ORIENTAL-SEMI-OSG65R260FSF-NB

Part #ORIENTAL-SEMI-OSG65R260FSF-NB
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ORIENTAL-SEMI-OSG65R260FSF-NB
OSG65R260FSF_NB_
Datasheet  
Enhancement Mode  
N-Channel Power MOSFET  
Features  
Applications  
Low R

DS(on)

& FOM  
Lighting  
Extremely low switching loss  
Excellent stability and uniformity  
Easy to drive  
Hard switching PWM  
Server power supply  
Charger  

OSG65R260FSF_NB  
Enhancement Mode N-Channel Power MOSFET  
General Description  
OSG65R260FSF_NB uses advanced GreenMOS

TM  

technology to provide low R

DS(ON)

, low gate  
charge, fast switching and excellent avalanche  
characteristics. This device is suitable for active  
power factor correction and switching mode  
power supply applications.  
V

DS, min@Tjmax  

I

D, pulse  

R

DS(ON), max @ VGS=10 V  

Q

g  

700 V  
45 A  
260 m
Ω  
26.4 nC  
Schematic and Package Information  
Schematic Diagram  
Pin Assignment Top View  
TO220F  
OSG65R260FSF_NB  
Absolute Maximum Ratings
at T

j

=25
℃
unless otherwise noted  
Parameter  
Symbol  
V

DS  

Value  
650  
±
30  
15  
Unit  
V
Drain source voltage  
Gate source voltage  
V

GS  

V
Continuous drain current

1)

, T

C

=25
℃  
Continuous drain current

1)

, T

C

=100
℃  
Pulsed drain current

2)

, T

C

=25
℃  
I

D  

A
9.5  
I

D, pulse  

I

S  

I

S, pulse  

P

D  

45  
A
A
Continuous diode forward current

1)

, T

C

=25
℃  
Diode pulsed current

2)

, T

C

=25
℃  
15  
45  
A
Power dissipation

3)

, T

C

=25
℃  
33  
W
Single pulsed avalanche energy

5)  

E

AS  

360  
50  
mJ  
V/ns  
V/ns  
℃
MOSFET dv/dt ruggedness, V

DS

=0
…
480 V  
Reverse diode dv/dt, V

DS

=0
…
480 V, I

SD

≤
I

D  

Operation and storage temperature  
dv/dt  
dv/dt  
T

stg

,
T

j  

15  
-55 to 150  
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OSG65R260FSF_NB  
Enhancement Mode N-Channel Power MOSFET  
Thermal Characteristics  
Parameter  
Symbol  
R

θ
JC  

Value  
3.8  
Unit  
℃
/W  
℃
/W  
Thermal resistance, junction-case  
Thermal resistance, junction-ambient

4)  

R

θ
JA  

62.5  
Electrical Characteristics
at T

j

=25
℃
unless otherwise specified  
Parameter  
Symbol  
BV

DSS  

Min.  
Typ.  
Max.  
Unit  
V
Test condition  
650  
V

GS

=0 V, I

D

=250
μ
A  
Drain-source breakdown voltage  
Gate threshold voltage  
V

GS

=0 V, I

D

=250
μ
A,  
T

j

=150
℃  
700  
2.9  
V

GS(th)  

3.9  
V
V

DS

=V

GS

, I

D

=250
μ
A  
0.22  
0.54  
0.26  
V

GS

=10 V, I

D

=7.5 A  
Drain-source on-state resistance  
R

DS(ON)  

Ω
V

GS

=10 V, I

D

=7.5 A,  
T

j

=150
℃  
100  
-100  
1
V

GS

=30 V  
Gate-source leakage current  
I

GSS  

nA  
V

GS

=-30 V  
Drain-source leakage current  
Gate resistance  
I

DSS  

R

G  

μ
A  
V

DS

=650 V, V

GS

=0 V  
f= 1 MHz,
 
Open drain  
8.3  
Ω
Dynamic Characteristics  
Parameter  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
Symbol  
C

iss  

Min.  
Typ.  
1227  
100.2  
7.1  
Max.  
Unit  
pF  
pF  
pF  
ns  
Test condition  
V

GS

=0 V,  
C

oss  

C

rss  

V

DS

=50 V,  
ƒ=
100 kHz  
t

d(on)  

t

r  

t

d(off)  

t

f  

24.7  
7.3  
V

GS

=10 V,  
V

DS

=400 V,  
R

G

=2
Ω
,  
ns  
Turn-off delay time  
Fall time  
56.3  
9.5  
ns  
I

D

=8 A  
ns  
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OSG65R260FSF_NB  
Enhancement Mode N-Channel Power MOSFET  
Gate Charge Characteristics  
Parameter  
Total gate charge  
Symbol  
Q

g  

Min.  
Typ.  
26.4  
7.8  
Max.  
Unit  
nC  
nC  
nC  
V
Test condition  
I

D

=8 A,  
Gate-source charge  
Gate-drain charge  
Gate plateau voltage  
Q

gs  

V

DS

=400 V,  
V

GS

=10 V  
Q

gd  

7.9  
V

plateau  

5.3  
Body Diode Characteristics  
Parameter  
Diode forward voltage  
Reverse recovery time  
Symbol  
Min.  
Typ.  
Max.  
Unit  
V
Test condition  
V

SD  

t

rr  

1.4  
I

S

=15 A, V

GS

=0 V  
ns  
μ
C  
A
292  
3.5  
V

R

=400 V, I

S

=8 A,  
Reverse recovery charge  
Peak reverse recovery current  
Q

rr  

I

rrm  

di/dt=100
A/μs  
21.8  
Note  
1) Calculated
 
continuous current based on maximum allowable junction temperature.  
2) Repetitive
 
rating; pulse width limited by max. junction temperature.  
3) Pd
 
is based on max. junction temperature, using junction-case thermal resistance.  
4) The
 
value of R

θJ
A

is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a  
still air environment with T

a

=25
°C
.  
5) V

DD

=100 V, R

G

=50
Ω
, L=79.9 mH, starting T

j

=25
°C
.  
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OSG65R260FSF_NB  
Enhancement Mode N-Channel Power MOSFET  
Electrical Characteristics Diagrams  
100  
35  
V

DS

= 10 V  
T

j

= 25 ℃  
10 V  
30  
T

j

= 25 ℃  
6.5 V  
25  
10  
6 V  
20  
15  
5.5 V  
1
10  
5
0
V

GS

= 5 V  
0.1  
0
2
4
6
8
10  
2
4
6
8
10  
V

GS

, Gate-source voltage(V)  
V

DS

, Drain-source voltage (V)  
Figure 1, Typ. output characteristics  
Figure 2, Typ. transfer characteristics  
10

5  

10

4  

10

3  

10

2  

10

1  

10

0  

10  
8
I

D

= 8 A  
f
= 100 kHz  
V

GS

= 0 V  
V

DS

= 400 V  
C

iss  

6
4
C

oss  

C

rss  

2
0
0
100  
200  
300  
400  
500  
600  
0
5
10  
15  
20  
25  
30  
V

DS

, Drain-source voltage (V)  
Q

g

, Gate charge(nC)  
Figure 3, Typ. capacitances  
Figure 4, Typ. gate charge  
800  
750  
700  
650  
600  
0.60  
0.50  
0.40  
0.30  
0.20  
0.10  
I

D

= 250 uA  
V

GS

= 0 V  
I

D

=7.5 A  
V

GS

= 10 V  
-50  
0
50  
100  
150  
-50  
0
50  
100  
150  
T

j

, Junction temperature (℃)  
T

j

, Junction Temperature (℃)  
Figure 5, Drain-source breakdown voltage  
Figure 6, Drain-source on-state resistance  
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OSG65R260FSF_NB  
Enhancement Mode N-Channel Power MOSFET  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1000  
T

j

= 25 ℃  
I

D

= 250 uA  
100  
10  
1
-50  
0
50  
100  
150  
0.5  
1.0  
1.5  
2.0  
T

j

, Junction Temperature (℃)  
V

SD

, Source-Drain voltage (V)  
Figure 7, Threshold voltage  
Figure 8, Forward characteristic of body diode  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
16  
14  
12  
10  
8
5.5 V  
6 V  
V

GS

=5 V  
6.5 V  
10 V  
6
4
2
0
0
5
10  
15  
20  
25  
30  
35  
40  
45  
0
20  
40  
60  
80  
100  
120  
140  
I

D

, Drain current(A)  
T

C

, Case Temperature (℃)  
Figure 9, Drain-source on-state resistance  
Figure 10, Drain current  
10

1  

10

0  

100  
D= t

p

/T  
D= 1  
0.5  
10  
10 μs  
0.2  
0.1  
100 μs  
1
0.1  
0.05  
R

DS(ON)

Limited  
1 ms  
10

-1  

10 ms  
0.02  
10

-3  

0.01  
Single Pulse  
DC  
0.01  
10

-2  

10

-5  

0.1  
1
10  
100  
1000  
10

-4  

10

-2  

10

-1  

10

0  

10

1  

10

2  

V

DS

, Drain-source voltage(V)  
t

p

Pulse width(s)  
Figure 11, Safe operation area T

C

=25
℃  
Figure 12, Max. transient thermal impedance  
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OSG65R260FSF_NB  
Enhancement Mode N-Channel Power MOSFET  
Test circuits and waveforms  
Figure 1, Gate charge test circuit & waveform  
Figure 2, Switching time test circuit & waveforms  
Figure 3, Unclamped inductive switching (UIS) test circuit & waveforms  
Figure 4, Diode reverse recovery test circuit & waveforms  
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OSG65R260FSF_NB  
Enhancement Mode N-Channel Power MOSFET  
Package Information  
Figure1, TO220F_NL package outline dimension  
mm  
SYMBOL  
MIN  
NOM  
M
A
X  
A
b
b1  
c
4.30  
0.60  
0.60  
0.45  
14.70  
4.50  
0.70  
0.80  
0.50  
15.00  
4.70  
0.80  
0.90  
0.60  
15.30  
D
8.50 REF.  
2.60 BSC.  
D1  
e
E
F
9.70  
2.50  
6.30  
13.40  
1.00  
2.50  
2.90  
10.00  
2.70  
6.50  
13.60  
1.10  
2.60  
10.30  
2.90  
6.70  
13.80  
1.20  
2.70  
3.10  
G
L
L1  
Q
Q1  
3.00  
3.50 REF.  
Q2  
R
Ф
3.00  
3.20  
3.40  
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OSG65R260FSF_NB  
Enhancement Mode N-Channel Power MOSFET  
Ordering Information  
Package Units/Tube Tubes/Inner
 
Box Units/Inner
 
Box  
Inner Box/Carton Box  
Units/Carton Box  
TO220F  
50  
40  
2000  
4
8000  
Product Information  
Product  
Package  
Pb Free  
RoHS  
Halogen Free  
OSG65R260FSF_NB  
TO220F  
yes  
yes  
yes  
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