onsemi-NVBG080N120SC1

Part #onsemi-NVBG080N120SC1
Download 
onsemi-NVBG080N120SC1
DATA SHEET  

MOSFET

– 80 mohm,  
1200ꢀV, M1, D2PAK-7L  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
1200 V  
110 m
W
@ 20 V  
30 A  
Drain (TAB)  
NVBG080N120SC1  
Features  
Gate (Pin 1)  
•
Typ. R  
= 80 m
W
 
DS(on)  
•
Ultra Low Gate Charge (Typ. Q  
= 56 nC)  
G(tot)  
•
Low Effective Output Capacitance (Typ. C
 
= 79 pF)  
Driver Source (Pin 2)  
oss  
•
100% Avalanche Tested  
Power Source (Pins 3, 4, 5, 6, 7)  
•
AEC
−
Q101 Qualified and P
P
A
P Capable  
N
−
CHANNEL MOSFET  
•
This Device is Halide Free and RoHS Compliant with exemption 7a,  
Pb
−
Free 2LI (on second level interconnection)  
Typical Applications  
•
Automotive On Board Charger  
•
Automotive DC-DC Converter for EV/HEV  
MAXIMUM RATINGS
(T =
 
25
°
C unless otherwise noted)  
J
D2PAK
−
7L  
CASE 418BJ  
Parameter  
Drain
−
to
−
Source Voltage  
Symbol  
Value  
Unit  
V
DSS  
1200  
V
V
Gate
−
to
−
Source Voltage  
V
GS  
−
15/+25  
MARKING DIAGRAM  
Recommended Operation  
Values of Gate
−
Source Voltage  
T
< 175
°
C  
= 25
°
C  
V
GSop  
−
5/+20  
V
C
AYWWZZ  
NVBG  
080120SC1  
Continuous Drain  
Steady  
State  
T
I
D
30  
A
C
Power Dissipation  
P
D
179  
21  
W
A
A
Y
= Assembly Location  
=
Y
e
ar  
Continuous Drain  
Steady  
State  
T
C
= 100
°
C  
I
D
WW =
 
Work Week  
ZZ =
 
Lot Traceability  
NVBG080120SC1 = Specific Device Code  
Power Dissipation  
P
89  
W
D
T
= 25
°
C  
I
110  
132  
A
A
C
DM  
Single Pulse Surge  
Drain Current  
Capability  
T
C
= 25
°
C, t
 
= 10
m
s,  
I
DSC  
p
ORDERING INFORMATION  
R
= 4.7
W  
G
†
Device  
Package  
Shipping  
Operating Junction and Storage
T
e
mperature  
Range  
T , T  
−
55 to  
+175  
°
C  
J
stg  
NVBG080N120SC1  
D2PAK
−
7L  
800 /  
T
a
pe & Reel  
Source Current (Body Diode)  
I
S
18  
A
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our
T
a
pe and Reel Packaging Specification  
Brochure,

.  
Single Pulse Drain
−
to
−
Source Avalanche  
E
171  
mJ  
AS  
Energy (I
 
= 18.5 A
 

L
pk  
Maximum Lead
T
e
mperature for Soldering,  
1/8
″
from Case for 10 Seconds  
T
300  
°
C  
L
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. The
 
entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2. Repetitive
 
rating, limited by max junction temperature.  
3. E
 
of 171 mJ is based on starting T
 
= 25
°
C; L = 1 mH, I
 
= 18.5 A,  
AS  
DD  
J
AS  
V
= 120
V
, V
 
=
1
8
V
.  
GS  
©
Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
May, 2022
−
Rev. 4  
NVBG080N120SC1/D  
 

NVBG080N120SC1  
Table 1. THERMAL CHARACTERISTICS  
Parameter  
Symbol  
Max  
0.84  
40  
Unit  
°
C/W  
°
C/W  
Thermal Resistance Junction
−
to
−

Thermal Resistance Junction
−
to
−

R
θ
JC  
JA  
R
θ
Table 2. ELECTRICAL CHARACTERISTICS
(T =
 
25
°
C unless otherwise stated)  
J
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Drain
−
to
−
Source Breakdown Voltage  
V
V
GS  
= 0
V
, I
 
= 1
m
A  
1200  
V
(BR)DSS  
D
Drain
−
to
−
Source Breakdown Voltage  
T
e
mperature Coefficient  
V
/T  
J
I =
 
1 mA, refer to 25
°
C  
D
0.5  
V/
°
C  
(BR)DSS  
Zero Gate Voltage Drain Current  
I
V
V
= 0
V
,  
= 1200 V  
T =
 
25
°
C  
100  
1
m
A  
mA  
m
A  
DSS  
GS  
J
DS  
T =
 
175
°
C  
J
Gate
−
to
−
Source Leakage Current  
ON CHARACTERISTICS

Gate Threshold Voltage  
I
V
GS  
= +25/
−
15
V
, V
 
= 0 V  
1
GSS  
DS  
V
R
V
GS  
= V
 
, I
 
= 5 mA  
1.8  
3
4.3  
+20  
110  
V
V
GS(TH)  
DS  
D
Recommended Gate Voltage  
Drain
−
to
−
Source On Resistance  
V
−
5  
GOP  
V
GS  
V
GS  
V
DS  
= 20 V, I
 
= 20 A, T
 
= 25
°
C  
80  
121  
11  
m
W  
m
W  
S
DS(on)  
D
J
= 20 V, I
 
= 20 A, T
 
= 150
°
C  
D
J
Forward Transconductance  
g
= 20 V, I
 
= 20 A  
FS  
D
CHARGES, CAPACITANCES & GATE RESISTANCE  
Input Capacitance  
C
V
V
= 0
V
, f = 1
M
Hz,  
= 800 V  
1154  
79  
pF  
nC  
ISS  
GS  
DS  
Output Capacitance  
C
OSS  
C
RSS  
Reverse Transfer Capacitance  
T
o
tal Gate Charge  
7.9  
56  
Q
V
=
−
5/20
V
, V
 
=
6
00
V
,  
= 20 A  
G(TOT)  
GS DS  
I
D
Threshold Gate Charge  
Gate
−
to
−
Source Charge  
Gate
−
to
−
Drain Charge  
Q
10  
G(TH)  
Q
18  
GS  
Q
11  
GD  
f = 1 MHz  
1.2  
W
Gate
−
Resistance  
R
G
SWITCHING CHARACTERISTICS  
Turn
−
On Delay Time  
t
V
D
=
−
5/20
V
, V
 
=
8
00
V
,  
12  
12  
22  
22  
34  
18  
ns  
d(ON)  
GS  
DS  
I
= 20 A, R
 
= 4.7
W
,
 
G
Rise Time  
t
r
Inductive Load  
Turn
−
Off Delay Time  
t
21  
d(OFF)  
Fall Time  
t
f
9
Turn
−
On Switching Loss  
Turn
−
Off Switching Loss  
T
o
tal Switching Loss  
E
135  
46  
m
J  
ON  
E
OFF  
E
TOT  
181  
DRAIN
−
SOURCE DIODE CHARACTERISTICS  
Continuous Drain
−
Source Diode Forward  
I
V
GS  
V
GS  
V
GS  
=
−
5
V
, T
 
=
2
5
°
C  
18  
A
A
V
SD  
J
Current  
Pulsed Drain
−
Source Diode Forward  
I
=
−
5
V
, T
 
=
2
5
°
C  
110  
SDM  
J
Forward Diode Voltage  
V
=
−
5
V
, I
 
=
1
0 A, T
 
= 25
°
C  
3.9  
SD  
SD  
J
2
 

NVBG080N120SC1  
Table

(T =
 
25
°
C unless otherwise stated) (continued)  
J
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
DRAIN
−
SOURCE DIODE CHARACTERISTICS  
Reverse Recovery Time  
t
V
=
−
5/20
V
, I
 
=
2
0 A,  
16.2  
61.6  
4.1  
ns  
nC  
m
J  
A
RR  
GS  
S
SD  
dI /dt
 
= 1000 A/
m
s  
Reverse Recovery Charge  
Q
RR  
Reverse Recovery Energy  
E
REC  
RRM  
Peak Reverse Recovery Current  
I
7.6  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
3

NVBG080N120SC1  
TYPICAL CHARACTERISTICS  
70  
60  
50  
40  
30  
20  
3.5  
V
= 20 V  
GS  
19 V  
3.0  
2.5  
2.0  
1.5  
V
GS  
= 15 V  
16 V  
18 V  
17 V  
16 V  
15 V  
10 V  
17 V  
18 V  
19 V  
20 V  
1.0  
0.5  
10  
0
0
2
4
6
8
10  
0
10  
20  
30  
40  
50  
60  
70  
V
DS  
, DRAIN
−
TO
−
SOURCE VOLTAGE (V)  
I ,
 
DRAIN CURRENT (A)  
D
Figure 1. On
−
Region Characteristics  
Figure 2. Normalized On
−
Resistance vs. Drain  
Current and Gate Voltage  
1.9  
1.7  
1.5  
1.3  
1.1  
400  
300  
200  
I
= 20 A  
D
I
V
= 20 A  
D
= 20 V  
GS  
T =
 
150
°
C  
J
100  
0
T =
 
25
°
C  
J
0.9  
0.7  
−
75
−
50
−
25  
0
25 50 75
 
100 125 150 175  
9
10 11
 
12 13 14 15 16 17 18 19 20  
T , JUNCTION TEMPERATURE (
°
C)  
J
V
GS  
, GATE
−
TO
−
SOURCE VOLTAGE (V)  
Figure 3. On
−
Resistance Variation with  
Figure 4. On
−
Resistance vs. Gate
−
to
−
Source  
Temperature  
Voltage  
50  
40  
30  
20  
70  
10  
V
DS  
= 20 V  
V
=
−
5 V  
GS  
T =
 
25
°
C  
J
T =
 
175
°
C  
J
T =
 
25
°
C  
J
T =
 
−
55
°
C  
J
1
T =
 
175
°
C  
J
10  
0
T =
 
−
55
°
C  
J
0.1  
2
4
6
8
10  
12  
14  
2
3
4
5
6
7
8
V
GS  
, GATE
−
TO
−
SOURCE VOLTAGE (V)  
V
SD  
, BODY DIODE FORWARD VOLTAGE (V)  
Figure 5. Transfer Characteristics  
Figure 6. Diode Forward Voltage vs. Current  
4

NVBG080N120SC1  
TYPICAL CHARACTERISTICS
(continued)  
20  
15  
10  
5
10K  
V
DD  
= 400 V  
I
D
= 47 A  
C
iss  
1K  
V
DD  
= 600 V  
V
DD  
= 800 V  
C
oss  
100  
C
rss  
10  
1
0
f = 1 MHz  
= 0 V  
V
GS  
−
5  
0.1  
1
10  
, DRAIN
−
TO
−
SOURCE VOLTAGE (V)  
DS  
100  
800  
175  
1
0
10  
20  
30  
40  
50  
60  
V
Q ,
 
GATE CHARGE (nC)  
g
Figure 7. Gate
−
to
−
Source Voltage vs. Total  
Figure 8. Capacitance vs. Drain
−
to
−
Source  
Charge  
Voltage  
100  
40  
30  
20  
V
GS  
= 20 V  
T =
 
25
°
C  
J
T =
 
150
°
C  
J
10  
10  
0
Typical Characteristics  
R
= 0.84
°
C/W  
q
JC  
1
0.001  
0.01  
0.1  
1
10  
100  
25  
50  
75  
100  
125  
150  
t
, TIME IN AVALANCHE (ms)  
T ,
 
CASE TEMPERATURE (
°
C)  
C
AV  
Figure 9. Unclamped Inductive Switching  
Capability  
Figure 10. Maximum Continuous Drain  
Current vs. Case Temperature  
100K  
10K  
1K  
1000  
100  
10  
Single Pulse  
Single Pulse  
R
T
= 0.84
°
C/W  
= 25
°
C  
R
T
= 0.84
°
C/W  
= 25
°
C  
q
JC  
q
JC  
C
C
10
m
s  
100
m
s  
1
100  
10  
R
Limit  
DS(on)  
1 ms  
Thermal Limit  
Package Limit  
10 ms/DC  
100 1000  
0.1  
0.1  
1
10  
0.00001 0.0001 0.001  
0.01  
0.1  
V
DS  
, DRAIN
−
TO
−
SOURCE VOLTAGE (V)  
t, PULSE WIDTH (sec)  
Figure 11. Safe Operating Area  
Figure 12. Single Pulse Maximum Power  
Dissipation  
5

NVBG080N120SC1  
TYPICAL CHARACTERISTICS
(continued)  
1
Duty Cycle = 0.5  
0.2  
0.1  
0.05  
0.1  
0.02  
0.01  
P
DM  
0.01  
Notes:  
= 0.84
°
C/W  
Single Pulse  
R
q
JC  
Peak T
 
= P  
x Z  
(t) + T  
JC C  
t
q
1
J
DM  
Duty Cycle, D = t
 
/t  
t
1
2
2
0.001  
0.00001  
0.0001  
0.001  
t, PULSE TIME (s)  
0.01  
0.1  
1
Figure 13. Junction
−
to
−
Case Transient Thermal Response Curve  
6

MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
D

2

PAK7 (TO
−
263
−
7L HV)  
CASE 418BJ  
ISSUE B  
DATE 16 AUG 2019  
GENERIC  
MARKING DIAGRAM*  
XXXXXXXXX  
AYWWG  
XXXX = Specific Device Code  
A
Y
= Assembly Location  
=
Y
e
ar  
WW =
 
Work Week  
G
= Pb
−
Free Package  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
Pb
−
Free indicator, “G” or microdot “
G
”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions
 
are uncontrolled
 
except when stamped
 
“CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON84234G  
D

2

PAK7 (TO
−
263
−
7L HV)  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
©
Semiconductor Components Industries, LLC, 2018  

onsemi
,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “
onsemi
” or its affiliates  
and/or subsidiaries in the United States and/or other countries.
onsemi
owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of
onsemi
’s product/patent coverage may be accessed at

.
onsemi
reserves the right to make changes at any time to any  
products or information herein, without notice. The information herein is provided “as
−
is” and
onsemi
makes no warranty, representation or guarantee regarding the accuracy of the  
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does
onsemi
assume any liability arising out of the application or use  
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products  
and applications using
onsemi
products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by
onsemi
. “Typical” parameters which may be provided in
onsemi
data sheets and/or specifications can and do vary in different applications and actual performance may  
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.
onsemi
does not convey any license  
under any of its intellectual property rights nor the rights of others.
onsemi
products are not designed, intended, or authorized for use as a critical component in life support systems  
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should  
Buyer purchase or use
onsemi
products for any such unintended or unauthorized application, Buyer shall indemnify and hold
onsemi
and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that
onsemi
was negligent regarding the design or manufacture of the part.
onsemi
is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMEN
T
:  
Email Requests to:

TECHNICAL SUPPORT  
North American Technical Support:  
Voice Mail: 1 800
−
282
−
9855
T
o
ll Free USA/Canada  
Phone: 011 421 33 790 2910  
Europe, Middle East and Africa Technical Support:  
Phone: 00421 33 790 2910  
For additional information, please contact your local Sales Representative  
onsemi Website:

◊