Potens-PDD6902

Part #Potens-PDD6902
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Potens-PDD6902
60V N-Channel MOSFETs  
PDD6902  
General Description  
BVDSS  
60V  
RDSON  
4.5m
 
ID  
These N-Channel enhancement mode power field effect  
transistors are using trench DMOS technology. This  
advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the  
avalanche and commutation mode. These devices are  
well suited for high efficiency fast switching applications.  
90A  
Features  
60V,90A, RDS(ON) =4.5m
Ω@VGS = 10V  
Improved dv/dt capability  
Fast switching  
Green Device Available  
TO252 Pin Configuration  
D
Applications  
D
PowerTools  
Quick Charger  
LED applications  
Motor Drive Applications  
G
S
G
S
Absolute Maximum Ratings
Tc=25
℃
unless otherwise noted  
Symbol  
Parameter  
Rating  
60  
Units  
V
V

DS  

V

GS  

Drain-Source Voltage  
Gate-Sou
r
ce Voltage  
V
±
20  
90  
A
Drain Current
–
Continuous (T

C

=25
℃
)  
Drain Current
–
Continuous (T

C

=100
℃
)  
Drain Current
–
Pulsed

1  

I

D  

60  
A
I

DM  

360  
A
EAS  
IAS  
Single Pulse Avalanche Energy

2  

Single Pulse Avalanche Current

2  

Power Dissipation (T

C

=25
℃
)  
450  
mJ  
A
95  
132  
W
P

D  

1.06  
Power Dissipation
–
Derate above 25
℃  
Storage
T
e
mperature Range  
W/
℃  
℃
℃
T

STG  

T

J  

-50 to 150  
-50 to 150  
Operating Junction Temperature Range  
Thermal Characteristics  
Symbol  
Parameter  
Typ.  
—  
Max.  
Unit  
℃
/W  
℃
/W  
R

θ
JA  

R

θ
JC  

Thermal Resistance Junction to ambient  
Thermal Resistance Junction to Case  
62  
—  
0.94  
Potens semiconductor corp.  
Ver.1.00  
1

60V N-Channel MOSFETs  
PDD6902  
Electrical Characteristics
(T

J

=25
℃
, unless otherwise noted)  
Off Characteristics  
Symbol  
Parameter  
Conditions  
V

GS

=0V , I

D

=250uA  
Min.  
60  
—  
Typ.  
—  
Max.  
—  
Unit  
V
BV

DSS  

Drain-Source Breakdown Voltage  
—  
1
uA  
uA  
nA  
V

DS

=60V , V

GS

=0V , T

J

=25
℃  
V

DS

=48V , V

GS

=0V , T

J

=125
℃  
I

DSS  

I

GSS  

Drain-Source Leakage Current  
Gate-Source Leakage Current  
—  
—  
10  
—  
—  
V

GS

=
±
20V , V

DS

=0V  
±
100  
On Characteristics  
V

GS

=10V , I

D

=20A  
V

GS

=4.5V , I

D

=10A  
V

GS

=V

DS

, I

D

=250uA  
V

DS

=10V , I

D

=3A  
—  
‘
—  
1
3.8  
4.2  
1.6  
25  
4.5  
5.5  
2.5  
—  
m
 
m
  
V
R

DS(ON)  

Static Drain-Source On-Resistance  
V

GS(th)  

gfs  
Gate Threshold Voltage  
Forward Transconductance  
—  
S
Dynamic and switching Characteristics  
Q

g  

Q

gs  

Q

gd  

T

d(on)  

T

r  

Total Gate Charge

3,4  

Gate-Source Charge

3,4  

Gate-Drain Charge

3,4  

Turn-On Delay Time

3,4  

Rise Time

3,4  

—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
58.2  
16.2  
23.4  
19.2  
56.3  
90.8  
21.6  
116  
32  
V

DS

=30V , V

GS

=4.5V , I

D

=10A  
nC  
ns  
46  
40  
V

DD

=30V , V

GS

=10V , R

G

=6
  
120  
200  
40  
Turn-Off Delay Time

3,4  

Fall Time

3,4  

I

D

=1A  
T

d(off)  

T

f  

C

iss  

C

oss  

C

rss  

R

g  

Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
6805 10000  
V

DS

=25V , V

GS

=0V , F=1MHz  
V

GS

=0V, V

DS

=0V, F=1MHz  
pF  
445  
195  
1.3  
680  
280  
2.6  
Drain-Source Diode Characteristics and Maximum Ratings  
Symbol  
I

S  

Parameter  
Continuous Source Current  
Pulsed Source Current  
Diode Forward Voltage  
Conditions  
Min.  
—  
Typ.  
—  
Max.  
90  
Unit  
A
V

G

=V

D

=0V , Force Current  
I

SM  

—  
—  
180  
1
A
V

SD  

—  
—  
V
V

GS

=0V , I

S

=1A , T

J

=25
℃  
Note :  
1. Repetitive
 
Rating : Pulsed width limited by maximum junction temperature.  
2. V

DD

=25V,V

GS

=10V,L=0.1mH,I

AS

=95A., Starting T
J
=25
℃
 
3. The
 
data tested by pulsed , pulse width
 
≦
300us , duty cycle
 
≦
2%.  
4. Essentially
 
independent of operating temperature.  
Potens semiconductor corp.  
Ver.1.00  
2

60V N-Channel MOSFETs  
PDD6902  
T

J

, Junction Temperature (
℃
)  
T

C

, Case Temperature (
℃
)  
Fig.1 Continuous
 
Drain Current vs. T

C  

Fig.2 Normalized
 
RDSON vs. T

J  

Qg , Gate Charge (nC)  
T

J

, Junction Temperature (
℃
)  
Fig.3 Normalized
 
Vth vs. T

J  

Fig.4 Gate
 
Charge Characteristics  
V

DS

, Drain to Source
V
o
ltage (V)  
Square Wave Pulse Duration (s)  
Fig.6 Maximum
 
Safe Operation Area  
Fig.5 Normalized
 
Transient Impedance  
Potens semiconductor corp.  
Ver.1.00  
3

60V N-Channel MOSFETs  
PDD6902  
V

DS  

90%  
10%  
V

GS  

T

d(on)  

T

r  

T

on  

T

d(off)  

T

f  

T

off  

Fig.7 Switching
 
Time Waveform  
Fig.8 Gate
 
Charge Waveform  
Potens semiconductor corp.  
Ver.1.00  
4

60V N-Channel MOSFETs  
PDD6902  
TO252 PACKAGE INFORMATION  
Dimensions In Millimeters  
Dimensions In Inches  
Symbol  
MAX  
2.400  
1.110  
0.150  
6.800  
0.580  
0.580  
5.500  
2.386  
0.940  
0.860  
10.400  
3.000  
6.200  
1.200  
9°  
MIN  
2.200  
0.910  
0.000  
6.400  
0.450  
0.460  
5.100  
2.186  
0.600  
0.500  
9.400  
2.400  
5.400  
0.600  
3°  
MAX  
0.094  
0.044  
0.006  
0.268  
0.023  
0.023  
0.217  
0.094  
0.037  
0.034  
0.409  
0.118  
0.244  
0.047  
9°  
MIN  
0.087  
0.036  
0.000  
0.252  
0.018  
0.018  
0.201  
0.086  
0.024  
0.020  
0.370  
0.094  
0.213  
0.024  
3°  
A
A1  
A2  
B
C
C1  
D
E
F
F1  
L
L1  
L2  
L3  
θ
Potens semiconductor corp.  
Ver.1.00  
5