onsemi-SBCX19LT1
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BCX17LT1, BCX18LT1, PNP
BCX19LT1, NPN
General Purpose
T
r
ansistors
Voltage and Current are Negative for
PNP Transistors
PNP
NPN
Features
COLLECTOR
3
COLLECTOR 3
•
Pb−Free Packages are Available
1
BASE
1
BASE
2 EMITTER
2
EMITTER
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Collector − Emitter Voltage
BCX17LT1, BCX19LT1
BCX18LT1
V
CEO
V
CBO
V
EBO
Vdc
45
25
3
Collector − Base Voltage
BCX17LT1, BCX19LT1
BCX18LT1
Vdc
50
30
1
2
Emitter − Base Voltage
5.0
Vdc
Collector Current − Continuous
I
500
mAdc
C
SOT−23
CASE 318
STYLE 6
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
T
o
tal Device Dissipation FR
−
5
B
oard
P
225
mW
D
Derate above 25
°
C
A
1.8
mW/
°
C
°
C/W
MARKING DIAGRAM
Thermal Resistance,
Junction−to−Ambient
R
q
JA
556
T
o
tal Device Dissipation Alumina
P
D
Derate above 25
°
C
300
2.4
mW
mW/
°
C
A
xx M
G
G
Thermal Resistance,
Junction−to−Ambient
1
R
417
°
C/W
°
C
q
JA
Junction and Storage
T
e
mperature
T , T
J
−
5
5 to +150
stg
xx
M
G
= T1, T2, or U1
= Date Code*
= Pb−Free Package
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
1. FR
−
5
=
1
.0
ꢀ
0.75
ꢀ
0.062 in.
2. Alumina
= 0.4
ꢀ
0.3
ꢀ
0.024 in 99.5% alumina.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
©
Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
October, 2005 − Rev. 4
BCX17LT1/D
BCX17LT1, BCX18LT1, PNP BCX19LT1, NPN
ELECTRICAL CHARACTERISTICS
(T =
25
°
C unless otherwise noted)
A
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Collector−Emitter Breakdown Voltage
(I =
10 mAdc, I
= 0)
V
Vdc
(BR)CEO
BCX17, 19
BCX18
45
25
−
−
−
−
C
B
Collector−Emitter Breakdown Voltage
(I =
10
m
Adc, I
= 0)
V
Vdc
(BR)CES
BCX17, 19
BCX18
50
30
−
−
−
−
C
C
Collector Cutoff Current
(V =
20 Vdc, I
= 0)
I
CBO
−
−
−
−
100
5.0
nAdc
m
Adc
CB
E
(V =
20 Vdc, I
= 0, T
= 150
°
C)
CB
E
A
Emitter Cutoff Current
(V =
5.0 Vdc, I
= 0)
I
−
−
10
m
Adc
EBO
EB
C
ON CHARACTERISTICS
DC Current Gain
h
FE
−
(I =
100 mAdc, V
= 1.0 Vdc)
100
70
40
−
−
−
600
−
−
C
CE
(I =
300 mAdc, V
= 1.0 Vdc)
C
CE
(I =
500 mAdc, V
= 1.0 Vdc)
C
CE
Collector−Emitter Saturation Voltage
(I =
500 mAdc, I
= 50 mAdc)
V
−
−
−
0.62
1.2
Vdc
Vdc
CE(sat)
C
B
Base−Emitter On Voltage
(I =
500 mAdc, V
= 1.0 Vdc)
V
BE(on)
−
C
CE
ORDERING INFORMATION
Device
†
Specific Marking
Package
Shipping
BCX17LT1
SOT−23
SOT−23
3000 /
T
a
pe & Reel
3000 /
T
a
pe & Reel
BCX17LT1G
(Pb−Free)
T1
BCX17LT3
SOT−23
10,000 /
T
a
pe & Reel
10,000 /
T
a
pe & Reel
BCX17LT3G
SOT−23
(Pb−Free)
BCX18LT1
SOT−23
3000 /
T
a
pe & Reel
3000 /
T
a
pe & Reel
T2
U1
BCX18LT1G
SOT−23
(Pb−Free)
BCX19LT1
SOT−23
3000 /
T
a
pe & Reel
3000 /
T
a
pe & Reel
SOT−23
BCX19LT1G
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our
T
a
pe and Reel Packaging
Specifications Brochure, BRD8011/D.
2
BCX17LT1, BCX18LT1, PNP BCX19LT1, NPN
1000
V
= 1 V
CE
T =
25
°
C
J
100
10
0.1
1.0
10
100
1000
I ,
COLLECTOR CURRENT (mA)
C
Figure 1. DC Current Gain
1.0
0.8
0.6
0.4
1.0
T =
25
°
C
T =
25
°
C
A
J
V
@ I
/I =
10
C B
BE(sat)
0.8
0.6
0.4
0.2
0
V
@ V
= 1 V
CE
BE(on)
I
C
= 10 mA
100 mA
300 mA
500 mA
0.2
0
V
@ I
/I =
10
C B
CE(sat)
0.01
0.1
1
I ,
BASE CURRENT (mA)
10
100
1
10
100
1000
I ,
COLLECTOR CURRENT (mA)
C
B
Figure 2. Saturation Region
Figure 3. “On” Voltages
100
+1
0
q
for V
CE(sat)
VC
C
ib
10
−1
−2
C
ob
q
for V
BE
VB
1
0.1
1
10
100
1000
1
10
100
I ,
COLLECTOR CURRENT (mA)
C
V ,
REVERSE VOLTAGE (VOLTS)
R
Figure 4. Temperature Coefficients
Figure 5. Capacitances
3
BCX17LT1, BCX18LT1, PNP BCX19LT1, NPN
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AN
NOTES:
D
1. DIMENSIONING
AND TOLERANCING PER ANSI
Y14.5M, 1982.
SEE VIEW C
2. CONTROLLING
DIMENSION: INCH.
3. MAXIMUM
LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 318−01
THRU −07 AND −09 OBSOLETE, NEW
STANDARD 318−08.
3
H
E
E
c
1
2
MILLIMETERS
INCHES
DIM
A
A1
b
c
D
E
e
L
L1
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
NOM
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.20
0.54
2.40
MAX
MIN
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.094
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
b
0.25
1.11
0.10
0.50
0.18
3.04
1.40
2.04
0.30
0.69
2.64
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
e
q
A
L
A1
L1
VIEW C
H
E
STYLE 6:
PIN 1.
BASE
2. EMITTER
3. COLLECTOR
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
mm
inches
ǒ
Ǔ
SCALE 10:1
0.8
0.031
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting
T
e
chniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).
SCILLC reserves the right to make changes without further notice
to any products herein.
SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.
All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.
SCILLC does not convey any license under its patent rights
nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.
Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.
SCILLC is an Equal
Opportunity/Affirmative Action Employer.
This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMEN
T
:
N. American Technical Support
: 800−282−9855
T
o
ll Free
USA/Canada
Literature Distribution Center for ON Semiconductor
P
.
O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone
: 480−829−7710 or 800−344−3860
T
o
ll Free USA/Canada
Fax
: 480−829−7709 or 800−344−3867
T
o
ll Free USA/Canada
Email
: orderlit@onsemi.com
Japan
: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku,
T
o
kyo, Japan 153−0051
Phone
: 81−3−5773−3850
For additional information, please contact your
local Sales Representative.
BCX17LT1/D
