Rainsun-microwave-Tech-AN9520-245

Part #Rainsun-microwave-Tech-AN9520-245
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Rainsun-microwave-Tech-AN9520-245
AN9520  
Multilayer Chip Antenna for  
2.4GHz Wireless Communication  
RainSun Corporation  
Aug, 2009  
V
e
r.2.3  
1 of 9  

AN9520 Multilayer Chip Antenna  
◆
Features  
y
Light weight and low profile
 
9.5
mm(L)X2.1mm(W)X1.0mm(H)  
y
Omni
‐
directional in azimuth  
Lead (Pb) Free  
◆
Applications  
y
2.4GHz wireless communications  
y
2.4GHz Modules  
y
Bluetooth System  
802.11b/g Wireless LAN System  
Specifications  
Center frequency  
Peak gain  
2.45GHz  
1.5dBi  
Operation temperature  
Storage temperature  
VSWR  
Input Impedance  
Power handling  
Bandwidth  
‐
40 ~ +85
˚
C  
‐
40 ~ +85
˚
C  
2.0 (max)  
50 Ohm  
3W (max)  
200MHz  
Azimuth beamwidth  
Polarization  
Omni
‐
directional  
Linear  
RainSun Corporation  
Aug, 2009  
V
e
r.2.3  
2 of 9  

Pin configuration  
Top view  
1
Pin No  
Pin assignment  
Feed termination  
Feed point mark  
Solder termination  
1
2
3
2
3
Dimensions  
Symbol  
Dimensions(mm)  
9.50
±
0.10  
A
B
2.10
±
0.10  
C
H
0.65
±
0.05  
1.00
±
0.20  
PCB foot printer  
RainSun Corporation  
Aug, 2009  
V
e
r.2.3  
3 of 9  

Recommended
T
e
st Board Pattern  
Bottom view  
Top view  
50 Ohm  
Transmission line  
Ground Plane  
SMA connector  
Unit : mm  
Board thickness :
 
0.6mm  
Board material : FR4  
Fig-1  
T
e
sting Setup  
Measurement  
T
e
sting Instrument:  
Anritsu 37369C VNA(Vector Network  
Analyzer)  
VNA calibrate with 1 path reflection  
only calibration sequence on test board  
feed point.  
The test board dimension and it
’
s  
layout is the same as Fig
‐
1.  
RainSun Corporation  
Aug, 2009  
4 of 9  
V
e
r.2.3  

T
y
pical Electrical Characteristics  
Return loss  
Smith Chart  
Marker data:  
1 : f=2.567
GHz  
2 : f=2.365
GHz  
3 : f=2.447
GHz  
RainSun Corporation  
5 of 9  
Aug, 2009  
V
e
r.2.3  

T
y
pical Radiation Patterns  
2.45 GHz H
‐
Plane  
2.45 GHz E
‐
Plane  
RainSun Corporation  
Aug, 2009  
V
e
r.2.3  
6 of 9  

T
y
pical Soldering Profile for Lead
‐
free Process  
Peak temp 340°C  
340°C  
300°C  
150°C  
5 sec.  
25 sec.  
Pre-heating  
Time (sec.)  
Do not exceed 30 secs.  
Reflow Soldering  
10 sec, max  
260°C  
230°C  
180°C  
30 sec.  
60 sec.  
Pre-heating  
Time (sec.)  
RainSun Corporation  
Aug, 2009  
V
e
r.2.3  
7 of 9  

Packing  
Blister
T
a
pe Specifications  
Symbol  
Dimension  
16.00  
Tolerance  
±
0.30  
Unit  
mm  
mm  
mm  
W
E
1.75  
±
0.10  
F
7.50  
±
0.10  
+ 0.10  
‐
0.00  
D
1.50  
1.50  
mm  
mm  
+ 0.25  
‐
0.00  
D

1  

P

0  

P
4.00  
8.00  
2.00  
2.20  
10.00  
1.20  
0.30  
±
0.10  
±
0.10  
±
0.10  
±
0.10  
±
0.10  
±
0.10  
±
0.05  
mm  
mm  
mm  
mm  
mm  
mm  
mm  
P

2  

A

0  

B

0  

K

0  

t
RainSun Corporation  
Aug, 2009  
V
e
r.2.3  
8 of 9  

Reel Specifications  
Quantity  
Per Reel  
Tape Width  
(mm)  
A
(mm)  
C
(mm)  
B
(mm)  
E
(mm)  
W
(mm)  
W

1  

(mm)  
1,500  
16  
180
±
1  
13.0
±
0.5  
62
±
0.5  
2.2
±
0.5  
16
±
0.5  
20
±
0.2  
RainSun Corporation  
Aug, 2009  
V
e
r.2.3  
9 of 9