onsemi-NVH4L018N075SC1

Part #onsemi-NVH4L018N075SC1
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onsemi-NVH4L018N075SC1
DATA SHEET  

MOSFET

– 13.5 mohm,  
750ꢀV, M2, TO-247-4L  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
750 V  
18 m
ꢀ
@ 18 V  
140 A  
D
NVH4L018N075SC1  
Features  
G
•
Typ. R  
= 13.5 m
ꢀ
@ V
 
= 18 V  
GS  
= 18 m
ꢀ
@ V
 
= 15 V  
GS  
DS(on)  
S1: Driver Source  
S2: Power Source  
Typ. R  
DS(on)  
S1  
S2  
•
Ultra Low Gate Charge (Q  
= 262 nC)  
G(tot)  
N
−
CHANNEL MOSFET  
•
High Speed Switching with Low Capacitance (C
 
= 365 pF)  
oss  
•
100% Avalanche Tested  
•
AEC
−
Q101 Qualified and P
P
A
P Capable  
•
This Device is Halide Free and RoHS Compliant with exemption 7a,  
Pb
−
Free 2LI (on second level interconnection)  
Typical Applications  
D
S2  
•
Automotive On Board Charger  
•
Automotive DC-DC Converter for EV/HEV  
•
Automotive Traction Inverter  
S1  
G
TO247
−
4L  
CASE 340CJ  
MAXIMUM RATINGS
(T =
 
25
°
C unless otherwise noted)  
J
MARKING DIAGRAM  
Parameter  
Drain
−
to
−
Source Voltage  
Symbol  
Value  
Unit  
V
DSS  
750  
V
V
V
Gate
−
to
−
Source Voltage  
V
GS  
−
8/+22  
−
5/+18  
H4L018  
N075SC  
AYWWZZ  
Recommended Operation Values  
of Gate
−
to
−
Source Voltage  
T
< 175
°
C  
= 25
°
C  
V
GSop  
C
Continuous Drain  
Steady  
State  
T
I
D
140  
500  
99  
A
W
A
C
Power Dissipation  
P
D
Continuous Drain  
Steady  
State  
T
C
= 100
°
C  
I
D
H4L018N075SC = Specific Device Code  
A
Y
= Assembly Location  
=
Y
e
ar  
Power Dissipation  
P
250  
483  
807  
W
A
D
WW =
 
Work Week  
ZZ  
= Lot Traceability  
Pulsed Drain Current  
T
= 25
°
C  
I
DM  
C
Single Pulse Surge  
Drain Current Capability  
T =
 
25
°
C, t
 
= 10
ꢁ
s,  
I
A
A
p
DSC  
ORDERING INFORMATION  
R
= 4.7  
ꢀ
G
Device  
NVH4L018N075SC1  
Package  
Shipping  
Operating Junction and Storage
T
e
mperature  
Range  
T , T  
−
55 to  
°
C  
J
stg  
+175  
TO247
−
4L  
30 Units /  
Tube  
Source Current (Body Diode)  
I
S
108  
162  
A
Single Pulse Drain
−
to
−
Source Avalanche  
E
AS  
mJ  
Energy (I  
L(pk)  
Maximum Lead
T
e
mperature for Soldering  
(1/8
″
from case for 5 s)  
T
L
300  
°
C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. The
 
entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2. Repetitive
 
rating, limited by max junction temperature.  
3. EAS
 
of 162 mJ is based on starting T
 
= 25
°
C; L = 1 mH, I
 
= 18 A,  
J
AS  
V
DD  
= 50
V
, V
 
=
1
8
V
.  
GS  
©
Semiconductor Components Industries, LLC, 2021  
1
Publication Order Number:  
May, 2022
−
Rev. 4  
NVH4L018N075SC1/D  
 

NVH4L018N075SC1  
Table 1. THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Junction
−
to
−
Case
−

Junction
−
to
−
Ambient
−

Symbol  
Max  
0.3  
40  
Unit  
°
C/W  
R
ꢂ
JC  
R
ꢂ
JA  
4. The
 
entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular  
conditions noted.  
Table 2. ELECTRICAL CHARACTERISTICS
(T =
 
25
°
C unless otherwise specified)  
J
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Drain
−
to
−
Source Breakdown Voltage  
V
V
= 0
V
, I
 
= 1
m
A  
750  
−
−
−
V
(BR)DSS  
GS  
D
Drain
−
to
−
Source Breakdown Voltage  
T
e
mperature Coefficient  
V
/T  
I =
 
1 mA, referenced to 25
°
C  
D
−
0.06  
V/
°
C  
(BR)DSS  
J
Zero Gate Voltage Drain Current  
I
V
V
= 0
V
,  
T =
 
25
°
C  
−
−
−
−
−
−
10  
1
ꢁ
A  
mA  
nA  
DSS  
GS  
DS  
J
= 750 V  
T =
 
175
°
C  
J
Gate
−
to
−
Source Leakage Current  
ON CHARACTERISTICS

Gate Threshold Voltage  
I
V
V
= +18/
−
5
V
, V
 
= 0 V  
250  
GSS  
GS  
DS  
V
R
= V
 
, I
 
= 22 mA  
1.8  
−
5  
−
2.7  
−
4.3  
V
V
GS(TH)  
GS  
DS  
D
Recommended Gate Voltage  
Drain
−
to
−
Source On Resistance  
V
+18  
GOP  
V
GS  
V
GS  
V
GS  
V
DS  
= 15
V
, I
 
=
6
6 A, T
 
= 25
°
C  
18  
m
ꢀ  
DS(on)  
D
J
= 18
V
, I
 
=
6
6 A, T
 
= 25
°
C  
−
13.5  
19  
18  
D
J
= 18
V
, I
 
=
6
6 A, T
 
= 175
°
C  
D
J
Forward Transconductance  
g
FS  
= 10
V
, I
 
=
6
6 A  
−
40  
−
S
D
CHARGES, CAPACITANCES & GATE RESISTANCE  
Input Capacitance  
C
V
= 0
V
, f = 1
M
Hz, V
 
= 375 V  
−
−
−
−
−
−
−
5010  
365  
31  
−
−
−
−
−
−
−
pF  
nC  
ISS  
GS  
DS  
Output Capacitance  
C
OSS  
C
RSS  
Reverse Transfer Capacitance  
T
o
tal Gate Charge  
Q
V
D
=
−
5/18
V
, V
 
=
6
00
V
,  
262  
75  
G(TOT)  
GS  
DS  
I
= 66 A  
Gate
−
to
−
Source Charge  
Gate
−
to
−
Drain Charge  
Gate
−
Resistance  
Q
Q
GS  
72  
GD  
R
f = 1 MHz  
1.6  
ꢀ
G
SWITCHING CHARACTERISTICS, VGS = 10 V  
Turn
−
On Delay Time  
t
V
D
=
−
5/18
V
, V
 
=
4
00
V
,  
−
−
−
−
−
−
−
24  
24  
−
−
−
−
−
−
−
ns  
d(ON)  
GS  
DS  
I
= 66 A, R
 
= 2.2
ꢀ  
G
Rise Time  
t
r
Inductive load  
Turn
−
Off Delay Time  
t
46  
d(OFF)  
Fall Time  
t
f
9.6  
144  
207  
351  
Turn
−
On Switching Loss  
Turn
−
Off Switching Loss  
T
o
tal Switching Loss  
E
ON  
ꢁ
J
E
OFF  
E
tot  
SOURCE
−
DRAIN DIODE CHARACTERISTICS  
Continuous Source
−
Drain Diode Forward  
I
V
V
=
−
5
V
, T
 
=
2
5
°
C  
−
−
−
−
−
108  
483  
−
A
V
SD  
GS  
J
Current  
Pulsed Drain
−
Source Diode Forward  
I
SDM  
Forward Diode Voltage  
V
=
−
5
V
, I
 
=
6
6 A, T
 
= 25
°
C  
4.5  
SD  
GS  
SD  
J
2
 

NVH4L018N075SC1  
Table

(T =
 
25
°
C unless otherwise specified) (continued)  
J
Parameter  
SOURCE
−
DRAIN DIODE CHARACTERISTICS  
Reverse Recovery Time  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
t
V
=
−
5/18
V
, I
 
=
6
6 A,  
−
−
−
−
−
−
28  
221  
19  
−
−
−
−
−
−
ns  
nC  
ꢁ
J  
A
RR  
GS  
S
SD  
dI /dt
 
= 1000 A/
ꢁ
s  
Reverse Recovery Charge  
Reverse Recovery Energy  
Peak Reverse Recovery Current  
Charge Time  
Q
RR  
E
REC  
I
16  
RRM  
Ta  
17  
ns  
ns  
Discharge Time  
Tb  
11  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
3

NVH4L018N075SC1  
TYPICAL CHARACTERISTICS  
280  
240  
200  
160  
120  
80  
4
V
GS  
= 18 V  
15 V  
3
V
GS  
= 12 V  
12 V  
2
15 V  
18 V  
10 V  
1
9 V  
40  
8 V  
0
0
0
2
4
6
8
10  
0
40  
80  
120  
160  
200  
V
DS  
, DRAIN
−
TO
−
SOURCE VOLTAGE (V)  
I ,
 
DRAIN CURRENT (A)  
D
Figure 1. On
−
Region Characteristics  
Figure 2. Normalized On
−
Resistance vs. Drain  
Current and Gate Voltage  
1.6  
1.4  
1.2  
1.0  
0.8  
150  
120  
90  
60  
30  
0
I
= 66 A  
I
V
= 66 A  
D
D
= 18 V  
GS  
T =
 
150
°
C  
J
T =
 
25
°
C  
J
3
6
9
12  
15  
18  
−
75
−
50
−
25  
0
25 50 75
 
100 125 150 175  
T , JUNCTION TEMPERATURE (
°
C)  
J
V
GS  
, GATE
−
TO
−
SOURCE VOLTAGE (V)  
Figure 3. On
−
Resistance Variation with  
Figure 4. On
−
Resistance vs. Gate
−
to
−
Source  
Temperature  
Voltage  
280  
100  
280  
240  
200  
160  
120  
80  
V
=
−
5 V  
V
DS  
= 10 V  
GS  
T =
 
175
°
C  
J
T =
 
25
°
C  
J
T =
 
175
°
C  
10  
1
J
T =
 
−
55
°
C  
J
T =
 
25
°
C  
J
40  
T =
 
−
55
°
C  
J
0
2
4
6
8
0
4
8
12  
16  
V
GS  
, GATE
−
TO
−
SOURCE VOLTAGE (V)  
V
SD  
, BODY DIODE FORWARD VOLTAGE (V)  
Figure 5. Transfer Characteristics  
Figure 6. Diode Forward Voltage vs. Current  
4

NVH4L018N075SC1  
TYPICAL CHARACTERISTICS
(continued)  
20  
15  
10  
5
10000  
C
I
D
= 66 A  
iss  
V
= 450 V  
DD  
V
= 750 V  
DD  
1000  
100  
10  
C
oss  
V
= 600 V  
DD  
0
C
rss  
f = 1 MHz  
= 0 V  
V
GS  
−
5  
0
50  
100  
150  
200  
250  
300  
750  
0.1  
1
10  
100  
V
DS  
, DRAIN
−
TO
−
SOURCE VOLTAGE (V)  
Q ,
 
GATE CHARGE (nC)  
g
Figure 7. Gate
−
to
−
Source Voltage vs. Total  
Figure 8. Capacitance vs. Drain
−
to
−
Source  
Charge  
Voltage  
150  
120  
90  
60  
30  
0
100  
10  
1
V
= 18 V  
GS  
R
= 0.30
°
C/W  
ꢂ
JC  
0.001  
0.01  
0.1  
1
25  
50  
75  
100  
125  
150  
175  
t ,
 
TIME IN AVALANCHE (ms)  
AV  
T ,
 
CASE TEMPERATURE (
°
C)  
C
Figure 9. Unclamped Inductive Switching  
Capability  
Figure 10. Maximum Continuous Drain  
Current vs. Case Temperature  
100000  
10000  
1000  
1000  
Single Pulse  
R
= 0.30
°
C/W  
ꢂ
JC  
10
ꢁ
s  
T
C
= 25
°
C  
100  
10  
1
100
ꢁ
s  
1 ms  
Single Pulse  
T =
 
Max Rated  
10 ms  
J
DC  
R
= 0.3
°
C/W  
ꢂ
JC  
T
= 25
°
C  
C
100  
0.1  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
0.1  
1
10  
100  
1000  
V
DS  
, DRAIN
−
TO
−
SOURCE VOLTAGE (V)  
t, PULSE WIDTH (sec)  
Figure 11. Safe Operating Area  
Figure 12. Single Pulse Maximum Power  
Dissipation  
5

NVH4L018N075SC1  
TYPICAL CHARACTERISTICS
(continued)  
1
0.1  
50% Duty Cycle  
20%  
10%  
5%  
Notes:  
= 0.30
°
C/W  
2%  
P
DM  
0.01  
0.001  
R
ꢂ
JC  
Duty Cycle, D = t
 
/t  
1
2
1%  
Single Pulse  
t
1
t
2
0.00001  
0.0001  
0.001  
0.01  
0.1  
t, RECTANGULAR PULSE DURATION (sec)  
Figure 13. Junction
−
to
−
Case Thermal Response  
6

MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO
−
247
−
4LD  
CASE 340CJ  
ISSUE A  
DATE 16 SEP 2019  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions
 
are uncontrolled
 
except when stamped
 
“CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13852G  
TO
−
247
−
4LD  
PAGE 1 OF 1  
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
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rights of others.  
©
Semiconductor Components Industries, LLC, 2018  

onsemi
,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “
onsemi
” or its affiliates  
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’s product/patent coverage may be accessed at

.
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−
is” and
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onsemi
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provided by
onsemi
. “Typical” parameters which may be provided in
onsemi
data sheets and/or specifications can and do vary in different applications and actual performance may  
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.
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