onsemi-NVBG015N065SC1

Part #onsemi-NVBG015N065SC1
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onsemi-NVBG015N065SC1
DATA SHEET  

MOSFET

– 12 mohm, 650
V
,  
M2, D2PAK-7L  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
650 V  
18 m
W
@ 18 V  
145 A  
NVBG015N065SC1  
Drain (TAB)  
Features  
•
Typ. R  
= 12 m
W
@ V
 
= 18 V  
DS(on)  
GS  
Typ. R  
= 15 m
W
@ V
 
= 15 V  
Gate (Pin 1)  
DS(on)  
GS  
•
Ultra Low Gate Charge (Q  
= 283 nC)  
G(tot)  
•
Low Effective Output Capacitance (C
 
= 424 pF)  
oss  
Driver Source (Pin 2)  
•
100% Avalanche Tested  
•
AEC
−
Q101 Qualified and P
P
A
P Capable  
Power Source (Pins 3, 4, 5, 6, 7)  
•
This Device is Halide Free and RoHS Compliant with exemption 7a,  
Pb
−
Free 2LI (on second level interconnection)  
N
−
CHANNEL MOSFET  
Typical Applications  
•
Automotive On Board Charger  
•
Automotive DC-DC Converter for EV/HEV  
•
Automotive Traction Inverter  
MAXIMUM RATINGS
(T =
 
25
°
C unless otherwise noted)  
J
D2PAK
−
7L  
CASE 418BJ  
Parameter  
Drain
−
to
−
Source Voltage  
Symbol  
Value  
Unit  
V
DSS  
650  
V
V
V
Gate
−
to
−
Source Voltage  
V
GS  
−
8/+22  
−
5/+18  
MARKING DIAGRAM  
Recommended Operation  
Values of Gate
−
Source Voltage  
T
< 175
°
C  
= 25
°
C  
V
GSop  
C
BG015N  
065SC1  
AYWWZZ  
Continuous Drain  
Current R
 

Steady  
State  
T
I
D
145  
500  
103  
A
W
A
C
q
JC  
Power Dissipation  
P
D
R
q
JC  
Continuous Drain  
Current R  
Steady  
State  
T
C
= 100
°
C  
I
D
BG015N065SC1 = Specific Device Code  
q
JA  
A
Y
= Assembly Location  
=
Y
e
ar  
WW =
 
Work Week  
(

,

)  
Power Dissipation  
P
D
250  
W
R
q
JA  
ZZ  
= Lot Traceability  
T
= 25
°
C  
I
422  
798  
A
A
C
DM  
Single Pulse Surge  
Drain Current  
Capability  
T =
 
25
°
C, t
 
= 10
m
s,  
A
I
DSC  
p
R
= 4.7
W  
G
ORDERING INFORMATION  
Operating Junction and Storage
T
e
mperature  
Range  
T , T  
−
55 to  
+175  
°
C  
J
stg  
†
Device  
Package  
Shipping  
Source Current (Body Diode)  
I
111  
84  
A
NVBG015N065SC1  
D2PAK
−
7L  
800 /  
T
a
pe & Reel  
S
Single Pulse Drain
−
to
−
Source Avalanche  
E
AS  
mJ  
Energy (I
 
= 13 A
 

L
pk  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our
T
a
pe and Reel Packaging Specification  
Brochure,

.  
Maximum Lead
T
e
mperature for Soldering,  
1/8
″
from Case for 10 Seconds  
T
245  
°
C  
L
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
2
1. Surface
 
mounted on a FR
−
4 board using1 in
 
pad of 2 oz copper.  
2. The
 
entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
3. Repetitive
 
rating, limited by max junction temperature.  
4. E
 
of 84 mJ is based on starting T
 
= 25
°
C; L = 1 mH, I
 
= 13 A,  
AS  
DD  
J
AS  
V
= 50
V
, V
 
=
1
8
V
.  
GS  
©
Semiconductor Components Industries, LLC, 2020  
1
Publication Order Number:  
April, 2022
−
Rev. 3  
NVBG015N065SC1/D  
 

NVBG015N065SC1  
Table 1. THERMAL CHARACTERISTICS  
Parameter  
Symbol  
Max  
0.3  
40  
Unit  
°
C/W  
°
C/W  
Thermal Resistance Junction
−
to
−

Thermal Resistance Junction
−
to
−

R
θ
JC  
JA  
R
θ
Table 2. ELECTRICAL CHARACTERISTICS
(T =
 
25
°
C unless otherwise stated)  
J
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Drain
−
to
−
Source Breakdown Voltage  
V
V
GS  
= 0
V
, I
 
= 1
m
A  
650  
V
(BR)DSS  
D
Drain
−
to
−
Source Breakdown Voltage  
T
e
mperature Coefficient  
V
/T  
J
I =
 
20 mA, refer to 25
°
C  
D
0.12  
V/
°
C  
(BR)DSS  
Zero Gate Voltage Drain Current  
I
V
V
= 0
V
,  
= 650 V  
T =
 
25
°
C  
10  
1
m
A  
mA  
nA  
DSS  
GS  
J
DS  
T =
 
175
°
C  
J
Gate
−
to
−
Source Leakage Current  
ON CHARACTERISTICS  
I
V
GS  
= +18/
−
5
V
, V
 
= 0 V  
250  
GSS  
DS  
Gate Threshold Voltage  
V
R
V
= V
 
, I
 
= 25 mA  
1.8  
2.8  
4.3  
V
V
GS(TH)  
GS  
DS  
D
Recommended Gate Voltage  
Drain
−
to
−
Source On Resistance  
V
GOP  
−
5  
+18  
V
GS  
V
GS  
V
GS  
V
DS  
= 15 V, I
 
= 75 A, T
 
= 25
°
C  
15  
12  
16  
42  
m
W  
DS(on)  
D
J
= 18 V, I
 
= 75 A, T
 
= 25
°
C  
18  
D
J
= 18 V, I
 
= 75 A, T
 
= 175
°
C  
D
J
Forward Transconductance  
g
FS  
= 10 V, I
 
= 75 A  
S
D
CHARGES, CAPACITANCES & GATE RESISTANCE  
Input Capacitance  
C
V
V
= 0
V
, f = 1
M
Hz,  
= 325 V  
4689  
424  
37  
pF  
ISS  
GS  
DS  
Output Capacitance  
C
OSS  
RSS  
Reverse Transfer Capacitance  
T
o
tal Gate Charge  
C
Q
V
=
−
5/18
V
, V
 
=
5
20
V
,  
283  
72  
nC  
G(TOT)  
GS  
DS  
I
= 75 A  
D
Gate
−
to
−
Source Charge  
Gate
−
to
−
Drain Charge  
Q
Q
GS  
64  
GD  
f = 1 MHz  
1.6  
W
Gate
−
Resistance  
R
G
SWITCHING CHARACTERISTICS  
Turn
−
On Delay Time  
t
V
D
=
−
5/18
V
, V
 
=
4
00
V
,  
23  
26  
ns  
d(ON)  
GS  
DS  
I
= 75 A, R
 
= 2.2
W
,
 
G
Rise Time  
t
r
Inductive Load  
Turn
−
Off Delay Time  
t
49  
d(OFF)  
Fall Time  
t
9.6  
167  
276  
443  
f
Turn
−
On Switching Loss  
Turn
−
Off Switching Loss  
T
o
tal Switching Loss  
E
m
J  
ON  
E
E
OFF  
TOT  
DRAIN
−
SOURCE DIODE CHARACTERISTICS  
Continuous Drain
−
Source Diode Forward  
I
V
GS  
V
GS  
V
GS  
=
−
5
V
, T
 
=
2
5
°
C  
111  
422  
A
A
V
SD  
J
Current  
Pulsed Drain
−
Source Diode Forward  
I
=
−
5
V
, T
 
=
2
5
°
C  
J
SDM  
Forward Diode Voltage  
V
=
−
5
V
, I
 
=
7
5 A, T
 
= 25
°
C  
4.8  
SD  
SD  
J
2
 

NVBG015N065SC1  
Table

(T =
 
25
°
C unless otherwise stated) (continued)  
J
Parameter  
DRAIN
−
SOURCE DIODE CHARACTERISTICS  
Reverse Recovery Time  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
t
V
=
−
5/18
V
, I
 
=
7
5 A,  
28  
234  
23  
ns  
nC  
m
J  
A
RR  
GS  
S
SD  
dI /dt
 
= 1000 A/
m
s  
Reverse Recovery Charge  
Reverse Recovery Energy  
Peak Reverse Recovery Current  
Charge Time  
Q
RR  
E
REC  
I
16  
RRM  
Ta  
17  
ns  
ns  
Discharge Time  
Tb  
11  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
3

NVBG015N065SC1  
TYPICAL CHARACTERISTICS  
280  
240  
200  
160  
120  
80  
4
15 V  
V
= 18 V  
GS  
V
= 12 V  
GS  
12 V  
3
2
15 V  
18 V  
10 V  
1
0
9 V  
40  
0
8 V  
0
1
2
3
4
5
6
7
8
9
10  
0
40  
80  
120  
160  
200  
V
DS  
, DRAIN
−
TO
−
SOURCE VOLTAGE (V)  
I ,
 
DRAIN CURRENT (A)  
D
Figure 1. On
−
Region Characteristics  
Figure 2. Normalized On
−
Resistance vs. Drain  
Current and Gate Voltage  
100  
80  
60  
40  
20  
0
1.6  
1.4  
1.2  
I
D
= 75 A  
I
V
= 75 A  
D
= 18 V  
GS  
T =
 
150
°
C  
J
1.0  
0.8  
T =
 
25
°
C  
J
8
10  
12  
14  
16  
18  
−
75
−
50
−
25  
0
25 50 75
 
100 125 150 175  
T , JUNCTION TEMPERATURE (
°
C)  
J
V
GS  
, GATE
−
TO
−
SOURCE VOLTAGE (V)  
Figure 3. On
−
Resistance Variation with  
Figure 4. On
−
Resistance vs. Gate
−
to
−
Source  
Temperature  
Voltage  
280  
240  
200  
160  
120  
80  
280  
100  
T =
 
175
°
C  
J
V =
 
0 V  
GS  
V
DS  
= 10 V  
T =
 
175
°
C  
J
T =
 
−
55
°
C  
J
T =
 
25
°
C  
J
T =
 
−
55
°
C  
J
T =
 
25
°
C  
J
10  
1
40  
0
3
6
9
12  
15  
2
4
6
8
V
GS  
, GATE
−
TO
−
SOURCE VOLTAGE (V)  
V
SD  
, BODY DIODE FORWARD VOLTAGE (V)  
Figure 5. Transfer Characteristics  
Figure 6. Diode Forward Voltage vs. Current  
4

NVBG015N065SC1  
TYPICAL CHARACTERISTICS
(continued)  
10000  
20  
V
DD  
= 390 V  
I
D
= 75 A  
C
iss  
15  
10  
V
= 650 V  
DD  
1000  
100  
10  
V
DD  
= 520 V  
C
oss  
5
0
C
rss  
f = 1 MHz  
= 0 V  
V
GS  
−
5  
650  
0.1  
1
10  
100  
0
50  
100  
150  
200  
250  
300  
350  
V
DS  
, DRAIN
−
TO
−
SOURCE VOLTAGE (V)  
Q ,
 
GATE CHARGE (nC)  
g
Figure 7. Gate
−
to
−
Source Voltage vs. Total  
Figure 8. Capacitance vs. Drain
−
to
−
Source  
Charge  
Voltage  
100  
160  
120  
80  
V
GS  
= 18 V  
T =
 
25
°
C  
J
10  
40  
0
Typical performance based  
on characterization data  
R
= 0.3
°
C/W  
q
JC  
1
25  
50  
75  
100  
125  
150  
175  
0.001 0.01  
0.1  
1
t ,
 
TIME IN AVALANCHE (ms)  
AV  
T ,
 
CASE TEMPERATURE (
°
C)  
C
Figure 9. Unclamped Inductive Switching  
Capability  
Figure 10. Maximum Continuous Drain  
Current vs. Case Temperature  
1000  
100  
10  
100000  
10000  
Single Pulse  
R
= 0.3
°
C/W  
q
JC  
T
C
= 25
°
C  
10
m
s  
100
m
s  
1 ms  
1000  
100  
10 ms  
Single Pulse  
T =
 
175
°
C  
1
J
R
= 0.3
°
C/W  
q
JC  
DC  
T
C
= 25
°
C  
0.1  
0.1  
1
10  
100  
1000  
0.00001  
0.0001  
0.001  
0.01  
0.1  
V
DS  
, DRAIN
−
TO
−
SOURCE VOLTAGE (V)  
t, PULSE WIDTH (sec)  
Figure 11. Safe Operating Area  
Figure 12. Single Pulse Maximum Power  
Dissipation  
5

NVBG015N065SC1  
TYPICAL CHARACTERISTICS
(continued)  
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
0.01  
P
DM  
0.01  
Single Pulse  
Notes:  
= 0.3
°
C/W  
R
t
q
JC  
1
Duty Cycle, D = t
 
/t  
t
1
2
2
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
t, PULSE TIME (s)  
Figure 13. Junction
−
to
−
Case Transient Thermal Response Curve  
6

MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
D

2

PAK7 (TO
−
263
−
7L HV)  
CASE 418BJ  
ISSUE B  
DATE 16 AUG 2019  
GENERIC  
MARKING DIAGRAM*  
XXXXXXXXX  
AYWWG  
XXXX = Specific Device Code  
A
Y
= Assembly Location  
=
Y
e
ar  
WW =
 
Work Week  
G
= Pb
−
Free Package  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
Pb
−
Free indicator, “G” or microdot “
G
”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions
 
are uncontrolled
 
except when stamped
 
“CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON84234G  
D

2

PAK7 (TO
−
263
−
7L HV)  
PAGE 1 OF 1  
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the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
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©
Semiconductor Components Industries, LLC, 2018  

onsemi
,  
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onsemi
” or its affiliates  
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.
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−
is” and
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onsemi
. “Typical” parameters which may be provided in
onsemi
data sheets and/or specifications can and do vary in different applications and actual performance may  
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