onsemi-NUF9005MNT4G
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NUF9005MN
Low Capacitance 8 Line EMI
Filter with ESD Protection
This device is an 8 line EMI filter array for wireless applications.
Greater than
−
25 dB attenuation is obtained at frequencies from
800 MHz to 2.2 GHz. It also offers ESD protection
−
clamping transients
from static discharges. ESD protection is provided across all capacitors.
1
16
Features
Cd
Cd
•
EMI Filtering and ESD Protection
•
Integration of 40 Discrete Components
•
Compliance with IEC61000
−
4
−
2 (Level 4)
2
3
4
5
6
15
14
13
12
11
Cd
Cd
Cd
Cd
Cd
Cd
Cd
Cd
Cd
Cd
> 14 kV (Contact)
•
DFN Package, 1.6 x 4.0 mm
•
Moisture Sensitivity Level 1
•
ESD Ratings: Machine Model = C
Human Body Model = 3B
•
This is a Pb
−
Free Device
Benefits
•
Reduces EMI/RFI Emmisions on a Data Line
•
Integrated Solution Offers Cost and Space Savings
•
Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass
7
8
10
9
Filter Response
Cd
Cd
Cd
Cd
•
Integrated Solution Improves System Reliability
Applications
•
EMI Filtering and ESD Protection for Data Lines
•
Wireless Phones
•
Handheld Products
•
Notebook Computers
•
LCD Displays
(
T
o
p View)
MARKING
DIAGRAM
841
AYW
G
G
16
DFN16
CASE 506AC
1
2
3
4
5
6
7
8
1
841
A
Y
= Specific Device Code
= Assembly Location
=
Y
e
ar
GND
W
G
= Work Week
= Pb
−
Free Package
(*Note: Microdot may be in either location)
16
15
14
13 12
(Bottom View)
11
10
9
*Date Code orientation and/or position may
vary depending upon manufacturing location.
Figure 1. Pin Connections
ORDERING INFORMATION
†
Device
Package
Shipping
NUF9005MNT4G DFN16
4000 /
T
a
pe & Reel
(Pb
−
Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our
T
a
pe and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
September, 2013
−
Rev. 1
NUF9005MN/D
NUF9005MN
MAXIMUM RATINGS
Parameter
Symbol
Value
Unit
ESD Discharge IEC61000
−
4
−
2
V
kV
PP
Contact Discharge
14
328
Steady
−
State Power per Resistor @ 25
°
C
Operating
T
e
mperature Range
P
mW
°
C
R
T
OP
−
40 to 85
−
55 to 150
260
Storage
T
e
mperature Range
T
STG
°
C
Maximum Lead
T
e
mperature for Soldering Purposes (1.8 in from case for 10 seconds)
T
°
C
L
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS
(T =
25
°
C unless otherwise noted)
J
Parameter
Maximum Reverse Working Voltage
Breakdown Voltage
Symbol
Test Conditions
Min
Typ
Max
5.0
8.0
100
115
15
Unit
V
V
RWM
V
BR
I
R
= 1.0 mA
6.0
7.0
V
Leakage Current
I
R
V
RWM
= 3.3 V
nA
ꢀ
Resistance
R
I
R
= 20 mA
85
10
100
12
A
Cd
pF
MHz
f
Above this frequency,
appreciable attenuation occurs
175
3dB
1. Measured
at 25
°
C, V
= 2.5
V
, f =
1
.0 MHz.
R
2.
T
o
tal
Line Capacitance is 2 times the Diode Capacitance (Cd).
3. 50
ꢀ
source and 50
ꢀ
load termination.
2
NUF9005MN
TYPICAL PERFORMANCE CURVES
(T =
25
°
C unless otherwise specified)
A
0
−
5
0
−
10
−
10
−
15
−
20
−
25
−
30
−
35
−
40
−
45
−
50
Channel 1,4,5 & 8
−
20
−
30
−
40
−
50
Channel 2,3,6 & 7
−
60
1.E+06
1.E+06
1.E+07
1.E+08
1.E+09
1.E+10
1.E+07
1.E+08
1.E+09
1.E+10
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 2. Typical Insertion Loss Characteristic
(S21 Measurement)
Figure 3. Analog Crosstalk Curve
(S41 Measurement)
2.0
1.5
1.0
0.5
0
110
108
106
104
102
100
98
96
94
92
90
0
1.0
2.0
3.0
4.0
5.0
−
40
−
20
0
20
40
60
80
TEMPERATURE (
°
C)
REVERSE VOLTAGE (V)
Figure 4. Typical Capacitance vs.
Reverse Biased Voltage
Figure 5. Typical Resistance over Temperature
(Normalized Capacitance Cd at 2.5 V)
3
NUF9005MN
PACKAGE DIMENSIONS
DFN16, 4×1.6, 0.5P
CASE 506AC
ISSUE D
NOTES:
D
A
1. DIMENSIONING
AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING
DIMENSION: MILLIMETER.
3. DIMENSION
b APPLIES TO TERMINAL AND
IS MEASURED BETWEEN 0.25 AND 0.30 MM
FROM TERMINAL.
B
E
PIN ONE
REFERENCE
2X
4. COPLANARITY
APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
0.15
C
MILLIMETERS
2X
(A3)
DIM MIN
MAX
1.00
0.05
TOP VIEW
SIDE VIEW
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
0.80
0.00
0.15
C
0.20 REF
L
0.18
0.30
(A3)
4.00 BSC
0.10
0.08
C
3.10
0.30
3.30
1.60 BSC
L1
A
0.50
16X
0.50 BSC
SEATING
PLANE
DETAIL A
C
0.20
0.20
0.00
−−−
0.40
0.15
OPTIONAL
CONSTRUCTION
A1
C
RECOMMENDED
D2
e
SOLDERING FOOTPRINT*
DETAIL A
L
16X
2X
1
8
9
0.25 x 0.40 mm
TEST PAD SIZE
4.10
0.50 PITCH
E2
16
16X
K
b
16X
NOTE 3
0.10
0.05
C
C
A B
0.50
1.91
BOTTOM VIEW
16X
0.28
16X
0.51
DIMENSION: MILLIMETERS
*For additional information on our Pb
−
Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting
T
e
chniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).
SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at
www.onsemi.com/site/pdf/Patent
−
Marking.pdf
. SCILLC
reserves the right to make changes without further notice to any products herein.
SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time.
All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.
SCILLC
does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur.
Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part.
SCILLC is an Equal Opportunity/Affirmative Action Employer.
This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMEN
T
:
N. American Technical Support
: 800
−
282
−
9855
T
o
ll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81
−
3
−
5817
−
1050
Literature Distribution Center for ON Semiconductor
P
.
O. Box 5163, Denver, Colorado 80217 USA
Phone
: 303
−
675
−
2175 or 800
−
344
−
3860
T
o
ll Free USA/Canada
Fax
: 303
−
675
−
2176 or 800
−
344
−
3867
T
o
ll Free USA/Canada
Email
: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
NUF9005MN/D
