onsemi-NSVBC846BM3T5G
| Part # | onsemi-NSVBC846BM3T5G |
| Download | onsemi-NSVBC846BM3T5G |
General Purpose
T
r
ansistor
NPN Silicon
BC846BM3T5G,
NSVBC846BM3T5G
Features
•
Moisture Sensitivity Level: 1
•
ESD Rating:
Human Body Model: >4000 V
Machine Model: >400 V
COLLECTOR
3
•
NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC
−
Q101
Qualified and PPAP Capable
1
BASE
2
•
This is a Pb
−
Free Device
EMITTER
MAXIMUM RATINGS
MARKING
DIAGRAM
Rating
Symbol
Value
65
Unit
Vdc
3
Collector
−
Emitter Voltage
Collector
−
Base Voltage
Emitter
−
Base Voltage
V
CEO
V
CBO
V
EBO
SOT
−
723
CASE 631AA
STYLE 1
80
Vdc
1B M
2
6.0
Vdc
1
Collector Current
−
Continuous
THERMAL CHARACTERISTICS
Characteristic
I
C
100
mAdc
1B =
Specific Device Code
= Date Code
M
Symbol
Max
Unit
T
o
tal Device Dissipation FR
−
5 Board
P
D
265
mW
ORDERING INFORMATION
T =
25
°
C
A
†
Device
BC846BM3T5G
Package
Shipping
Derate above 25
°
C
2.1
mW/
°
C
°
C/W
SOT
−
723
(Pb
−
Free)
8000 /
T
a
pe &
Reel
Thermal Resistance,
R
470
q
JA
NSVBC846BM3T5G SOT
−
723
(Pb
−
Free)
8000 /
T
a
pe &
Reel
T
o
tal Device Dissipation
P
D
640
mW
T =
25
°
C
Derate above 25
°
C
A
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our
T
a
pe and Reel Packaging Specifications
Brochure, BRD8011/D.
5.1
mW/
°
C
°
C/W
Thermal Resistance,
R
195
q
JA
Junction and Storage
T
e
mperature Range
T , T
−
55 to
+150
°
C
J
stg
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR
−
5 = 1.0
ꢀ
0.75
ꢀ
0.062 in.
2. Alumina
= 0.4
ꢀ
0.3
ꢀ
0.024 in. 99.5% alumina.
©
Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
July, 2021
−
Rev. 4
BC846BM3/D
BC846BM3T5G, NSVBC846BM3T5G
ELECTRICAL CHARACTERISTICS
(T =
25
°
C unless otherwise noted)
A
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Collecto
r
−
Emitter Breakdown Voltage
(I =
10 mA)
C
V
V
V
V
V
(BR)CEO
65
80
80
6.0
−
−
−
−
−
−
−
−
Collecto
r
−
Emitter Breakdown Voltage
V
(BR)CES
(BR)CBO
(BR)EBO
(I =
10
m
A, V
= 0)
C
EB
Collecto
r
−
Base Breakdown Voltage
(I =
10
m
A)
C
V
V
Emitte
r
−
Base Breakdown Voltage
(I =
1.0
m
A)
E
Collector Cutoff Current
(V =
30 V)
I
−
−
−
−
15
5.0
nA
m
A
CB
CBO
(V =
30
V
, T
=
1
50
°
C)
CB
A
Base Peak Current
I
mA
BM
(t
≤
1 s)
−
−
200
ON CHARACTERISTICS
DC Current Gain
h
FE
−
(I =
10
m
A, V
= 5.0 V)
−
200
150
290
−
450
C
CE
(I =
2.0 mA, V
= 5.0 V)
C
CE
Collecto
r
−
Emitter Saturation Voltage (I
= 10 mA, I
= 0.5 mA)
V
−
−
−
−
0.25
0.6
V
V
C
B
CE(sat)
Collecto
r
−
Emitter Saturation Voltage
(I =
100 mA, I
= 5.0 mA)
C
B
Bas
e
−
Emitter Saturation Voltage (I
= 10 mA, I
= 0.5 mA)
V
−
−
0.7
0.9
−
−
C
B
BE(sat)
Bas
e
−
Emitter Saturation Voltage
(I =
100 mA, I
= 5.0 mA)
C
B
Bas
e
−
Emitter Voltage (I
= 1.0 mA, V
= 5.0 V)
V
BE(on)
550
580
−
645
660
−
700
700
770
mV
C
CE
Bas
e
−
Emitter Voltage
(I =
2.0 mA, V
= 5.0 V)
C
CE
Bas
e
−
Emitter Voltage
(I =
10 mA, V
= 5.0 V)
C
CE
SMALL
−
SIGNAL CHARACTERISTICS
Curren
t
−
Gain
−
Bandwidth Product
f
MHz
pF
T
(I =
10 mA, V
= 5.0 Vdc, f = 100 MHz)
100
−
−
−
−
−
C
CE
Output Capacitance
(V =
10
V
, f =
1
.0 MHz)
CB
C
obo
4.5
Noise Figure
NF
dB
(I =
0.2 mA, V
= 5.0 Vdc, R
= 2.0 k
W
, f = 1.0 kHz, BW = 200 Hz)
−
10
C
CE
S
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2
BC846BM3T5G, NSVBC846BM3T5G
TYPICAL CHARACTERISTICS
1,000
0.4
150
°
C
25
°
C
V
CE
= 5 V
IC/IB = 20
0.3
0.2
−
55
°
C
150
°
C
−
55
°
C
100
10
25
°
C
0.1
0
0.1
1
10
100
1,000
0.1
1
10
100
I ,
COLLECTOR CURRENT (mA)
C
I ,
COLLECTOR CURRENT (mA)
C
Figure 1. DC Current Gain
Figure 2. Collector
−
Emitter Saturation Voltage
1.2
1.2
1.0
1.0
0.8
0.6
0.4
−
55
°
C
25
°
C
−
55
°
C
25
°
C
0.8
0.6
0.4
150
°
C
150
°
C
0.2
0
V
= 5 V
0.2
0
IC/IB = 20
CE
0.1
1
10
100
1,000
0.1
1
10
100
1,000
I ,
COLLECTOR CURRENT (mA)
C
I ,
COLLECTOR CURRENT (mA)
C
Figure 3. Base
−
Emitter Saturation Voltage
Figure 4. Base
−
Emitter “On” Voltage
−
0.2
2.0
1.6
1.2
0.8
T =
25
°
C
A
V
CE
= 5 V
−
0.6
−
1.0
−
1.4
−
1.8
−
2.2
10 mA
20 mA
50 mA
100 mA
I =
200 mA
C
q
, for V
BE
VB
0.4
0
−
2.6
−
3.0
−
55
°
C to 150
°
C
0.1
1
10
100
1,000
0.01
0.1
1
10
100
I ,
COLLECTOR CURRENT (mA)
C
I ,
BASE CURRENT (mA)
B
Figure 5. Base
−
Emitter Temperature
Figure 6. Collector Saturation Region
Coefficient
3
BC846BM3T5G, NSVBC846BM3T5G
TYPICAL CHARACTERISTICS
10
1,000
V
CE
= 5 V
Cib
Cob
1
100
10
0.1
0.1
1
10
100
1
10
I ,
COLLECTOR CURRENT (mA)
100
V ,
REVERSE VOLTAGE (V)
R
C
Figure 7. Capacitances
Figure 8. Current
−
Gain
−
Bandwidth Product
4
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT
−
723
CASE 631AA
−
01
ISSUE D
DATE 10 AUG 2009
SCALE 4:1
NOTES:
−
X
−
1. DIMENSIONING
AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING
DIMENSION: MILLIMETERS.
3. MAXIMUM
LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
D
A
b1
−
Y
−
3
E
H
E
4. DIMENSIONS
D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
1
2
MILLIMETERS
2X
b
3X
C
DIM MIN
NOM
0.50
0.21
0.31
0.12
1.20
0.80
MAX
0.55
0.27
0.37
0.17
1.25
0.85
2X
e
0.08 X
Y
A
b
0.45
0.15
0.25
0.07
1.15
0.75
SIDE VIEW
TOP VIEW
b1
C
L
D
1
E
0.40 BSC
1.20
0.29 REF
0.20
e
H
E
L
1.15
0.15
1.25
0.25
L2
GENERIC
3X
L2
MARKING DIAGRAM*
BOTTOM VIEW
STYLE 1:
PIN 1.
BASE
STYLE 2:
PIN 1.
ANODE
2. N/C
STYLE 3:
STYLE 4:
STYLE 5:
PIN 1.
GATE
2. SOURCE
3. DRAIN
PIN 1.
ANODE
2. ANODE
PIN 1.
CATHODE
2. CATHODE
3. ANODE
XX M
1
2. EMITTER
3. COLLECTOR
3. CATHODE
3. CATHODE
XX
M
= Specific Device Code
= Date Code
RECOMMENDED
SOLDERING FOOTPRINT*
*This information is generic. Please refer
to device data sheet for actual part
marking. Pb
−
Free indicator, “G”, may
or not be present.
2X
0.40
2X
0.27
PACKAGE
OUTLINE
1.50
3X
0.52
0.36
DIMENSIONS: MILLIMETERS
*For additional information on our Pb
−
Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting
T
e
chniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions
are uncontrolled
except when stamped
“CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON12989D
SOT
−
723
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
©
Semiconductor Components Industries, LLC, 2019
onsemi
,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “
onsemi
” or its affiliates
and/or subsidiaries in the United States and/or other countries.
onsemi
owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of
onsemi
’s product/patent coverage may be accessed at
www.onsemi.com/site/pdf/Patent
−
Marking.pdf
.
onsemi
reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as
−
is” and
onsemi
makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does
onsemi
assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using
onsemi
products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by
onsemi
. “Typical” parameters which may be provided in
onsemi
data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.
onsemi
does not convey any license
under any of its intellectual property rights nor the rights of others.
onsemi
products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use
onsemi
products for any such unintended or unauthorized application, Buyer shall indemnify and hold
onsemi
and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that
onsemi
was negligent regarding the design or manufacture of the part.
onsemi
is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMEN
T
:
TECHNICAL SUPPORT
North American Technical Support:
Voice Mail: 1 800
−
282
−
9855
T
o
ll Free USA/Canada
Phone: 011 421 33 790 2910
Europe, Middle East and Africa Technical Support:
Phone: 00421 33 790 2910
For additional information, please contact your local Sales Representative
◊
