PUOLOP-PTD50N06
| Part # | PUOLOP-PTD50N06 |
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PTD50N06
60V/50A N-Channel Advanced Power MOSFET
Features
General Features
Low On-Resistance
V
DS
=60
V
,
I
D
=50A
Fast Switching
R
DS(ON)
<20m
Ω
@ V
GS
=10V
100% Avalanche Tested
Repetitive Avalanche Allowed up to Tj max
Lead-Free, RoHS Compliant
D
Description
PTD50N06 designed by the trench process
techniques to achieve extremely low on-resistance.
Additional features of this design can operate at
high junction temperature, fast switching speed and
improved repetitive avalanche rating.These
features combine to make this design an extremely
efficient and
reliable device for use in Motor
applications and a wide variety of other applications.
S
G
TO-252-2L
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only;and
functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are
measured under board mounted and still air conditions. Ambient temperature (Ta) is 25°C, unless otherwise specified.
Parameter
Symbol
V
DS
Limit
60
Unit
V
Drain-Source Voltage
Gate-Source Voltage
Drain Current-Continuous
±20
V
V
GS
50
35.4
A
A
I
D
Drain Current-Continuous(T
C
=100
℃
)
Pulsed Drain Current
I
D
(100
℃
)
I
DM
200
A
Maximum Power Dissipation
85
W
P
D
Derating factor
0.57
W/
℃
mJ
℃
Single pulse avalanche energy
(Note 5)
Operating Junction and Storage Temperature Range
Thermal Resistance,Junction-to-Case
(Note 2)
E
AS
T
J
,T
STG
R
θ
JC
300
-55
T
o
1
75
1.8
℃
/W
– 1-
2015-3-26
PTD50N06
60V/50A N-Channel Advanced Power MOSFET
Electrical Characteristics (T
C
=25
℃
unless otherwise noted)
Parameter
Symbol
Condition
Min Typ
Max
Unit
Off Characteristics
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
On Characteristics
(Note 3)
Gate Threshold Voltage
Drain-Source On-State Resistance
Forward Transconductance
Dynamic Characteristics
(Note4)
Input Capacitance
BV
DSS
I
DSS
V
GS
=0V I
D
=250
μ
A
V
DS
=60V,V
GS
=0V
V
GS
=±20V,V
DS
=0V
60
–
–
–
–
–
1
V
μ
A
nA
I
GSS
–
±100
V
GS(th)
R
DS(ON)
g
FS
V
DS
=V
GS
,I
D
=250
μ
A
V
GS
=10V, I
D
=20A
V
DS
=5V,I
D
=20A
1.4
–
1.9
14
–
2.5
20
–
V
m
Ω
S
18
C
lss
C
oss
C
rss
–
–
–
2050
158
–
–
–
PF
PF
PF
V
DS
=30V,V
GS
=0V,
F=1.0MHz
Output Capacitance
Reverse Transfer Capacitance
Switching Characteristics
(Note 4)
Turn-on Delay Time
120
t
d(on)
t
r
t
d(off)
t
f
–
–
–
–
–
–
–
7.4
5.1
28.2
5.5
50
–
–
–
–
nS
nS
nS
nS
nC
nC
nC
Turn-on Rise Time
V
DD
=30V, R
L
=6.7
Ω
V
GS
=10V,R
G
=3
Ω
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Q
g
Q
gs
Q
gd
V
DS
=30V,I
D
=20A,
Gate-Source Charge
6
V
GS
=10V
Gate-Drain Charge
15
Drain-Source Diode Characteristics
Diode Forward Voltage
(Note 3)
Diode Forward Current
(Note 2)
Reverse Recovery Time
V
SD
I
S
V
GS
=0V,I
S
=20A
–
–
–
–
1.2
50
–
V
A
–
t
rr
TJ = 25°C, IF =20A
di/dt = 100A/
μ
s
(Note3)
28
40
nS
nC
Reverse Recovery Charge
Forward Turn-On Time
Qrr
t
on
–
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
– 2-
2015-3-26
PTD50N06
60V/50A N-Channel Advanced Power MOSFET
Typical Electrical and Thermal Characteristics (Curves)
Vds Drain-Source Voltage (V)
T
J
-Junction
T
e
mperature(
℃
)
Figure 1 Output Characteristics
Figure 4 Rdson-Junction Temperature
Vgs Gate-Source Voltage (V)
Qg Gate Charge (nC)
Figure 2 Transfer Characteristics
Figure 5 Gate Charge
I
D
– Drain Current (A)
Vsd Source-Drain Voltage (V)
Figure 3 Rdson-
Drain Current
Figure 6 Source- Drain Diode Forward
– 3-
2015-3-26
PTD50N06
60V/50A N-Channel Advanced Power MOSFET
Vds Drain-Source Voltage (V)
T
J
-Junction
T
e
mperature(
℃
)
Figure 7 Capacitance vs Vds
Figure 9 BV
DSS
vs Junction Temperature
Vds Drain-Source Voltage (V)
T
J
-Junction
T
e
mperature(
℃
)
Figure 8 Safe Operation Area
Figure 10 V
GS(th)
vs Junction Temperature
Square Wave Pluse Duration (sec)
Figure 11 Normalized Maximum Transient Thermal Impedance
– 4 –
2015-3-26
