onsemi-NGTB15N60S1EG

Part #onsemi-NGTB15N60S1EG
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onsemi-NGTB15N60S1EG
NGTB15N60S1EG  
IGBT – Short-Circuit Rated  
This Insulated Gate Bipolar Transistor (IGBT) features a robust and  
cost effective Non−Punch Through (NPT) Trench construction, and  
provides superior performance in demanding switching applications.  
Offering both low on state voltage and minimal switching loss, the  
IGBT is well suited for motor drive control and other hard switching  
applications. Incorporated into the device is a rugged co−packaged  
reverse recovery diode with a low forward voltage.  
15 A, 650 V  
Features  
V

CEsat

= 1.5 V  
•
Low Saturation
V
o
ltage Resulting in Low Conduction Loss  
•
Low Switching Loss in Higher Frequency Applications  
•
Soft Fast Reverse Recovery Diode  
C
•
5
m
s Short Circuit Capability  
•
Excellent Current versus Package Size Performance Density  
•
This is a Pb−Free Device  
G
Typical Applications  
E
•
White Goods Appliance Motor Control  
•
General Purpose Inverter  
•
AC and DC Motor Control  
C
ABSOLUTE MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
V
Collector−emitter voltage  
V
CES  
650  
TO−220  
CASE 221A  
STYLE 9  
Collector current  
@ T
C
= 25
°
C  
@ T
C
= 100
°
C  
I

C  

A
G
C
30  
15  
E
Pulsed collector current, T  
limited by  
I
120  
A
A
pulse  
CM  
MARKING DIAGRAM  
T
Jmax  
Diode forward current  
@ T
C
= 25
°
C  
@ T
C
= 100
°
C  
I
F
30  
15  
Diode pulsed current, T  
limited by  
I
120  
A
pulse  
FM  
T
Jmax  
15N60S1G  
AYWW  
Gate−emitter voltage  
V
$
20  
V
GE  
Power dissipation  
@ T
C
= 25
°
C  
@ T
C
= 100
°
C  
P
W
D
117  
47  
Short circuit withstand time  
t
5
m
s  
°
C  
°
C  
°
C  
SC  
V
= 15
V
, V
 
=
4
00
V
, T
 
v
+150
°
C  
GE  
CE  
J
A
Y
= Assembly Location  
=
Y
e
ar  
Operating junction temperature range  
T
−55 to  
+150  
J
WW  
G
= Work Week  
= Pb−Free Package  
Storage temperature range  
T
−55 to  
+150  
stg  
Lead temperature for soldering, 1/8” from  
case for 5 seconds  
T
SLD  
260  
ORDERING INFORMATION  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
Device  
NGTB15N60S1EG  
Package  
Shipping  
50 Units / Rail  
TO−220  
(Pb−Free)  
©
Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
May, 2017 − Rev. 7  
NGTB15N60S1E/D  

NGTB15N60S1EG  
THERMAL CHARACTERISTICS  
Rating  
Symbol  
Value  
0.5  
Unit  
°
C/W  
°
C/W  
°
C/W  
Thermal resistance junction to case, for IGBT  
Thermal resistance junction to case, for Diode  
Thermal resistance junction to ambient  
R
q
JC  
q
JC  
q
JA  
R
R
2.3  
60  
ELECTRICAL CHARACTERISTICS
(T =
 
25
°
C unless otherwise specified)  
J
Parameter  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
STATIC CHARACTERISTIC  
Collector−emitter breakdown voltage,  
gate−emitter short−circuited  
V
= 0
V
, I
 
=
5
00
m
A  
C J  
V
(BR)CES  
650  
−
720  
660  
−
−
V
V
GE  
C
V
= 0
V
, I
 
=
5
00
m
A, T
 
= −40
°
C  
GE  
Collector−emitter saturation voltage  
V
= 15 V , I
 
= 15 A  
V
V
1.3  
1.55  
1.5  
1.75  
1.7  
1.95  
GE  
C
CEsat  
V
= 15 V , I
 
= 15 A, T
 
= 150
°
C  
GE  
C
J
Gate−emitter threshold voltage  
V
GE  
=
V
, I
 
= 250
m
A  
4.5  
5.5  
6.5  
V
CE  
C
GE(th)  
Collector−emitter cut−off current, gate−emitter  
short−circuited  
V
= 0
V
, V
 
=
6
50 V  
I
−
−
10  
−
−
200  
m
A  
GE  
CE  
CES  
V
GE  
= 0
V
, V
 
=
6
50
V
, T
 
=
1
50
°
C  
CE  
J
Gate leakage current, collector−emitter  
short−circuited  
V
= 20
V
, V
 
= 0 V  
I
−
−
100  
−
nA  
S
GE  
CE  
GES  
Forward Transconductance  
DYNAMIC CHARACTERISTIC  
Input capacitance  
V
= 20
V
, I
 
=
1
5 A  
g
fs  
−
10.1  
CE  
C
C
C
−
−
−
−
−
−
1950  
70  
−
−
−
−
−
−
ies  
Output capacitance  
V
= 20
V
, V
 
= 0 V, f = 1
M
Hz  
pF  
nC  
oes  
CE  
GE  
Reverse transfer capacitance  
Gate charge total  
C
42  
res  
Q
88  
g
Gate to emitter charge  
Gate to collector charge  
Q
Q
16  
V
CE  
= 480
V
, I
 
=
1
5 A, V
 
= 15 V  
ge  
C
GE  
42  
gc  
SWITCHING CHARACTERISTIC , INDUCTIVE LOAD  
Turn−on delay time  
Rise time  
t
−
−
−
−
−
−
−
−
−
−
−
−
−
−
65  
28  
−
−
−
−
−
−
−
−
−
−
−
−
−
−
d(on)  
t
r
ns  
mJ  
ns  
Turn−off delay time  
Fall time  
t
170  
d(off)  
T =
 
25
°
C  
J
V
= 400
V
, I
 
=
1
5 A  
CC  
C
t
f
140  
R =
 
22
W  
g
V
= 0 V / 15 V  
Turn−on switching loss  
Turn−off switching loss  
T
o
tal switching loss  
Turn−on delay time  
Rise time  
E
on  
0.550  
0.350  
0.900  
65  
GE  
E
off  
E
ts  
t
t
d(on)  
t
r
28  
Turn−off delay time  
Fall time  
180  
d(off)  
T =
 
150
°
C  
J
V
CC  
= 400 V, I
 
= 15 A  
C
t
f
260  
R =
 
22
W  
g
V
= 0 V / 15 V  
Turn−on switching loss  
Turn−off switching loss  
T
o
tal switching loss  
DIODE CHARACTERISTIC  
E
on  
0.650  
0.600  
1.250  
GE  
E
off  
mJ  
V
E
ts  
Forward voltage  
V
= 0
V
, I
 
=
1
5 A  
V
F
−
−
1.65  
1.75  
1.85  
−
GE  
F
V
= 0
V
, I
 
=
1
5 A, T
 
= 150
°
C  
GE  
F J  
2

NGTB15N60S1EG  
ELECTRICAL CHARACTERISTICS
(T =
 
25
°
C unless otherwise specified)  
J
Parameter  
DIODE CHARACTERISTIC  
Reverse recovery time  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
t
rr  
−
−
−
−
−
−
270  
350  
5
−
−
−
−
−
−
ns  
nc  
A
T =
 
25
°
C  
J
Reverse recovery charge  
Reverse recovery current  
Reverse recovery time  
I =
 
15 A, V
 
= 200 V  
Q
rr  
F
R
di /dt
 
= 200 A/
µ
s  
F
I
rrm  
t
rr  
350  
1000  
7.5  
ns  
nc  
A
T =
 
125
°
C  
J
Reverse recovery charge  
Reverse recovery current  
Q
I =
 
15 A
, V
 
= 200 V  
rr  
F
R
di /dt
 
= 200 A/
µ
s  
F
I
rrm  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
3

NGTB15N60S1EG  
TYPICAL CHARACTERISTICS  
60  
50  
40  
30  
20  
60  
T =
 
25
°
C  
J
V
GE  
= 17 V to 13 V  
T =
 
150
°
C  
J
V
GE  
= 17 V to 13 V  
V
= 11 V  
GE  
50  
40  
30  
20  
V
GE  
= 11 V  
V
V
= 9 V  
= 7 V  
GE  
V
= 9 V  
GE  
10  
0
10  
0
GE  
V
= 7 V  
GE  
0
1
2
3
4
5
6
7
8
0
0
0
1
2
3
4
5
6
7
8
V
CE  
, COLLECTOR−EMITTER VOLTAGE (V)  
V
CE  
, COLLECTOR−EMITTER VOLTAGE (V)  
Figure 1. Output Characteristics  
Figure 2. Output Characteristics  
70  
60  
50  
40  
30  
20  
60  
50  
40  
30  
20  
T =
 
−40
°
C  
T =
 
25
°
C  
J
J
V
= 17 V to 13 V  
GE  
V
= 11 V  
GE  
−40
°
C  
150
°
C  
V
V
= 9 V  
= 7 V  
GE  
10  
0
10  
0
GE  
0
1
2
3
4
5
6
7
8
2
4
6
8
10  
12  
14  
V
CE  
, COLLECTOR−EMITTER VOLTAGE (V)  
V
GE  
, GATE−EMITTER VOLTAGE (V)  
Figure 3. Output Characteristics  
Figure 4. Typical Transfer Characteristics  
3.0  
2.5  
10,000  
1000  
I
= 30 A  
C
C
ies  
2.0  
1.5  
1.0  
I
I
= 15 A  
= 10 A  
= 5 A  
C
C
I
C
100  
10  
C
oes  
0.5  
0
C
res  
−50  
−20  
10  
40  
70  
100  
130  
160  
10 20 30 40 50 60 70 80 90
 
100  
T , JUNCTION TEMPERATURE (
°
C)  
J
V
CE  
, COLLECTOR−EMITTER VOLTAGE (V)  
Figure 5. V

CE(sat)

vs. T

J  

Figure 6. Typical Capacitance  
4

NGTB15N60S1EG  
TYPICAL CHARACTERISTICS  
20  
15  
35  
30  
25  
20  
15  
10  
5
T =
 
25
°
C  
J
V
= 480 V  
CES  
−40
°
C  
150
°
C  
10  
5
0
0
0
10  
20 30 40 50 60 70  
Q ,
 
GATE CHARGE (nC)  
80  
90 100  
0
0.5  
1
1.5  
2
2.5  
V , FORWARD VOLTAGE (V)  
F
G
Figure 7. Diode Forward Characteristics  
Figure 8. Typical Gate Charge  
1000  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
Eon  
Eoff  
t
f
t
d(off)  
d(on)  
100  
t
t
r
10  
1
V
V
= 400 V  
= 15 V  
= 15 A  
CE  
V
V
= 400 V  
= 15 V  
CE  
GE  
GE  
I
C
0.1  
0
I
C
= 15 A  
Rg = 22
W  
Rg = 22
W  
0
20  
40  
60  
80  
100  
120  
140 160  
0
20 40  
60  
80  
100  
120  
140 160  
T , JUNCTION TEMPERATURE (
°
C)  
J
T , JUNCTION TEMPERATURE (
°
C)  
J
Figure 10. Switching Time vs. Temperature  
Figure 9. Switching Loss vs. Temperature  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
1000  
100  
V
V
= 400 V  
= 15 V  
CE  
t
Eon  
f
GE  
T =
 
150
°
C  
J
t
Rg = 22
W  
d(off)  
Eoff  
t
d(on)  
t
r
10  
1
V
V
= 400 V  
= 15 V  
CE  
GE  
T =
 
150
°
C  
Rg = 22
W  
J
0.2  
0
8
12  
16  
20  
24  
28  
32  
8
12  
16  
20  
24  
28  
32  
I ,
 
COLLECTOR CURRENT (A)  
C
I ,
 
COLLECTOR CURRENT (A)  
C
Figure 11. Switching Loss vs. I

C  

Figure 12. Switching Time vs. I

C  

5

NGTB15N60S1EG  
TYPICAL CHARACTERISTICS  
1.2  
0.9  
0.6  
0.3  
0
1000  
Eon  
V
V
I
= 400 V  
= 15 V  
= 15 A  
CE  
t
f
GE  
t
d(off)  
C
T =
 
150
°
C  
J
100  
t
d(on)  
Eoff  
t
r
10  
1
V
V
= 400 V  
= 15 V  
= 15 A  
CE  
GE  
I
C
T =
 
150
°
C  
J
5
15  
25  
35  
45  
55  
65  
75  
85  
5
15  
25  
35  
45  
55  
65  
75  
85  
Rg, GATE RESISTOR (
W
)  
Rg, GATE RESISTOR (
W
)  
Figure 14. Switching Time vs. Rg  
Figure 13. Switching Time vs. Rg  
1.2  
0.9  
0.6  
0.3  
0
1000  
100  
V
= 15 V  
= 15 A  
GE  
t
f
Eon  
I
C
Rg = 22
W  
T =
 
150
°
C  
J
t
d_off  
Eoff  
t
d_on  
t
r
10  
1
V
= 15 V  
= 15 A  
Rg = 22
W  
T =
 
150
°
C  
GE  
I
C
J
175 225  
275  
325  
375  
425  
475  
525 575  
175 225  
275 325  
375  
425  
475  
525 575  
V
CE  
, COLLECTOR−EMITTER VOLTAGE (V)  
V
CE  
, COLLECTOR−EMITTER VOLTAGE (V)  
Figure 15. Switching Loss vs. V

CE  

Figure 16. Switching Time vs. V

CE  

1000  
100  
10  
1000  
100  
10  
1 ms  
100
m
s  
50
m
s  
dc operation  
1
1
Single Nonrepetitive  
Pulse T
 
= 25
°
C  
C
0.1  
0.1 Curves
 
must be derated  
linearly with increase  
in temperature  
V
GE  
= 15
V
, T
 
=
1
25
°
C  
C
0.01  
0.01  
1
10  
100  
1000  
1
10  
100  
1000  
V
CE  
, COLLECTOR−EMITTER VOLTAGE (V)  
V
CE  
, COLLECTOR−EMITTER VOLTAGE (V)  
Figure 17. Safe Operating Area  
Figure 18. Reverse Bias Safe Operating Area  
6

NGTB15N60S1EG  
TYPICAL CHARACTERISTICS  
10  
1
R
= 1.06  
q
JC  
50% Duty Cycle  
R (
°
C/W)
t
(sec)  
i
i
0.1  
7.1E−5  
1.0E−4  
0.002  
0.003  
20%  
10%  
5%  
R
C
R
C
R
0.05010  
0.15051  
0.33992  
Junction  
Case  
1
1
2
2
n
0.1  
C =
 
t
/R  
i
i
i
0.10550 0.00999  
2%  
0.20020  
0.11423  
0.03  
0.1  
C
n
0.01 1%  
Single Pulse  
0.00001  
Duty Factor = t
 
/t  
1
2
Peak T
 
= P  
x Z  
+ T  
JC C  
q
J
DM  
0.001  
0.000001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
PULSE TIME (sec)  
Figure 19. IGBT Transient Thermal Impedance  
10  
50% Duty Cycle  
R
= 3.76  
q
JC  
20%  
10%  
5%  
1
0.1  
R (
°
C/W)
t
(sec)  
i
i
0.01895  
0.04097  
0.12956  
0.1  
1.0E−7  
1.0E−6  
1.0E−5  
7.1E−5  
1.0E−4  
Duty Factor = t
 
/t  
1
2
2%  
Peak T
 
= P  
x Z  
+ T  
JC C  
q
J
DM  
1%  
0.20199  
Single Pulse  
R
C
R
R
n
Junction  
Case  
1
1
2
1.62730  
0.57301  
0.002  
0.003  
C =
 
t
/R  
0.01  
0.001  
0.45453 0.00498  
i
i
i
0.40199  
0.21558  
0.03  
0.1  
C
C
n
2
0.000001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
PULSE TIME (sec)  
Figure 20. Diode Transient Thermal Impedance  
Figure 21.
 
Test Circuit for Switching Characteristics  
7

NGTB15N60S1EG  
Figure 22. Definition of Turn On Waveform  
8

NGTB15N60S1EG  
Figure 23. Definition of Turn Off Waveform  
9

NGTB15N60S1EG  
PACKAGE DIMENSIONS  
TO−220  
CASE 221A−09  
ISSUE AH  
NOTES:  
1. DIMENSIONING
 
AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING
 
DIMENSION: INCH.  
3. DIMENSION
 
Z DEFINES A ZONE WHERE ALL  
BODY AND LEAD IRREGULARITIES ARE  
ALLOWED.  
SEATING  
PLANE  
−T−  
C
B
F
T
S
INCHES  
DIM MIN
 
MAX  
MILLIMETERS  
4
1
MIN  
14.48  
9.66  
4.07  
0.64  
3.61  
2.42  
2.80  
0.36  
12.70  
1.15  
4.83  
2.54  
2.04  
1.15  
5.97  
0.00  
1.15  
—  
MAX  
15.75  
10.53  
4.83  
0.96  
4.09  
2.66  
4.10  
0.61  
14.27  
1.52  
5.33  
3.04  
2.79  
1.39  
6.47  
1.27  
—  
A
B
C
D
F
0.570  
0.380  
0.160  
0.025  
0.142  
0.095  
0.110  
0.014  
0.500  
0.045  
0.190  
0.100  
0.080  
0.045  
0.235  
0.000  
0.045  
—  
0.620  
0.415  
0.190  
0.038  
0.161  
0.105  
0.161  
0.024  
0.562  
0.060  
0.210  
0.120  
0.110  
0.055  
0.255  
0.050  
—  
A
K
Q
Z
2
3
U
H
G
H
J
K
L
N
Q
R
S
T
L
R
V
J
G
U
V
Z
D
0.080  
2.04  
N
STYLE 9:  
PIN 1.
 
GATE  
2. COLLECTOR  
3. EMITTER  
4. COLLECTOR  
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