Qorvo-RFPA5542TR13

RFMD + TriQuint = Qorvo  

RFPA5542  

RFPA5542  

WiFi Integrated PA Module  

4.9GHz to 5.925GHz  

Package: QFN, 20-pin,  

4.0mm x 4.0mm x 0.90mm  

The RFPA5542 is a three-stage power amplifier (PA) designed for  

802.11a/n/ac applications.

 

The integr

ated input and output 50Ω match  

greatly reduces the layout area, bill of materials and manufacturability  

cost in the customer application.

 

The PA is optimized to minimize the  

required external components to maintain linear performance. The  

RFPA5542 is manufactured on an advanced InGaP heterojunction bipolar  

transistor (HBT) process and is capable of achieving linear powers up to  

23dBm with an EVM <1.8% while maintaining excellent power added  

efficiency. The

 

device is provided in a 4.0mm x 4.0mm x 0.90mm  

package that meets or exceeds the power requirements of  

Features  

■

P

OUT

= 23dBm, 5V, 11ac, 80MHz  

MCS9 at 1.8% EVM  

■

P

OUT

= 25dBm, 5V, 11n, 20/40MHz  

MCS7 at 3% EVM  

■

■

■

Typical Gain = 33dB  

High PAE  

Required external components  

minimized  

IEEE802.11a/n/ac WiFi RF systems

.  

■

■

■

Integrated Regulator  

VCC

1

V

CC2 VCC3 GND GND  

Input and Output Matched to 50Ω  

Integrated Power Detector  

GND  

1

2

3

4

5

15  

14  

13  

12  

11  

NC  

GND  

GND  

Applications  

RFIN  

GND  

RFOUT  

GND  

■

Customer Premise Equipment  

(CPE)  

■

■

■

■

Wireless Access Points, Gateways  

Routers  

REGULATOR  

PA_EN  

GND  

Set-Top Box Applications  

Picocell/Femtocell  

NC NC NC  

NC PDET  

Functional Block Diagram  

Ordering Information  

RFPA5542SB  

Standard 5-piece Sample Bag  

Standard 25-piece Sample Bag  

Standard 100-piece Reel  

RFPA5542SQ  

RFPA5542SR  

RFPA5542TR13  

RFPA5542PCK-410  

Standard 2500-piece Reel  

Fully Assembled Evaluation Board  

Data Sheet 20161027  

Disclaimer: Subject to change without notice  

1 of 8  

RFPA5542  

RFMD + TriQuint = Qorvo  

Absolute Maximum Ratings  

Caution!

ESD sensitive device.  

Parameter  

Rating  

Unit  

DC Supply Voltage  

-0.5 to +6  

1000  

V

DC  

mA  

ºC  

DC Supply Current  

RFMD Green: RoHS status based on EU  

Directive 2011/65/EU (at time of this  

document revision), halogen free per IEC  

61249-2-21, < 1000ppm each of  

antimony trioxide in polymeric materials  

and red phosphorus as a flame retardant,  

and <2% antimony in solder.  

Operating Case Temperature  

Storage Temperature  

-40 to +85  

-40 to +150  

ºC  

Maximum TX Input Power into 50Ω Load for 11a/n/ac (No Damage)

.  

*R1=0

Ω  

Maximum TX Input Power into 10:1 VSWR Load for 11a/n/ac (No  

Damage). *R1=15

Ω  

+10  

+15  

dBm  

dBm  

C

Exceeding any one or a combination of the Absolute  

Maximum Rating conditions may cause permanent  

damage to the device. Extended application of Absolute  

Maximum Rating conditions to the device may reduce  

device reliability. Specified typical performance or  

functional operation of the device under Absolute  

Maximum Rating conditions is not implied. This is an  

InGaP PA designed for high duty cycle applications with  

Tj>30oC over ambient.  

Junction Temperature  

+160  

Moisture Sensitivity Level (260°C JEDEC J-STD-020)  

*Note: For

 

R1 placement, please refer to the applications schematic.  

MSL2  

Nominal Operating Parameters  

Specification  

Parameter  

Unit  

Condition  

Min  

Typ  

Max  

Compliance  

802.11a/n/ac  

Operating Frequency  

Extended Operating Frequency  

Power Supply V

CC  

5.180  

4.900  

4.75  

1.7  

5.925  

5.180  

5.25  

3.3  

GHz  

GHz  

V

5.00  

3.0  

PA Enable – High  

V

PA Enable

 

– Low  

0

0.5  

V

T= +25ºC, V

CC

=5.0V, V

PAEN

= 3.0V, Unless otherwise  

noted  

5V Transmit Performance  

11ac 80MHz Output Power  

11ac 80MHz DEVM  

22  

21  

23  

dBm  

%

1.5  

1.8  

-35  

MCS9 256QAM  

MCS9 256QAM  

-36.5  

22  

dB  

dBm  

%

11ac 160MHz Output Power  

11ac 160MHz DEVM  

1.5  

1.8  

-35  

-36.5  

25  

dB  

dBm  

%

11n 20/40MHz Output Power  

11n 20/40MHz DEVM  

23.5  

2.5  

3

MCS7 64QAM  

-32.0  

33  

-30.5  

dB  

dB  

dB  

Gain  

31  

Gain Variation over Temp  

-2.5  

+2.5  

Over operating frequency band  

P

OUT

=23dBm; MCS0 160MHz  

P

OUT

=25dBm; MCS0 80MHz  

3

3

dB  

dB  

Margin to Spectral Mask  

3

dB  

dB  

P

OUT

=26dBm; MCS0 40MHz  

P

OUT

=27dBm; MCS0 20MHz  

P

OUT

=23dBm  

3

285  

385  

310  

430  

mA  

mA  

Operating Current  

Quiescent Current  

P

OUT

=27dBm  

150  

165  

mA  

RF=Off, T= +25ºC, V

CC

=5.0V, V

P

A

E

N

= 3.0V,  

Data Sheet 20161027  

Disclaimer: Subject to change without notice  

2 of 8  

RFPA5542  

RFMD + TriQuint = Qorvo  

Specification  

Parameter  

Unit  

Condition  

Min  

Typ  

Max  

1

5

1

uA  

uA  

PA Enable Current  

Leakage Current  

PA_EN High  

0.2  

RF OFF; V

CC

=5.0V, V

P

A

E

N

= 0V  

T= +25ºC, V

CC

=5.0V, V

PAEN

= 3.0V, Unless otherwise  

noted  

5V Transmit Performance  

Second Harmonic  

-45  

-50  

-5  

-40  

-45  

dBm/MHz  

dBm/MHz  

dB  

P

OUT

= 27dBm, measured with a standard IEEE802.11a 6 Mbps  

waveform  

Third Harmonic  

P

OUT

= 27dBm, measured with a standard IEEE802.11a 6 Mbps  

waveform  

Gain @ 3.3-3.8GHz  

Gain @ 7.0GHz  

OOB Gain  

7

dB  

dB  

Input Return Loss  

Output Return Loss  

12  

12  

dB  

V

0.25  

RF=Off  

0.55  

P

OUT

= 22dBm  

Power Detector Range  

0.65  

0.85  

V

V

P

OUT

= 23dBm  

P

OUT

= 27dBm  

General Specifications  

Stability  

Output VSWR  

4:1  

27  

CW signal. No spurious above -41.25dBm/MHz for non-harmonic  

related signals.  

Output Power Range  

Output P1dB  

0

dBm  

dBm  

nS  

33  

200  

25  

CW signal  

Ramp ON/OFF time  

Thermal Resistance  

ESD HBM  

10-90% / 90-10% of gain  

°C/W  

V

1500  

500  

EIA/JESD22-114A; All pins  

JESD22-C101C; All pins  

ESD CDM  

V

Data Sheet 20161027  

Disclaimer: Subject to change without notice  

3 of 8  

RFPA5542  

RFMD + TriQuint = Qorvo  

Timing Diagram  

RF/DC Power On/Off Sequence  

V

CC  

PA-EN  

RF On  

TX RF Signal  

RF OFF  

Time  

Td Td  

Td  

Td  

Note: Observe

 

the timing sequence shown in the diagram above and described below.  

DC and RF signal levels per data sheet specification  





Apply V

CC

prior to turning on or pulsing PA enable.  

Turn off PA enable prior to turning off V

C

C

.  





Turn on PA enable prior to applying RF signal.  

Turn off RF signal prior to turning off PA enable.  

Data Sheet 20161027  

Disclaimer: Subject to change without notice  

4 of 8  

RFPA5542  

RFMD + TriQuint = Qorvo  

RFPA5542 Applications Schematic  

Data Sheet 20161027  

Disclaimer: Subject to change without notice  

5 of 8  

RFPA5542  

RFMD + TriQuint = Qorvo  

Pin Out  

VCC

1

V

CC2 VCC3 GND GND  

GND  

15  

14  

13  

12  

11  

1

2

3

4

5

NC  

GND  

GND  

RFIN  

GND  

RFOUT  

GND  

PA_EN  

GND  

NC NC NC  

NC PDET  

Data Sheet 20161027  

Disclaimer: Subject to change without notice  

6 of 8  

RFPA5542  

RFMD + TriQuint = Qorvo  

Package Drawing  

PCB Patterns  

Data Sheet 20161027  

Disclaimer: Subject to change without notice  

7 of 8  

RFPA5542  

RFMD + TriQuint = Qorvo  

Pin Names and Descriptions  

Pin  

1

Name  

NC  

Description  

Not connected internally. It may be left floating or connected to ground.  

2

GND  

RFIN  

GND  

PA_EN  

NC  

Ground connection. This pin is not connected internally and can be left floating or connected to ground.  

RF inp

ut, internally matched to 50Ω

and DC shorted. External DC blocking capacitor required.  

Ground connection. This pin is not connected internally and can be left floating or connected to ground.  

PA Enable pin.

 

Apply <0.4V

DC

. Apply

 

1.5V

DC

to V

CC

to enable PA.  

3

4

5

6

Not connected internally. It may be left floating or connected to ground.  

7

NC  

Not connected internally. It may be left floating or connected to ground.  

8

NC  

Not connected internally. It may be left floating or connected to ground.  

9

NC  

Not connected internally. It may be left floating or connected to ground.  

10  

11  

12  

13  

14  

15  

16  

17  

18  

19  

20  

PDET  

GND  

GND  

RFOUT  

GND  

GND  

GND  

GND  

VCC3  

VCC2  

VCC1  

Power detector. Provides an output voltage proportional to the RF output power level.  

Ground connection. This pin is not connected internally and can be left floating or connected to ground.  

Ground connection. This pin is not connected internally and can be left floating or connected to ground.  

RF outp

ut, internally matched to 50Ω and DC shorted

. External DC blocking capacitor required.  

Ground connection. This pin is not connected internally and can be left floating or connected to ground.  

Ground connection. This pin is not connected internally and can be left floating or connected to ground.  

Ground connection. This pin is not connected internally and can be left floating or connected to ground.  

Ground connection. This pin is not connected internally and can be left floating or connected to ground.  

Third stage supply voltage  

Second stage supply voltage.  

First stage supply voltage.  

Ground connection. The back side of the package should be connected to the ground plan though as  

short of a connection as possible. PCB vias under the device are recommended.  

Pkg Base  

GND  

Data Sheet 20161027  

Disclaimer: Subject to change without notice  

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