onsemi-NJV4031NT3G

Part #onsemi-NJV4031NT3G
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onsemi-NJV4031NT3G
NJT4031N,  
NJV4031NT1G,  
NJV4031NT3G  
Bipolar Power
T
r
ansistors  
NPN Silicon  
Features  
•
Epoxy Meets UL 94, V
−
0 @ 0.125 in  
•
NJV Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AEC
−
Q101  
Qualified and PPAP Capable  
NPN TRANSISTOR  
3.0 AMPERES  
40 VOLTS, 2.0 WATTS  
•
These Devices are Pb
−
Free, Halogen Free/BFR Free and are RoHS  
Compliant  
COLLECTOR 2,4  
MAXIMUM RATINGS
(T =
 
25
°
C unless otherwise noted)  
BASE  
1
C
Rating  
Collector
−
Emitter Voltage  
Collector
−
Base Voltage  
Emitter
−
Base Voltage  
Symbol  
Value  
40  
Unit  
Vdc  
Vdc  
Vdc  
EMITTER 3  
V
CEO  
MARKING  
DIAGRAM  
V
CB  
40  
4
V
EB  
6.0  
1
2
Base Current
−
Continuous  
Collector Current
−
Continuous  
Collector Current
−
Peak  
ESD
−
Human Body Model  
ESD
−
Machine Model  
I
B
1.0  
3.0  
5.0  
3B  
C
Adc  
Adc  
Adc  
V
3
AYW  
SOT
−
223  
CASE 318E  
STYLE 1  
4031N
G  
I
C
1
I
CM  
HBM  
MM  
A
Y
W
= Assembly Location  
Y
e
ar  
= Work Week  
V
4031N =
 
Specific Device Code  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
G
= Pb
−
Free Package  
ORDERING INFORMATION  
THERMAL CHARACTERISTICS  
†
Device  
Package  
Shipping  
Characteristic  
Symbol  
Max  
Unit  
NJT4031NT1G  
NJV4031NT1G  
SOT
−
223  
(Pb
−
Free)  
1000 /
T
a
pe &  
Reel  
T
o
tal Power Dissipation  
T
o
tal P
 
@ T
 
= 25
°

P
D
W
2.0  
0.80  
D
D
A
T
o
tal P
 
@ T
 
= 25
°
C

)  
A
NJT4031NT3G  
NJV4031NT3G  
SOT
−
223  
(Pb
−
Free)  
4000 /
T
a
pe &  
Reel  
Thermal Resistance, Junction
−
to
−
Case  
Junction
−
to
−

Junction
−
to
−
Ambient

)  
°
C/W  
R
R
64  
155  
q
q
JA  
JA  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our
T
a
pe and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Maximum Lead
T
e
mperature for Soldering  
Purposes, 1/8” from case for 5 seconds  
T
L
260  
°
C  
°
C  
Operating and Storage Junction  
T
e
mperature Range  
T , T  
−
55 to  
+
1
50  
J
stg  
1. Mounted
 
on 1” sq. (645 sq. mm) Collector pad on FR
−
4 bd material.  
2. Mounted
 
on 0.012” sq. (7.6 sq. mm) Collector pad on FR
−
4 bd material.  
©
Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
August, 2013
−
Rev. 4  
NJT4031N/D  
 

NJT4031N, NJV4031NT1G, NJV4031NT3G  
ELECTRICAL CHARACTERISTICS
(T =
 
25
°
C unless otherwise noted)  
C
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Collector
−
Emitter Sustaining Voltage  
(I =
 
10 mAdc, I
 
= 0 Adc)  
V
Vdc  
Vdc  
CEO(sus)  
40  
6.0  
−
−
−
−
−
−
C
B
Emitter
−
Base Voltage  
(I =
 
50
m
Adc, I
 
= 0 Adc)  
V
EBO  
−
E
C
Collector Cutoff Current  
I
nAdc  
nAdc  
CBO  
(V =
 
40 Vdc)  
100  
100  
CB  
Emitter Cutoff Current  
I
EBO  
(V =
 
6.0 Vdc)  
−
BE  
ON CHARACTERISTICS

Collector
−
Emitter Saturation Voltage  
V
V
Vdc  
CE(sat)  
(I =
 
0.5 Adc, I
 
= 5.0 mAdc)  
−
−
−
−
−
−
0.100  
0.150  
0.300  
C
B
(I =
 
1.0 Adc, I
 
= 10 mAdc)  
C
B
(I =
 
3.0 Adc, I
 
= 0.3 Adc)  
C
B
Base
−
Emitter Saturation Voltage  
(I =
 
1.0 Adc, I
 
= 0.1 Adc)  
Vdc  
Vdc  
BE(sat)  
−
−
−
−
1.0  
1.0  
C
B
Base
−
Emitter On Voltage  
V
BE(on)  
(I =
 
1.0 Adc, V
 
= 2.0 Vdc)  
C
CE  
DC Current Gain  
h
FE  
(I =
 
0.5 Adc, V
 
= 1.0 Vdc)  
220  
200  
100  
−
−
−
C
CE  
(I =
 
1.0 Adc, V
 
= 1.0 Vdc)  
500  
C
CE  
CE  
(I =
 
3.0 Adc, V
 
= 1.0 Vdc)  
C
DYNAMIC CHARACTERISTICS  
Output Capacitance  
C
pF  
pF  
ob  
(V =
 
10 Vdc, f = 1.0 MHz)  
−
−
−
25  
−
−
−
CB  
Input Capacitance  
C
ib  
(V =
 
5.0 Vdc, f = 1.0 MHz)  
170  
215  
EB  
f
T
MHz  
(I =
 
500 mA, V
 
= 10
V
, F
 
=
1
.0 MHz)  
C
CE  
test  
3. Pulse
 
T
e
st: Pulse Width
≤
300
m
s, Duty Cycle
≤
2%.  
4. f =
 
|h |
 
•
f  
T
FE  
test  
2.5  
2.0  
1.5  
1.0  
T
C
T
A
0.5  
0
25  
50  
75  
100  
125  
150  
T , TEMPERATURE (
°
C)  
J
Figure 1. Power Derating  
2
 

NJT4031N, NJV4031NT1G, NJV4031NT3G  
TYPICAL CHARACTERISTICS  
600  
500  
400  
300  
200  
700  
V
CE  
= 4 V  
V
CE  
= 1 V  
150
°
C  
600  
500  
400  
300  
200  
150
°
C  
25
°
C  
25
°
C  
−
55
°
C  
−
55
°
C  
100  
0
100  
0
0.001  
0.01  
0.1  
1
10  
0.001  
0.01  
0.1  
1
10  
10  
10  
I ,
 
COLLECTOR CURRENT (A)  
C
I ,
 
COLLECTOR CURRENT (A)  
C
Figure 2. DC Current Gain  
Figure 3. DC Current Gain  
1
1
I /I
 
= 10  
C
B
I /I
 
= 50  
C
150
°
C  
B
150
°
C  
25
°
C  
0.1  
−
55
°
C  
25
°
C  
0.1  
−
55
°
C  
0.01  
0.001  
0.01  
0.001  
0.01  
0.1  
1
10  
0.001  
0.01  
0.1  
1
I ,
 
COLLECTOR CURRENT (A)  
C
I ,
 
COLLECTOR CURRENT (A)  
C
Figure 4. Collector
−
Emitter Saturation Voltage  
Figure 5. Collector
−
Emitter Saturation Voltage  
1
1.2  
1.0  
0.8  
0.6  
0.4  
V
= 2 V  
CE  
−
55
°
C  
I
C
= 3 A  
2 A  
0.1  
25
°
C  
1 A  
0.5 A  
150
°
C  
0.2  
0
0.1 A  
0.01  
0.0001  
0.001  
0.01  
0.1  
1.0  
0.001  
0.01  
0.1  
1
I ,
 
BASE CURRENT (A)  
B
I ,
 
COLLECTOR CURRENT (A)  
C
Figure 6. Collector Saturation Region  
Figure 7. V

BE(on)

Voltage  
3

NJT4031N, NJV4031NT1G, NJV4031NT3G  
TYPICAL CHARACTERISTICS  
1.4  
1.4  
1.2  
I /I
 
= 10  
I /I
 
= 50  
C B  
C
B
1.2  
1.0  
0.8  
0.6  
0.4  
1.0  
0.8  
0.6  
0.4  
−
55
°
C  
−
55
°
C  
25
°
C  
25
°
C  
150
°
C  
150
°
C  
0.2  
0
0.2  
0
0.001  
0.01  
0.1  
1
10  
0.001  
0.01  
0.1  
1
10  
I ,
 
COLLECTOR CURRENT (A)  
C
I ,
 
COLLECTOR CURRENT (A)  
C
Figure 8. Base
−
Emitter Saturation Voltage  
Figure 9. Base
−
Emitter Saturation Voltage  
450  
100  
80  
T =
 
25
°
C  
J
J
400  
350  
300  
250  
200  
150  
100  
f
= 1 MHz  
f
test  
60  
40  
20  
0
50  
0
0
1
2
3
4
5
6
7
8
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
V
EB  
, EMITTER BASE VOLTAGE (V)  
V
CB  
, COLLECTOR BASE VOLTAGE (V)  
Figure 10. Input Capacitance  
Figure 11. Output Capacitance  
240  
200  
160  
120  
80  
10  
1
T =
 
25
°
C  
J
f
= 1 MHz  
0.5 ms  
test  
V
CE  
= 10 V  
1 ms  
10 ms  
100 ms  
0.1  
40  
0
0.01  
0.001  
0.01  
0.1  
1
10  
1
10  
, COLLECTOR
−
EMITTER VOLTAGE (V)  
100  
I ,
 
COLLECTOR CURRENT (A)  
C
V
CE  
Figure 12. Current
−
Gain Bandwidth Product  
Figure 13. Safe Operating Area  
4

MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SOT
−
223 (TO
−
261)  
CASE 318E
−
04  
ISSUE R  
DATE 02 OCT 2018  
SCALE 1:1  
q
q
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions
 
are uncontrolled
 
except when stamped
 
“CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98ASB42680B  
SOT
−
223 (TO
−
261)  
PAGE 1 OF 2  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
©
Semiconductor Components Industries, LLC, 2018  

SOT
−
223 (TO
−
261)  
CASE 318E
−
04  
ISSUE R  
DATE 02 OCT 2018  
STYLE 1:  
PIN 1.
 
BASE  
2. COLLECTOR  
3. EMITTER  
4. COLLECTOR  
STYLE 2:  
PIN 1.
 
ANODE  
STYLE 3:  
STYLE 4:  
PIN 1.
 
SOURCE  
STYLE 5:  
PIN 1.
 
DRAIN  
PIN 1.
 
GATE  
2. DRAIN  
2. CATHODE  
3. NC  
2. DRAIN  
3. GATE  
4. DRAIN  
2. GATE  
3. SOURCE  
4. DRAIN  
3. SOURCE  
4. GATE  
4. CATHODE  
STYLE 6:  
PIN 1.
 
RETURN  
STYLE 7:  
STYLE 8:  
STYLE 9:  
STYLE 10:  
PIN 1.
 
ANODE 1  
2. CATHODE  
3. ANODE
 
2  
CANCELLED  
PIN 1.
 
INPUT  
2. GROUND  
3. LOGIC  
PIN 1.
 
CATHODE  
2. ANODE  
2. INPUT  
3. OUTPUT  
4. INPUT  
3. GATE  
4. CATHODE  
4. GROUND  
4. ANODE  
STYLE 11:  
PIN 1.
 
MT 1  
STYLE 12:  
STYLE 13:  
PIN 1.
 
INPUT  
2. OUTPUT  
3. NC  
PIN 1.
 
GATE  
2. COLLECTOR  
3. EMITTER  
4. COLLECTOR  
2. MT
 
2  
3. GATE  
4. MT
 
2  
4. OUTPUT  
GENERIC  
MARKING DIAGRAM*  
AYW  
XXXXX
G  
G
1
A
Y
= Assembly Location  
=
Y
e
ar  
W
= Work Week  
XXXXX =
 
Specific Device Code  
G
= Pb
−
Free Package  
(Note: Microdot may be in either location)  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
Pb
−
Free indicator, “G” or microdot “
G
”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions
 
are uncontrolled
 
except when stamped
 
“CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98ASB42680B  
SOT
−
223 (TO
−
261)  
PAGE 2 OF 2  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
©
Semiconductor Components Industries, LLC, 2018  

ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at

. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
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T
:  
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o
ll Free USA/Canada  
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