onsemi-NVHL160N120SC1

Part #onsemi-NVHL160N120SC1
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onsemi-NVHL160N120SC1
DATA SHEET  

MOSFET

– 160 mohm,  
1200ꢀV, M1, TO-247-3L  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
1200 V  
224 m
ꢀ
@ 20 V  
17 A  
N
−
CHANNEL MOSFET  
NVHL160N120SC1  
Features  
D
•
Typ. R  
= 160 m
ꢀ  
•
Ultra Low Gate Charge (typ. Q  
DS(on)  
= 34 nC)  
G(tot)  
•
Low Effective Output Capacitance (typ. C
 
= 50 pF)  
oss  
G
•
100% UIL Tested  
•
AEC
−
Q101 Qualified and P
P
A
P Capable  
S
•
This Device is Halide Free and RoHS Compliant with exemption 7a,  
Pb
−
Free 2LI (on second level interconnection)  
Typical Applications  
•
Automotive On Board Charger  
•
Automotive DC
−
DC Converter for EV/HEV  
G
D
MAXIMUM RATINGS
(T =
 
25
°
C unless otherwise noted)  
S
J
TO
−
247
−
3LD  
CASE 340CX  
Parameter  
Drain
−
to
−
Source Voltage  
Symbol  
Value  
Unit  
V
DSS  
1200  
−
15/+25  
−
5/+20  
V
V
V
Gate
−
to
−
Source Voltage  
V
GS  
MARKING DIAGRAM  
Recommended Opera-  
tion Values of Gate
−
to
−  
Source Voltage  
T
C
< 175
°
C  
V
GSop  
Continuous Drain  
Current  
Steady  
State  
T
= 25
°
C  
I
17  
A
C
D
&Z&3&K  
NVHL160  
N120SC1  
Power Dissipation  
P
119  
12  
W
A
D
Continuous Drain  
Current  
Steady  
State  
T
C
= 100
°
C  
I
D
Power Dissipation  
P
59  
69  
W
A
D
Pulsed Drain Current  
T =
 
25
°
C  
A
I
DM  
Single Pulse Surge Drain
 
T =
 
25
°
C, t
 
= 10
ꢁ
s,  
I
140  
A
A
p
DSC  
&Z  
&3  
&K  
= Assembly Plant Code  
= Date Code (
Y
e
ar & Week)  
= Lot  
Current Capability  
R
= 4.7  
ꢀ
G
Operating Junction and Storage
T
e
mperature  
Range  
T , T  
J
−
55 to  
+175  
°
C  
stg  
NVHL160N120SC1 = Specific Device Code  
Source Current (Body Diode)  
I
S
11  
A
Single Pulse Drain
−
to
−
Source Avalanche  
E
AS  
128  
mJ  
ORDERING INFORMATION  
Energy (I  
L(pk)  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
Device  
Package  
Shipping  
30 Units /  
Tube  
TO247
−
3L  
NVHL160N120SC1  
THERMAL CHARATERISTICS  
Parameter  
Junction
−
to
−

Junction
−
to
−

Symbol  
Value  
1.3  
Unit  
°
C/W  
°
C/W  
R
ꢂ
JC  
R
40  
ꢂ
JA  
1. The
 
entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2. Repetitive
 
rating, limited by max junction temperature.  
3. E
 
of 128 mJ is based on starting T
 
= 25
°
C; L = 1 mH, I
 
= 16 A,  
AS  
DD  
J
AS  
V
= 120 V, V
 
= 18 V.  
GS  
©
Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
May, 2022
−
Rev. 2  
NVHL160N120SC1/D  
 

NVHL160N120SC1  
ELECTRICAL CHARACTERISTICS
(T =
 
25
_
C unless otherwise stated)  
J
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Drain
−
to
−
Source Breakdown Voltage  
V
V
I
= 0
V
, I
 
= 1 mA  
1200  
−
−
−
V
(BR)DSS  
GS  
D
Drain
−
to
−
Source Breakdown Voltage  
T
e
mperature Coefficient  
V
/T  
= 1 mA, referenced to 25
_
C  
−
600  
mV/
_
C  
(BR)DSS  
J
D
Zero Gate Voltage Drain Current  
I
−
−
−
−
−
−
100  
250  
1
ꢁ
A  
V
GS  
V
GS  
V
GS  
= 0
V
, V
 
= 1200 V, T
 
= 25
_
C  
DSS  
DS  
J
= 0
V
, V
 
= 1200 V, T
 
= 175
_
C  
DS  
J
Gate
−
to
−
Source Leakage Current  
ON CHARACTERISTICS  
I
= +25/
−
15 V, V
 
= 0 V  
DS  
ꢁ
A
GSS  
Gate Threshold Voltage  
V
R
V
= V
 
, I
 
= 2.5 mA  
1.8  
−
5  
−
3.1  
−
4.3  
+20  
224  
377  
−
V
V
GS(th)  
GS  
DS  
D
Recommended Gate Voltage  
Drain
−
to
−
Source On Resistance  
V
GOP  
V
GS  
V
GS  
V
DS  
= 20
V
, I
 
=
1
2 A, T
 
= 25
_
C  
162  
271  
3
m
ꢀ  
DS(on)  
D
J
= 20
V
, I
 
=
1
2 A, T
 
= 175
_
C  
−
D
J
Forward Transconductance  
g
FS  
= 10
V
, I
 
=
1
2 A  
−
S
D
CHARGES, CAPACITANCES & GATE RESISTANCE  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
T
o
tal Gate Charge  
C
V
= 0
V
, f = 1
M
Hz, V
 
= 800 V  
−
−
−
−
−
−
−
−
665  
50  
−
−
−
−
−
−
−
−
pF  
nC  
ISS  
GS  
GS  
DS  
C
OSS  
RSS  
C
5
Q
V
=
−
5/20 V, V
 
= 600 V, I
 
= 16 A  
34  
G(tot)  
DS  
D
Threshold Gate Charge  
Gate
−
to
−
Source Charge  
Gate
−
to
−
Drain Charge  
Gate Resistance  
Q
6
G(th)  
Q
12.5  
9.6  
1.4  
GS  
GD  
Q
R
f = 1 MHz  
ꢀ
G
SWITCHING CHARACTERISTICS  
Turn-On Delay Time  
Rise Time  
t
t
V
D
=
−
5/20 V, V
 
= 800 V,  
−
−
−
−
−
−
−
11  
19  
−
−
−
−
−
−
−
ns  
d(on)  
GS  
DS  
I
= 16 A, R
 
= 6
ꢀ
,  
G
t
r
Inductive Load  
Turn
−
Off Delay Time  
Fall Time  
15  
d(off)  
t
f
8
Turn-On Switching Loss  
Turn-Off Switching Loss  
T
o
tal Switching Loss  
E
200  
34  
ꢁ
J
ON  
OFF  
TOT  
E
E
234  
DRAIN
−
SOURCE DIODE CHARACTERISTICS  
Continuous Drain
−
to
−
Source Diode  
I
V
V
=
−
5
V
, T
 
=
2
5
_
C  
−
−
−
−
11  
69  
A
A
SD  
GS  
J
Forward Current  
Pulsed Drain
−
to
−
Source Diode  
I
=
−
5
V
, T
 
=
2
5
_
C  
SDM  
GS  
J
Forward Diode Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Energy  
Peak Reverse Recovery Current  
Charge Time  
V
V
V
=
−
5
V
, I
 
= 6
A
, T
 
= 25
_
C  
−
−
−
−
−
−
−
4
10  
−
V
ns  
nC  
ꢁ
J  
A
SD  
GS  
SD  
J
t
=
−
5/20
V
, I
 
=
1
6 A,  
15  
45  
3.9  
6.2  
7.4  
7
RR  
GS  
S
SD  
dI /dt
 
= 1000 A/
ꢁ
s  
Q
−
RR  
E
REC  
−
I
−
RRM  
Ta  
−
ns  
ns  
Discharge Time  
Tb  
−
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
2

NVHL160N120SC1  
TYPICAL CHARACTERISTICS  
50  
40  
30  
20  
4.0  
10 V  
V
= 12 V  
GS  
19 V  
3.5  
V
= 20 V  
GS  
15 V  
18 V  
16 V  
3.0  
2.5  
2.0  
1.5  
17 V  
17 V  
18 V  
16 V  
19 V  
15 V  
12 V  
10 V  
V
GS  
= 20 V  
10  
0
1.0  
0.5  
0
2
4
6
8
10  
0
10  
20  
I ,
 
DRAIN CURRENT (A)  
30  
40  
V
DS  
, DRAIN
−
TO
−
SOURCE VOLTAGE (V)  
D
Figure 1. On
−
Region Characteristics  
Figure 2. Normalized On
−
Resistance vs. Drain  
Current and Gate Voltage  
700  
600  
500  
1.9  
1.7  
1.5  
1.3  
1.1  
I =
 
12 A  
D
I
V
= 12 A  
D
= 20 V  
GS  
400  
300  
200  
T =
 
150
°
C  
J
T =
 
25
°
C  
J
0.9  
0.7  
100  
0
−
75
−
50
−
25  
0
25 50 75
 
100 125 150 175  
9
10 11 12 13 14 15 16 17 18
 
19 20  
T , JUNCTION TEMPERATURE (
°
C)  
J
V
GS  
, GATE
−
TO
−
SOURCE VOLTAGE (V)  
Figure 3. On
−
Resistance Variation with  
Figure 4. On
−
Resistance vs. Gate
−
to
−
Source  
Temperature  
Voltage  
25  
20  
15  
10  
100  
V
=
−
5 V  
V
DS  
= 20 V  
GS  
T =
 
25
°
C  
J
T =
 
175
°
C  
J
T =
 
25
°
C  
J
10  
5
0
T =
 
175
°
C  
J
T =
 
−
55
°
C  
T =
 
−
55
°
C  
J
J
1
2
4
6
8
10  
12  
14  
16  
2
3
4
5
6
7
8
9
V
GS  
, GATE
−
TO
−
SOURCE VOLTAGE (V)  
V
SD  
, BODY DIODE FORWARD VOLTAGE (V)  
Figure 5. Transfer Characteristics  
Figure 6. Diode Forward Voltage vs. Current  
3

NVHL160N120SC1  
TYPICAL CHARACTERISTICS
(continued)  
10K  
20  
V
DD  
= 400 V  
I
D
= 16 A  
15  
10  
5
V
= 800 V  
C
DD  
1K  
iss  
V
= 600 V  
DD  
100  
C
oss  
10  
1
C
0
rss  
f = 1 MHz  
= 0 V  
V
GS  
−
5  
0
10  
20  
Q ,
 
GATE CHARGE (nC)  
30  
40  
0.1  
1
10  
100  
800  
175  
0.1  
V
DS  
, DRAIN
−
TO
−
SOURCE VOLTAGE (V)  
g
Figure 7. Gate
−
to
−
Source Voltage vs. Total  
Figure 8. Capacitance vs. Drain
−
to
−
Source  
Charge  
Voltage  
20  
16  
12  
8
50  
10  
V
GS  
= 20 V  
T =
 
25
°
C  
J
T =
 
150
°
C  
J
4
0
R
= 1.3
°
C/W  
ꢂ
JC  
1
0.001  
0.01  
0.1  
1
10  
25  
50  
75  
100  
125  
150  
t ,
 
TIME IN AVALANCHE (ms)  
AV  
T ,
 
CASE TEMPERATURE (
°
C)  
C
Figure 9. Unclamped Inductive Switching  
Capability  
Figure 10. Maximum Continuous Drain  
Current vs. Case Temperature  
100  
100K  
10K  
1K  
Single Pulse  
R
= 1.3
°
C/W  
ꢂ
JC  
= 25
°
C  
T
C
10
ꢁ
s  
10  
1
100
ꢁ
s  
This area is  
limited by R  
DS(on)  
1 ms  
10 ms  
100 ms  
Single Pulse  
T =
 
Max Rated  
0.1  
100  
10  
J
R
= 1.3
°
C/W  
ꢂ
JC  
T
C
= 25
°
C  
0.01  
0.1  
1
10  
100  
1K  
5K  
0.00001 0.0001  
0.001  
0.01  
V
DS  
, DRAIN
−
TO
−
SOURCE VOLTAGE (V)  
t, PULSE WIDTH (sec)  
Figure 11. Safe Operating Area  
Figure 12. Single Pulse Maximum Power  
Dissipation  
4

NVHL160N120SC1  
TYPICAL CHARACTERISTICS
(continued)  
2
1
50% Duty Cycle  
20%  
10%  
5%  
0.1  
2%  
Notes:  
(t) = r(t) x R  
1%  
P
DM  
Z
ꢂ
ꢂ
JC  
JC  
0.01  
Single Pulse  
R
= 1.3
°
C/W  
ꢂ
JC  
t
Peak T
 
= P  
x Z  
(t) + T  
JC C  
1
ꢂ
J
DM  
Duty Cycle, D = t
 
/t  
t
1
2
2
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
t, RECTANGULAR PULSE DURATION (sec)  
Figure 13. Junction
−
to
−
Ambient Thermal Response  
5

MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO
−
247
−
3LD  
CASE 340CX  
ISSUE A  
DATE 06 JUL 2020  
GENERIC  
MARKING DIAGRAM*  
XXXXX =
 
Specific Device Code  
A
Y
= Assembly Location  
=
Y
e
ar  
WW  
G
= Work Week  
= Pb
−
Free Package  
XXXXXXXXX  
AYWWG  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
Pb
−
Free indicator, “G” or microdot “
G
”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions
 
are uncontrolled
 
except when stamped
 
“CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON93302G  
TO
−
247
−
3LD  
PAGE 1 OF 1  
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
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rights of others.  
©
Semiconductor Components Industries, LLC, 2018  

onsemi
,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “
onsemi
” or its affiliates  
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’s product/patent coverage may be accessed at

.
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−
is” and
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onsemi
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onsemi
. “Typical” parameters which may be provided in
onsemi
data sheets and/or specifications can and do vary in different applications and actual performance may  
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