onsemi-NST856BF3T5G

Part #onsemi-NST856BF3T5G
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onsemi-NST856BF3T5G
NST856BF3T5G  
PNP General Purpose  
Transistor  
The NST856BF3T5G device is a spin
−
off of our popular  
SOT
−
23/SOT
−
323/SOT
−
563/SOT
−
963 three
−
leaded device. It is  
designed for general purpose amplifier applications and is housed in  
the SOT
−
1123 surface mount package. This device is ideal for  
low
−
power surface mount applications where board space is at a  
premium.  
COLLECTOR  
3
Features  
•
h ,
 
220
−
475  
FE  
1
•
Low V  
,
≤
−
0.3 V  
CE(sat)  
BASE  
•
Reduces Board Space  
•
This is a Halide
−
Free Device  
•
This is a Pb
−
Free Device  
2
EMITTER  
NST856BF3T5G  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
−
65  
Unit  
Vdc  
3
Collecto
r
−
Emitter Voltage  
Collecto
r
−
Base Voltage  
Emitte
r
−
Base Voltage  
Collector Current
−
Continuous  
V
CEO  
V
CBO  
V
EBO  
2
1
−
80  
Vdc  
−
5.0  
−
100  
Vdc  
SOT
−
1
1
23  
CASE 524AA  
STYLE 1  
I
C
mAdc  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
MARKING DIAGRAM  
T
o
tal Device Dissipation, T
 
= 25
°
C  
P
D
290  
2.3  
mW  
mW/
°
C  
A
Derate above 25
°
C  
A M  
Thermal Resistance,  
R
432  
°
C/W  
q
JA  
Junction
−
to
−
Ambient  
A
M
= Device Code  
= Date Code  
T
o
tal Device Dissipation, T
 
= 25
°
C  
Derate above 25
°
C  
P
347  
2.8  
mW  
mW/
°
C  
A
D
Thermal Resistance,  
Junction
−
to
−
Ambient  
R
360  
°
C/W  
°
C/W  
°
C  
q
JA  
ORDERING INFORMATION  
Thermal Resistance,  
Junction
−
to
−
Lead 3  
R
143  
Y
JL  
†
Device  
NST856BF3T5G  
Package  
Shipping  
SOT
−
1
1
23 8000/
T
a
pe
 
& Reel  
(Pb
−
Free)  
Junction and Storage
T
e
mperature Range
 
T , T  
−
55 to  
+150  
J
stg  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our
T
a
pe and Reel Packaging Specifications  
Brochure, BRD8011/D.  
2
2
1. 100
 
mm 1
 
oz, copper traces.  
2. 500
 
mm 1
 
oz, copper traces.  
©
Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
July, 2012
−
Rev. 1  
NST856BF3/D  
 

NST856BF3T5G  
ELECTRICAL CHARACTERISTICS
(T =
 
25
°
C unless otherwise noted)  
A
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Collecto
r
−
Emitter Breakdown Voltage (I
 
=
−
10 mA)  
V
−
65  
−
80  
−
80  
−
5.0  
−
−
−
−
−
−
−
−
V
V
V
V
C
(BR)CEO  
Collecto
r
−
Emitter Breakdown Voltage (I
 
=
−
10
m
A, V
 
= 0)  
V
C
EB  
(BR)CES  
(BR)CBO  
(BR)EBO  
Collecto
r
−
Base Breakdown Voltage (I
 
=
−
10
m
A)  
V
V
C
Emitte
r
−
Base Breakdown Voltage (I
 
=
−
1.0
m
A)  
E
Collector Cutoff Current (V
 
=
−
30 V)  
I
−
−
−
−
−
15  
−
4.0  
nA  
m
A  
CB  
CBO  
Collector Cutoff Current
(V =
 
−
30
V
, T
 
=
1
50
°
C)  
CB  
A
ON CHARACTERISTICS  
DC Current Gain  
h
−
V
V
V
FE  
(I =
 
−
10
m
A, V
 
=
−
5.0 V)  
−
220  
150  
290  
−
475  
C
CE  
(I =
 
−
2.0 mA, V
 
=
−
5.0 V)  
C
CE  
Collecto
r
−
Emitter Saturation Voltage  
(I =
 
−
10 mA, I
 
=
−
0.5 mA)  
V
CE(sat)  
BE(sat)  
−
−
−
−
−
0.3  
−
0.8  
C
B
(I =
 
−
100 mA, I
 
=
−
5.0 mA)  
C
B
Bas
e
−
Emitter Saturation Voltage  
(I =
 
−
10 mA, I
 
=
−
0.5 mA)  
V
−
−
−
0.7  
−
0.9  
−
−
C
B
(I =
 
−
100 mA, I
 
=
−
5.0 mA)  
C
B
Bas
e
−
Emitter On Voltage  
(I =
 
−
2.0 mA, V
 
=
−
5.0 V)  
V
BE(on)  
−
0.6  
−
−
−
−
0.75  
−
0.82  
C
CE  
(I =
 
−
10 mA, V
 
=
−
5.0 V)  
C
CE  
SMALL
−
SIGNAL CHARACTERISTICS  
Curren
t
−
Gain
−
Bandwidth Product  
f
100  
−
−
−
−
−
−
MHz  
pF  
T
(I =
 
−
10 mA, V
 
=
−
5.0 Vdc, f = 100 MHz)  
C
CE  
Output Capacitance  
(V =
 
−
10
V
, f =
1
.0 MHz)  
CB  
C
4.5  
10  
10  
obo  
Input Capacitance  
C
−
pF  
ibo  
(V =
 
−
0.5
V
, I
 
= 0
m
A, f = 1.0 MHz)  
EB  
C
Noise Figure  
NF  
−
dB  
(I =
 
−
0.2 mA, V
 
=
−
5.0 Vdc, R
 
= 2.0 k
W
, f = 1.0 kHz, BW = 200 Hz)  
C
CE  
S
0.18  
0.16  
0.14  
0.12  
0.10  
0.08  
0.06  
800  
700  
600  
500  
400  
300  
200  
I /I
 
= 10  
150
°
C (5.0 V)  
C
B
V
= 150
°
C  
CE(sat)  
150
°
C (1.0 V)  
25
°
C (5.0 V)  
25
°
C  
25
°
C (1.0 V)  
−
55
°
C (5.0 V)  
−
55
°
C (1.0 V)  
−
55
°
C  
0.04  
0.02  
100  
0
0.0001  
0.001  
0.01  
0.1  
0.0001  
0.001  
0.01  
0.1  
I ,
 
COLLECTOR CURRENT (A)  
C
I ,
 
COLLECTOR CURRENT (A)  
C
Figure 1. Collector Emitter Saturation Voltage vs.  
Collector Current  
Figure 2. DC Current Gain vs. Collector Current  
2

NST856BF3T5G  
1.0  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
V
= 2.0 V  
I /I
 
= 10  
CE  
C
B
0.9  
0.8  
0.7  
0.6  
−
55
°
C  
−
55
°
C  
25
°
C  
25
°
C  
0.5  
0.4  
0.3  
0.4  
0.3  
150
°
C  
150
°
C  
0.0001  
0.001  
0.01  
0.1  
0.0001  
0.001  
0.01  
0.1  
I ,
 
COLLECTOR CURRENT (A)  
C
I ,
 
COLLECTOR CURRENT (A)  
C
Figure 3. Base Emitter Saturation Voltage vs.  
Collector Current  
Figure 4. Base Emitter Turn
−
On Voltage vs.  
Collector Current  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
10  
9
I
=
C
100 mA  
8
50 mA  
7
6
5
4
3
30 mA  
C
ib  
10 mA  
0
0.00001  
0.0001  
0.001  
0.01  
0
1.0  
2.0  
, EMITTER BASE VOLTAGE (V)  
eb  
3.0  
4.0  
5.0  
I ,
 
BASE CURRENT (A)  
b
V
Figure 5. Saturation Region  
Figure 6. Input Capacitance  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
C
ob  
1.0  
0.5  
0
5
10  
15  
20  
25  
30  
V
cb  
, COLLECTOR BASE VOLTAGE (V)  
Figure 7. Output Capacitance  
3

MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SOT
−
1123  
CASE 524AA  
ISSUE C  
DATE 29
 
NOV 2011  
SCALE 8:1  
NOTES:  
−
X
−  
D
1. DIMENSIONING
 
AND TOLERANCING PER ASME  
Y14.5M, 1994.  
−
Y
−  
2. CONTROLLING
 
DIMENSION: MILLIMETERS.  
3. MAXIMUM
 
LEAD THICKNESS INCLUDES LEAD  
FINISH. MINIMUM LEAD THICKNESS IS THE  
MINIMUM THICKNESS OF BASE MATERIAL.  
4. DIMENSIONS
 
D AND E DO NOT INCLUDE MOLD  
FLASH, PROTRUSIONS, OR GATE BURRS.  
1
2
3
E
TOP VIEW  
MILLIMETERS  
A
DIM MIN  
MAX  
0.40  
0.28  
0.20  
0.17  
0.85  
0.65  
0.40  
1.05  
A
b
0.34  
0.15  
b1
0.10  
c
D
E
e
0.07  
0.75  
0.55  
0.35  
0.95  
H
c
E
H
E
SIDE VIEW  
L
0.185 REF  
L2
0.05 0.15  
b
3X  
L2  
GENERIC  
MARKING DIAGRAM*  
0.08 X  
Y
e
X M  
3X  
L
2X  
b1  
X
M
= Specific Device Code  
= Date Code  
BOTTOM VIEW  
*This information is generic. Please refer  
to device data sheet for actual part  
marking.  
SOLDERING FOOTPRINT*  
1.20  
Pb
−
Free indicator, “G” or microdot “
G
”,  
may or may not be present.  

3X

0.34  
0.26  
1
0.38  
2X  
0.20  
PACKAGE  
OUTLINE  
DIMENSIONS: MILLIMETERS  
*For additional information on our Pb
−
Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting
T
e
chniques Reference Manual, SOLDERRM/D.  
STYLE 1:  
STYLE 2:  
STYLE 3:  
STYLE 4:  
STYLE 5:  
PIN 1.
 
BASE  
PIN 1.
 
ANODE  
2. N/C  
PIN 1.
 
ANODE  
2. ANODE  
PIN 1.
 
CATHODE  
2. CATHODE  
3. ANODE  
PIN 1.
 
GATE  
2. EMITTER  
3. COLLECTOR  
2. SOURCE  
3. DRAIN  
3. CATHODE  
3. CATHODE  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions
 
are uncontrolled
 
except when stamped
 
“CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON23134D  
SOT
−
1123, 3
−
LEAD, 1.0X0.6X0.37, 0.35P  
PAGE 1 OF 1  
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
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©
Semiconductor Components Industries, LLC, 2019  

onsemi
,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “
onsemi
” or its affiliates  
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onsemi
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−
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onsemi
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onsemi
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onsemi
. “Typical” parameters which may be provided in
onsemi
data sheets and/or specifications can and do vary in different applications and actual performance may  
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.
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does not convey any license  
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