onsemi-NST856BF3T5G
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NST856BF3T5G
PNP General Purpose
Transistor
The NST856BF3T5G device is a spin
−
off of our popular
SOT
−
23/SOT
−
323/SOT
−
563/SOT
−
963 three
−
leaded device. It is
designed for general purpose amplifier applications and is housed in
the SOT
−
1123 surface mount package. This device is ideal for
low
−
power surface mount applications where board space is at a
premium.
COLLECTOR
3
Features
•
h ,
220
−
475
FE
1
•
Low V
,
≤
−
0.3 V
CE(sat)
BASE
•
Reduces Board Space
•
This is a Halide
−
Free Device
•
This is a Pb
−
Free Device
2
EMITTER
NST856BF3T5G
MAXIMUM RATINGS
Rating
Symbol
Value
−
65
Unit
Vdc
3
Collecto
r
−
Emitter Voltage
Collecto
r
−
Base Voltage
Emitte
r
−
Base Voltage
Collector Current
−
Continuous
V
CEO
V
CBO
V
EBO
2
1
−
80
Vdc
−
5.0
−
100
Vdc
SOT
−
1
1
23
CASE 524AA
STYLE 1
I
C
mAdc
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
MARKING DIAGRAM
T
o
tal Device Dissipation, T
= 25
°
C
P
D
290
2.3
mW
mW/
°
C
A
Derate above 25
°
C
A M
Thermal Resistance,
R
432
°
C/W
q
JA
Junction
−
to
−
Ambient
A
M
= Device Code
= Date Code
T
o
tal Device Dissipation, T
= 25
°
C
Derate above 25
°
C
P
347
2.8
mW
mW/
°
C
A
D
Thermal Resistance,
Junction
−
to
−
Ambient
R
360
°
C/W
°
C/W
°
C
q
JA
ORDERING INFORMATION
Thermal Resistance,
Junction
−
to
−
Lead 3
R
143
Y
JL
†
Device
NST856BF3T5G
Package
Shipping
SOT
−
1
1
23 8000/
T
a
pe
& Reel
(Pb
−
Free)
Junction and Storage
T
e
mperature Range
T , T
−
55 to
+150
J
stg
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our
T
a
pe and Reel Packaging Specifications
Brochure, BRD8011/D.
2
2
1. 100
mm 1
oz, copper traces.
2. 500
mm 1
oz, copper traces.
©
Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
July, 2012
−
Rev. 1
NST856BF3/D
NST856BF3T5G
ELECTRICAL CHARACTERISTICS
(T =
25
°
C unless otherwise noted)
A
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Collecto
r
−
Emitter Breakdown Voltage (I
=
−
10 mA)
V
−
65
−
80
−
80
−
5.0
−
−
−
−
−
−
−
−
V
V
V
V
C
(BR)CEO
Collecto
r
−
Emitter Breakdown Voltage (I
=
−
10
m
A, V
= 0)
V
C
EB
(BR)CES
(BR)CBO
(BR)EBO
Collecto
r
−
Base Breakdown Voltage (I
=
−
10
m
A)
V
V
C
Emitte
r
−
Base Breakdown Voltage (I
=
−
1.0
m
A)
E
Collector Cutoff Current (V
=
−
30 V)
I
−
−
−
−
−
15
−
4.0
nA
m
A
CB
CBO
Collector Cutoff Current
(V =
−
30
V
, T
=
1
50
°
C)
CB
A
ON CHARACTERISTICS
DC Current Gain
h
−
V
V
V
FE
(I =
−
10
m
A, V
=
−
5.0 V)
−
220
150
290
−
475
C
CE
(I =
−
2.0 mA, V
=
−
5.0 V)
C
CE
Collecto
r
−
Emitter Saturation Voltage
(I =
−
10 mA, I
=
−
0.5 mA)
V
CE(sat)
BE(sat)
−
−
−
−
−
0.3
−
0.8
C
B
(I =
−
100 mA, I
=
−
5.0 mA)
C
B
Bas
e
−
Emitter Saturation Voltage
(I =
−
10 mA, I
=
−
0.5 mA)
V
−
−
−
0.7
−
0.9
−
−
C
B
(I =
−
100 mA, I
=
−
5.0 mA)
C
B
Bas
e
−
Emitter On Voltage
(I =
−
2.0 mA, V
=
−
5.0 V)
V
BE(on)
−
0.6
−
−
−
−
0.75
−
0.82
C
CE
(I =
−
10 mA, V
=
−
5.0 V)
C
CE
SMALL
−
SIGNAL CHARACTERISTICS
Curren
t
−
Gain
−
Bandwidth Product
f
100
−
−
−
−
−
−
MHz
pF
T
(I =
−
10 mA, V
=
−
5.0 Vdc, f = 100 MHz)
C
CE
Output Capacitance
(V =
−
10
V
, f =
1
.0 MHz)
CB
C
4.5
10
10
obo
Input Capacitance
C
−
pF
ibo
(V =
−
0.5
V
, I
= 0
m
A, f = 1.0 MHz)
EB
C
Noise Figure
NF
−
dB
(I =
−
0.2 mA, V
=
−
5.0 Vdc, R
= 2.0 k
W
, f = 1.0 kHz, BW = 200 Hz)
C
CE
S
0.18
0.16
0.14
0.12
0.10
0.08
0.06
800
700
600
500
400
300
200
I /I
= 10
150
°
C (5.0 V)
C
B
V
= 150
°
C
CE(sat)
150
°
C (1.0 V)
25
°
C (5.0 V)
25
°
C
25
°
C (1.0 V)
−
55
°
C (5.0 V)
−
55
°
C (1.0 V)
−
55
°
C
0.04
0.02
100
0
0.0001
0.001
0.01
0.1
0.0001
0.001
0.01
0.1
I ,
COLLECTOR CURRENT (A)
C
I ,
COLLECTOR CURRENT (A)
C
Figure 1. Collector Emitter Saturation Voltage vs.
Collector Current
Figure 2. DC Current Gain vs. Collector Current
2
NST856BF3T5G
1.0
1.0
0.9
0.8
0.7
0.6
0.5
V
= 2.0 V
I /I
= 10
CE
C
B
0.9
0.8
0.7
0.6
−
55
°
C
−
55
°
C
25
°
C
25
°
C
0.5
0.4
0.3
0.4
0.3
150
°
C
150
°
C
0.0001
0.001
0.01
0.1
0.0001
0.001
0.01
0.1
I ,
COLLECTOR CURRENT (A)
C
I ,
COLLECTOR CURRENT (A)
C
Figure 3. Base Emitter Saturation Voltage vs.
Collector Current
Figure 4. Base Emitter Turn
−
On Voltage vs.
Collector Current
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
10
9
I
=
C
100 mA
8
50 mA
7
6
5
4
3
30 mA
C
ib
10 mA
0
0.00001
0.0001
0.001
0.01
0
1.0
2.0
, EMITTER BASE VOLTAGE (V)
eb
3.0
4.0
5.0
I ,
BASE CURRENT (A)
b
V
Figure 5. Saturation Region
Figure 6. Input Capacitance
4.5
4.0
3.5
3.0
2.5
2.0
1.5
C
ob
1.0
0.5
0
5
10
15
20
25
30
V
cb
, COLLECTOR BASE VOLTAGE (V)
Figure 7. Output Capacitance
3
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT
−
1123
CASE 524AA
ISSUE C
DATE 29
NOV 2011
SCALE 8:1
NOTES:
−
X
−
D
1. DIMENSIONING
AND TOLERANCING PER ASME
Y14.5M, 1994.
−
Y
−
2. CONTROLLING
DIMENSION: MILLIMETERS.
3. MAXIMUM
LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS
D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
1
2
3
E
TOP VIEW
MILLIMETERS
A
DIM MIN
MAX
0.40
0.28
0.20
0.17
0.85
0.65
0.40
1.05
A
b
0.34
0.15
b1
0.10
c
D
E
e
0.07
0.75
0.55
0.35
0.95
H
c
E
H
E
SIDE VIEW
L
0.185 REF
L2
0.05 0.15
b
3X
L2
GENERIC
MARKING DIAGRAM*
0.08 X
Y
e
X M
3X
L
2X
b1
X
M
= Specific Device Code
= Date Code
BOTTOM VIEW
*This information is generic. Please refer
to device data sheet for actual part
marking.
SOLDERING FOOTPRINT*
1.20
Pb
−
Free indicator, “G” or microdot “
G
”,
may or may not be present.
3X
0.34
0.26
1
0.38
2X
0.20
PACKAGE
OUTLINE
DIMENSIONS: MILLIMETERS
*For additional information on our Pb
−
Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting
T
e
chniques Reference Manual, SOLDERRM/D.
STYLE 1:
STYLE 2:
STYLE 3:
STYLE 4:
STYLE 5:
PIN 1.
BASE
PIN 1.
ANODE
2. N/C
PIN 1.
ANODE
2. ANODE
PIN 1.
CATHODE
2. CATHODE
3. ANODE
PIN 1.
GATE
2. EMITTER
3. COLLECTOR
2. SOURCE
3. DRAIN
3. CATHODE
3. CATHODE
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions
are uncontrolled
except when stamped
“CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON23134D
SOT
−
1123, 3
−
LEAD, 1.0X0.6X0.37, 0.35P
PAGE 1 OF 1
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Semiconductor Components Industries, LLC, 2019
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,
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onsemi
” or its affiliates
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−
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