PANASONIC-TX2SS-L2-9V-Z

Part #PANASONIC-TX2SS-L2-9V-Z
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PANASONIC-TX2SS-L2-9V-Z
Relay Technical Information  
Definition of Relay Terminology  
COIL

(also referred to as primary or input)  

• Nominal Coil Voltage
(Rated Coil  
Voltage)  
decreased, the value at or above which all  
contacts must revert to their unoperated  
position.  
• Maximum Continuous Voltage  
The maximum voltage that can be applied  
continuously to the coil without causing  
damage
.
S
hort duration spikes of a higher  
voltage may be tolerable, but this should  
not be assumed without first checking  
with the manufacturer.  
• Nominal Operating Power  
The value of power used by the coil at  
nominal voltage. For DC coils expressed  
in watts; AC expressed as volt amperes.  
Nominal Power (W or VA) = Nominal  
Voltage
×
Nominal Current.  
A single value (or narrow range) of source  
voltage intended by design to be applied  
to the coil or input.  
• Pick-U
p
V
oltage
(Pull-I
n
V
oltage or Must  
Operate Voltage)  
As the voltage on an unoperated relay is  
increased, the value at or below which all  
contacts must function (transfer).  
• Drop-Out Voltage
(Release or Must  
Release Voltage)  
• Coil Resistance  
This is the DC resistance of the coil in DC  
type relays for the temperature conditions  
listed in the catalog. (Note that for certain  
types of relays, the DC resistance may be  
for temperatures other than the standard  
20°C
68°
F
.)  
• Nominal Operating Current  
The value of current flow in the coil when  
nominal voltage is impressed on the coil  
As the voltage on an operated relay is  
• Coil Designation  
Single side stable type  
2 coil latching type  
1 coil latching type  
Non-polarized  
Polarized  
4-terminal  
3-terminal  
—
+
+
—
+
—
+
+
+
or  
or  
—
+
—
—
—
A black coil represents the energized  
state. For latching relays, schematic  
diagrams generally show the coil in its  
reset state. Therefore, the coil symbol is  
also shown for the reset coil in its reset  
state.  
CONTACTS

(secondary or output)  

• Contact Forms  
amperes (AC) which can safely be  
switched by the contacts
.
T
his value is the  
product of switching voltage x switching  
current, and will be lower than the  
maximum voltage and maximum current  
product.  
• Maximum Switching Voltage  
The maximum open circuit voltage which  
can safely be switched by the contacts.  
AC and DC voltage maximums will differ  
in most cases.  
• Minimum switching capability  
This value is a guideline as to the lowest  
possible level at which it will be possible  
for a low level load to allow switching
.
T
he  
level of reliability of this value depends on  
switching frequenc
y
,
a
mbient conditions,  
change in the desired contact resistance,  
and the absolute value. Please use a  
relay with AgPd contacts if your needs  
analog low level loads, control, or a  
contact resistance of 100 m
Ω
or less.  
We recommend that you verify with one of  
our sales offices regarding usage.  
• Maximum Switching Capacity  
Denotes the contact mechanism and  
number of contacts in the contact circuit.  
• Contact Symbols  
Form A contacts  
(normally open contacts)  
Form B contacts  
(normally closed contacts)  
• Maximum Switching Current  
The maximum current which can safely be  
switched by the contacts. AC and DC  
current maximums may differ.  
Form C contacts  
(changeover contacts)  
This is listed in the data column for each  
type of relay as the maximum value of the  
contact capacity and is an  
Form A contacts are also called N.O.  
contacts or make contacts.  
Form B contacts are also called N.C.  
contacts or break contacts.  
Form C contacts are also called  
changeover contacts or transfer contacts.  
• MBB Contacts  
Abbreviation for make-before-break  
contacts. Contact mechanism where  
Form A contacts (normally open contacts)  
close before Form B contacts open  
(normally closed contacts).  
• Maximum Switching Power  
The upper limit of power which can be  
switched by the contacts. Care should be  
taken not to exceed this value.  
interrelationship of the maximum  
switching power, maximum switching  
voltage, and maximum switching current.  
The switching current and switching  
voltage can be obtained from this graph.  
For example, if the switching voltage is  
fixed in a certain application, the  
maximum switching current can be  
obtained from the intersection between  
the voltage on the axis and the maximum  
switching power.  
• Maximum Carrying Current  
The maximum current which after closing  
or prior to opening, the contacts can  
safely pass without being subject to  
temperature rise in excess of their design  
limit, or the design limit of other  
temperature sensitive components in the  
relay (coil, springs, insulation, etc.). This  
value is usually in excess of the maximum  
switching current.  
• Rated Switching Power  
The design value in watts (DC) or volt  
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OPYRIGHT
Matsushita Electric Works, Ltd.  

Definition of Relay Terminology  
Maximum Switching Capacity  
(TX relay)  
Example: Using TX relay at a switching  
voltage of 60V DC, the maximum  
switching current is 1A.  
(Maximum switching capacity is given for  
a resistive load
.
B
e sure to carefully check  
the actual load before use.)  
• Contact Resistance  
Test Currents  
This value is the combined resistance of  
the resistance when the contacts are  
touching each other, the resistance of the  
terminals and contact spring
.
T
he contact  
resistance is measured using the voltage-  
drop method as shown below. The  
measuring currents are designated in  
Fig. 1.  
Rated Contact Current or  
Switching Current (A)  
T
e
st Current  
(mA)  
Less than 0.01  
1
10  
0.01 or more and less than 0.1  
0.1 or more and less than 1  
1 or more  
100  
1,000  
The resistance can be measured with  
reasonable accuracy on a YHP 4328A  
milliohmmeter.  
3.0  
2.0  
In general, for relays with a contact rating  
of 1A or more, measure using the voltage-  
drop method at 1A 6V DC.  
V
DC resistive load  
1.0  
• Capacitance  
This value is measured between the  
terminals at 1kHz and 20°C
68°
F
.  
Measured contact  
R
0.5  
0.4  
Power  
source  
0.3  
A
0.2  
(AC or DC)  
A :  
Ammeter
V :
 
Voltmeter
R :
Variable resister  
0
20 30
 
50  
100  
200 300  
Contact voltage, V  
Fig. 1  
PERFORMANCE  
• Insulation Resistance  
closure of the normally open contacts.  
(With multiple pole devices the time until  
the last contact closes.) This time does  
not include any bounce time.  
• Release Time
(Drop-Out Time)  
The elapsed time from the initial removal  
of coil power until the reclosure of the  
normally closed contacts (last contact  
with multi-pole) this time does not include  
bounce.  
• Set Time  
T
e
rm used to describe operate time of a  
latching rela
y
.  
• Reset Time  
T
e
rm used to describe release time of a  
latching rela
y
.
W
ith a 2-coil magnetic  
latching relay the time is from the first  
application of power to the reset coil until  
the reclosure of the reset contacts
.
W
ith a  
single coil latching rela
y
,
t
he time is  
measured from the first application of  
reverse coil voltage until the reclosure of  
the reset contact.  
• Shock Resistance, Destructive  
The acceleration which can be withstood  
by the relay during shipping or installation  
without it suffering damage, and without  
causing a change in its operating charac-  
teristics. Usually expressed in “G”s.  
• Shock Resistance, Functional  
The acceleration which can be tolerated  
by the relay during service without  
causing the closed contacts to open for  
more than the specified time. (usually  
10
µ
s)  
• Vibration Resistance, Destructive  
The vibration which can be withstood by  
the relay during shipping, installation or  
use without it suffering damage, and  
without causing a change in its operating  
characteristics. Expressed as an  
acceleration in G’s or displacement, and  
frequency range.  
The resistance value between all mutually  
isolated conducting sections of the rela
y
,  
i.e. between coil and contacts, across  
open contacts and between coil or  
contacts to any core or frame at ground  
potential. This value is usually expressed  
as “initial insulation resistance” and may  
decrease with time, due to material  
degradation and the accumulation of  
contaminants.  
• Breakdow
n
V
oltage
(Hi-Pot or Dielectric  
Strength)  
The maximum voltage which can be  
tolerated by the relay without damage for  
a specified period of time, usually  
measured at the same points as  
insulation resistance. Usually the stated  
value is in VAC (RMS) for one minute  
duration.  
• Surge Withstand Voltage  
• Vibration Resistance, Functional  
The vibration which can be tolerated by  
the relay during service, without causing  
the closed contacts to open for more than  
the specified time.  
The ability of the device to withstand an  
abnormal externally produced power  
surge, as in a lightning strike, or other  
phenomenon. An impulse test waveform  
is usually specified, indicating rise time,  
peak value and fall time. (Fig. 2)  
• Contact Bounce
(Time)  
Generally expressed in time (ms), this  
refers to the intermittent switching  
phenomenon of the contacts which  
occurs due to the collision between the  
movable metal parts or contacts, when  
the relay is operated or released.  
• Operate Bounce Time  
The time period immediately following  
operate time during which the contacts  
are still dynamic, and ending once all  
bounce has ceased.  
• Mechanical Life  
The minimum number of times the relay  
can be operated under nominal conditions  
(coil voltage, temperature, humidit
y
,
e
tc.)  
with no load on the contacts.  
1,500 V  
750 V  
• Electrical Life  
The minimum number of times the relay  
can be operated under nominal conditions  
with a specific load being switched by the  
contacts.  
• Release Bounce Time  
• Maximum Switching Frequency  
This refers to the maximum switching  
frequency which satisfies the mechanical  
life or electrical life under repeated  
operations by applying a pulse train at the  
rated voltage to the operating coil.  
10
µ
s  
160
µ
s  
The time period immediately following  
release time during which the contacts  
are still dynamic, ending when all bounce  
has ceased.  
Fig. 2  
• Operat
e
T
ime (Pull-In or Pick-U
p
T
ime)  
The elapsed time from the initial  
application of power to the coil, until the  
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OPYRIGHT
Matsushita Electric Works, Ltd.  

Definition of Relay Terminology  
• Life Curve  
HIGH FREQUENCY CHARACTERISTICS  
This is listed in the data column for each  
type of rela
y
.
T
he life (number of  
operations) can be estimated from the  
switching voltage and switching current.  
For example, for a DS relay operating at:  
Switching voltage = 125V AC  
• Isolation  
•
V
.
S.W.R.
(Voltage Standing Wave Ratio)  
High frequency resonance is generated  
from the interference between the input  
signal and reflected (wave) signal.  
V
.
S.W.R. refers to the ratio of the  
maximum value to minimum value of the  
waveform
.
T
h
e
V
.
S.W.R
.
i
s 1 when there is  
no reflected wave. It usually becomes  
greater than 1.  
High frequency signals leak through the  
stray capacitance across contacts even if  
the contacts are separated. This leak is  
called isolation. The symbol dB (decibel)  
is used to express the magnitude of the  
leak signal. This is expressed as the  
logarithm of the magnitude ratio of the  
signal generated by the leak with respect  
to the input signal. The larger the  
magnitude, the better the isolation.  
• Insertion Loss  
At the high frequency region, signal  
disturbance occurs from self-induction,  
resistance, and dielectric loss as well as  
from reflection due to impedance  
mismatching in circuits
.
L
oss due to any of  
these types of disturbances is called  
insertion loss
.
T
herefore, this refers to the  
magnitude of loss of the input signal
.
T
he  
smaller the magnitude, the better the  
rela
y
.  
Switching current = 0.6A  
The life expectancy is 300,000  
operations. However, this value is for a  
resistive load. Be sure to carefully check  
the actual load before use.  
Notes:  
1. Except where otherwise specified, the  
tests above are conducted under  
standard temperature and humidity (15°C  
to 35°C
59°F to 95°
F
, 25 to 75%).  
2. The coil impressed voltage in the  
switching tests is a rectangular wave at  
the rated voltage.  
Life Curve  
1,000  
30V DC resistance load  
100  
3. The phase of the AC load operation is  
random.  
125V AC resistance load  
10  
1
2
Current (A)  
PROTECTIVE CONSTRUCTION  
Several different degrees of protection are  
provided for different relay types, for  
resistance to dust, flux, contaminating  
environments, automatic cleaning, etc.  
• Open Type  
For reasons of cost, some devices are not  
provided with any enclosure. It is usually  
assumed that the end application will be  
in an overall enclosure or protective  
environment.  
contamination, and also may protect user  
and chemical stabilit
y
.
T
his annealing  
process drives off residual volatiles in the  
plastics, insuring a contaminant free  
environment inside the sealed rela
y
,  
resulting in more stable contact  
personnel from a shock hazard.  
• Flux-Resistant Type  
In this type of construction, solder flux  
penetration is curtailed by either insert  
molding the terminals with the header, or  
by a simple sealing operation during  
manufacturing.  
resistance over life.  
• Hermetic Seal  
The plastic sealed type is not a true  
hermetic seal, there is an exchange of  
gas molecules through the plastic cover  
over time. The only true hermetic seals  
are metal to metal and glass to metal
.
T
he  
entire device is purged with dry nitrogen  
gas prior to sealing, improving reliabilit
y
.  
• Sealed Type  
This type of sealed relay totally excludes  
the ingress of contaminants by way of a  
sealing compound being applied to the  
header/cover interface. The constituent  
components are annealed for physical  
• Dust Cover Type  
Most standard relays are provided with a  
dust cover of some type
.
T
his protects the  
relay from large particulate  
CONSTRUCTION AND CHARACTERISTIC  
(
ꢀ
:
Y
e
s,
ꢁ
: No)  
Automatic  
Soldering  
Automatic  
Cleaning  
Harmful Gas  
Resistance  
T
y
pe  
Construction  
Characteristics  
Most basic construction where the case and base  
(or body) are fitted together.  
Dust Cover
T
y
pe  
ꢁ
ꢀ
ꢀ
ꢁ
ꢁ
ꢀ
ꢁ
ꢁ
ꢀ
Base  
T
e
rminals are sealed or molded simultaneousl
y
.  
The joint between the case and base is higher  
than the surface of the PC board.  
Flux-Resistant
T
y
pe  
Sealed
T
y
pe  
Base  
T
e
rminals, case, and base are filled with sealing  
resin.  
Sealing resin  
Metal case  
Metallic Hermetic  
Seal
T
y
pe  
Hermetically sealed with metal case and metal  
base.
T
e
rminals are sealed with glass.  
ꢀ
ꢀ
ꢀ
Glass  
Metal base  
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OPYRIGHT
Matsushita Electric Works, Ltd.  

Definition of Relay Terminology  
OPERATIONAL FUNCTION  
• Single Side Stable Type  
Relay which turns on when the coil is  
energized and turns off when de-  
energized. (Fig. 3)  
• 2 Coil Latching Type  
Relay with a latching construction  
composed of 2 coils: set coil and reset  
coil
.
T
he relay is set or reset by alternately  
applying pulse signals of the same  
polarit
y
.
(
Fig. 5)  
• Operation Indication  
Indicates the set and reset states either  
electrically or mechanically for easy  
maintenance. An LED wired type (LED  
wired HC relay), lamp type (lamp wired  
HP relay) are available. (Fig. 6)  
1
3
4 5  
+
1
3
4
5
6
–
12  
10 9 8  
+
–
Direction indication*  
TX relay  
+
12  
–
7
10  
9
8
Fig. 3  
Direction indication*  
TX relay  
LED wired  
HC relay  
• 1 Coil Latching Type  
Fig. 5  
Relay with a latching construction that can  
maintain the on or off state with a pulse  
input. With one coil, the relay is set or  
reset by applying signals of opposite  
polarities. (Fig. 4)  
Fig. 6  
1
3
4 5  
–
+
12  
10 9 8  
Direction indication*  
TX relay  
Fig. 4  
TERMINAL CONFIGURATION  
PC board  
PC board  
surface-mount  
terminal  
PC board through hole  
terminal  
Quick connect  
T
y
pe  
self-clinching  
terminal  
Plug-in terminal  
Screw terminal  
terminal  
T
y
pical relay  
type  
T
e
rminal  
configuration  
GQ, GN, TQ, TN, TK, TX,  
TX-D rela
y
,
D
S rela
y
,  
T
y
pical relay
 
DS-BT rela
y
,
R
P rela
y
,  
GQ-SMD,  
GN-SMD,  
TX-SMD,  
TQ-SMD  
HJ rela
y
,
H
C relay  
HE relay  
EP relay  
EJ relay  
TQ, TN, TK, TX,  
TX-D relay  
HP rela
y
,
H
E relay
 
JC relay  
HL rela
y
,
H
K relay
 
JR relay  
HN relay  
type  
JS rela
y
,
J
W rela
y
,  
SEB rela
y
,
J
Q rela
y
,  
PQ relay  
MOUNTING METHOD  
T
e
rminal socket  
T
y
pe  
Insertion mount  
Surface mount  
Socket mount  
TM relay  
TMP type  
mount  
Mounting  
configuration  
Terminal  
Socket  
GQ, GN, TQ, TN, TK, TX,  
T
y
pical relay
 
TX-D rela
y
,
D
S rela
y
,  
GQ-SMD,  
GN-SMD,  
TX-SMD,  
TQ-SMD  
HJ rela
y
,
H
C relay  
HP rela
y
,
H
G relay  
HL rela
y
,
H
K relay  
HN relay  
NC relay  
HC relay  
HL relay  
HC relay  
JR relay  
JC relay  
JR relay  
LF relay  
J
T
–
N relay  
type  
DS-BT rela
y
,
R
P rela
y
,  
SEB relay  
Notes: 1. Sockets are available for certain PC board relays. (SEB rela
y
,
S
T rela
y
,
e
tc.)  
2. M type (solder type) for direct screw mounting of case is also available. (HG relay)  
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OPYRIGHT
Matsushita Electric Works, Ltd.  

General Application Guidelines  
A relay may encounter a variety of  
ambient conditions during actual use  
resulting in unexpected failure
.
T
herefore,  
testing over a practical range under actual  
operating conditions is necessar
y
.  
Application considerations should be  
reviewed and determined for proper use  
of the rela
y
.  
CAUTIONS REGARDING SAFETY  
• Be absolutely sure not to exceed the  
specification ranges, such as coil rating,  
contact rating and switching life. Doing so  
may lead to abnormal heating, smoke,  
and fire.  
turn off the power when installing,  
heating, and fire, etc.  
maintaining and troubleshooting the relay  
(including connecting parts such as the  
terminal block and socket).  
• Perform terminal connections correctly  
after verifying the internal wiring diagrams  
in the catalog
.
C
onnecting incorrectly may  
cause unexpected malfunction, abnormal  
• Prepare with a redundant safety device  
construction if there is a possibility that  
such things as adhesion, contact failure or  
disconnection could cause bodily harm or  
property damage.  
• Be absolutely sure not to touch the  
charging part when the relay is on. Doing  
so may cause electrical shock. Be sure to  
METHOD OF DETERMINING SPECIFICATIONS  
Failsafe  
Specification item  
Consideration points regarding selection  
a) Rating  
b) Pick-up voltage (current)  
c) Drop-out voltage (current)  
d) Maximum continuous  
impressed voltage (current)  
e) Coil resistance  
1) Select relay with consideration for power source ripple.  
2) Give sufficient consideration to ambient temperature, for the coil temperature rise and hot  
start.  
3) When used in conjunction with semiconductors, additional attention to the application  
should be taken.  
Coil  
f) Impedance  
g)
T
e
mperature rise  
h) Input frequency for AC type  
1) It is desirable to use a standard product with more than the required number of contacts.  
2) It is beneficial to have the relay life balanced with the life of the device it is used in.  
3) Is the contact material matched to the type of load?  
It is necessary to take care particularly with low level usage.  
4) The rated life may become reduced when used at high temperatures.  
Life should be verified in the actual atmosphere used.  
a) Contact arrangement  
b) Contact rating  
c) Contact material  
d) Life  
e) Contact pressure  
f) Contact
 
resistance  
Contacts  
5) Depending on the circuit, the relay drive may synchronize with the AC load. As this will  
cause a drastic shortening of life should be verified with the actual machine.  
a) Operate time  
b) Release time  
c) Bounce time  
Operate time  
1) It is beneficial to make the bounce time short for sound circuits and similar applications.  
d) Switching frequency  
a) Vibration resistance  
b) Shock resistance  
c) Ambient temperature  
d) Life  
1) Give consideration to performance under vibration and shock in the use location.  
2) In particular, when used in high temperature applications, relay with class B or class F  
coil insulation may be required.  
Mechanical  
characteristics  
1) Selection can be made for connection method with plug-in type, printed circuit board  
type, soldering, tab terminals, and screw fastening type.  
2) For use in an adverse atmosphere, sealed construction type should be selected.  
3) Are there any special conditions?  
a) Mounting method  
b) Cover  
c) Size  
Other items  
BASICS ON REL
A
Y
H
ANDLING  
•
T
o
m
aintain initial performance, care  
should be taken to avoid dropping or  
hitting the rela
y
.  
coil polarity (+, –) for polarized relays.  
before use.  
• Proper usage requires that the rated  
voltage be impressed on the coil. Use  
rectangular waves for DC coils and sine  
waves for AC coils.  
• Be sure the coil impressed voltage does  
not continuously exceed the maximum  
allowable voltage.  
• Absolutely avoid using switching  
voltages and currents that exceed the  
designated values.  
• Do not exceed the usable ambient  
temperature values listed in the catalog.  
• Use the flux-resistant type or sealed type  
if automatic soldering is to be used.  
• Use alcohol based cleaning solvents  
when cleaning is to be performed using a  
sealed type rela
y
.  
• Avoid ultrasonic cleaning of all types of  
relays.  
• Avoid bending terminals, because it may  
cause malfunction.  
• As a guide, use a Faston mounting  
pressure of 40 to 70N {4 to 7kgf}for relays  
with tab terminals.  
• For proper use, read the main text for  
details.  
• Under normal use, the relay is designed  
so that the case will not detach.
T
o  
maintain initial performance, the case  
should not be removed. Relay  
characteristics cannot be guaranteed if  
the case is removed.  
• Use of the relay in an atmosphere at  
standard temperature and humidity with  
minimal amounts of dust, SO

2

, H

2

S, or  
organic gases is recommended.  
• Please avoid the use of silicon-based  
resins near the rela
y
,
b
ecause doing so  
may result in contact failure. (This applies  
to plastic
 
sealed type relays, too.)  
• Care should be taken to observe correct  
• The rated switching power and life are  
given only as guides. The physical  
phenomena at the contacts and contact  
life greatly vary depending on the type of  
load and the operating conditions.  
Therefore, be sure to carefully check the  
type of load and operating conditions  
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OPYRIGHT
Matsushita Electric Works, Ltd.  

General Application Guidelines  
PROBLEM POINTS WITH REGARD TO USE  
In the actual use of relays, various  
tests are necessary under the possible  
relay is a mass production item, and as a  
matter of principle, it must be recognized  
that the relay is to be used to the extent of  
such variations without the need for  
adjustment.  
ambient conditions are encountered, and  
because unforeseen events occur which  
can not be thought of on the drawing  
board, with regard to such conditions,  
range of operation. For example,  
consideration must always be given to  
variation of performance when relay  
characteristics are being reviewed. The  
REL
A
Y
C
OIL  
• AC operation type  
resistance due to temperature rise, must  
be given consideration for the worst  
possible condition of relay operation,  
making it necessary to consider the  
current value as 1.5 to 2 times the pick-up  
current. Also, because of the extensive  
use of relays as limit devices in place of  
meters for both voltage and current, and  
because of the gradual increase or  
decrease of current impressed on the coil  
causing possible delay in movement of  
the contacts, there is the possibility that  
the designated control capacity may not  
be satisfied. Thus it is necessary to  
exercise care. The DC type relay coil  
resistance varies due to ambient  
humming is stopped, but with a distorted  
waveform, that function is not displayed.  
Fig. 1 below shows an example of  
For the operation of AC relays, the power  
source is almost always a commercial  
frequency (50 or 60Hz) with standard  
voltages of 6, 12, 24, 48, 115, and 240V  
AC. Because of this, when the voltage is  
other than the standard voltage, the  
product is a special order item, and the  
factors of price, deliver
y
,
a
nd stability of  
characteristics may create  
waveform distortion.  
If the power source for the relay operating  
circuit is connected to the same line as  
motors, solenoids, transformers, and  
other loads, when these loads operate,  
the line voltage drops, and because of this  
the relay contacts suffer the effect of  
vibration and subsequent burn damage.  
In particular, if a small type transformer is  
used and its capacity has no margin of  
safet
y
,
w
hen there is long wiring, or in the  
case of household used or small sales  
shop use where the wiring is slender, it is  
necessary to take precautions because of  
the normal voltage fluctuations combined  
with these other factors. When trouble  
develops, a survey of the voltage situation  
should be made using a synchroscope or  
similar means, and the necessary  
counter-measures should be taken, and  
together with this determine whether a  
special relay with suitable excitation  
characteristics should be used, or make a  
change in the DC circuit as shown in Fig.  
2 in which a capacitor is inserted to  
absorb the voltage fluctuations.  
In particular, when a magnetic switch is  
being used, because the load becomes  
like that of a motor, depending upon the  
application, separation of the operating  
circuit and power circuit should be tried  
and investigated.  
inconveniences.
T
o
t
he extent that it is  
possible, the standard voltages should be  
selected.  
Also, in the AC type, shading coil  
resistance loss, magnetic circuit eddy  
current loss, and hysteresis loss exit, and  
because of lower coil efficienc
y
,
i
t is  
normal for the temperature rise to be  
greater than that for the DC type.  
Furthermore, because humming occurs  
when below the pick-up voltage and when  
above the rated voltage, care is required  
with regard to power source voltage  
fluctuations.  
For example, in the case of motor starting,  
if the power source voltage drops, and  
during the humming of the rela
y
,
i
f it  
reverts to the restored condition, the  
contacts suffer a burn damage and  
welding, with the occurrence of a false  
operation self-maintaining condition.  
For the AC type, there is an inrush current  
during the operation time (for the  
separated condition of the armature, the  
impedance is low and a current greater  
than rated current flows; for the adhered  
condition of the armature, the impedance  
is high and the rated value of current  
flows), and because of this, for the case of  
several relays being used in parallel  
connection, it is necessary to give  
consideration to power consumption.  
• DC operation type  
temperature as well as to its own heat  
generation to the extent of about 0.4%/
°
C,  
and accordingl
y
,
i
f the temperature  
increases, because of the increase in pic  
k-up and drop-out voltages, care is  
required.  
• Energizing voltage of AC coil  
In order to have stable operation of the  
rela
y
,
t
he energizing voltage should be  
basically within the range of +10%/-15%  
of the rated voltage. However, it is  
necessary that the waveform of the  
voltage impressed on the coil be a sine  
wave. There is no problem if the power  
source is commercially provided power,  
but when a stabilized AC power source is  
used, there is a waveform distortion due  
to that equipment, and there is the  
possibility of abnormal overheating. By  
means of a shading coil for the AC coil,  
Sine wave  
Approximate keystone wave  
Waveform with a  
this harmonic included  
For the operation of DC relays, standards  
exist for power source voltage and  
current, with DC voltage standards set at  
5, 6, 12, 24, 48, and 100
V
,
b
ut with regard  
to current, the values as expressed in  
catalogs in milliamperes of pick-up  
current.  
However, because this value of pick-up  
current is nothing more than a guarantee  
of just barely moving the armature, the  
variation in energizing voltage and  
resistance values, and the increase in coil  
Fig. 1 Distortion in an AC stabilized power source  
T
Switch  
C
100V AC  
24V DC  
R
Relay coil  
Fig. 2 Voltage fluctuation absorbing circuit using a condenser  
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General Application Guidelines  
• Power source for DC input  
As a power source for the DC type rela
y
, a  
battery or either a half wave or full wave  
rectifier circuit with a smoothing capacitor  
is used
.
T
he characteristics with regard to  
the excitation voltage of the relay will  
change depending upon the type of power  
source, and because of this, in order to  
display stable characteristics, the most  
desirable method is perfect DC.  
~
R
Relay  
Smoothing capacitor  
Ripple portion  
In the case of ripple included in the DC  
power source, particularly in the case of  
half wave rectifier circuit with a smoothing  
capacitor, if the capacity of the capacitor  
is too small, due to the influence of the  
DC portion  
Emean.  
Emax. Emin.  
Emax.
–
Emin  
Emax. = Maximum value of ripple portion  
Emin. = Minimum value of ripple portion  
Emean. = Average value of ripple portion  
Ripple percentage =  
×
100%  
Emean.  
Fig. 3  
ripple, humming develops and an  
unsatisfactory condition is produced
.
W
ith  
the actual circuit to be used, it is  
absolutely necessary to confirm the  
characteristics. (Fig. 3)  
[1] It is desirable to have less than a 5%  
ripple for the reed type rela
y
.  
[4] Coil applied voltage and the drop in  
voltage.  
Please verify that the actual voltage is  
applied to the coil at the actual load.  
Electrical life will be affected by the drop in  
voltage in the coil when load is turned on.  
[2] For the hinge type rela
y
, a
h
alf wave  
rectifier cannot be used, alone unless you  
use a smoothing capacitor
.
T
he ripple and  
the characteristics must be evaluated for  
proper usage.  
[3] For the hinge type rela
y
,
t
here are  
certain applications that may or maynot  
use the full wave rectifier on it’s own.  
Please check specifications with the  
original manufacture.  
With regard to our
T
–
Series (TQ, TN, TK,  
TX, TX-D, TQ-SMD) and SEB relays, it is  
necessary to give consideration to the use  
of a power source with less than a 5%  
ripple, but for the J series, NC relays,  
there is no hindrance to the operation.  
However, the pull-up force becomes  
somewhat weakened, and it is necessary  
to take care since the resistance to  
vibration and shock is reduced. Also  
ordinarily the following must be given  
thought.  
Shown on the right, is a circuit driven by  
the same power supply (batter
y
,
e
tc.) for  
both the coil and contact.  
• Coil temperature rise  
In addition to being a requirement for relay  
operation stabilit
y
,
t
he maximum  
continuous impressed coil voltage is an  
important constraint for the prevention of  
such problems as thermal deterioration or  
deformity of the insulation material, or the  
occurrence of fire hazards.  
In actual use with E-type insulation, when  
the ambient temperature is 40°C
104°
F
, a  
temperature rise limit of 80°C
176°F
is  
thought to be reasonable according to the  
resistance method. However, when  
complying with the Electrical Appliance  
and Material Safety Law, this becomes  
75°C
167°
F
.  
•
T
emperature rise due to pulse voltage  
When a pulse voltage with ON time of less  
than 2 minutes is used, the coil  
temperature rise bares no relationship to  
the ON time. This varies with the ratio of  
ON time to OFF time, and compared with  
continuous current passage, it is rather  
small. The various relays are essentially  
the same in this respect. (Fig. 4)  
• Pick-up voltage change due to coil  
temperature rise (hot start)  
range, but for miniature types it is for the  
most part 1/2 cycle (about 10ms).  
In DC relays, after continuous passage of  
current in the coil, if the current is turned  
OF
F
,
t
hen immediately turned ON again,  
due to the temperature rise in the coil, the  
pick-up voltage will become somewhat  
higher. Also, it will be the same as using it  
in a higher temperature atmosphere. The  
resistance/temperature relationship for  
copper wire is about 0.4% for 1
°
C, and  
with this ratio the coil resistance  
However, for the somewhat large type  
relay where bounce is large, the operate  
time is 7 to 16ms, with release time in the  
order of 9 to 18ms Also, in the case of DC  
operation, to the extent of large coil input,  
the operating time is rapid, but if it is too  
rapid, the “A” contact bounce time is  
extended.  
Current passage time  
%
• Stray circuits (bypass circuits)  
In the case of sequence circuit  
T
e
mperature rise  
value is 100%  
For continuous passage  
increases. That is, in order to operate of  
the rela
y
,
i
t is necessary that the voltage  
be higher than the pick-up voltage and the  
pick-up voltage rises in accordance with  
the increase in the resistance value.  
However, for some polarized relays, this  
rate of change is considerably smaller.  
• Operate time  
In the case of AC operation, there is  
extensive variation in operate time  
depending upon the point in the phase at  
which the switch is turned ON for coil  
excitation, and it is expressed as a certain  
construction, because of bypass flow or  
alternate routing, it is necessary to take  
care not to have erroneous operation or  
abnormal operation.
T
o
u
nderstand this  
condition while preparing sequence  
circuits, as shown in Fig. 5, with 2 lines  
written as the power source lines, the  
upper line is always
B
and the lower line  
v
(when the circuit is AC, the same  
thinking applies). Accordingly the
B
side  
is necessarily the side for making contact  
connections (contacts for relays, timers,  
limit switches, etc.), and the
v
side is the  
ON : OFF = 3 : 1  
ON : OFF = 1 : 1  
ON : OFF = 1 : 3  
About 80%  
About 50%  
About 35%  
1 : 1  
Time  
Fig. 4  
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Matsushita Electric Works, Ltd.  

General Application Guidelines  
load circuit side (relay coil, timer coil,  
magnet coil, solenoid coil, motor, lamp,  
etc.).  
a series circuit through A, R
1
, R
2
, and R
3
,  
correctly made. In addition, with regard to  
the DC circuit, because it is simple by  
means of a diode to prevent stray circuits,  
proper application should be made.  
and the relays will hum and sometimes  
not be restored to the drop out condition.  
The connections shown in Fig. 6 (b) are  
Upper side line  
Contact circuit  
Power source lines  
A
B
C
A
D
Load circuit  
R
Lower side line  
R
1  
R
2  
R
3  
B
Fig. 5 Example of a vertically written  
sequence circuit  
R
1  
R

2  

R
3  
C
Fig. 6 shows an example of stray circuits.  
In Fig. 6 (a), with contacts A, B, and C  
closed, after relays R

1

, R
2
, and R
3  
(a) Not a good example  
(b) Correct example  
Fig. 6 Stray circuits  
operate, if contacts B and C open, there is  
• Gradual increase of coil impressed  
voltage and suicide circuit  
When the voltage impressed on the coil is  
increased slowl
y
,
t
he relay transferring  
operation is unstable, the contact  
with mixture of gradual increase of  
impressed voltage for the coil and a  
sucide circuit. In the timing portion for  
relay R

1

, when the timing times out,  
chattering occurs causing trouble. In the  
initial test (trial production), it shows  
favorable operation, but as the number of  
operations increases, contact blackening  
(carbonization) plus the chattering of the  
relay creates instability in performance.  
pressure drops, contact bounce  
increases, and an unstable condition of  
contact occurs. This method of applying  
voltage to the coil should not be used, and  
consideration should be given to the  
method of impressing voltage on the coil  
(use of switching circuit). Also, in the case  
of latching relays, using self contacts “B
,
”  
the method of self coil circuit for complete  
interruption is used, but because of the  
possibility of trouble developing, care  
should be taken.  
Instability point  
R

1

a  
R
2
a  
Switch  
R
1
b  
X
R
2
b  
X
SW  
ON  
E
C
C
R
1  
R

2  

e
R
1
b  
R

1

a  
R

1

: Reed relay  
R

2

: Reed relay  
C: Capacitor  
X: Variable resistance  
(for time adjustment)  
R

1

a: Form A of relay R
1  
R
1
b: Form B of relay R
1  
The circuit shown in Fig
.
7
c
auses a timing  
and sequential operation using a reed  
type rela
y
, but this is not a good example  
Fig. 7 A timing and sequential operation using a reed type relay  
• Phase synchronization in AC load  
switching  
If switching of the relay contacts is  
synchronized with the phase of the AC  
power, reduced electrical life, welded  
contacts, or a locking phenomenon  
(incomplete release) due to contact  
material transfer may occur. Therefore,  
check the relay while it is operating in the  
actual system. When driving relays with  
timers, micro computers and thyristors,  
etc., there may be synchronization with  
the power supply phase. (Fig. 8)  
Load  
R
y  
Load  
voltage  
V
in.  
V
in.  
Fig. 8  
• Erroneous operation due to inductive  
interference  
caused by a problem with distribution  
capacity or the device might break down  
due to the influence of externally caused  
surges, such as that caused by lightning.  
• Long term current carrying  
operation.  
Continuous, long-term current to the coil  
will facilitate deterioration of coil insulation  
and characteristics due to heating of the  
coil itself.  
For circuits such as these, please use a  
magnetic-hold type latching rela
y
.
I
f you  
must use a single stable rela
y
,
u
se a  
sealed type relay that is not easily  
affected by ambient conditions and  
provide a failsafe circuit design that  
considers the possibility of contact failure  
or disconnection.  
For long wire runs, when the line for the  
control circuit and the line for power line  
use a single conduit, induction voltage,  
caused by induction from the power line,  
will be applied to the operation coil  
regardless of whether or not the control  
signal is off. In this case the relay and  
timer may not revert. Therefore, when  
wiring divs a long distance please  
remember that along with inductive  
interference, connection failure may be  
A circuit designed for non-excitation when  
left running is desirable for circuits  
(circuits for emergency lamps, alarm  
devices and error inspection that, for  
example, revert only during malfunction  
and output warnings with form B contacts)  
that will be carrying a current continuously  
for long periods without relay switching  
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General Application Guidelines  
• Usage with infrequent switching  
Please carry out periodic contact  
conductivity inspections when the  
frequency of switching is once or fewer  
times per month. When no switching of  
the contacts occurs for long periods,  
organic membrane may form on the  
contact surfaces and lead to contact  
instabilit
y
.  
• Regarding electrolytic corrosion of  
coils  
In the case of comparatively high voltage  
coil circuits (in particular above 48 V DC),  
when such relays are used in high  
temperature and high humidity  
(2) When a grounding is not required,  
important role as a method for preventing  
electrolytic corrosion.  
connect the ground terminal to the
B
side  
of the coil. (Refer to Fig. 11) (NF and NR  
with ground terminal)  
[3] When the
v
side of the power source  
is grounded, always avoid interting the  
contacts (and switches) in the
v
side.  
(Refer to Fig. 12) (Common to all relays)  
[4] In the case of relays provided with a  
ground terminal, when the ground  
Note: The designation on the drawing  
indicates the insertion of insulation  
between the iron core and the chassis. In  
relays where a ground terminal is  
provided, the iron core can be grounded  
directly to the chassis, but in  
consideration of electrolytic corrosion, it is  
more expedient not to make the  
connection.  
terminal is not considered effective, not  
making a connection to ground plays an  
Judgement: Good (Fig. 9)  
Judgement: Good (Fig. 10)  
Switch  
Bobbin  
Bobbin  
atmospheres or with continuous passage  
of current, the corrosion can be said to be  
the result of the occurrence of electrolytic  
corrosion. Because of the possibility of  
open circuits occurring, attention should  
be given to the following points.  
End of coil winding  
+
–
+
–
+
–
+
Iron core  
Relay coil  
Iron core  
Relay coil  
–
Start of coil winding  
R (Insulation  
resistance)  
R (Insulation  
resistance)  
Switch  
[1
]
T
he
B
side of the power source should  
be connected to the chassis
.
(
Refer to Fig.  
9) (Common to all relays)  
Judgement: Good (Fig. 11)  
Judgement: No good (Fig. 12)  
[2] In the case where unavoidably the
v  
side is grounded, or in the case where  
grounding is not possible.  
(1) Insert the contacts (or switch) in the
B  
side of the power source, and connect the  
start of the coil winding the
v
side
.
(
Refer  
to Fig. 10) (Common to all relays)  
Switch  
Bobbin  
+
+
+
–
+
+
Iron core  
Relay coil  
Iron core  
Relay coil  
–
–
Bobbin  
R (Insulation  
resistance)  
Switch  
CONTACT  
The contacts are the most important  
elements of relay construction. Contact  
performance conspicuously influenced by  
contact material, and voltage and current  
values applied to the contacts (in  
particular, the voltage and current  
waveforms at the time of application and  
release), the type of load, frequency of  
switching, ambient atmosphere, form of  
contact, contact switching speed, and of  
bounce.  
exercise care with regard to control  
capacit
y
.
I
n the case of DC, there is no  
zero current point such as there is with  
AC, and accordingl
y
,
o
nce a cathode arc  
has been generated, because it is difficult  
to quench that arc, the extended time of  
the arc is a major cause. In addition, due  
to the direction of the current being fixed,  
the phenomenon of contact shift, as noted  
separately below, occurs in relation to the  
contact wear. Ordinaril
y
,
t
he approximate  
control capacity is mentioned in catalogs  
or similar data sheets, but this alone is not  
sufficient
.
W
ith special contact circuits, for  
the individual case, the maker either  
estimates from the past experience or  
makes test
 
on each occasion. Also, in  
catalogs and similar data sheets, the  
control capacity that is mentioned is  
limited to resistive load, but there is a  
broad meaning indicated for that class of  
rela
y
,
a
nd ordinarily it is proper to think of  
current capacity as that for 125V AC  
circuits.  
ambient conditions, change in the desired  
contact resistance, and the absolute  
value. Please use relays with AgPd  
contacts when minute analog load control  
or contact resistance no higher than 100  
m
Ω
is desired (for measurement and  
wireless applications, etc.).  
[Current]  
The current at both the closing and  
opening time of the contact circuit exerts  
important influence. For example, when  
the load is either a motor or a lamp, to the  
extent of the inrush current at the time of  
closing the circuit, wear of the contacts,  
and the amount of contact transfer  
increase, and contact welding and contact  
transfer make contact separation  
impossible.  
Because of contact transfer, welding,  
abnormal wear, increase in contact  
resistance, and the various other  
damages which bring about unsuitable  
operation, the following items require full  
investigation.  
*We recommend that you verify with one  
of our sales offices.  
1. Contact circuit voltage, current, and  
load  
[Voltage, AC and DC]  
When there is inductance included in the  
circuit, a rather high counter emf is  
generated as a contact circuit voltage,  
and since, to the extent of the value of that  
voltage, the energy applied to the  
contacts causes damage with  
Minimum applicable loads are given in the  
catalog; however, these are only provided  
as a guide to the lower limit that the relay  
is able to switch and are not guaranteed  
values. The level of reliability of these  
values depends on switching frequenc
y
,  
consequent wear of the contacts, and  
transfer of the contacts, it is necessary to  
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Matsushita Electric Works, Ltd.  

General Application Guidelines  
2. Characteristics of Common Contact Materials  
Characteristics of contact materials are given below. Refer to them when selecting a rela
y
.  
Electrical conductivity and thermal conductivity are the highest of all metals. Exhibits low contact resistance, is  
inexpensive and widely used. A disadvantage is it easily develops a sulfide film in a sulfide atmosphere. Care is  
required at low voltage and low current levels.  
Ag  
(silver)  
AgCd  
(silver-cadmium)  
Exhibits the conductivity and low contact resistance of silver as well as excellent resistance to welding. Like silver,  
it easily develops a sulfide film in a sulfide atmosphere.  
Hardness and melting point are high, arc resistance is excellent, and it is highly resistant to material transfer.  
However, high contact pressure is required. Furthermore, contact resistance is relatively high and resistance to  
corrosion is poor. Also, there are constraints on processing and mounting to contact springs.  
Contact  
Material  
AgW  
(silver-tungsten)  
AgNi  
(silver-nickel)  
Equals the electrical conductivity of silver. Excellent arc resistance.  
AgPd  
(silver-palladium)  
At standard temperature, good corrosion resistance and good sulfidation resistance. However, in dry circuits,  
organic gases adhere and it easily develops a polymer. Gold clad is used to prevent polymer buildup. Expensive.  
Combines perfect corrosion resistance and hardness. As plated contacts, used for relatively light loads. In an  
organic gas atmosphere, care is required as polymers may develop. Therefore, it is used in hermetic seal relays  
(reed relays, etc.) . Expensive.  
Rh plating  
(rhodium)  
Au with its excellent corrosion resistance is pressure welded onto a base metal. Special characteristics are  
uniform thickness and the nonexistence of pinholes. Greatly effective especially for low level loads under relatively  
adverse atmospheres. Often difficult to implement clad contacts in existing relays due to design and installation.  
Au clad  
(gold clad)  
Surface  
Finish  
Au plating  
(gold plating)  
Similar effect to Au cladding. Depending on the plating process used, supervision is important as there is the  
possibility of pinholes and cracks. Relatively easy to implement gold plating in existing relays.  
Au flash plating  
Purpose is to protect the contact base metal during storage of the switch or device with built-in switch. However, a  
(gold thin-film plating)
 
certain degree of contact stability can be obtained even when switching loads.  
3. Contact Protection  
Generall
y
,
t
he critical dielectric  
• Counter EMF  
breakdown voltage at standard  
ON OFF  
E
0
When switching inductive loads with a DC  
relay such as relay sequence circuits, DC  
motors, DC clutches, and DC solenoids, it  
is always important to absorb surges (e.g.  
with a diode) to protect the contacts.  
When these inductive loads are switched  
off, a counter emf of several hundred to  
several thousand volts develops which  
can severely damage contacts and  
greatly shorten life. If the current in these  
loads is relatively small at around 1A or  
less, the counter emf will cause the  
ignition of a glow or arc discharge. The  
discharge decomposes organic matter  
contained in the air and causes black  
deposits (oxides, carbides) to develop on  
the contacts. This may result in contact  
failure.  
temperature and pressure in air is about  
200 to 300 volts. Therefore, if the counter  
emf exceeds this, discharge occurs at the  
contacts to dissipate the energy (

1

/
2
Li

2

)  
stored in the coil. For this reason, it is  
desirable to absorb the counter emf so  
that it is 200V or less.  
Peak voltage  
+
–
meter  
–
Several hundred  
to several  
thousand volts  
+
e
+
R
E
–
di  
dt  
e =
–
L  
(a)  
(b)  
Fig. 13  
In Fig. 13 (a), an emf (e = –L di/dt) with a  
steep waveform is generated across the  
coil with the polarity shown in Fig. 13 (b)  
at the instant the inductive load is  
switched off. The counter emf passes  
through the power supply line and  
reaches both contacts.  
• Material Transfer Phenomenon  
Material transfer of contacts occurs when  
one contact melts or boils and the contact  
material transfers to the other contact. As  
the number of switching operations  
increases, uneven contact surfaces  
develop such as those shown in Fig. 14.  
After a while, the uneven contacts lock as  
if they were welded together. This often  
occurs in circuits where sparks are  
produced at the moment the contacts  
“make” such as when the DC current is  
large for DC inductive or capacitive loads  
or when the inrush current is large  
(several amperes or several tens of  
amperes).  
Contact protection circuits and contact  
materials resistant to material transfer  
such as AgSnO, AgW or AgCu are used  
as countermeasures. Generall
y
, a  
concave formation appears on the  
cathode and a convex formation appears  
on the anode. For DC capacitive loads  
(several amperes to several tens of  
amperes), it is always necessary to  
conduct actual confirmation tests.  
Meterial transfer of contacts  
Fig. 14  
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Matsushita Electric Works, Ltd.  

General Application Guidelines  
• Contact Protection Circuit  
Use of contact protective devices or  
protection circuits can suppress the  
counter emf to a low level. However, note  
that incorrect use will result in an adverse  
effect.
T
y
pical contact protection circuits  
are given in the table below.  
(G: Good
 
NG: No Good)  
Application  
AC DC  
Circuit  
Features/Others  
Devices Selection  
If the load is a timer, leakage current flows  
through the CR circuit causing faulty operation.  
* If used with AC voltage, be sure the  
impedance of the load is sufficiently smaller  
than that of the CR circuit  
Contact  
As a guide in selecting r and c,  
r: 0.5 to 1
Ω
per 1V contact voltage  
c: 0.5 to 1
µ
F per 1A contact current  
Values vary depending on the properties of the  
load and variations in relay characteristics.  
Capacitor c acts to suppress the discharge the  
moment the contacts open. Resistor r acts to  
limit the current when the power is turned on  
the next time.
T
e
st to confirm. Use a capacitor  
with a breakdown voltage of 200 to 300
V
.
U
se  
AC type capacitors (non-polarized) for AC  
circuits.  
*
G
G
r
c
CR  
circuit  
Contact  
If the load is a relay or solenoid, the release time  
lengthens. Effective when connected to both  
contacts if the power supply voltage is 24 or 48V  
and the voltage across the load is 100 to 200
V
.  
r
G
c
The diode connected in parallel causes the  
Use a diode with a reverse breakdown voltage  
Contact  
energy stored in the coil to flow to the coil in the
 
at least 10 times the circuit voltage and a  
form of current and dissipates it as joule heat at
 
forward current at least as large as the load  
the resistance component of the inductive load.
 
current. In electronic circuits where the circuit  
This circuit further delays the release time  
compared to the CR circuit. (2 to 5 times the  
release time listed in the catalog)  
Diode  
circuit  
NG  
NG  
G
G
G
G
Diode  
voltages are not so high, a diode can be used  
with a reverse breakdown voltage of about 2 to  
3 times the power supply voltage.  
Contact  
Diode  
and  
zener  
diode  
circuit  
Effective when the release time in the diode  
circuit is too long.  
Use a zener diode with a zener voltage about  
the same as the power supply voltage.  
Using the stable voltage characteristics of the  
varistor, this circuit prevents excessively high  
voltages from being applied across the contacts.  
This circuit also slightly delays the release time.  
Effective when connected to both contacts if the  
power supply voltage is 24 or 48V and the  
voltage across the load is 100 to 200
V
.  
Contact  
Varistor  
Varistor  
circuit  
• Avoid using the protection circuits  
shown in the figures below.  
Fig. 15  
Contact  
Power  
Contact  
Although DC inductive loads are usually  
more difficult to switch than resistive  
loads, use of the proper protection circuit  
will raise the characteristics to that for  
resistive loads. (Fig. 15)  
Power  
C
C
No good  
No good  
supply  
supply  
Although extremely effective in arc suppression
 
Although extremely effective in arc suppression  
as the contacts open, the contacts are
 
as the contacts open, the contacts are  
susceptible to welding since energy is stored in
 
susceptible to welding since charging current  
C when the contacts open and discharge  
flows to C when the contacts close.  
current flows from C when the contacts close.  
• Mounting the Protective Device  
In the actual circuit, it is necessary to  
locate the protective device (diode,  
resistor, capacitor, varistor, etc.) in the  
immediate vicinity of the load or contact
.
I
f  
located too far awa
y
,
t
he effectiveness of  
the protective device may diminish. As a  
guide, the distance should be within  
50cm.  
• Abnormal Corrosion during High  
Frequency Switching of DC Loads  
(spark generation)  
If, for example, a DC valve or clutch is  
switched at a high frequenc
y
, blue-green  
rust may develop. This occurs from the  
reaction of nitrogen and oxygen in the air  
when sparks (arc discharge) are  
generated during switching.  
• Type of Load and Inrush Current  
The type of load and its inrush current  
characteristics, together with the  
T
y
pe of load  
Inrush current  
Resistive load  
Steady state current  
10 to 20 times the  
steady state current  
Solenoid load  
Motor load  
switching frequenc
y
,
a
re important factors  
which cause contact welding. Particularly  
for loads with inrush currents, measure  
the steady state and inrush current.  
Then select a relay which provides an  
ample margin of safet
y
.
T
he table on the  
right shows the relationship between  
typical loads and their inrush currents.  
Also, verify the actual polarity used since,  
depending on the rela
y
,
e
lectrical life is  
affected by the polarity of COM and NO.  
5 to 10 times the  
steady state current  
Incandescent lamp  
load  
10 to 15 times the  
steady state current  
Approx. 3 times the  
steady state current  
Mercury lamp load  
Sodium vapor lamp  
load  
1 to 3 times the  
steady state current  
20 to 40 times the  
steady state current  
Capacitive load  
T
r
ansformer load  
5 to 15 times the  
steady state current  
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General Application Guidelines  
Load Inrush Current Wave and Time  
(1) Incandescent Lamp Load  
(2) Mercury Lamp Load  
(3) Fluorescent Lamp Load  
i/i
o
]
3 times  
i/i
o
]
5 to 10 times  
L
Contacts  
i
i
i

o  

i
o  
C
i
i
o  
(for high power factor type)  
3 to  
5 minutes  
10 seconds  
or less  
Incandescent lamp  
The discharge tube, transformer, choke coil,  
capacitor, etc., are combined in common  
discharge lamp circuits. Note that the inrush  
current may be 20 to 40 times, especially if  
the power supply impedance is low in the  
high power factor type.  
Approx. 1/3 second  
Inrush current/rated current  
=i/i

o

= 10 to 15 times  
(4) Motor Load i/i
o
]
5 to 10 times  
(5) Solenoid Load  
(6) Electromagnetic Contact Load
 
(7) Capacitive Load  
i/i
o
]
10 to 20 times  
i/i
o
]
3 to 10 times  
i/i
o
]
20 to 40 times  
i
o  
i
i
i
o  
i
i
o  
i
o  
i
0.07  
to 0.1 second  
0.2 to 0.5 second  
•
Conditions become more harsh if plugging or inching  
is performed since state transitions are repeated.  
•
When using a relay to control a DC motor and brake,  
the on time surge current, normal current and off  
time brake current differ depending on whether the  
load to the motor is free or locked. In particular, with  
non-polarized relays, when using from b contact of  
from contact for the DC motor brake, mechanical life  
might be affected by the brake current. Therefore,  
please verify current at the actual load.  
1 to 2 cycles  
(1/60 to 1/30 seconds)  
Note that since inductance is great,  
the arc lasts longer when power is cut.  
The contact may become easily worn.  
1/2 to 2 cycles (1/120 to 1/30 seconds)  
• When Using Long Wires  
• Electrical life at high temperatures  
Verify at the actual use condition since  
electrical life may be affected by use at  
high temperatures.  
If long wires (100 to 300m) are to be used  
in a relay contact circuit, inrush current  
may become a problem due to the stray  
capacitance existing between wires. Add  
a resistor (approx. 10 to 50
Ω
) in series  
with the contacts. (Fig. 16)  
Equivalent circuit  
+
Contacts  
Stray capacitance  
Added resistor  
Wire  
(100 to 300m)  
of wire  
10 to 50
Ω  
Fig. 16  
• Phase Synchronization in Switching AC Loads  
If switching of the relay contacts is  
synchronized with the phase of the AC  
power, reduced electrical life, welded  
contacts, or a locking phenomenon  
R
y  
Load  
voltage  
Load  
voltage  
Load  
V
in  
(incomplete release) due to contact  
material transfer may occur. Therefore,  
check the relay while it is operating in the  
actual system. However, if problems  
V
in  
develop, control the relay using an  
appropriate phase. (Fig. 17)  
Fig. 17  
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Matsushita Electric Works, Ltd.  

General Application Guidelines  
4. Cautions on Use Related to Contacts  
• Connection of load and contacts  
Connect the load to one side of the power  
supply as shown in Fig. 18 (a). Connect  
the contacts to the other side. This  
prevents high voltages from developing  
between contacts. If contacts are  
connected to both side of the power  
supply as shown in Fig. 18 (b), there is a  
risk of shorting the power supply when  
relatively close contacts short.  
R
y  
E
E
(a)  
(b)  
R
y  
R
y  
R
y  
(a) Good example  
(b) Bad example  
Fig. 18  
• Dummy Resistor  
Since voltage levels at the contacts used  
in low current circuits (dry circuits) are  
low, poor conduction is often the result.  
One method to increase reliability is to  
add a dummy resistor in parallel with the  
load to intentionally raise the load current  
reaching the contacts.  
• Avoid Circuits Where Shorts Occur  
Between Form A and B Contacts  
(Fig. 19)  
R
1  
R
1  
R
2  
Push-botton  
switch  
N.C.  
N.O.  
COM  
M
R
Relay coil  
R
R
2  
3) R
1
, R
2
: Contacts for R  
1) R

1

, R
2
: Contacts for R  
: Double pole relay  
2)  
R
R
: Double pole relay  
1) The clearance between form A and B  
contacts in compact control components  
is small. The occurrence of shorts due to  
Fig. 19  
arcing must be assumed.  
• Shorts Between Different Electrodes  
Although there is a tendency to select  
miniature control components because of  
the trend toward miniaturizing electrical  
control units, care must be taken when  
selecting the type of relay in circuits where  
different voltages are applied between  
electrodes in a multi-pole rela
y
,
e
specially  
when switching two different power supply  
circuits. This is not a problem that can be  
determined from sequence circuit  
diagrams. The construction of the control  
component itself must be examined and  
sufficient margin of safety must be  
provided especially in creepage between  
electrodes, space distance, presence of  
barrier, etc.  
2) Even if the three N.C., and COM  
contacts are connected so that they short,  
a circuit must never be designed to allow  
the possibility of burning or generating an  
overcurrent.  
3) A forward and reverse motor rotation  
circuit using switching of form A and B  
contacts must never be designed.  
LATCHING REL
A
Y
S  
• Latching relays are shipped from the  
factory in the reset state. A shock to the  
relay during shipping or installation may  
cause it to change to the set state.  
Therefore, it is recommended that the  
relay be used in a circuit which initializes  
the relay to the required state (set or  
reset) whenever the power is turned on.  
• Avoid impressing voltages to the set coil  
and reset coil at the same time.  
(a) Parallel connection of set coils  
(+)  
(b) Parallel connection of set coils  
(+)  
S
1  
S
2  
S
3  
S
1  
S
2  
S
3  
Reset  
coil  
Reset  
coil  
Reset coil  
Reset coil  
Set coil  
Set coil  
Set coil  
Set coil  
(
–
)  
(
–
)  
• Connect a diode as shown since latching  
may be compromised when the relay is  
used in the following circuits.  
Diode connection  
Diode connection  
Diode connection  
Diode connection  
If set coils or reset coils are to be  
connected together in parallel, connect a  
diode in series to each coil. Fig. 20 (a),  
Fig. 20 (b) Also, if the set coil of a relay  
and the reset coil of another relay are  
connected in parallel, connect a diode to  
the coils in series. Fig. 20 (c)  
(c) Parallel connection of set coils and reset coils  
(d) Circuit with inductive load in parallel  
with the set coil or reset coil  
(+)  
(+)  
S
1  
S
2  
S
3  
S
Reset  
coil  
AC  
or DC  
Reset coil  
Motor  
Common relay  
coil  
M
Set coil  
If the set coil or reset coil is to be  
Set coil  
Set or  
reset coil  
connected in parallel with an inductive  
load (e.g. another electromagnetic relay  
coil, motor, transformer, etc.), connect a  
diode to the set coil or reset coil in series.  
Fig. 20 (d)  
(
–
)  
(
–
)  
Diode connection  
Diode connection
 
Diode connection  
Fig. 20  
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Matsushita Electric Works, Ltd.  

General Application Guidelines  
Use a diode having an ample margin of  
safety for repeated DC reverse voltage  
and peak reverse voltage applications  
and having an average rectified current  
greater than or equal to the coil current.  
• Avoid applications in which conditions  
include frequent surges to the power  
suppl
y
.  
• Four-
T
e
rminal Latching Relay  
In the 2 coil latching type circuit in Fig. 22,  
one terminal at one end of the set coil and  
one terminal at one end of the reset coil  
are connected in common and voltages of  
the same polarity are applied to the other  
side for the set and reset operations. In  
this type of circuit, short 2 terminals of the  
relay as noted in the next table
.
T
his helps  
to keep the insulation high between the  
two winding.  
Relay
T
y
pe  
1c  
T
e
rminal Nos.  
—
15 & 16  
*
DS  
2c  
4c  
Flat  
Slim  
5 & 6  
3 & 4  
*
NC  
ST  
SP  
DE  
JH  
• Avoid using the following circuit since  
self-excitation at the contacts will inhibit  
the normal keep state. (Fig. 21)  
2 & 4  
1 & 2  
6 & 8  
Notes:  
1. *DS4c and ST relays are constructed so that the set  
coil and reset coil are separated for high insulation  
resistance.  
2. DS
P
,
T
Q, TQ-SMD, TN, TX, and SEB relays are not  
applicable due to polarit
y
.  
R
Lb  
R
La  
Set switch  
Set coil  
Reset coil  
R
L  
Reset switch  
R
L
: Latching relay  
R
La
: Form A contacts of R
L  
R
Lb
: Form B contacts of R
L  
Bad example  
Fig. 21  
Fig. 22  
•
T
w
o Coil Latch Induction Voltage  
is generated on the reverse side coil when  
voltage is applied and shut off to each coil.  
Although the amount of induction voltage  
is about the same as the rated relay  
voltage, you must be careful of the  
reverse bias voltage when driving  
transistors.  
Each coil in a 2-coil latch relay is wound  
with a set coil and a reset coil on the same  
iron cores. Accordingl
y
,
i
nduction voltage  
HANDLING CAUTIONS FOR TUBE
P
ACKAGING  
Some types of relays are supplied in tube  
packaging. If you remove any relays from  
the tube packaging, be sure to slide the  
Slide in the plug.  
stop plug at one end to hold the remaining  
relays firmly together so they would not  
Stop plug  
move in the tube. Failing to do this may  
lead to the appearance and/or  
performance being damaged.  
AMBIENT ENVIRONMENT  
1. Ambient Temperature and  
3. NOx Generation  
on separate plates, using a rubber sheet  
to absorb the shock, and changing the  
direction of the shock to a perpendicular  
angle.  
5. Influence of External Magnetic  
Fields  
Permanent magnets are used in reed  
relays and polarized relays (including NR  
relays), and their movable parts are  
constructed of ferrous materials. For this  
reason, when a magnet or permanent  
magnet in any other large rela
y
,  
transformer, or speaker is located nearb
y
,  
the relay characteristics may change and  
faulty operations may result. The  
influence depends on the strength of the  
magnetic field and it should be checked at  
the installation.  
Atmosphere  
When a plastic sealed type relay is used  
in an atmosphere high in humidity to  
switch a load which easily produces an  
arc, the NO

x

created by the arc and the  
water absorbed from outside the relay  
combine to produce nitric acid. This  
corrodes the internal metal parts and  
adversely affects operation.  
Avoid use at an ambient humidity of  
85%RH or higher (at 20°C
68°F
). If use at  
high humidity is unavoidable, consult us.  
4. Vibration and Shock  
If a relay and magnetic switch are  
mounted next to each other on a single  
plate, the relay contacts may separate  
momentarily from the shock produced  
when the magnetic switch is operated and  
result in faulty operation.  
Be sure the ambient temperature at the  
installation does not exceed the value  
listed in the catalog. Furthermore,  
environmentally sealed types (plastic  
sealed type, metallic hermetic seal type)  
should be considered for applications in  
an atmosphere with dust, sulfur gases  
(SO

2

, H
2
S), or organic gases.  
2. Silicon Atmosphere  
Please use something other than silicon  
based materials (silicon rubber, silicon oil,  
silicon-based coatings, and silicon bulking  
agents, etc.) in the vicinity of the relay  
since their use will generate volatile gas.  
When contacts are switched in such an  
environment, silicon may adhere to the  
contacts and lead to contact failure (in  
plastic seal types, too).  
Countermeasures include mounting them  
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Matsushita Electric Works, Ltd.  

General Application Guidelines  
6. Usage, storage, and transport  
conditions  
• Pressure: 86 to 106 kPa  
functional disorder. Please verify the  
environment for storing and transporting.  
• Packaging should be designed to  
reduce, as much as possible, the  
influence of humidit
y
,
o
rganic gas and  
sulfide gas when packaging.  
• Since the SMD type is sensitive to  
humidity it is packaged with tightly sealed  
anti-humidity packaging. However, when  
storing, please be careful of the following.  
(1) Please use promptly once the anti-  
humidity pack is opened. (As a guide, use  
within one week.)  
(2) When storing for a long period after  
opening the anti-humidity pack, storage in  
a humidity-controlled desicator or in anti-  
humidity packaging with an anti-humidity  
bag to which silica gel has been added, is  
recommended. (As a guide, storage can  
be for three months.)  
The humidity range varies with the  
temperature. Use within the range  
indicated in the graph above.  
1) During usage, storage, or  
transportation, avoid locations subject to  
direct sunlight and maintain normal  
temperature, humidit
y
,
a
nd pressure  
conditions.  
2) Condensation  
Condensation forms when there is a  
sudden change in temperature under high  
temperature, high humidity conditions.  
Condensation will cause deterioration of  
the relay insulation.  
3) Freezing  
Condensation or other moisture may  
freeze on the relay when the  
temperatures is lower than 0°C
32°
F
.  
This causes problems such as sticking of  
movable parts or operational time lags.  
4) Low temperature, low humidity  
environments  
The plastic becomes brittle if the relay is  
exposed to a low temperature, low  
humidity environment for long periods of  
time.  
The allowable specifications for  
environments suitable for usage, storage,  
and transportation are given below.  
•
T
e
mperature
:
T
he allowable temperature  
range differs for each rela
y
,
s
o refer to the  
relay’s individual specifications.  
In addition, when transporting or storing  
relays while they are tube packaged,  
there are cases when the temperature  
may differ from the allowable range.  
In this situation, be sure to consult the  
individual specifications.  
• Humidity: 5 to 85 % R.H.  
7.Vibration
,
I
mpact and Pressure when  
Shipping  
TX(-SMD) / TX-D(-SMD) / TQ-SMD  
Humidity, %R.H.  
• Be aware that plastic may become brittle  
in low-temperature, low-humidity  
environments.  
When shipping, if strong vibration, impact  
or heavy weight is applied to a device in  
which a relay is installed, functional  
damage may occur. Therefore, please  
package in a wa
y
,
u
sing shock absorbing  
material, etc., so that the allowable range  
for vibration and impact is not exceeded.  
85  
When stored in high-temperature, high-  
humidity environments, and in  
environments with organic or sulfide  
gases for long periods of time (including  
during transport), sulfide or oxide  
membrane will form on the surfaces of the  
contacts, which may lead to contact  
instability or malfunction, as well as  
Tolerance range  
(Avoid freezing when  
used at temperatures  
lower than 0
°
C
32
°
F
)  
(Avoid  
condensation when  
used at temperatures  
higher than 0
°
C
32
°
F
)  
5
–
40  
0
+85  
–
40  
+32  
+185  
Temperature,
°
C
°
F  
ENVIRONMENTAL
L
Y
S
EALED TYPE REL
A
Y
S  
Sealed type relays are available
.
T
hey are  
effective when problems arise during PC  
board mounting (e.g. automatic soldering  
and cleaning). They also, of course,  
feature excellent corrosion resistance.  
Note the cautions below regarding the  
features and use of environmentally  
sealed type relays to avoid problems  
when using them in applications.  
avoid atmospheric pressures beyond  
96 10kPa.
 
Also avoid using them in an  
atmosphere containing flammable or  
explosive gases. Use the metallic  
1. Operating Environment  
Plastic sealed type relays are not suited  
for use in environments that especially  
require air tightness. Although there is no  
problem if they are used at sea level,  
hermetic seal types for these applications.  
PROCESSING CONSIDERATIONS  
1. Handling  
supplied in prime condition. Some key  
researched carefull
y
.
A
n unsealed relay is  
prone to internal flux contamination which  
can compromise contact performance,  
and ideally should be hand soldered.  
“Flux-resistant” relays are available which  
will prevent flux migration through the  
terminal-header interface. These and  
“sealed” relays are compatible with mist  
foam or spray fluxing operations, however  
“Flux-resistant” types are not totally  
sealed which precludes washing  
State of the art relays are precision  
mechanical devices and as such are  
sensitive to abusive handling practices.  
Every attempt is made during their  
manufacture to preclude any anomalies.  
Relays are packed in a variety of ways to  
best protect them during shipment and  
subsequent handling. These include the  
use of “Egg Crate” type inserts which  
support the relay and prevent damage to  
the terminals, foam trays which prevent  
shock damage, and tubes similar to those  
used by semiconductor manufacturers for  
machine dispensing and assembl
y
.  
During incoming inspection and  
areas of concern:  
(1)
T
e
rminals should not be handled in  
order to prevent contamination of the  
surface finish. This could lead to  
solderability problems.  
(2)
T
e
rminal layout and
P
.
C. board hole  
pattern should match. Any misalignment  
caused by mis-registered
P
.
C. board  
holes can lead to severe stress on the  
rela
y
,
c
ompromising performance and  
reliability (seal integrity).  
operations, and makes a non-active flux  
almost a necessit
y
.  
(3) The storage temperature specification  
should be observed.  
(4) Relays should be stored and handled  
in a suitably clean area.  
Pre-heating the board assembly prior to  
soldering “Flux-resistant” types will dry  
the flux and further help to prevent flux  
being driven into the relay during the  
soldering operation.  
subsequent customer handling  
2. Fluxing  
operations, care should be taken so as  
not to degrade the device which has been  
Depending upon the type of relay  
involved, fluxing procedures should be  
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Matsushita Electric Works, Ltd.  

General Application Guidelines  
3. Soldering  
should not be exceeded. The use of an  
relay should be avoided. Sealed devices  
can be immersion cleaned in a suitable  
solvent (see solvent compatibility chart).  
Cleaning in a ultrasonic bath should also  
be avoided. A harmonic of the bath  
frequency may be induced in the contacts  
causing friction welding and subsequent  
contact sticking. Relays with a removable  
“vent” tab should be vented after cooling  
to room temperature following cleaning  
and drying.  
As with fluxing, automated soldering  
processes can, unless controlled  
carefull
y
,
c
ompromise the performance of  
unsealed relays.  
Flux-resistant and sealed types are  
compatible with mist dip or wave soldering  
procedures. Some state-of-the-art relays  
are suitable for various reflow processes,  
such as I.R. or vapor phase maximum  
soldering temperatures and times will  
vary from relay type to relay type, and  
I.R. reflow process with a relay not  
specifically designed to withstand the  
process, will in all probability degrade the  
relay and cause performance problems
.
A  
safe practice would be to review the  
thermal profile of the process on a case  
by case basis with your local Matsushita  
office.  
4. Cleaning  
Any cleaning process which involves  
potential contamination of an unsealed  
MOUNTING CONSIDERATIONS  
•
Top View and Bottom View  
Relays used for PC boards, especially the  
flat type relays, have their top or bottom  
surface indicated in the terminal wiring  
diagrams.  
the vibration and shock resistance of  
buildup.  
Form B contacts while the coil is not  
excited is greatly affected by the mounting  
direction of the rela
y
.  
This also applies when a large number of  
boards mounted with relays are installed  
as in a card rack. Be sure the ambient  
temperature of the relay does not exceed  
the value listed in the catalog.  
•
In
fl
uence of Adjacent Mounting of  
Polarized Relays  
When polarized relays are mounted close  
together, their characteristics change.  
Since the affect of adjacent mounting  
differs according to the type of rela
y
,
r
efer  
to the data for the particular type.  
•
Panel Mounting  
-Do not remove the panel. It has a special  
function
.
(
It will not come off under normal  
handling.)  
-When installing please use washers to  
prevent damage and deformation. Please  
keep the tightening torque to within 0.49  
to 68.6 N (5 to 7 kgf). Also, please use a  
spring washer to prevent it from coming  
loose.  
•
Contact Reliability  
Relay with  
terminals viewed  
from the bottom  
(terminals cannot  
be seen from the  
Mounting the relay so the surfaces of its  
contacts (fixed contacts or movable  
contacts) are vertical prevents dirt and  
dust as well as scattered contact material  
(produced due to large loads from which  
arcs are generated) and powdered metal  
from adhering to them.  
top)  
Relay with  
terminals viewed  
from the top (all  
terminals can be  
seen from the top)  
Note during PC  
Furthermore, it is not desirable to switch  
both a large load and a low level load with  
a single rela
y
.
T
he scattered contact  
material produced when switching the  
large load adheres to the contacts when  
switching the low level load and may  
cause contact failure. Therefore, avoid  
mounting the relay with its low level load  
contacts located below the large load  
contacts.  
board pattern  
design (NL, NC)  
•
Mounting Direction  
Mounting direction is important for  
optimum relay characteristics.  
•
Adjacent Mounting  
•
Shock Resistance  
When many relays are mounted close  
together, abnormally high temperatures  
may result from the combined heat  
generated. Mount relays with sufficient  
spacing between them to prevent heat  
•
Tab Terminals  
It is ideal to mount the relay so that the  
movement of the contacts and movable  
parts is perpendicular to the direction of  
vibration or shock. Especially note that  
As a guide, use a quick connect mounting  
pressure of 40 to 70N {4 to 7 kgf} for  
relays with tab terminals.  
METHOD OF MOUNTING  
• The direction of mounting is not  
specifically designated, but to the extent  
possible, the direction of contact  
movement should be such that vibration  
and shock will not be applied.  
When a terminal socket is used  
• After drilling the mounting holes, the  
terminal socket should be mounted  
making certain the mounting screws are  
not loose. DIN standard sockets are  
available for one-touch mounting on DIN  
rail of 35mm
1.378 inch
width.  
When reversible terminal sockets are  
used  
• The reversible terminal sockets (HC, HL  
socket) are for one-touch mounting. (A  
panel thickness of 1 to 2mm
.039 to .079  
inch
should be used.) (Fig. 23)  
Fig. 24  
• When all four of the projections are  
visible from the back side of the mounting  
panel, the mounting is completed and the  
socket is fastened.  
•
T
o
r
emove the socket, the projections on  
the side of the mounting bracket should  
be pushed inward and at the same time  
the body of the socket should be pushed  
lightly from the back side
.
T
he socket can  
then be removed from the panel.  
Fig. 23  
• The socket should be pushed through  
the opening in the mounting panel until  
the projections on the side of the  
mounting bracket extend out over the  
back surface. (Fig. 24)  
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General Application Guidelines  
REGARDING CONNECTION OF LEAD WIRES  
• When making the connections,  
• When the terminal board uses screw  
fastening connections, either pressure  
terminals or other means should be used  
to make secure fastening of the wire.  
To
p
revent damage and deformit
y
,
p
lease  
use a torque within the following range  
when tightening the push screw block of  
the terminal block.  
M4.5 screw:  
1.47 to 1.666 N·m (15 to 17 kgf·cm)  
M4 screw:  
1.176 to 1.37 N·m (12 to 14 kgf·cm)  
M3.5 screw:  
M3 screw:  
0.49 to 0.69 N·m (5 to 7 kgf·cm)  
depending upon the size of load, the wire  
cross-section should be at least as large  
as the values shown in the table below.  
Permissible current
 
Cross-section (mm

2

)  
2
3
0.2  
0.3  
0.5  
0.75  
1.25  
2
5
7.5  
12.5  
15  
20  
30  
2
3.5  
0.784 to 0.98 N·m (8 to 10 kgf·cm)  
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General Application Guidelines  
CAUTIONS FOR USE
–
Check List  
Check Item  
1. Is
 
the correct rated voltage applied?  
2. Is
 
the applied coil voltage within the allowable continuous voltage limit?  
3. Is
 
the ripple in the coil voltage within the allowable level?  
4. For
 
voltage applied to a polarized coil, is polarity observed?  
5. When
 
hot start is required, is the increase in coil resistance resulting from coil temperature rise taken into account  
in setting coil voltage?  
Coil Drive Input  
6. Is
 
the coil voltage free from momentary drop caused by load current?  
(Pay special attention for self-holding relays.)  
7. Is
 
supply voltage fluctuation taken into account when setting the rated coil voltage?  
8. The
 
relay status may become unstable if the coil voltage (current) is gradually increased or decreased.  
Was the relay tested in a real circuit or with a real load?  
9. When
 
driving with transistors, did you consider voltage drops?  
1. Is
 
the load rated within the contact ratings?  
2. Does
 
the load exceed the contacts’ minimum switching capacity?  
3. Special
 
attention is required for contact welding when the load is a lamp, motor, solenoid, or electromagnetic  
contractor.  
4. Was
 
the relay tested with a real load?  
A DC load may cause contact lock-up due to large contact transfer. Was the relay tested with a real load?  
5. For
 
an inductive load, is a surge absorber used across the contacts?  
6. When
 
an inductive load causes heavy arc discharge across the relay contacts, the contacts may be corroded by  
chemical reaction with nitrogen in the atmosphere. Was the relay tested with a real load?  
Load  
(Relay contacts)  
7. Platinum
 
contacts may generate brown powder due to a catalyzer effect or vibration energy.  
Was the relay tested with a real load?  
8. Is
 
the contact switching frequency below the specification?  
9. When
 
there are more than two sets of contacts (2T) in a rela
y
,
m
etallic powder shed from one set of contacts may  
cause a contact failure on the other set (particularly for light loads). Was the relay tested in a real circuit?  
10. A
 
delay capacitor used across relay contacts may cause contact welding. Was the relay tested with a real load?  
11. For
 
an AC rela
y
, a
l
arge contact bounce may cause contact welding. Was the relay tested in a real circuit or with a  
real load?  
12. A
 
high voltage may be induced at transformer load. Was the relay tested with a real load?  
1. Does
 
circuit design take into account electrolytic corrosion of the coil?  
2. Are
 
transistors and other circuit components protected rom counter electromotive force that develops across the  
relay coil?  
3. Is
 
the circuit designed so the relay coil is left deenergized while the relay is inactive for long period of time?  
4. Is
 
the relay operated within the ratings approved by the relevant international standard (if compliance is required)?  
5. Is
 
the circuit protected from malfunction when the relay’s activation and/or deactivation time varies considerably?  
6. Is
 
the circuit protected from malfunctions that might result from relay contact bounce?  
7. Is
 
the circuit protected from malfunction when a high-sensitivity self-holding rela
y
,
s
uch as NR type, is to be used?  
8. When
 
there are two or more sets of contacts (2T) in a rela
y
,
a
rc discharges from load switching may cause short  
circuits across the two or more sets of contacts. Is the circuit designed to suppress such arc discharges?  
Circuit Design  
9. Item
 
8 above also requires special attention when loads are supplied from separate power sources.  
10. Does
 
the post-installation insulation distance comply with the requirement of the relevant international standard or  
the Electrical Appliance and Material Control Law?  
11. Is
 
the circuit protected from malfunction when the relay is to be driven by transistors?  
12. When
 
the SCR is used for on/off control, the relay activation tends to synchronize with the line frequency, resulting  
in an extremely shortened life. Was the relay tested in a real circuit or with a real load?  
13. Does
 
the PC board design take into account use of on-board relay?  
14. RF
 
signals may leak across relay’s open contacts. Check for adequate contact isolation and use RF relays as  
needed.  
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General Application Guidelines  
Check Item  
1. Is
 
the ambient temperature in the allowable operating temperature range?  
2. Is
 
relative humidity below 85 percent?  
3. Is
 
the operating atmosphere free from organic and sulfide gases?  
4. Is
 
the operating atmosphere free from silicon gas? Depending on the load type, silicon gas may cause a black  
substance to from on the contacts, leading to contact failure.  
5. Is
 
the operating atmosphere free from excessive airborne dust?  
Operating  
Environment  
6. Is
 
the relay protected from oil and water splashes?  
7. Is
 
the relay protected from vibration and impact which may cause poor contact with the socket?  
8. Is
 
ambient vibration and impact below the level allowable for the relay?  
9. Is
 
the relay free from mechanical resonance after it is installed in position?  
10. Is
 
insulation coating applied to the relay along with the PC board? Depending on the load type, a black substance  
may form to cause contact failure.  
1. Is
 
the relay protected from solder chips and flux when it is manually soldered?  
2. Are
 
preparations for flux application and automatic soldering complete?  
3. Is
 
the PC board cleaning process designed to minimize adverse affects to the relays?  
4. Are
 
adequate separations provided between polarized or reed relays to prevent magnetic coupling?  
5. Are
 
the relay terminals free from stress in the socket?  
6. Polarized
 
relay’s characteristics may be affected by strong external magnetic field. Are the relays installed away  
from such fields?  
7. If
 
very long leads (100 to 300 meters) are used to connect the load, the stray capacity existing across the leads  
may cause a surge current. Was the relay tested with a real load?  
Installation and  
Connection  
8. Unless
 
otherwise specified, all relay terminals should be soldered at 250°C
482°F
within 5 sec. or at 350°C
662°F  
within 3 sec.  
9. A
 
badly warped PC board can cause stress to the relay terminals which may lead to degraded relay  
characteristics.  
10. Glass
 
shot should not be used to clean the PC board of solder flux
.
T
his may cause relay malfunction due to glass  
powder becoming lodged in the relay’s internal structure.  
11. Relays
 
should always be used with their plastic shields installed, or degraded relay performance may result.  
12. Do
 
not cut away any relay terminal as the stress may cause degraded relay performance.  
1. Is
 
the relay subject to freezing or condensation (especially when shipping)?  
2. Is
 
the temperature in the allowable temperature range?  
3. Is
 
the humidity in the allowable humidity range?  
4. Is
 
the storing atmosphere free from organic and sulfide gases?  
5. Is
 
the storing atmosphere free from excessive airborne dust?  
6. Is
 
the relay protected from oil and water splashes?  
Storage and  
T
r
ansport  
7. Is
 
the relay subject to the application of heavy weight?  
8. When
 
shipping does vibration and impact exceed the allowable range?  
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Reliability  
•
What is Reliability?  
1. Reliability in a Narrow Sense of the  
3. Intrinsic Reliability and Reliability of  
Use  
Reliability is “built” into products. This is  
referred to as intrinsic reliability which  
consists mainly of reliability in the narrow  
sense.  
Product reliability at the user’s site is  
called “reliability of use”, which consists  
mainly of reliability in the broad sense. In  
the relay industr
y
,
r
eliability of use has a  
significance in aspects of servicing.  
T
e
rm  
In the industrial world, reliability is an  
index of how long a particular product  
serves without failure.  
2. Reliability in a Board Sense of the
T
e
rm  
Every product has a finite service lifetime.  
This means that no product can continue  
normal service infinitel
y
.
W
hen a product  
has broken down, the user may throw it  
away or repair it. The reliability of  
repairable products is recognized as  
“reliability in a broad sense of the term”.  
For repairable products, their  
serviceability or maintainability is another  
problem. In addition, reliability of product  
design is becoming a serious concern for  
the manufacturing industr
y
.
I
n short,  
reliability has three senses: i.e. reliability  
of the product itself, serviceability of the  
product, and reliability of product design.  
1. Reliability (narrow sense), durability  
Long life time: MTTF, B

10

, R(T),  
Low failure rate: Lamda (
λ
), MTBF  
2. Maintainability  
MTTR  
Reliability  
(broad sense)  
Availability  
Preventive maintenance, predicted  
maintenance  
3. Design reliability  
Human factor, redundancy,  
fool-proof, fail-safe  
•
Reliability Measures  
The following list contains some of the  
1. Degree of Reliability  
4. Failure Rate  
most popular reliability measures:  
Degree of reliability represents  
percentage ratio of reliabilit
y
. For  
example, if none of 10 light bulbs has  
failed for 100 hours, the degree of  
reliability defined in, 100 hours of time is  
10/10 = 100%. If only three bulbs  
remained alive, the degree of reliability is  
3/10 = 30%.  
The JIS Z8115 standard defines the  
degree of reliability as follows:  
The probability at which a system,  
equipment, or part provides the specified  
functions over the intended duration  
under the specified conditions.  
2. MTBF  
MTBF is an acronym of mean time  
between failures. It indicates the mean  
time period in which a system, equipment,  
or part operates normally between two  
incidences of repair
.
M
TBF only applies to  
repairable products.  
MTBF tells how long a product can be  
used without the need for repair.  
Sometimes MTBF is used to represent  
the service lifetime before failure.  
3. MTTF  
Failure rate includes mean failure rate and  
momentary failure rate.  
Mean failure rate is defined as follows:  
Sample  
Reliability measure  
representation  
Degree of reliability R(T)  
MTBF  
99.9%  
100 hours  
100 hours  
20 fit, 1%/hour  
50 hours  
Mean failure rate
=
T
o
tal failure count/total  
operating hours  
MTTF  
Failure rate
λ  
Safe life B
10  
In general, failure rate refers to  
momentary failure rate. This represents  
the probability at which a system,  
equipment, or part, which has continued  
normal operation to a certain point of  
time, becomes faulty in the subsequent  
specified time period.  
Failure rate is often represented in the unit  
of percent/hours
.
F
or parts with low failure  
rates, “failure unit (Fit) = 10

9

/hour” is often  
used instead of failure rate. Percent/count  
is normally used for relays.  
f(t)  
T
Time  
(a) R(T)  
5. Safe Life  
MTTF  
Safe life is an inverse of degree of  
reliabilit
y
.
I
t is given as value B which  
makes the following equation true:  
1 – R(B) =
t
%  
MTTF is an acronym of mean time to  
failure. It indicates the mean time period  
until a product becomes faulty MTTF  
normally applies to unrepairable products  
such as parts and materials.  
In general, “B[1 – R(B)] = 10%” is more  
often used. In some cases this represents  
a more practical value of reliability than  
MTT
F
.  
(b) MTTF  
The relay is one of such objective of  
MTT
F
.  
10%  
B

10  

(c) Safe life  
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Matsushita Electric Works, Ltd.  

Reliability  
•
Failure  
[1] What is Failure?  
(III) Wear-out failure period  
Weibull distribution can be adopted to the  
actual failure rate distribution if the three  
variables above are estimated.  
Failure is defined as a state of system,  
equipment, or component in which part of  
all of its functions are impaired or lost.  
[2] Bathtub Curve  
In the final stage of the product’s service  
lifetime comes the wear-out failure period,  
in which the life of the product expires due  
to wear of fatigue. Preventive  
Product’s failure rate throughout its  
lifetime is depicted as a bathtub curve, as  
shown below. Failure rate is high at the  
beginning and end of its service lifetime.  
(I) Initial failure period  
The high failure rate in the initial failure  
period is derived from latent design  
errors, process errors, and many other  
causes. Initial failures are screened at  
manufacturer’s site through burn-in  
process. This process is called  
debugging, performing aging or  
screening.  
maintenance is effective for this type of  
failure. The timing of a relay’s wear-out  
failure can be predicted with a certain  
accuracy from the past record of uses.  
The use of a relay is intended only in the  
accidental failure period, and this period  
virtually represents the service lifetime of  
the rela
y
.  
m
63%  
Time  
γ
α
[3] Weibull Analysis  
The Weibull probability chart is a simpler  
alternative of complex calculation  
formulas
.
T
he chart provides the following  
advantages:  
(1) The Weibull distribution has the  
closest proximity to the actual failure rate  
distribution.  
(2
)
T
he Weibull probability chart is easy to  
use.  
(3) Different types of failures can be  
identified on the chart.  
Weibull analysis is often used for  
classifying a product’s failure patterns and  
to determine its lifetime. Weibull  
distribution is expressed by the following  
equation:  
(II) Accidental failure period  
The initial failure period is followed by a  
long period with low, stable failure rate. In  
this period, called accidental failure  
period, failures occurs at random along  
the time axis
.
W
hile zero accidental failure  
rate is desirable, this is actually not  
practical in the real world.  
m
–
1  
(
χ
–
γ
)

m  

m
f
(x) =
 
(
χ
–
γ
)
e  
–
α
α
where  
m
: Figure parameter  
α
: Measurement parameter  
γ
: Position prameter  
The following describes the correlation  
with the bathtub curve. The value of the  
parameter “m” represents the type of the  
failure.  
(1) When
m
< 1: Initial failures  
(2) When
m
= 1: Accidental failures  
(3) When
m
> 1: Wear-out failures  
( I )  
( II )  
( III )  
m > 1  
Time  
m < 1  
m = 1  
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Applications of Relays in Electronic Circuits  
REL
A
Y
D
RIVE BY MEANS OF A TRANSISTOR  
•
Connection method  
The voltage impressed on the relay is  
always full rated voltage, and in the OFF  
time, the voltage is completely zero for  
avoidance of trouble in use. (Fig. 1)  
R
Ry  
Tr  
Tr  
R
1  
Tr  
Ry  
R
2  
Ry  
(Good) Collector connection  
With this most common  
connection, opertion is stable.  
(Care) Emitter connection  
When the circumstances  
make the use of this  
connection unavoidable, if  
the voltage is not completely  
impressed on the relay, the  
transistor does not conduct  
completely and operation is  
uncertain.  
(Care) Parallel connection  
When the power consumed  
by the complete circuit  
becomes large, consideration  
of the relay voltage is  
necessary.  
Fig. 1  
•
Countermeasures for surge voltage of relay control transistor  
If the coil current is suddenly interrupted,  
a sudden high voltage pulse is developed  
in the coil. If this voltage exceeds the  
voltage resistance of the transistor, the  
transistor will be degraded, and this will  
lead to damage
.
I
t is absolutely necessary  
to connect a diode in the circuit as a  
means of preventing damage from the  
counter emf.  
As suitable ratings for this diode, the  
current should be equivalent to the  
average rectified current to the coil, and  
the inverse blocking voltage should be  
about 3 times the value of the power  
source voltage. (Fig. 2)  
Diode  
Ry  
Tr  
Take care of ASO.  
Fig. 2  
•
Snap action  
(Characteristic of relay with voltage rise  
Pulse signal (square wave)  
Non-pulse signal  
and fall of voltage)  
Unlike the characteristic when voltage is  
impressed slowly on the relay coil, this is  
the case where it is necessary to impress  
the rated voltage in a short time and also  
to drop the voltage in a short time. (Fig. 3)  
As a guide, the rising time and falling time  
are 1 ms or less.  
I
B  
Ry  
Tr Ic  
I
C  
I
B  
ON  
Ry  
OFF  
(No Good) Without snap action  
(Good) Snap action  
Fig. 3  
•
Schmitt circuit (Snap action circuit)  
(Wave rectifying circuit)  
When the input signal does not produce a  
snap action, ordinarily a Schmitt trigger  
circuit is used to produce safe snap  
action.  
2. Due to the relay coil current, the  
difference in the voltage at point P when  
T

2

is conducting and at point P when T
1
is  
conducting creates hysteresis in the  
detection capability of Schmitt circuit, and  
care must be taken in setting the values.  
3. When there is chattering in the input  
signal because of waveform oscillation,  
an RC time constant circuit should be  
inserted in the stage before the Schmitt  
trigger circuit. (However, the response  
speed drops.) (Fig. 4)  
R
1  
Ry  
Signal  
R
3  
R
2  
Tr
2  
Tr

1  

Characteristic points  
P
1. The common emitter resistor R

E

must  
have a value sufficiently small compared  
with the resistance of the relay coil. (The  
voltage impressed on the relay must not  
be greater than the excitation voltage.)  
R
E  
Fig. 4  
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Applications of Relays in Electronic Circuits  
•
Avoid Darlington circuit connections.  
(High amplification)  
This circuit is a trap into which it is easy to  
fall when dealing with high circuit  
Ry  
Ry  
technolog
y
.
T
his does not mean that it is  
immediately connected to the defect, but it  
is linked to troubles that occur after long  
periods of use and with many units in  
operation. (Fig. 5)  
Tr
1  
Tr
1  
V
CESAT
=  
About 0.7V  
V
CESAT
=  
About 0.1V  
Tr
2  
Tr
2  
GND  
(No good) Darlington connection  
(Good) Emitter connection  
(
•
Due to excessive consumption of power,  
heat is generated.)  
(T
2
conducts completely.)  
(T

1

is sufficient for signal use.)  
(
•
A strong T

1

, is necessary.)  
Fig. 5  
•
Residual Coil Voltage  
In switching applications where a  
semiconductor (transistor, UJ
T
,
e
tc.) is  
connected to the coil, a residual voltage is  
retained at the relay coil which may cause  
incomplete restoration and faulty  
operation. By using DC coils, there may  
be a reduction in; the danger of  
incomplete restoration, the contact  
pressure, and the vibration resistance.  
This is because the drop-out voltage is  
10% or more of the rated voltage, a low  
value compared to that for AC coil, and  
also there is a tendency to increase the  
life by lowering the drop-out voltage.  
When the signal from the transistor’s  
collector is taken and used to drive  
another circuit as shown in the figure on  
the right, a minute dark current flows to  
the relay even if the transistor is off. This  
may cause the problems described  
above. (Fig. 6)  
Ry  
I
O  
T

2  

T
1  
I
O
: dark current (No good)  
Fig. 6 Connection to the next stage through  
collector  
REL
A
Y
D
RIVE BY MEANS OF SCR  
•
Ordinary drive method  
•
Caution points regarding ON/OFF  
heater, the switching can occur only at  
peak values and it can occur only at zero  
phase values as a phenomenon of this  
type of control. (Depending upon the  
sensitivity and response speed of the  
relay)  
4. Accordingl
y
,
e
ither an extremely long  
life or an extremely short life results with  
wide variation, and it is necessary to take  
care with the initial device quality check.  
For SCR drive, it is necessary to take  
particular care with regard to gate  
sensitivity and erroneous operation due to  
noise. (Fig. 7)  
control circuits  
(When used for temperature or similar  
control circuits)  
When the relay contacts close  
simultaneously with an AC single phase  
power source, because the electrical life  
of the contacts suffers extreme  
shortening, care is necessar
y
.
(
Fig. 8)  
1. When the relay is turned ON and OFF  
using a SCR, the SCR serves as a half  
wave power source as it is, and there are  
ample cases where the SCR is easily  
restored.  
Ry  
R
C
S
I

GT  

Ry  
2. In this manner the relay operation and  
restoration timing are easily synchronized  
with the power source frequenc
y
,
a
nd the  
timing of the load switching also is easily  
synchronized.  
R
GK  
I

GT

: There is no problem even with more than 3 times  
the rated current.  
R
GK
: 1K ohms must be connected.  
R,C : This is for prevention of isolation point error due to  
a sudden rise in the power source or to noise.  
(dv/dt countermeasure)  
Ry  
S
3. When the load for the temperature  
control is a high current load such as a  
Fig. 7  
Fig. 8  
REL
A
Y
D
RIVE FROM EXTERNAL CONTACTS  
Relays for PC board use have high  
sensitivity and high speed response  
characteristics, and because they  
respond sufficiently to chattering and  
bouncing, it is necessary to take care in  
their drive.  
When the frequency of use is low, with the  
delay in response time caused by a  
condenser, it is possible to absorb the  
chattering and bouncing. (Fig. 9)  
(However, it is not possible to use only a  
condenser
.
A
r
esistor should also be used  
with the capacitor.)  
External contact  
R
Ry  
C
Fig. 9  
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Applications of Relays in Electronic Circuits  
LED SERIES AND
P
A
RALLEL CONNECTIONS  
2. R in parallel with LED  
3. In parallel connection with relay  
1. In series with relay  
R

2  

Ry  
Ry  
Ry  
R
1  
LED  
Power consumption:  
In common with relay (Good)  
Defective LED:  
Relay operate (No good)  
Low voltage circuit:  
With LED, 1.5V down (No good)  
No. of parts: R

1

(Care)  
Power consumption:  
Current limiting resistor R

2

(Care)  
Defective LED:  
Relay operate stable (Good)  
Low voltage circuit: (Good)  
No. of parts: R

2

(Care)  
Power consumption:  
In common with relay (Good)  
Defective LED:  
Relay does not operate (No good)  
Low voltage circuit:  
With LED, 1.5V down (No good)  
No. of parts: (Good)  
ELECTRONIC CIRCUIT DRIVE BY MEANS OF A REL
A
Y  
•
Chatterless electronic circuit  
Even though a chatterless characteristic  
Notes: 1. The A, B, and C lines should be made as short as possible.  
is a feature of relays, this is to the fullest  
extent a chatterless electrical circuit,  
much the same as a mercury rela
y
. To  
meet the requirement for such circuits as  
the input to a binary counter, there is an  
electronic chatterless method in which  
chattering is absolutely not permissible.  
Even if chattering develops on one side,  
either the N.O. side contacts or the N.C.  
side contacts, the flip flop does not  
2. It is necessary that there be no noise from the coil section induced into the contact section.  
A
Ry  
N.O.  
N.C.  
Binary  
Counter  
C
B
reverse, and the counter circuit can be fed  
pulsed without a miss. (However,  
R-S-F.F  
bouncing from the N.O. side to N.C. side  
must be absolutely avoided.) (Fig. 10)  
Fig. 10  
•
Triac drive  
When an electronic circuit using a direct  
drive from a triac, the electronic circuit will  
not be isolated from the power circuit, and  
because of this, troubles due to erroneous  
operation and damage can develop  
easil
y
.
T
he introduction of a relay drive is  
the most economical and most effective  
solution. (Photo coupler and pulse  
transformer circuits are complicated.)  
When a zero cross switching  
L
Ry  
Fig. 11  
characteristic is necessar
y
, a
s
olid state  
relay (SSR) should be used. (Fig. 11)  
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Applications of Relays in Electronic Circuits  
ASSURANCE OF POWER SOURCE FOR REL
A
Y
A
ND ELECTRONIC CIRCUIT  
•
Constan
t
V
oltage circuit and PC board  
pattern  
manner in which the PC board pattern is  
designed, the ON/OFF operation of the  
relay coil, lamp, etc., will exert no  
influence on the electronic circuit. This is  
just a matter of technique that is  
necessar
y
.  
Ordinaril
y
,
i
t is extremely undesirable to  
have ripple and voltage variation in an  
electronic circuit power source. This is  
naturally true also for relay power sources  
but not to the same extent as for the  
electronic circuit. Accordingl
y
,
i
t is  
desirable to have a constant voltage  
circuit for dedicated use of the electronic  
circuit with a sufficient margin of current.  
Roughly speaking, this is also good for the  
rela
y
, but from a practical viewpoint, the  
relay should be operated within the  
standards set for ripple and voltage  
variation. Similarl
y
,
i
n the circuit diagram  
shown in Fig. 12, but means of the  
Ry  
C
Regular circuit (Example)  
Relay power supply  
Regulated power supply or voltage stabilizer.  
Electronic circuit  
C
Fig. 12  
•
Prevention of Voltage Drop Due to  
Rush Current  
In the circuit shown in Fig. 13 (a), rush  
current flows from the lamp or capacitor.  
The instant the contacts close, the voltage  
drops and the relay releases or chatters.  
In this case it is necessary to raise the  
transformer’s capacity or add a smoothing  
circuit.  
Ry  
C
(a)  
Lamp  
Ry  
Fig. 13 (b) shows an example of the  
modified circuit.  
C
(b)  
Fig. 13 (C) shows a battery-powered  
version.  
C
Lamp  
Ry  
Battery  
(C)  
Motor  
M
C
Fig. 13  
PC BOARD DESIGN CONSIDERATIONS  
•
Pattern Layout for Relays  
the same circuit, pattern design  
considerations which minimize the  
relay coil and lamp on other electronic  
circuits are necessar
y
.
(
Fig. 14)  
Since relays affect electronic circuits by  
generating noise, the following points  
should be noted.  
influence of the on/off operations of the  
Relay coil Ry  
Keep relays away from semiconductor  
devices. Design the pattern traces for  
shortest lengths. Place the surge arrester  
(diode, etc.) near the relay coil. Avoid  
routing pattern traces susceptible to noise  
(such as for audio signals) underneath the  
relay coil section. Avoid through-holes in  
places which cannot be seen from the top  
(e.g. at the base of the relay). Solder  
flowing up through such a hole may cause  
damage such as a broken seal. Even for  
Ry  
(No good)  
(Good)  
A
2  
A
CO  
A
1  
Co  
B
1  
Constant  
B
Electronic  
circuit  
Constant  
voltage  
voltage  
Electronic  
circuit  
Tr  
Tr  
B

2  

Relay currents and electronic circuit  
currents flow together through A and B.  
•
Relay coil currents consist only of A
1
, and B
1
.  
•
Electronic circuit currents consist only of  
A

2

and B
2
. A simple design consideration can  
change the safety of the operation.  
Fig. 14  
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Applications of Relays in Electronic Circuits  
•
When it is necessary to use hand  
soldering for one part of a component  
after dip soldering has been done  
By providing a narrow slot in the circular  
part of the foil pattern, the slot will prevent  
the hole from being plugged with solder.  
(Fig. 15)  
•
When the printed circuit board itself is used as a connector  
[1] The edge should be beveled. (This  
prevents peeling of the foil when the board  
is inserted into its socket.)  
[2] When only a single side is used as the  
connector blade, if there is distortion in  
the circuit board, contact will be defective.  
Care should be taken. (Fig. 16)  
Through  
hole  
0.3 to 0.5mm  
.012 to .020 inch  
Bevel of radius  
(Care)  
(Good) (Good)
 
Contact on both surfaces  
Fig. 15  
Fig. 16  
PC BOARD REFERENCE DATA  
(This data has been derived from samples of this company’s products. Use this data as a reference when designing printed circuit boards.)  
•
Conductor width  
The allowable current for the conductor  
was determined from the safety aspect  
and the effect on the performance of the  
conductor due to the rise in saturation  
temperature when current is flowing. (The  
narrower the conductor width and the  
thinner the copper foil, the larger the  
temperature rise.) For example, too high a  
rise in temperature causes degradation of  
the characteristic and color changes of  
the laminate. In general, the allowable  
current capacity of the conductor is  
determined so that the rise is temperature  
is less than 10 degrees C. It is necessary  
to design the conductor width from this  
allowable conductor current capacit
y
.
F
ig.  
17, Fig. 18, Fig. 19 show the relationship  
between the current and the conductor  
width for each rise in temperature for  
different copper foils. It is also necessary  
to give consideration to preventing  
abnormal currents from exceeding the  
destruction current of the conductor. Fig.  
21 shows the relationship between the  
conductor width and the destruction  
current.  
10  
14  
10  
Copper foil  
Copper foil  
13  
Copper foil  
0.0018mm  
.0007 inch  
60
°
C
140
°
F  
.035mm  
60
°
C
140
°
F  
40
°
C
104
°
F  
.070mm  
9
8
7
6
5
4
3
2
1
0
9
8
7
6
5
4
3
2
1
0
12  
11  
10  
9
8
7
6
5
.001 inch  
.003 inch  
40
°
C
104
°
F  
60
°
C
140
°
F  
40
°
C
104
°
F  
20
°
C
68
°
F  
10
°
C
50
°
F  
20
°
C
68
°
F  
10
°
C
50
°
F  
20
°
C
68
°
F  
10
°
C
50
°
F  
4
3
2
1
0
0 0.2 0.5
 
1.0 1.5 2.0 2.5 3.0  
0 0.2 0.5
 
1.0 1.5 2.0 2.5 3.0  
0
0
0.5 1.0
 
1.5 2.0 2.5 3.0  
.020 .039
 
.059 .079 .098 .118  
Conductor width, mm
inch  
0
.008.020
.039 .059 .079 .098 .118  
Conductor width, mm
inch  
0
.008.020
.039 .059 .079 .098 .118  
Conductor width, mm
inch  
Fig. 17  
Fig. 18  
Fig. 19  
Copper foil thick  
40  
width=0.5
.020  
1.0
.039  
.070  
.003  
Copper foil  
.035mm  
.001 inch  
200  
35  
30  
25  
20  
15  
10  
5
100  
50  
2.0
.079  
3.0
.118  
.035  
.001  
30  
20  
.018  
.0007  
10  
5
3
2
1
0
0.5  
1
2
3
5
10
20  
30  
50
100 200  
39.37 78.74  
0
0
0.5 1.0 1.5 2.0 2.5 3.0  
.020 .039 .059 .079 .098 .118  
Conductor width, mm
inch  

.7

C

87
1

o

.
1

n

8
1

d

1

u

.9
6

c

9

tor lenth (cm

1

i

9

n

.6

c

8
5

h
)  
.197 .394  
3.937
7.874 11.811  
Fig. 20  
Fig. 21  
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Applications of Relays in Electronic Circuits  
mm
inch  
•
Hole and land diameter  
Standard dimensions for hole and land diameter  
The hole diameter and land are made with  
the hole slightly larger than the lead wire  
so that the component may be inserted  
easil
y
.
A
lso, when soldering, the solder  
will build up in an eyelet condition,  
increasing the mounting strength.  
The standard dimensions for the hole  
diameter and land are shown in the table  
below.  
Standard hole diameter  
0.8
.031  
T
o
lerance  
Land diameter  
2.0 to 3.0
.079 to .118  
3.5 to 4.5
.138 to .177  
1.0
.039  
0.1
.039  
1.2
.047  
1.6
.063  
Remarks  
1. The hole diameter is made 0.2 to 0.5mm
.008 to .020inch
larger than the lead diameter. However, if the jet  
method (wave type, jet type) of soldering is used, because of the fear of solder passing through to the  
component side, it is more suitable to make the hole diameter equal to the lead diameter +0.2mm.  
2. The land diameter should be 2 to 3 times the hole diameter.  
3. Do not put more than 1 lead in one hole.  
•
Expansion and shrinkage of copperclad laminates  
Because copperclad
 
laminates have a  
longitudinal and lateral direction, the  
manner of punching fabrication and layout  
must be observed with care. The  
Example :
 
As shwon is
 
the drawing below, the 150mm  
5.906 inch
direction is taken as the longitudinal  
direction.  
Longitudinal  
150
5.906  
expansion and shrinkage in the  
longitudinal direction due to heat is 1/15 to  
1/2 that in the lateral, and accordingl
y
,  
after the punching fabrication, the  
distortion in the longitudinal direction will  
be 1/15 to 1/2 that of the lateral direction.  
The mechanical strength in the  
longitudinal direction is 10 to 15% greater  
than that in the lateral direction. Because  
of this difference between the longitudinal  
and lateral directions, when products  
having long configurations are to be  
fabricated, the lengthwise direction of the  
configuration should be made in the  
longitudinal direction, and PC boards  
having a connector section should be  
made with the connector along the  
longitudinal side. (Fig. 22)  
Longitudinal  
direction  
70  
2.756  
Also, as shown in the drawing below, when the pattern  
has a connector section, the direction is taken as shown  
by the arrow in the longitudinal direction  
Longitudinal  
direction  
Fig. 22  
Space between conductors  
Fig. 23 shows the relationship between  
the spacing between conductors and the  
destruction voltage. This destruction  
voltage is not the destruction voltage of  
the PCB; it is the flash over voltage  
(insulation breakdown voltage of the  
space between circuits.) Coating the  
surface of the conductor with an insulating  
resin such as a solder resist increases the  
flash over voltage, but because of the pin  
holes of the solder resist, it is necessary  
to consider the conductor destruction  
voltage without the solder resist. In fact, it  
is necessary to add an ample safety factor  
when determining the spacing between  
conductors
.
T
a
ble 1 shows an example of  
a design for the spacing between  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0
0
0
0.2 0.5
 
1.0  
.008 .020
 
.039  
2.0  
3.0  
4.0  
.157  
.079  
.118  
Conductor width mm
inch  
Fig. 23  
Table 1. Example of conductor spacing  
design  
conductors. (
T
a
ken from the JIS C5010  
standards.) However, when the product is  
covered by the electrical products control  
law, UL standards or other safety  
Maximum DC and AC  
Minimum Conductor  
Voltage Between  
Spacing (mm
inch
)  
Conductors (V)  
0 to 50  
0.381
.015  
0.635
.025  
1.27
.050  
2.54
.100  
standards, it is necessary to conform to  
the regulations.  
51 to 150  
151 to 300  
301 to 500  
Calculated at  
0.00508 mm/V  
500 or more  
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Relay Soldering and Cleaning Guidelines  
• Avoid bending the terminals to make the  
1. Mounting of Relay  
2. Flux Application  
3. Preheating  
relay self-clinching. Relay performance  
cannot be guaranteed if the terminals are  
bent. Self-clinching terminal types are  
available depending on the type of rela
y
.  
• Correctly drill the PC board according to  
the given PC board pattern illustration.  
• Stick packaging for automatic mounting  
is available depending on the type of  
rela
y
.  
Bad example  
• Adjust the position of the PC board so  
that flux does not overflow onto the top of  
it. This must be observed especially for  
dust-cover type relays.  
• Use rosin-based non-corrosive flux.  
• If the PC board is pressed down into a  
flux-soaked sponge as shown on the  
right, the flux can easily penetrate a dust-  
cover type rela
y
.
N
ever use this method.  
Note that if the PC board is pressed down  
hard enough, flux may even penetrate a  
flux-resistant type rela
y
.  
Bad example  
• Be sure to preheat before using  
automatic soldering. For dust-cover type  
relays and flux-resistant type relays,  
preheating acts to prevent the penetration  
of flux into the relay when soldering.  
Solderability also improves.  
• Preheat according to the following  
conditions.  
T
e
mperature  
Time  
120°C
248°F
or less  
Within approx. 2 minutes  
• Note that long exposure to high  
temperatures (e.g. due to a  
malfunctioning unit) may affect relay  
characteristics.  
Automatic Soldering  
Hand Soldering  
4. Soldering  
• Flow solder is the optimum method for  
soldering.  
• Keep the tip of the soldering iron clean.  
Soldering Iron  
30W to 60W  
• Adjust the level of solder so that it does  
not overflow onto the top of the PC board.  
• Unless otherwise specified, solder  
under the following conditions depending  
on the type of rela
y
.  
Iron Tip  
T
e
mperature  
Approx. 400°C
 
752°F  
Soldering Time
 
Within approx. 3 seconds  
Solder  
Approx. 260°C
 
500°F  
T
e
mperature  
Soldering Time
 
Within approx. 6 seconds  
Please consult us regarding lead-free solder.  
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Relay Soldering and Cleaning Guidelines  
Automatic Soldering  
Hand Soldering  
5. Cooling  
6. Cleaning  
7. Coating  
• Immediate air cooling is recommend to  
prevent deterioration of the relay and  
surrounding parts due of soldering heat.  
• Although the environmentally sealed  
type relay (plastic sealed type, etc.) can  
be cleaned, avoid immersing the relay  
into cold liquid (such as cleaning solvent)  
immediately after soldering. Doing so  
may deteriorate the sealing performance.  
• Do not clean dust-cover type relays and  
flux-resistant type relays by immersion.  
Even if only the bottom surface of the PC  
board is cleaned (e.g. with a brush),  
careless cleaning may cause cleaning  
solvent to penetrate the rela
y
.  
use materials which are chemical  
resistant. Select the suitable relay or  
solvent by referring to the cleaning solvent  
compatibility chart below.  
• Cleaning with the boiling method is  
recommended. Avoid ultrasonic cleaning  
on relays. Use of ultrasonic cleaning may  
cause breaks in the coil or slight sticking  
of the contacts due to the ultrasonic  
energ
y
.  
• Plastic sealed type relays can be  
cleaned by immersion. Use a Freon- or  
alcohol-based cleaning solvent. Use of  
other cleaning solvents (e.g.
T
r
ichlene,  
chloroethene, thinner) may damage the  
relay case
.
H
owever, some types of relays  
• If the PC board is to be coated to prevent  
the insulation of the PC board from  
deteriorating due to corrosive gases and  
high temperatures, note the following.  
• Do not coat dust-cover type relays and  
flux-resistant type relays, since the  
coating material may penetrate the relay  
and cause contact failure. Or, mount the  
relay after coating.  
• Depending on the type, some coating  
materials may have an adverse affect on  
relays. Furthermore, solvents (e.g.  
xylene, toluene, MEK, I.
P
.
A.) may damage  
the case or chemically dissolve the epoxy  
and break the seal. Select coating  
materials carefull
y
.  
Suitability  
T
y
pe  
Features  
for Relays  
• Good electrical insulation.  
• Although slightly difficult to appl
y
,
d
oes not affect relay contacts.  
Epoxy-base  
Good  
Care  
• Good electrical insulation, easy to appl
y
.  
• Solvent may damage case. Check before use.  
Urethane-base  
• Silicon gas becomes the cause of contact failure.  
(also plastic sealed types)  
Silicon-base  
No Good  
• Use a substitute that is not a silicon-base  
• If the relay and all components (e.g. ICs) are to be coated, be sure to carefully check  
the flexibility of the coating material. The solder may peel off from thermal stress.  
•
T
r
ansporting when mounted on PCBs  
Whether mounted or not, since relays are precision devices, do not apply vibration and  
shock that exceeds the stipulated value. Initial performance, as shipped from the factor
y
,  
may be lost if undue vibration or shock is applied to the rela
y
.  
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SMT Soldering Guidelines  
CAUTIONS FOR SURFACE MOUNT REL
A
Y
I
NSTALLATION  
To
m
eet the market demand for  
surface mounting technolog
y
.
T
o
m
eet this  
need, we offer a line of surface mount  
relays. The following describes some  
cautions required for surface mount relay  
installation to prevent malfunction and  
incorrect operation.  
downsizing to smaller, lighter, and thinner  
products, PC boards also need to  
proceed from Insertion mounting to  
•
What is a Surface Mount Relay?  
1. From IMT to SMT  
Conventional insertion mount technology  
(IMT) with some 30 years of history is now  
being replaced with surface mount  
technology (SMT).  
Solid-state components such as resistors,  
ICs, and diodes can withstand high heat  
stresses from reflow soldering because  
they use no mechanical parts. In contrast,  
the conventional electro-mechanical  
relays consisting of solenoid coils,  
springs, and armatures are very sensitive  
to thermal stress from reflow soldering.  
We applied the experience gained from  
our advanced relay technologies to  
produce high-performance  
electromagnetic relays compatible with  
surface mount technologies such as IRS  
and VPS.  
•
Insertion Mount Technology vs. Surface Mount Technology  
Components’ leads are inserted into lead  
Insertion Mounting
 
holes of PC board and are soldered to  
Resistor  
Relay  
T
e
chnology: IMT  
copper pads on the other side of the board  
using flow-soldering techniques.  
PC board  
Components are placed on copper pads  
precoated with paste solder and the board  
assembly is heated to solder the  
components on the pads (reflow  
soldering).  
Relay  
Chip resistance  
IC  
Surface Mount  
T
e
chnology (SMT)  
PC board  
2. Features and Effects  
• TQ-SMD Relay  
Features  
Effects  
• Allows high density mounting  
• Components can be installed  
on both sides of a board  
• Ceramic PC boards can be  
used  
Low volatility gas liquid crystal resin case  
System  
downsizing  
Case  
• Compatible with automatic  
placement by robots  
• Drilling for lead holes is not  
required  
• Compact system designs are  
possible due to high density  
mounting  
High impact resistant flexible hinge spring  
Coil sealed formation body  
Armature block  
Overall cost  
reduction  
(High heat resistance, high insulation, low volatility gas)  
Permanent magnet, laser welding connection of iron core.  
• High heat resistance  
• Anti-gas measures  
High  
reliability  
Warped cross-section iron core  
– EIAJ standard conformant  
– High wthstand voltage between contacts  
Body block  
The surface mount relay is manufactured  
with the following advanced technologies:  
• Heat-resistance encapsulation  
technique  
• Gas analysis  
• Reliability assessment  
• Precision molding technique for heat-  
resistant materials  
3. Examples of SMT Applications  
The following describes some examples of typical SMT applications:  
(1) Infrared Reflow Soldering (IRS)  
IRS is the most popular reflow soldering  
technology now available for surface  
mounting. It uses a sheath heater or  
infrared lamp as its heat source
.
P
C board  
assemblies are continuously soldered as  
they are transferred through a tunnel  
furnace comprised of a preheating,  
heating, and cooling-stages.  
(2) Vapor Phase Soldering (VPS)  
(3) Belt conveyer reflow furnace  
As PCB assemblies are transferred on a  
thin, heat-resistant belt conveyer, they are  
soldered by the heat from hotplates  
placed begeath the conveyer belt.  
(4) Double Wave Soldering (DWS)  
Components are glued to the PC board  
surface. The board assembly is  
transferred through a molten solder  
fountain (with the component side facing  
down), and the components are soldered  
to the board.  
With VPS technolog
y
,
P
CB assemblies  
are carried through a special inactive  
solvent, such as Fluorinert FC-70, that  
has been heated to a vapor state. As the  
saturated vapor condenses on the PC  
board surface, the resulting evaporation  
heat provides the energy for reflow  
soldering.  
Preheat  
stage  
Heating  
stage  
Cooling  
stage  
Cooling coil  
(5) Other
T
e
chnologies  
Saturated vapor  
Other reflow soldering technologies  
include those utilizing lasers, hot air, and  
pulse heaters.  
Heater  
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OPYRIGHT
Matsushita Electric Works, Ltd.  

SMT Soldering Guidelines  
•
Cautions for installation  
1. Paste Soldering  
• Mounting pads on PC boards must be  
designed to absorb placement errors  
while taking account of solderability and  
insulation. Refer to the suggested  
mounting pad layout in the application  
data for the required relay product.  
• Paste solder may be applied on the  
board with screen printing or dispenser  
techniques. For either method, the paste  
solder must be coated to appropriate  
thickness and shapes to achieve good  
solder wetting and adequate insulation.  
Screen Printing  
Squeegee  
Paste solder  
(for screen printing)  
Mask  
Pad  
PC board  
Solder Dispenser  
Air  
Syringe  
Paste solder  
(for dispenser)  
Needle  
Pad  
PC board  
• For small, lightweight components  
Such as chip components, a self-  
alignment effect can be expected if small  
placement errors exist. However, this  
effect is not as expected for electro-  
mechanical components such as relays,  
and they require precise positioning on  
their soldering pads.  
• Our SMT relays are supplied in stick  
packaging compatible with automatic  
placement processes. We also offer tape  
packaging at customer request.  
2. Relay Installation  
Holding Pressure  
Direction A: Less than 9.807 N (less than 1,000 gf)  
Direction B: Less than 9.807 N (less than 1,000 gf)  
Direction C: Less than 9.807 N (less than 1,000 gf)  
C
B
A
• If SMT relays sustain excessive  
mechanical stress from the placement  
machine’s pickup head, their performance  
cannot be guaranteed.  
(ex. TQ-SMD type)  
• Reflow soldering under inadequate  
soldering conditions may result in  
unreliable relay performance or even  
physical damage to the relay (even if the  
relay is of surface mount type with high  
heat resistance).  
(2) VPS technique  
3. Reflow  
T
3  
T
2  
T
1  
Example of Recommended Soldering  
Condition for Surface Mount Relays.  
(1) IRS technique  
t
1  
t
2  
T
1
= 90 to 100
°
C
194 to 212
°
F  
T
2
= 180 to 200
°
C
356 to 392
°
F  
T
3
= Less than 215
°
C
419
°
F  
t
1
= 90 to 120 sec.  
t
2
= Less than 60 sec.  
T
3  
T
2  
T
1  
(3) Manual soldering  
Soldering iron tip temperature: 280 to  
300°C
536 to 572°F  
Soldering iron wattage: 30 to 60 watts  
Soldering time: Less than 5 sec.  
(4) Others  
<Reference>  
Recommended temperature profile  
condition during reflow when using lead-  
free solder.  
Please consult us correspondence  
products.  
t
1  
t
2  
T
1
= 155 to 165
°
C
311 to 329
°
F  
T
2
= 180 to 200
°
C
356 to 392
°
F  
T
3
= Less than 245
°
C
473
°
F  
t
1
= Less than 120 sec.  
t
2
= Less than 30 sec.  
When a soldering technique other than  
above is to be used (hot air, hotplate,  
laser, or pulse heater technique), carefully  
investigate the suitability of the technique.  
T
3  
T
2  
T
1  
• It is recommended that the soldered pad  
be immediately cooled to prevent thermal  
damage to the relay and its associated  
components.  
• While surface mount relays are solvent  
washable, do not immerse the relay in  
cold cleaning solvent immediately after  
soldering.  
Notes:  
1. The soldering temperature profile indicates the pad  
temperature. In some cases, the ambient  
temperature may be greatly increased. Check for  
the specific mounting condition.  
2. The preheating conditions for the VPS technique  
are identical to those for the IRS technique.  
t
1  
t
2  
T
1
= 150 to 180
°
C
302 to 356
°
F  
T
2
= 230
°
C
446
°
F
and higher  
T
3
= Within 250
°
C
482
°
F  
t
1
= 60 to 120 sec.  
t
2
= Within 30 sec.  
• The surface mount relays are solvent  
washable. Use alcohol or an equivalent  
solvent for cleaning.  
4. Cleaning  
• Boiled cleaning is approved for surface  
mount relays. Ultrasonic cleaning may  
cause coil damage or light contact  
sticking.  
* Please consult us regarding lead-free solder.  
All Rights Reserved © C
OPYRIGHT
Matsushita Electric Works, Ltd.