onsemi-NSVBC846BM3T5G

Part #onsemi-NSVBC846BM3T5G
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onsemi-NSVBC846BM3T5G
General Purpose
T
r
ansistor  
NPN Silicon  
BC846BM3T5G,  
NSVBC846BM3T5G  
Features  
•
Moisture Sensitivity Level: 1  
•
ESD Rating:  
Human Body Model: >4000 V  
Machine Model: >400 V  
COLLECTOR  
3
•
NSV Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AEC
−
Q101  
Qualified and PPAP Capable  
1
BASE  
2
•
This is a Pb
−
Free Device  
EMITTER  
MAXIMUM RATINGS  
MARKING  
DIAGRAM  
Rating  
Symbol  
Value  
65  
Unit  
Vdc  
3
Collector
−
Emitter Voltage  
Collector
−
Base Voltage  
Emitter
−
Base Voltage  
V
CEO  
V
CBO  
V
EBO  
SOT
−
723  
CASE 631AA  
STYLE 1  
80  
Vdc  
1B M  
2
6.0  
Vdc  
1
Collector Current
−
Continuous  
THERMAL CHARACTERISTICS  
Characteristic  
I
C
100  
mAdc  
1B =
 
Specific Device Code  
= Date Code  
M
Symbol  
Max  
Unit  
T
o
tal Device Dissipation FR
−
5 Board  
P
D
265  
mW  
ORDERING INFORMATION  
T =
 
25
°
C  
A
†
Device  
BC846BM3T5G  
Package  
Shipping  
Derate above 25
°
C  
2.1  
mW/
°
C  
°
C/W  
SOT
−
723  
(Pb
−
Free)  
8000 /
T
a
pe &  
Reel  
Thermal Resistance,  
R
470  
q
JA  
NSVBC846BM3T5G SOT
−
723  
(Pb
−
Free)  
8000 /
T
a
pe &  
Reel  
T
o
tal Device Dissipation  
P
D
640  
mW  
T =
 
25
°
C  
Derate above 25
°
C  
A
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our
T
a
pe and Reel Packaging Specifications  
Brochure, BRD8011/D.  
5.1  
mW/
°
C  
°
C/W  
Thermal Resistance,  
R
195  
q
JA  
Junction and Storage  
T
e
mperature Range  
T , T  
−
55 to  
+150  
°
C  
J
stg  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. FR
−
5 = 1.0
ꢀ
0.75
ꢀ
0.062 in.  
2. Alumina
 
= 0.4
ꢀ
0.3
ꢀ
0.024 in. 99.5% alumina.  
©
Semiconductor Components Industries, LLC, 2014  
1
Publication Order Number:  
July, 2021
−
Rev. 4  
BC846BM3/D  
 

BC846BM3T5G, NSVBC846BM3T5G  
ELECTRICAL CHARACTERISTICS
(T =
 
25
°
C unless otherwise noted)  
A
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Collecto
r
−
Emitter Breakdown Voltage  
(I =
 
10 mA)  
C
V
V
V
V
V
(BR)CEO  
65  
80  
80  
6.0  
−
−
−
−
−
−
−
−
Collecto
r
−
Emitter Breakdown Voltage  
V
(BR)CES  
(BR)CBO  
(BR)EBO  
(I =
 
10
m
A, V
 
= 0)  
C
EB  
Collecto
r
−
Base Breakdown Voltage  
(I =
 
10
m
A)  
C
V
V
Emitte
r
−
Base Breakdown Voltage  
(I =
 
1.0
m
A)  
E
Collector Cutoff Current
 
(V =
 
30 V)  
I
−
−
−
−
15  
5.0  
nA  
m
A  
CB  
CBO  
(V =
 
30
V
, T
 
=
1
50
°
C)  
CB  
A
Base Peak Current  
I
mA  
BM  
(t
≤
1 s)  
−
−
200  
ON CHARACTERISTICS  
DC Current Gain  
h
FE  
−
(I =
 
10
m
A, V
 
= 5.0 V)  
−
200  
150  
290  
−
450  
C
CE  
(I =
 
2.0 mA, V
 
= 5.0 V)  
C
CE  
Collecto
r
−
Emitter Saturation Voltage (I
 
= 10 mA, I
 
= 0.5 mA)  
V
−
−
−
−
0.25  
0.6  
V
V
C
B
CE(sat)  
Collecto
r
−
Emitter Saturation Voltage
(I =
 
100 mA, I
 
= 5.0 mA)  
C
B
Bas
e
−
Emitter Saturation Voltage (I
 
= 10 mA, I
 
= 0.5 mA)  
V
−
−
0.7  
0.9  
−
−
C
B
BE(sat)  
Bas
e
−
Emitter Saturation Voltage
(I =
 
100 mA, I
 
= 5.0 mA)  
C
B
Bas
e
−
Emitter Voltage (I
 
= 1.0 mA, V
 
= 5.0 V)  
V
BE(on)  
550  
580  
−
645  
660  
−
700  
700  
770  
mV  
C
CE  
Bas
e
−
Emitter Voltage
(I =
 
2.0 mA, V
 
= 5.0 V)  
C
CE  
Bas
e
−
Emitter Voltage
(I =
 
10 mA, V
 
= 5.0 V)  
C
CE  
SMALL
−
SIGNAL CHARACTERISTICS  
Curren
t
−
Gain
−
Bandwidth Product  
f
MHz  
pF  
T
(I =
 
10 mA, V
 
= 5.0 Vdc, f = 100 MHz)  
100  
−
−
−
−
−
C
CE  
Output Capacitance  
(V =
 
10
V
, f =
1
.0 MHz)  
CB  
C
obo  
4.5  
Noise Figure  
NF  
dB  
(I =
 
0.2 mA, V
 
= 5.0 Vdc, R
 
= 2.0 k
W
, f = 1.0 kHz, BW = 200 Hz)  
−
10  
C
CE  
S
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
2

BC846BM3T5G, NSVBC846BM3T5G  
TYPICAL CHARACTERISTICS  
1,000  
0.4  
150
°
C  
25
°
C  
V
CE  
= 5 V  
IC/IB = 20  
0.3  
0.2  
−
55
°
C  
150
°
C  
−
55
°
C  
100  
10  
25
°
C  
0.1  
0
0.1  
1
10  
100  
1,000  
0.1  
1
10  
100  
I ,
 
COLLECTOR CURRENT (mA)  
C
I ,
 
COLLECTOR CURRENT (mA)  
C
Figure 1. DC Current Gain  
Figure 2. Collector
−
Emitter Saturation Voltage  
1.2  
1.2  
1.0  
1.0  
0.8  
0.6  
0.4  
−
55
°
C  
25
°
C  
−
55
°
C  
25
°
C  
0.8  
0.6  
0.4  
150
°
C  
150
°
C  
0.2  
0
V
= 5 V  
0.2  
0
IC/IB = 20  
CE  
0.1  
1
10  
100  
1,000  
0.1  
1
10  
100  
1,000  
I ,
 
COLLECTOR CURRENT (mA)  
C
I ,
 
COLLECTOR CURRENT (mA)  
C
Figure 3. Base
−
Emitter Saturation Voltage  
Figure 4. Base
−
Emitter “On” Voltage  
−
0.2  
2.0  
1.6  
1.2  
0.8  
T =
 
25
°
C  
A
V
CE  
= 5 V  
−
0.6  
−
1.0  
−
1.4  
−
1.8  
−
2.2  
10 mA  
20 mA
 
50 mA
 
100 mA
 
I =
 
200 mA  
C
q
, for V  
BE  
VB  
0.4  
0
−
2.6  
−
3.0  
−
55
°
C to 150
°
C  
0.1  
1
10  
100  
1,000  
0.01  
0.1  
1
10  
100  
I ,
 
COLLECTOR CURRENT (mA)  
C
I ,
 
BASE CURRENT (mA)  
B
Figure 5. Base
−
Emitter Temperature  
Figure 6. Collector Saturation Region  
Coefficient  
3

BC846BM3T5G, NSVBC846BM3T5G  
TYPICAL CHARACTERISTICS  
10  
1,000  
V
CE  
= 5 V  
Cib  
Cob  
1
100  
10  
0.1  
0.1  
1
10  
100  
1
10  
I ,
 
COLLECTOR CURRENT (mA)  
100  
V ,
 
REVERSE VOLTAGE (V)  
R
C
Figure 7. Capacitances  
Figure 8. Current
−
Gain
−
Bandwidth Product  
4

MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SOT
−
723  
CASE 631AA
−
01  
ISSUE D  
DATE 10 AUG 2009  
SCALE 4:1  
NOTES:  
−
X
−  
1. DIMENSIONING
 
AND TOLERANCING PER ASME  
Y14.5M, 1994.  
2. CONTROLLING
 
DIMENSION: MILLIMETERS.  
3. MAXIMUM
 
LEAD THICKNESS INCLUDES LEAD  
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM  
THICKNESS OF BASE MATERIAL.  
D
A
b1  
−
Y
−  
3
E
H

E  

4. DIMENSIONS
 
D AND E DO NOT INCLUDE MOLD  
FLASH, PROTRUSIONS OR GATE BURRS.  
1
2
MILLIMETERS  
2X
b  
3X  
C
DIM MIN  
NOM  
0.50  
0.21  
0.31  
0.12  
1.20  
0.80  
MAX  
0.55  
0.27  
0.37  
0.17  
1.25  
0.85  
2X
e  
0.08 X
 
Y  
A
b
0.45  
0.15  
0.25  
0.07  
1.15  
0.75  
SIDE VIEW  
TOP VIEW  
b1  
C
L
D
1
E
0.40 BSC  
1.20  
0.29 REF  
0.20  
e
H
E  
L
1.15  
0.15  
1.25  
0.25  
L2  
GENERIC  
3X  
L2  
MARKING DIAGRAM*  
BOTTOM VIEW  
STYLE 1:  
PIN 1.
 
BASE  
STYLE 2:  
PIN 1.
 
ANODE  
2. N/C  
STYLE 3:  
STYLE 4:  
STYLE 5:  
PIN 1.
 
GATE  
2. SOURCE  
3. DRAIN  
PIN 1.
 
ANODE  
2. ANODE  
PIN 1.
 
CATHODE  
2. CATHODE  
3. ANODE  
XX M  
1
2. EMITTER  
3. COLLECTOR  
3. CATHODE  
3. CATHODE  
XX  
M
= Specific Device Code  
= Date Code  
RECOMMENDED  
SOLDERING FOOTPRINT*  
*This information is generic. Please refer  
to device data sheet for actual part  
marking. Pb
−
Free indicator, “G”, may  
or not be present.  
2X  
0.40  

2X

0.27  
PACKAGE  
OUTLINE  
1.50  
3X  
0.52  
0.36  
DIMENSIONS: MILLIMETERS  
*For additional information on our Pb
−
Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting
T
e
chniques Reference Manual, SOLDERRM/D.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions
 
are uncontrolled
 
except when stamped
 
“CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON12989D  
SOT
−
723  
PAGE 1 OF 1  
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
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©
Semiconductor Components Industries, LLC, 2019  

onsemi
,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “
onsemi
” or its affiliates  
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−
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onsemi
. “Typical” parameters which may be provided in
onsemi
data sheets and/or specifications can and do vary in different applications and actual performance may  
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:  
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