Potens-PDD6902
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60V N-Channel MOSFETs
PDD6902
General Description
BVDSS
60V
RDSON
4.5m
ID
These N-Channel enhancement mode power field effect
transistors are using trench DMOS technology. This
advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are
well suited for high efficiency fast switching applications.
90A
Features
60V,90A, RDS(ON) =4.5m
Ω@VGS = 10V
Improved dv/dt capability
Fast switching
Green Device Available
TO252 Pin Configuration
D
Applications
D
PowerTools
Quick Charger
LED applications
Motor Drive Applications
G
S
G
S
Absolute Maximum Ratings
Tc=25
℃
unless otherwise noted
Symbol
Parameter
Rating
60
Units
V
V
DS
V
GS
Drain-Source Voltage
Gate-Sou
r
ce Voltage
V
±
20
90
A
Drain Current
–
Continuous (T
C
=25
℃
)
Drain Current
–
Continuous (T
C
=100
℃
)
Drain Current
–
Pulsed
1
I
D
60
A
I
DM
360
A
EAS
IAS
Single Pulse Avalanche Energy
2
Single Pulse Avalanche Current
2
Power Dissipation (T
C
=25
℃
)
450
mJ
A
95
132
W
P
D
1.06
Power Dissipation
–
Derate above 25
℃
Storage
T
e
mperature Range
W/
℃
℃
℃
T
STG
T
J
-50 to 150
-50 to 150
Operating Junction Temperature Range
Thermal Characteristics
Symbol
Parameter
Typ.
—
Max.
Unit
℃
/W
℃
/W
R
θ
JA
R
θ
JC
Thermal Resistance Junction to ambient
Thermal Resistance Junction to Case
62
—
0.94
Potens semiconductor corp.
Ver.1.00
1
60V N-Channel MOSFETs
PDD6902
Electrical Characteristics
(T
J
=25
℃
, unless otherwise noted)
Off Characteristics
Symbol
Parameter
Conditions
V
GS
=0V , I
D
=250uA
Min.
60
—
Typ.
—
Max.
—
Unit
V
BV
DSS
Drain-Source Breakdown Voltage
—
1
uA
uA
nA
V
DS
=60V , V
GS
=0V , T
J
=25
℃
V
DS
=48V , V
GS
=0V , T
J
=125
℃
I
DSS
I
GSS
Drain-Source Leakage Current
Gate-Source Leakage Current
—
—
10
—
—
V
GS
=
±
20V , V
DS
=0V
±
100
On Characteristics
V
GS
=10V , I
D
=20A
V
GS
=4.5V , I
D
=10A
V
GS
=V
DS
, I
D
=250uA
V
DS
=10V , I
D
=3A
—
‘
—
1
3.8
4.2
1.6
25
4.5
5.5
2.5
—
m
m
V
R
DS(ON)
Static Drain-Source On-Resistance
V
GS(th)
gfs
Gate Threshold Voltage
Forward Transconductance
—
S
Dynamic and switching Characteristics
Q
g
Q
gs
Q
gd
T
d(on)
T
r
Total Gate Charge
3,4
Gate-Source Charge
3,4
Gate-Drain Charge
3,4
Turn-On Delay Time
3,4
Rise Time
3,4
—
—
—
—
—
—
—
—
—
—
—
58.2
16.2
23.4
19.2
56.3
90.8
21.6
116
32
V
DS
=30V , V
GS
=4.5V , I
D
=10A
nC
ns
46
40
V
DD
=30V , V
GS
=10V , R
G
=6
120
200
40
Turn-Off Delay Time
3,4
Fall Time
3,4
I
D
=1A
T
d(off)
T
f
C
iss
C
oss
C
rss
R
g
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
6805 10000
V
DS
=25V , V
GS
=0V , F=1MHz
V
GS
=0V, V
DS
=0V, F=1MHz
pF
445
195
1.3
680
280
2.6
Drain-Source Diode Characteristics and Maximum Ratings
Symbol
I
S
Parameter
Continuous Source Current
Pulsed Source Current
Diode Forward Voltage
Conditions
Min.
—
Typ.
—
Max.
90
Unit
A
V
G
=V
D
=0V , Force Current
I
SM
—
—
180
1
A
V
SD
—
—
V
V
GS
=0V , I
S
=1A , T
J
=25
℃
Note :
1. Repetitive
Rating : Pulsed width limited by maximum junction temperature.
2. V
DD
=25V,V
GS
=10V,L=0.1mH,I
AS
=95A., Starting T
J
=25
℃
3. The
data tested by pulsed , pulse width
≦
300us , duty cycle
≦
2%.
4. Essentially
independent of operating temperature.
Potens semiconductor corp.
Ver.1.00
2
60V N-Channel MOSFETs
PDD6902
T
J
, Junction Temperature (
℃
)
T
C
, Case Temperature (
℃
)
Fig.1 Continuous
Drain Current vs. T
C
Fig.2 Normalized
RDSON vs. T
J
Qg , Gate Charge (nC)
T
J
, Junction Temperature (
℃
)
Fig.3 Normalized
Vth vs. T
J
Fig.4 Gate
Charge Characteristics
V
DS
, Drain to Source
V
o
ltage (V)
Square Wave Pulse Duration (s)
Fig.6 Maximum
Safe Operation Area
Fig.5 Normalized
Transient Impedance
Potens semiconductor corp.
Ver.1.00
3
60V N-Channel MOSFETs
PDD6902
V
DS
90%
10%
V
GS
T
d(on)
T
r
T
on
T
d(off)
T
f
T
off
Fig.7 Switching
Time Waveform
Fig.8 Gate
Charge Waveform
Potens semiconductor corp.
Ver.1.00
4
60V N-Channel MOSFETs
PDD6902
TO252 PACKAGE INFORMATION
Dimensions In Millimeters
Dimensions In Inches
Symbol
MAX
2.400
1.110
0.150
6.800
0.580
0.580
5.500
2.386
0.940
0.860
10.400
3.000
6.200
1.200
9°
MIN
2.200
0.910
0.000
6.400
0.450
0.460
5.100
2.186
0.600
0.500
9.400
2.400
5.400
0.600
3°
MAX
0.094
0.044
0.006
0.268
0.023
0.023
0.217
0.094
0.037
0.034
0.409
0.118
0.244
0.047
9°
MIN
0.087
0.036
0.000
0.252
0.018
0.018
0.201
0.086
0.024
0.020
0.370
0.094
0.213
0.024
3°
A
A1
A2
B
C
C1
D
E
F
F1
L
L1
L2
L3
θ
Potens semiconductor corp.
Ver.1.00
5
