC Reference  
Voltage  
Sensing Voltage  
of Shunt Resistance  
CR Circuit Time  
Constant Delay  
c5  
Fault Output Signal  
(with the external sense resistance and RC filter connection)  
c1: Normal operation: IGBT ON and carrying current.  
c2: Short circuit current detection (SC trigger).  
c3: All low
−
side IGBT’s gate are hard interrupted.  
c4: All low
−
side IGBT’s turn OF
F
.  
c5: Fault output operation starts with a fixed pulse width.  
c6: Input HIGH: IGBT ON state, but during the active period of fault output the IGBT doesn’t turn ON.  
c7: Fault output operation finishes, but IGBT doesn’t turn on until triggering next signal from LOW to HIGH.  
c8: Normal operation: IGBT ON and carrying current.  
Figure 11. Short
−
Circuit Protection (Low
−
Side Operation Only)  
+5 V (for MCU or Control power)  
RPF = 10 k
W  
SPM  
HIN(U), HIN(V), HIN(W)  
LIN(U), LIN(V), LIN(W)  
MCU  
VFO  
VSS  
NOTE:  
13
.
R
C coupling at each input might change depending on the PWM control scheme used in the application and the wiring impedance of the  
application’s printed circuit board. The input signal section of the Motion SPM 45 product integrates 5 k
W
(
typ.) pull
−
down resistor.  
Therefore, when using an external filtering resistor, please pay attention to the signal voltage drop at input terminal.  
Figure 12. Recommended MCU I/O Interface Circuit  
12  

NFA41560R42  
HVIC  
(26) VB(U)  
P (3)  
U (4)  
VB (U)  
C3  
C3  
C3  
C4  
C4  
(25) VS(U)  
(20) H
N
I (U)  
VS (U)  
HIN(U)  
OUT(UH)  
VS (U)  
R1  
R1  
R1  
Gating UH  
Gating VH  
Gating WH  
(24) VB(V)  
VB (V)  
(23) VS(V)  
(19) H
N
I (V)  
VS (V)  
HIN(V)  
OUT(VH)  
VS (V)  
V ( 5)  
(22) VB(W)  
(21) VS(W)  
M
VB (W)  
VS (W)  
C4  
C4  
(18) H
N
I (W)  
(17) VDD(H)  
HIN(W)  
VDD  
C6  
VDC  
M
C
U
OUT(WH)  
VS (W)  
15 V line  
C2  
W (6)  
C1  
C1  
C1  
(15) VSS  
VS S  
5V line  
C4  
LVIC  
(16) VDD(L)  
VDD  
VFO  
OUT(UL)  
R2  
C1  
C2  
A
R3  
NU (7)  
NV (8)  
NW (9)  
R1  
(11) VFO  
Fault  
C1  
OUT(VL)  
R1  
(14)
L
I
N(U)  
(13)
L
I
N(V)  
(12)
L
I
N(W)  
Gating UL  
Gating VL  
Gating WL  
LI N(U)  
LI N(V)  
LI N(W)  
R3  
R1  
R1  
Shunt  
Resistor  
E
Power  
GND Line  
C5  
OUT(WL)  
VS S  
(10) IT
R
I
P  
(1) TH1  
C1 C1  
C1  
R3  
ITRIP  
R5  
D
B
R4  
THERMISTOR  
(2) TH2  
Control  
GND Line  
C
U-Phase Current  
V-Phase Current  
Input Signal for  
Short
−
Circuit Protection  
W-Phase Current  
Temp. Monitoring  
NOTE:  
14
.
T
o
a
void malfunction, the wiring of each input should be as short as possible (less than 2
−
3 cm).  
15
.
V
FO output is open
−
drain type. This signal line should be pulled up to the positive side of the MCU or control power supply with a resistor  
that makes IFO up to 1 mA.  
16
.
I
nput signal is active
−
HIGH type. There is a 5k
W
resistor inside the IC to pull down each input signal line to GND. RC coupling circuits is  
recommended for the prevention of input signal oscillation. R1C1 time constant should be selected in the range 50~150 ns (recommended  
R1 = 100
W
, C1 = 1 nF).  
17
.
E
ach wiring pattern inductance of point A should be minimized (recommend less than 10 nH). Use the shunt resistor R3 of surface mounted  
(SMD) type to reduce wiring inductance.
T
o
p
revent malfunction, wiring of point E should be connected to the terminal of the shunt resistor  
R3 as close as possible.  
18
.
T
o
i
nsert the shunt resistor to measure each phase current at NU, N
V
,
N
W terminal, it makes to change the trip level ISC about the short
−
cir-  
cuit current.  
19
.
T
o
p
revent errors of the protection function, the wiring of point B, C, and D should be as short as possible.  
20
.
I
n the short
−
circuit protection circuit, please select the R5C5 time constant in the range 1.5~2
m
s. Do enough evaluation on the real system  
because short
−
circuit protection time may vary wiring pattern layout and value of the R5C5 time constant.  
21
.
E
ach capacitor should be mounted as close to the pins of the Motion SPM 45 product as possible.  
22
.
T
o
p
revent surge destruction, the wiring between the smoothing capacitor C6 and the P & GND pins should be as short as possible. The  
use of a high
−
frequency non
−
inductive capacitor of around 0.1~0.22
m
F between the P and GND pins is recommended.  
23
.
R
elays are used in almost every systems of electrical equipment in home appliances. In these cases, there should be sufficient distance  
between the MCU and the relays.  
24
.
T
he zener diode or transient voltage suppressor should be adopted for the protection of ICs from the surge destruction between each pair  
of control supply terminals (recommended zener diode is 22 V / 1 W, which has the lower zener impedance characteristic than about 15
W
).  
25
.
C
2 of around seven times larger than bootstrap capacitor C3 is recommended.  
26
.
P
lease choose the electrolytic capacitor with good temperature characteristic in C3. Also, choose 0.1~0.2
m
F R
−
category ceramic capacitors  
with good temperature and frequency characteristics in C4.  
Figure 13. Typical Application Circuit  
13  

NFA41560R42  
ORDERING INFORMATION  
Device  
Device Marking  
Package  
Shipping  
NFA41560R42  
NFA41560R42  
SPMAA
−
C26 / 26LD, PDD STD CERAMIC TYPE,  
LONG LEAD DUAL FORM TYPE  
(Pb
−
Free)  
12 Units / Rail  
SPM is registered trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.  
14  

NFA41560R42  
PACKAGE DIMENSIONS  
SPMAA
−
C26 / 26LD, PDD STD CERAMIC TYPE, LONG LEAD DUAL FORM TYPE  
CASE MODFC  
ISSUE O  
15  

NFA41560R42  
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T
:  
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o
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