onsemi-NTHL019N60S5F

Part #onsemi-NTHL019N60S5F
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onsemi-NTHL019N60S5F
DATA SHEET  

MOSFET

– Powe
r
,
S
ingle  
N-Channel, SUPERFET

)

V
,  
FRFET

)

, TO247-3L  
V
R
MAX  
I MAX  
D
DSS  
DS(ON)  
600 V  
19 m
W
@ 10 V  
75 A  
D
600
V
,
1
9 m
W
, 75 A  
NTHL019N60S5F  
Description  
G
The SUPERFET V MOSFET FRFET series, optimized reverse  
recovery performance of body diode, can remove additional component  
and improve system reliability for soft switching applications such as  
PSFB and LLC.  
S
Features  
•
650 V @ T
 
= 150
°
C  
J
•
Typ. R  
= 15.2 m
W
 
•
100% Avalanche Tested  
DS(on)  
•
Pb
−
Free, Halogen Free/BFR Free and are RoHS Compliant  
G
D
Applications  
S
•
Telecom / Server Power Supplies  
•
EV Charger / UPS / Solar / Industrial Power Supplies  
TO
−
247 Long Leads  
CASE 340CX  
ABSOLUTE MAXIMUM RATINGS
(T =
 
25
°
C, Unless otherwise noted)  
J
MARKING DIAGRAM  
Parameter  
Drain
−
to
−
Source Voltage  
Symbol  
Value  
600  
30  
Unit  
V
V
DSS  
V
GSS  
Gate
−
to
−
Source Voltage  
DC  
V
AC (f > 1 Hz)  
30  
T019N  
60S5F  
AYWWZZ  
Continuous Drain Current  
T
C
= 25
°
C  
= 100
°
C  
= 25
°
C  
= 25
°
C  
= 25
°
C  
I
75  
A
D
T
C
70  
Power Dissipation  
T
C
T
C
T
C
P
568  
393  
393  
W
A
D
I
DM  
Pulsed Source Current  
I
A
SM  
T019N60S5F =
 
Specific Device Code  
A
= Assembly Location  
Operating Junction and Storage
T
e
mperature
 
T , T  
−
55 to  
+150  
°
C  
YWW  
ZZ  
= Data Code (
Y
e
ar & Week)  
= Assembly Lot  
J
STG  
Range  
Source Current (Body Diode)  
I
S
75  
A
Single Pulse Avalanche  
Energy  
I =
 
12.4 A,  
G
E
AS  
1208  
mJ  
L
ORDERING INFORMATION  
R
= 25
W  
Avalanche Current  
I
12.4  
5.68  
120  
70  
A
Device  
NTHL019N60S5F  
Package  
Shipping  
AS  
Repetitive Avalanche Energy (Note

MOSFET dv/dt  
E
mJ  
TO
−
247  
30 Units / Tube  
AR  
dv/dt  
V/ns  
Peak Diode Recovery dv/dt (Note

Lead
T
e
mperature for Soldering Purposes  
(1/8
″
from case for 10 seconds)  
T
L
260  
°
C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Repetitive
 
rating: pulse
−
width limited by maximum junction temperature.  
2. I
 
≤
37.5 A, di/dt
≤
200 A/
m
s, V
 
≤
400
V
,
s
tarting T
 
= 25
°
C.  
SD  
DD  
J
©
Semiconductor Components Industries, LLC, 2021  
1
Publication Order Number:  
February, 2022
−
Rev. 2  
NTHL019N60S5F/D  
 

NTHL019N60S5F  
THERMAL CHARACTERISTICS  
Parameter  
Symbol  
Value  
0.22  
40  
Unit  
Thermal Resistance, Junction
−
to
−
Case, Max.  
Thermal Resistance, Junction
−
to
−
Ambient, Max.  
R
°
C/W  
q
JC  
R
q
JA  
ELECTRICAL CHARACTERISTICS
(T =
 
25
°
C unless otherwise noted)  
J
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Drain
−
to
−
Source Breakdown Voltage  
V
V
I
= 0
V
, I
 
= 1 mA, T
 
= 25
_
C  
600  
−
−
−
V
(BR)DSS  
GS  
D
J
Drain
−
to
−
Source Breakdown Voltage  
T
e
mperature Coefficient  
D
V  
/
= 10 mA, Referenced to 25
_
C  
−
630  
mV/
_
C  
(BR)DSS  
D
D
T  
J
Zero Gate Voltage Drain Current  
Gate
−
to
−
Source Leakage Current  
ON CHARACTERISTICS  
I
V
GS  
= 0
V
, V
 
= 600 V, T
 
= 25
_
C  
−
−
−
−
10  
m
A  
DSS  
GSS  
DS  
J
I
V
=
30
V
, V
 
= 0 V  
100  
nA  
GS  
DS  
Drain
−
to
−
Source On Resistance  
Gate Threshold Voltage  
R
V
= 10
V
, I
 
=
3
7.5 A, T
 
= 25
_
C  
−
3.2  
−
15.2  
−
19  
4.8  
−
m
W  
V
DS(on)  
GS  
D
J
V
V
GS  
= V
 
, I
 
= 15.7 mA, T
 
= 25
_
C  
GS(th)  
DS  
D
J
Forward Trans
−
conductance  
g
FS  
V
DS  
= 20
V
, I
 
=
3
7.5 A  
96  
S
D
CHARGES, CAPACITANCES & GATE RESISTANCE  
Input Capacitance  
C
V
= 400
V
, V
 
= 0 V, f =
2
50 kHz  
−
−
−
13400  
203  
−
−
−
pF  
ISS  
DS  
GS  
Output Capacitance  
C
OSS  
Time Related Output Capacitance  
C
I
= Constant, V
 
= 0 V to 400
V
,  
3174  
OSS(tr.)  
D
DS  
= 0 V  
V
GS  
Energy Related Output Capacitance  
T
o
tal Gate Charge  
C
V
= 0 V to 400 V, V
 
= 0 V  
−
−
−
−
−
343  
252  
75  
−
−
−
−
−
OSS(er.)  
DS  
GS  
Q
V
= 400
V
, I
 
=
3
7.5 A, V
 
= 10 V  
nC  
G(tot)  
DD  
D
GS  
Gate
−
to
−
Source Charge  
Gate
−
to
−
Drain Charge  
Gate Resistance  
Q
GS  
Q
71  
GD  
R
f = 1 MHz  
3.5  
W
G
SWITCHING CHARACTERISTICS  
Turn-On Delay Time  
Rise Time  
t
V
= 0/10
V
, V
 
=
4
00
V
,  
−
−
−
−
73  
45  
204  
4
−
−
−
−
ns  
d(on)  
GS  
D
DD  
I
= 37.5 A, R
 
= 2.2
W  
G
t
r
Turn-Off Delay Time  
Fall Time  
t
d(off)  
t
f
SOURCE-TO
−
DRAIN DIODE CHARACTERISTICS  
Forward Diode Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
V
V
GS  
= 0
V
, I
 
=
3
7.5 A, T
 
= 25
_
C  
−
−
−
−
1.2  
−
V
SD  
RR  
SD  
J
t
V
= 0
V
, I
 
=
3
7.5 A,  
204  
1686  
ns  
nC  
GS  
SD  
dI/dt = 100 A/
m
s, V
 
= 400 V  
DD  
Q
−
RR  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
2

NTHL019N60S5F  
TYPICAL CHARACTERISTICS  
150  
125  
100  
1000  
V
GS  
= 7.0 V  
10 V  
T
C
= 25
°
C  
V
DS  
= 20 V  
6.0 V  
100  
75  
50  
25  
0
5.5 V  
10  
1
5.0 V  
4.5 V  
T
= 150
°
C  
T
= 25
°
C  
T =
 
−
55
°
C  
C
C
C
0
5
10  
15  
20  
3
0
0
4
5
6
1.2  
300  
V
, DRAIN
−
TO
−
SOURCE VOLTAGE (V)  
V
GS  
, GATE
−
TO
−
SOURCE VOLTAGE (V)  
DS  
Figure 1. On
−
Region Characteristics  
Figure 2. Transfer Characteristics  
0.025  
0.020  
1000  
100  
10  
V
GS  
= 0 V  
T
= 25
°
C  
C
V
V
= 10 V  
= 20 V  
GS  
T
C
= 25
°
C  
0.015  
0.010  
GS  
1
0.005  
0
T
= 150
°
C  
T =
 
−
55
°
C  
C
C
0.1  
0
25  
50  
75  
100  
125  
150  
0.2  
0.4  
0.6  
0.8  
1.0  
I ,
 
DRAIN CURRENT (A)  
V
SD  
, DIODE FORWARD VOLTAGE (V)  
D
Figure 3. On
−
Resistance Variation vs. Drain  
Figure 4. Diode Forward Voltage vs. Source  
Current  
Current and Gate Voltage  
6
10  
10  
V
= 0 V  
f = 250 kHz  
C
C
C
= C
 
+ C
 
(C =
 
shorted)  
GS GD
 
DS  
GS  
ISS  
I
= 37.5 A  
= C
 
+ C  
= C  
D
5
OSS  
RSS  
DS  
GD  
10  
V
DS  
= 130 V  
GD  
C
8
6
4
ISS  
V
DS  
= 400 V  
4
10  
3
10  
C
C
OSS  
2
10  
RSS  
1
10  
2
0
0
10  
−
1  
10  
0
100  
200  
300  
400  
500  
600  
50  
100  
150  
200  
250  
V
DS  
, DRAIN
−
TO
−
SOURCE VOLTAGE (V)  
Q ,
 
TOTAL GATE CHARGE (nC)  
G
Figure 5. Capacitance Characteristics  
Figure 6. Gate Charge Characteristics  
3

NTHL019N60S5F  
TYPICAL CHARACTERISTICS  
1.2  
1.1  
1.0  
3.0  
V
= 0 V  
= 10 mA  
GS  
V
= 10 V  
= 37.5 A  
GS  
I
D
I
D
2.5  
2.0  
1.5  
1.0  
0.9  
0.8  
0.5  
0
−
75
−
50
−
25  
0
25 50 75
 
100 125 150 175  
−
75
−
50
−
25  
0
25 50  
75 100
 
125 150 175  
T , JUNCTION TEMPERATURE (
°
C)  
J
T , JUNCTION TEMPERATURE (
°
C)  
J
Figure 7. Breakdown Voltage Variation vs.  
Temperature  
Figure 8. On
−
Resistance Variation vs.  
Temperature  
80  
70  
60  
50  
40  
30  
20  
1000  
100  
10  
10
m
s  
100
m
s  
1 ms  
Operation in this Area  
10 ms  
is Limited by R  
DS(on)  
1
DC  
T
C
= 25
°
C  
10  
0
T =
 
150
°
C  
J
Single Pulse  
0.1  
1
10  
100  
1000  
25  
50  
75  
100  
125  
150  
V
DS  
, DRAIN
−
TO
−
SOURCE VOLTAGE (V)  
T ,
 
CASE TEMPERATURE (
°
C)  
C
Figure 9. Maximum Safe Operating Area  
Figure 10. Maximum Drain Current vs. Case  
Temperature  
50  
40  
30  
20  
10  
0
0
100  
200  
300  
400  
500  
600  
V
DS  
, DRAIN
−
TO
−
SOURCE VOLTAGE (V)  
Figure 11. E

OSS

vs. Drain
−
to
−
Source Voltage  
4

NTHL019N60S5F  
TYPICAL CHARACTERISTICS  
1
D = 0.5  
D = 0.2  
0.1  
D = 0.1  
D = 0.05  
D = 0.02  
Notes:  
(t) = 0.22
°
C/W Max  
0.01  
Z
q
JC  
D = 0.01  
Duty Cycle, D = t
 
/t  
1
2
T
JM  
= P  
x Z
 
(t) + T  
q
DM JC
 
C  
Single Pulse  
0.00001  
0.001  
0.0001  
0.001  
0.01  
0.1  
1
t, RECTANGULAR PULSE DURATION (s)  
Figure 12. Transient Thermal Impedance  
5

NTHL019N60S5F  
V
GS  
R
Q
g
L
V
DD  
Q
Q
gs  
gd  
V
GS  
DUT  
I
G
= Const.  
Charge  
Figure 13. Gate Charge Test Circuit & Waveform  
R
L
V
DS  
GS  
90%  
90%  
10%  
90%  
V
DS  
V
DD  
V
GS  
R
G
10%  
V
DUT  
V
GS  
t
r
t
f
t
t
d(off)  
d(on)  
t
on  
t
off  
Figure 14. Resistive Switching Test Circuit & Waveforms  
L
2
1
2
E

AS  

+
@
LI

AS  

V
DS  
BV  
DSS  
I
D
I
AS  
R
G
V
DD  
I (t)  
D
DUT  
V
DD  
V
GS  
V
DS  
(t)  
t
p
Time  
t
p
Figure 15. Unclamped Inductive Switching Test Circuit & Waveforms  
6

NTHL019N60S5F  
+
DUT  
V
SD  
−
I
SD  
L
Driver  
R
G
Same Type  
as DUT  
V
DD  
V
GS  
−
dv/dt controlled by R  
G
−
I controlled
 
by pulse period  
SD  
Gate Pulse Width  
D
+  
Gate Pulse Period  
V
GS  
10 V  
(Driver)  
I
, Body Diode Forward Current  
FM  
I
di/dt  
SD  
(DUT)  
I
RM  
Body Diode Reverse Current  
Body Diode Recovery dv/dt  
V
DS  
V
DD  
V
SD  
(DUT)  
Body Diode  
Forward Voltage Drop  
Figure 16. Peak Diode Recovery dv/dt Test Circuit & Waveforms  
SUPERFET and FRFET are a registered trademarks of Semiconductor Components Industries, LLC or its subsidiaries in the United States and/or other  
countries.  
7

NTHL019N60S5F  
PACKAGE DIMENSIONS  
TO
−
247
−
3LD  
CASE 340CX  
ISSUE A  
8

NTHL019N60S5F  
onsemi
,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “
onsemi
” or its affiliates  
and/or subsidiaries in the United States and/or other countries.
onsemi
owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of
onsemi’s
product/patent coverage may be accessed at

.
onsemi
reserves the right to make changes at any time to any  
products or information herein, without notice. The information herein is provided “as
−
is” and
onsemi
makes no warranty, representation or guarantee regarding the accuracy of the  
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does
onsemi
assume any liability arising out of the application or use  
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products  
and applications using
onsemi
products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by
onsemi
. “Typical” parameters which may be provided in
onsemi
data sheets and/or specifications can and do vary in different applications and actual performance may  
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.
onsemi
does not convey any license  
under any of its intellectual property rights nor the rights of others.
onsemi
products are not designed, intended, or authorized for use as a critical component in life support systems  
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should  
Buyer purchase or use
onsemi
products for any such unintended or unauthorized application, Buyer shall indemnify and hold
onsemi
and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that
onsemi
was negligent regarding the design or manufacture of the part.
onsemi
is an Equal  
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PUBLICATION ORDERING INFORMATION  
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