RENESAS-F2915NBGK
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F2915
Datasheet
High Reliability SP5T RF Switch
50 MHz to 8000 MHz
G
ENERAL
D
ESCRIPTION
F
EATURES
The F2915 is a high reliability, low insertion loss, 50 ꢀ
SP5T absorptive RF switch designed for a multitude of
RF applications including wireless communications.
This device covers a broad frequency range from
50 MHz to 8000 MHz.
In addition to providing low
insertion loss, the F2915 also delivers excellent
linearity and isolation performance while providing a
50 ꢀ termination to the unused RF input ports. The
F2915 also includes a patent pending constant
impedance (K
Z
) feature.
K
Z
improves system hot
switching ruggedness, minimizes LO pulling in VCOs,
and reduces phase and amplitude variations in
distribution networks.
It is also ideal for dynamic
switching/selection between two or more amplifiers
while avoiding damage to upstream /downstream
sensitive devices such as PAs and ADCs.
•
•
•
•
Five symmetric, absorptive RF ports
High Isolation: 50 dB @ 4000 MHz
Low Insertion Loss: 1.1 dB @ 4000 MHz
High Linearity:
o
IIP2 of 114 dBm @ 2000 MHz
IIP3 of 60.5 dBm @ 4000 MHz
o
•
High Operating Power Handling:
o
33 dBm CW on selected RF port
27 dBm on terminated ports
o
•
•
•
•
•
•
Single 2.7 V to 5.5 V supply voltage
External Negative Supply Option
3.3 V and 1.8 V compatible control logic
Operating Temperature ꢁ40 °C to +105 °C
4 mm x 4 mm 24 pin QFN package
Pin compatible with competitors
The F2915 uses a single positive supply voltage
supporting three logic control pins using either 3.3 V or
1.8 V control logic. Connecting a negative voltage to
pin 20 disables the internal negative voltage generator
and becomes the negative supply.
F
UNCTIONAL
B
LOCK
D
IAGRAM
VSSEXT
RFC
V3
Control
V2
V1
K
|
Z
|
C
OMPETITIVE
A
DVANTAGE
Circuit
The F2915 provides constant impedance in all RF ports
during transitions improving a system’s hotꢁswitching
ruggedness. The device also supports high power
handling, and high isolation; particularly important for
DPD receiver use.
RF5
50
Ω
50
Ω
50
Ω
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Constant impedance
K
|
Z
|
during switching transition
RFX to RFC Isolation = 50 dB*
Insertion Loss = 1.1 dB*
RF1
RF4
50
Ω
50
Ω
IIP3: +60.5 dBm*
Extended temperature: ꢁ40 °C to +105 °C
* 4 GHz
RF2
RF3
A
PPLICATIONS
O
RDERING NFORMATION
I
•
•
•
•
•
•
•
•
•
Base Station 2G, 3G, 4G
Portable Wireless
Tape &
Reel
Repeaters and E911 systems
Digital PreꢁDistortion
Point to Point Infrastructure
Public Safety Infrastructure
Military Systems, JTRS radios
Cable Infrastructure
F2915NBGK8
Green
Test / ATE Equipment
F2915, Rev 2 05/11/2016
1
© 2015 Integrated Device Technology, Inc.
F2915
BSOLUTE
A
M
AXIMUM
R
ATINGS
Parameter
Symbol
Min
ꢁ0.3
Max
+6.0
Units
V
DD
to GND
V
DD
V
Lower of
( 3.6, V
DD
+ 0.3)
+0.3
V1, V2, V3 to GND
V
CNTL
ꢁ0.3
V
RF1, RF2, RF3, RF4, RF5, RFC to GND
VSS
EXT
to GND
V
RF
V
EXT
ꢁ0.3
ꢁ4.0
V
V
+0.3
Input Power for any one selected RF through port.
(V
DD
applied @ 2 GHz and T
C
= +85 °C)
Input Power for any one selected RF terminated
port .(V
DD
applied @ 2 GHz and T
C
= +85 °C)
Input Power for RFC when in the all off state.
(V
DD
applied @ 2 GHz and T
C
= +85 °C)
Continuous Power Dissipation (T
C
= 95 °C Max)
Maximum Junction Temperature
P
MAXTHRU
P
MAXTERM
P
MAXCOM
37
30
33
dBm
dBm
dBm
3
+140
+150
W
°C
°C
°C
T
Jmax
T
ST
T
LEAD
Storage Temperature Range
Lead Temperature (soldering, 10s)
ꢁ65
+260
ESD Voltage– HBM (Per JESD22ꢁA114)
ESD Voltage – CDM (Per JESD22ꢁC101)
V
ESDHBM
V
ESDCDM
Class 1C (1500V)
Class C3 (1000V)
T
C
= Temperature of the exposed paddle
Stresses above those listed above may cause permanent damage to the device. Functional operation of the device at
these or any other conditions above those indicated in the operational section of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
P
ACKAGE
T
HERMAL AND
M
OISTURE
C
HARACTERISTICS
θ
JA
(Junction – Ambient)
41 °C/W
6.4 °C/W
MSL1
θ
JC
(Junction – Case) [The Case is defined as the exposed paddle]
Moisture Sensitivity Rating (Per JꢁSTDꢁ020)
High Reliability SP5T RF Switch
2
Rev 2 05/11/2016
F2915
F2915 R
ECOMMENDED
Parameter
O
PERATING
C
ONDITIONS
Conditions
Symbol
Min
2.7
2.7
ꢁ3.6
ꢁ40
50
Typ
Max
5.5
5.5
ꢁ3.2
+105
8000
Units
Pin 20 grounded
V
DD
Supply Voltage (s)
Pin 20 Driven with VSS
EXT
V
VSS
EXT
T
CASE
F
RF
Negative Supply
1
ꢁ3.4
Operating Temp Range
RF Frequency Range
Exposed Paddle Temperature
O
C
MHz
Selected Port
33
27
27
RF Continuous
P
RF
dBm
Input CW Powe
r
2
Terminated Ports
3
Switch to RF1
thru RF5.
RFC as
the input
Switched into or
out of all off
state.
24
27
27
RF Continuous
Input CW Power for
P
RFSW
dBm
Switched to RFC
or into Term
3
.
Switch into or
out of all off
condition.
Hot RF Switching
2
RF1 thru
RF5 as
the inputs
RF1 ꢁ 5 Port Impedance
RFC Port Impedance
Z
RFx
Z
RFC
50
50
ꢀ
Note 1: For normal operation, connect VSS
EXT
= 0 V (pin 20) to GND to enable the internal negative voltage generator.
By applying VSS
EXT
to pin 20, the negative voltage generator is disabled completely eliminating any
generator spurious responses.
Note 2: Levels based on T
C
≤ 85C.
See Figure 1 power deꢁrating curve for higher case temperatures.
Note 3: In any of the insertion loss modes or switching into any insertion loss mode, any 3 of the 4 remaining
terminated port paths may be each exposed to the maximum stated power level during continuous or hot
switching operation.
Figure 1 – MAXIMUM RF OPERATING INPUT POWER vs. RF FREQUENCY
Rev 2 05/11/2016
3
High Reliability SP5T RF Switch
F2915
F2915 S
PECIFICATION
Typical Application Circuit, Normal mode (V
DD
= 3.3 V, VSS
EXT
= 0 V) or Bypass mode (V
DD
= 3.3 V, VSS
EXT
= ꢁ3.3 V),
T
C
= +25 °C, F
RF
= 2000 MHz, Input power = 0 dBm, Z
S
= Z
L
= 50 ꢀ, RFX = one of the five input ports, PCB board
trace and connector losses are deꢁembedded unless otherwise noted.
Parameter
Symbol
Conditions
Min
Typ
Max
Lower of
( 3.6, V
DD
)
0.6
Units
Logic Input High Threshold
V
IH
1.1
V
Logic Input Low Threshold
Logic Current
V
IL
I
IH,
I
IL
-0.3
-2
V
µA
For each control pin
+2
Normal Mode
Bypass Mode
VSS
EXT
= ꢁ3.3 V
900 MHz
2100 MHz
2700 MHz
2700 MHz – 4000 MHz
4000 MHz – 8000 MHz
400 MHz – 900 MHz
900 MHz – 2100 MHz
2100 MHz – 2700 MHz
2700 MHz – 4000 MHz
4000 MHz – 8000 MHz
400 MHz – 900 MHz
900 MHz – 2100 MHz
2100 MHz – 2700 MHz
2700 MHz – 4000 MHz
3.3 V or 1.8V Logic
3.3 V or 1.8V Logic
290
270
ꢁ46
0.93
1.1
1.2
1.1
2.3
62
56
54
50
36.5
61.5
55
53
49.5
36.5
360
340
DC Current (V
DD
)
I
DD
µA
µA
DC Current (VSS
EXT
)
I
VSS
-60
1.4
1
1.5
Insertion Loss
RFX to RFC
IL
1.6
dB
dB
1.65
2
57.5
51
49.5
45
31
56.5
50
48
44.5
30.5
Minimum Isolation
RFX to RFC
ISOC
Minimum Isolation
RFX to RFX
ISOX
IL
FLAT
dB
dB
4000 MHz – 8000 MHz
400 MHz – 3800 MHz
Any 400 MHz range
Insertion Loss Flatness
0.1
0.4
RF1 through RF5 selected
VSWR RFC
VSWR
RFC
VSWR
ON
VSWR
TERM
1.25:1
1.33:1
1.15:1
1.7:1
2:1
1.78:1
1.78:1
1.58:1
ꢁ
ꢁ
ꢁ
RF1 through RF5 selected
RF1 through RF5 unselected
From RFX Active to RFX Term
From RFX Term to RFX Active
RF1 through RF5 selected
400 MHz
– 4000 MHz
VSWR RFX (On Ports)
VSWR RFX (Term Ports)
Maximum RFX Port VSWR
During Switching
Minimum Return Loss
(RFC Port )
VSWR
T
RFC
RL
RFX
RL
ꢁ
10
16
dB
dB
Active
9
13
15
36.5
35
Minimum Return Loss
(RFX Port )
400 MHz –
4000 MHz
Terminated
11
34
28
Input 1dB Compression
3
Input 0.1dB Compression
3
ICP
1dB
ICP
0.1dB
dBm
dBm
F
RF1
= 2000 MHz, F
RF2
= 2010 MHz
RF Input = RFX, P
IN
= +20 dBm / tone
F
RF1
+ F
RF2
Term
Input IP2
IIP2
IIP3
114
dBm
∆ F = 1 MHz
RF Input = RFX
P
IN
= +20
F
RF
= 400 MHz
F
RF
= 2000 MHz
45
56
60.5
60
Input IP3
dBm
F
RF
= 4000 MHz
60.5
dBm/tone
Note 1 – Items in min/max columns in
bold italics
are Guaranteed by Test.
Note 2 – Items in min/max columns that are not bold/italics are Guaranteed by Design Characterization.
Note 3 – The input 0.1dB and 1dB compression points are linearity figures of merit. Refer to Absolute Maximum
Ratings section for the maximum RF input power and Figure 1 for maximum operating RF input power.
High Reliability SP5T RF Switch
4
Rev 2 05/11/2016
F2915
F2915 S
PECIFICATION
(C
ONT
.)
Typical Application Circuit, Normal mode (V
DD
= 3.3 V, VSS
EXT
= 0 V) or Bypass mode (V
DD
= 3.3 V, VSS
EXT
= ꢁ3.3 V),
T
C
= +25 °C, F
RF
= 2000 MHz, Input power = 0 dBm, Z
S
= Z
L
= 50 ꢀ, RFX = one of the five input ports, PCB board
trace and connector losses are deꢁembedded unless otherwise noted.
Parameter
Group Delay
Symbol
Conditions
Min
Typ
0.43
256
256
Max
1
345
345
Units
ns
GD
50% CTRL to 90% RF
50% CTRL to 10% RF
50% CTRL to RF settled
within +/ꢁ 0.1 dB of I.L.
value.
Bypass
Mode
Switching Time
4
T
SW
ns
285
Pin 20 = GND
25
290
Maximum Switching Rate
5
SW
RATE
kHz
Pin 20 = VSS
EXT
applied
RF ports terminated into 50Ω
RFX connected to RFC
Maximum spurious level on
any RF port
6
Spur
MAX
ꢁ120
dBm
Note 1 – Items in min/max columns in
bold italics
are Guaranteed by Test.
Note 2 – Items in min/max columns that are not bold/italics are Guaranteed by Design Characterization.
Note 3 – The input 0.1dB and 1dB compression points are linearity figures of merit. Refer to Absolute Maximum
Ratings section for the maximum RF input power and Figure 1 for maximum operating RF input power.
Note 4 – F
RF
= 1GHz.
Note 5 – Minimum time required between switching of states =1/ (Maximum Switching Rate).
Note 6 – Spurious due to onꢁchip negative voltage generator. Typical generator fundamental frequency is 2.2 MHz.
T
ABLE
1: S
WITCH
C
ONTROL
T
RUTH
T
ABLE
Mode
All off
V3
0
0
0
0
1
1
1
1
V2
0
0
1
1
0
0
1
1
V1
0
1
0
1
0
1
0
1
RF1 on
RF2 on
RF3 on
RF4 on
RF5 on
All off
All off
T
YPICAL
O
PERATING
C
ONDITIONS
(TOC)
Unless otherwise noted for the TOC graphs on the following pages, the following conditions apply.
•
•
•
•
•
•
•
•
•
•
V
DD
= 3.3 V.
T
CASE
= +25 ºC (T
CASE
= Temperature of exposed paddle).
F
RF
= 2000 MHz.
RFX is the driven RF port and RFC is the output port.
Pin = 10 dBm for all small signal tests.
Pin = +15 dBm/tone applied to selected RFX port for two tone linearity tests.
Two tone frequency spacing = 5 MHz.
Z
S
= Z
L
= 50 ohms.
All unused RF ports terminated into 50 ohms.
For Insertion Loss and Isolation plots, RF trace and connector losses are de-embedded (see
EVKIT Board and Connector loss plot).
•
Plots for Isolation and Insertion Loss over temperature and voltage are for a typical path. For
performance of a specific path, refer to the online S-Parameter file.
Rev 2 05/11/2016
5
High Reliability SP5T RF Switch
F2915
YPICAL
T
O
PERATING
C
ONDITIONS
(- 1 -)
Insertion Loss vs. Selected Switch Path
Insertion Loss vs. Temperature
0
0
RF1
RF2
RF3
RF4
RF5
-40C
25C
-0.5
-1
-0.5
-1
105C
-1.5
-2
-1.5
-2
-2.5
-3
-2.5
-3
0
1
2
3
4
5
6
6
6
7
8
8
8
0
1
2
3
4
5
6
6
6
7
8
8
8
Frequency (GHz)
Frequency (GHz)
Insertion Loss vs. Voltage
RFX
ꢁ
RFC Isolation vs. Temperature
0
0
2.7V
3.3V
5.0V
5.5V
-40C
25C
-10
-20
-30
-40
-50
-60
-70
-80
-90
-0.5
-1
105C
-1.5
-2
-2.5
-3
0
1
2
3
4
5
7
0
1
2
3
4
5
7
Frequency (GHz)
Frequency (GHz)
RFX
ꢁ
RFC Isolation vs. Voltage
RFX
ꢁ
RFX Isolation vs. Temperature
0
0
2.7V
-40C
25C
-10
-20
-10
-20
-30
-40
-50
-60
-70
-80
-90
3.3V
5.0V
5.5V
105C
-30
-40
-50
-60
-70
-80
-90
-100
-110
0
1
2
3
4
5
7
0
1
2
3
4
5
7
Frequency (GHz)
Frequency (GHz)
High Reliability SP5T RF Switch
6
Rev 2 05/11/2016
F2915
T
YPICAL
O
PERATING
C
ONDITIONS
(- 2 -)
RFX
ꢁ
RFX Isolation vs. Voltage
RFX Return Loss vs. Selected RFX Port
0
0
2.7V
3.3V
5.0V
5.5V
-10
-20
-10
-20
-30
-40
-30
-40
-50
-60
-70
-80
RF1
RF2
RF3
RF4
RF5
-90
-100
-110
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
Frequency (GHz)
Frequency (GHz)
RFX Selected Return Loss vs. Temperature
RFX Selected Return Loss vs. Voltage
0
0
-10
-20
-30
-40
-10
-20
-30
-40
2.7V
3.3V
5.0V
5.5V
-40C
25C
105C
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
Frequency (GHz)
Frequency (GHz)
RFC Return Loss vs. Selected RFX Port
RFC Return Loss with RFX Selected vs. Temperature
0
0
-10
-20
-30
-40
-10
-20
RF1
RF2
RF3
RF4
RF5
-30
-40C
25C
105C
-40
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
Frequency (GHz)
Frequency (GHz)
Rev 2 05/11/2016
7
High Reliability SP5T RF Switch
F2915
YPICAL
T
O
PERATING
C
ONDITIONS
(- 3 -)
RFC Return Loss with RFX Selected vs. Voltage
RFX Terminated Return Loss vs. RFX Port
0
0
-10
-20
-30
-40
-50
-10
-20
-30
-40
RF1
RF2
RF3
RF4
RF5
2.7V
3.3V
5.0V
5.5V
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
Frequency (GHz)
Frequency (GHz)
RFX Terminated Return Loss vs. Temperature
RFX Terminated Return Loss vs. Voltage
0
0
-10
-20
-30
-40
-50
-10
-20
-30
-40
-50
2.7V
3.3V
5.0V
5.5V
-40C
25C
105C
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
Frequency (GHz)
Frequency (GHz)
Return Loss (During Switching) vs. Time
VSWR (During Switching) vs. Time
0
3
RFX Term —> RFX Active
RFX Active —> RFX Term
2.8
2.6
2.4
2.2
2
-5
-10
-15
-20
-25
-30
1.8
1.6
1.4
1.2
1
RFX Term —> RFX Active
RFX Active —> RFX Term
-35
-40
0
0.05 0.1
0.15 0.2
0.25 0.3
0.35 0.4
0
0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4
Time (µsec)
Time (µsec)
High Reliability SP5T RF Switch
8
Rev 2 05/11/2016
F2915
T
YPICAL
O
PERATING
C
ONDITIONS
(- 4 -)
RFX Switching Time [RFX Terminated to RFX Active]
0.5
RFX Switching Time [RFX Active to RFX Terminated]
0
-10
-20
-30
-40
-50
-60
-70
50% CTRL to Insertion Loss
0.4
50% CTRL to Isolation
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
-0.4
-0.5
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
1
4
8
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
1
Time (µsec)
Time (µsec)
RFX IIP3 vs. Selected RFX Port
70
RFX IIP3 vs. Temperature and Voltage
70
60
50
40
30
20
10
0
60
50
40
30
RF1
RF2
RF3
RF4
RF5
-40C, 2.7V
-40C, 5.0V
25C, 3.0V
25C, 5.5V
105C, 3.3V
-40C, 3.0V
-40C, 5.5V
25C, 3.3V
105C, 2.7V
105C, 5V
-40C, 3.3V
25C, 2.7V
25C, 5.0V
105C, 3V
105C, 5.5V
20
10
0
0.5
1
1.5
2
2.5
3
3.5
0.5
1
1.5
2
2.5
3
3.5
4
Frequency (GHz)
Frequency (GHz)
EVKIT Trace and Connector Loss vs. Temperature
0
-40C
25C
-0.2
-0.4
-0.6
-0.8
-1
105C
-1.2
0
1
2
3
4
5
6
7
Frequency (GHz)
Rev 2 05/11/2016
9
High Reliability SP5T RF Switch
F2915
P
ACKAGE
D
RAWING
(4mm x 4mm 24ꢁpin QFN), NBG24
N
OTE
: T
HE
F2915
USES THE
P3
EXPOSED PADDLE DIMENSIONS NOTED BELOW
High Reliability SP5T RF Switch
10
Rev 2 05/11/2016
F2915
L
AND
P
ATTERN
D
IMENSION
Land Pattern to Support 2.7 mm x 2.7 mm Exposed Paddle Version
(See Version P3 of Package Drawing)
Rev 2 05/11/2016
11
High Reliability SP5T RF Switch
F2915
IN
P
D
IAGRAM
1
2
3
4
5
6
18
17
16
15
14
13
GND
RF5
V2
Control
C
i
rcuit
E.P.
V1
50
Ω
50
Ω
VDD
GND
RF1
GND
GND
50
Ω
RF4
50
Ω
50
Ω
GND
GND
P
IN
D
ESCRIPTION
Pin
Name
Function
1, 3, 4, 6, 7, 9, 10, 12,
13, 15, 21, 23, 24
GND
RF5
RF4
RF3
RF2
RF1
VDD
Ground these pins as close to the device as possible.
RF5 Port.
Matched to 50 ohms.
If this pin is not 0V DC, then an external
coupling capacitor must be used.
2
5
RF4 Port.
Matched to 50 ohms.
If this pin is not 0V DC, then an external
coupling capacitor must be used.
RF3 Port.
Matched to 50 ohms.
If this pin is not 0V DC, then an external
coupling capacitor must be used.
8
RF2 Port.
Matched to 50 ohms.
If this pin is not 0V DC, then an external
coupling capacitor must be used.
11
14
16
RF1 Port.
Matched to 50 ohms.
If this pin is not 0V DC, then an external
coupling capacitor must be used.
Power Supply. Bypass to GND with capacitors shown in the Typical
Application Circuit as close as possible to pin.
17
18
19
V1
V2
V3
Control pin to set switch state.
See Table 1.
Control pin to set switch state.
See Table 1.
Control pin to set switch state.
See Table 1.
External VSS negative voltage control. Connect to ground to enable on chip
negative voltage generator. To bypass and disable on chip generator
connect this pin to an external VSS.
20
22
VSS
EXT
RFC
RF Common Port.
Matched to 50 ohms when one of the 5 RF ports is
selected. If
this pin is not 0V DC, then an external coupling capacitor must
be used.
Exposed Pad. Internally connected to GND. Solder this exposed pad to a
PCB pad that uses multiple ground vias to provide heat transfer out of the
device into the PCB ground planes. These multiple ground vias are also
required to achieve the specified RF performance.
25
— EP
High Reliability SP5T RF Switch
12
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F2915
A
PPLICATIONS NFORMATION
I
Default Start-up
There are no internal pullꢁup or pullꢁdown resistors on the Control pins.
Logic Control
Control pins V1, V2, and V3 are used to set the state of the SP5T switch (see Table 1).
External Vss
The F2915 is designed with an onꢁchip negative voltage generator.
This onꢁchip generator is enabled by
connecting pin 20 of the device to ground. To disable the onꢁchip generator apply a negative voltage to pin 20
(VSSEXT) of the device within the range stated in the Recommended Operating Conditions Table.
Power Supplies
A common VDD power supply should be used for all pins requiring DC power.
All supply pins should be
bypassed with external capacitors to minimize noise and fast transients. Supply noise can degrade noise figure
and fast transients can trigger ESD clamps and cause them to fail. Supply voltage change or transients should
have a slew rate smaller than 1 V / 20 µS.
In addition, all control pins should remain at 0 V (+/ꢁ0.3 V) while
the supply voltage ramps or while it returns to zero.
Control Pin Interface
If control signal integrity is a concern and clean signals cannot be guaranteed due to overshoot, undershoot,
ringing, etc., the following circuit at the input of each control pin is recommended. This applies to control pins
17, 18, and 19 as shown below.
Rev 2 05/11/2016
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High Reliability SP5T RF Switch
F2915
IT
E
V
K
P
ICTURES
Top View
Bottom View
High Reliability SP5T RF Switch
14
Rev 2 05/11/2016
F2915
EV
KIT
/ A
PPLICATIONS
C
IRCUIT
Rev 2 05/11/2016
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High Reliability SP5T RF Switch
F2915
EVK
IT
BOM
Part
Reference
QTY
DESCRIPTION
Mfr. Part #
Mfr.
C1, C3, C5, C7,
C8, C9
6
100 pF ±5%, 50V, C0G Ceramic Capacitor (0402)
GRM1555C1H101J
Murata
C2
0
0
1
3
3
1
1
8
1
1
1
Not Installed (0603)
C4
C6
Not Installed (0603)
1000 pF ±5%, 50V, C0G Ceramic Capacitor (0603)
0 Ω ±1%, 1/10W, Resistor (0402)
100 kΩ ±1%, 1/10W, Resistor (0402)
15 kΩ ±1%, 1/10W, Resistor (0402)
22 kΩ ±1%, 1/10W, Resistor (0402)
Edge Launch SMA (0.375 inch pitch ground tabs)
CONN HEADER VERT DBL 10 X 2 POS GOLD
SP5T Switch 4 mm x 4 mm QFN24ꢁEP
Printed Circuit Board
GRM1885C1H102J
ERJꢁ2GE0R00X
ERJꢁ2RKF1003X
ERJꢁ2RKF1502X
ERJꢁ2RKF2202X
142ꢁ0701ꢁ851
Murata
Panasonic
Panasonic
Panasonic
Panasonic
Emerson Johnson
FCI
R1, R2, R3
R4, R5, R6
R7
R8
J1ꢁJ8
J9
67997ꢁ120HLF
U1
F2915NBGK
IDT
F29XX EVKIT Rev 02.0
IDT
T
OP
M
ARKINGS
Part Number
Assembler
IDTF2915
NBGK
Z1528UZL
Code
ASM
Date Code [YYWW]
(Week 28 of 2015)
Test
Step
High Reliability SP5T RF Switch
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F2915
EV
KIT
O
PERATION
External Supply Setup
Set up a VDD power supply in the voltage range of 2.7 V to 5.5 V and disable the power supply output.
If using the onꢁchip negative voltage generator install a 2ꢁpin shunt to short pins 3 and 4 of J9.
If an external negative voltage supply is to be used set its voltage within the range of ꢁ3.6 V to
ꢁ3.2 V and disable it. Also, be sure there are no jumper connections on pins 3 and 4 of J9.
Logic Control Setup
Using the EVKIT to manually set the control logic:
On connector J9 connect a 2ꢁpin shunt from pin 7 (VDD) to pin 8 (VDD_CTRL). This connection provides
the VDD voltage supply to the Eval Board logic control pull up network.
On connector J9 connect a 2ꢁpin shunt from pin 9 (LVSEL2) to pin 10 (LVSEL). This connection enables R7
(15 kΩ) and R8 (22 kΩ) to form a voltage divider to set the proper logic control levels to support the full
voltage range of VDD. Note that when using the onꢁboard R7 / R8 voltage divider the current draw from
the VDD supply will be higher by approximately VDD / 37 kꢀ.
Connector J9 has 3 logic input pins: V1 (pin 20), V2 (pin 18), and V3 (pin 16). See Table 1 for Logic Truth
Table. With the pullup network enabled (as noted above), when these pins are left open a logic high will
be provided through pull up resistors R4, R5, and R6. To set a logic low to V1, V2, and V3 connect 2ꢁpin
shunts from pin 16 to pin 15, pin 18 to pin 17 and pin 20 to pin 19 respectively.
Using external control logic:
Pins 6, 7, 8, 9, and 10 of J9 should have no connection. External logic controls can be applied to J9 pins
16 (V3), 18 (V2) and 20 (V1). See Table 1 for Logic Truth Table.
Turn-on Procedure
Setup the supplies and Eval Board as noted in the
External Supply Setup
and
Logic Control Setup
sections above.
Connect the preset disabled VDD power supply to pin 2 (VDD) and pin 1 (GND) of J9.
If the external negative voltage source is to be used, connect the disabled supply to pin 4 (VSSEXT) and
pin 3 (GND) of J9. If using onꢁchip negative supply be sure the 2ꢁpin shunt is installed connecting pin 3 to
pin 4.
Enable the VDD supply then enable the VSSEXT supply (if used).
Set the desired logic setting using V1, V2, and V3 to achieve the desired Table 1 setting. Note that
external control logic should not be applied without VDD being applied first.
Turn-off Procedure
If using external control logic V1, V2, V3 must be set to a logic low.
Disable any external VSSEXT supply.
Disable the VDD supply.
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High Reliability SP5T RF Switch
F2915
EVISION
R
H
ISTORY
S
HEET
Rev
Date
Page
Description of Change
O
1
2
2015ꢁDecꢁ11
2016ꢁFebꢁ22
2016ꢁMayꢁ05
Initial Release
1, 2, 3, 4
2, 4, 5
Added min/max limits. Increased frequency range. Updated ESD values.
Added new Guaranteed by Design parameters to specification table.
High Reliability SP5T RF Switch
18
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F2915
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6024 Silver Creek Valley Road
San Jose, CA 95138 USA
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Tech Support
1-800-345-7015 or 408-284-8200
Fax: 408-284-2775
DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT’s sole discretion.
Performance specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer
products. The
information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT’s products for
any particular purpose, an implied warranty of merchantability, or nonꢁinfringement of the intellectual property rights of others.
This document is presented only as a guide and does not convey any
license under intellectual property rights of IDT or any third parties.
IDT’s products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can
be reasonably expected to significantly affect the health or safety of users.
Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries.
Other trademarks used herein are
the property of IDT or their respective third party owners.
Copyright ©2015. Integrated Device Technology, Inc. All rights reserved.
Rev 2 05/11/2016
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High Reliability SP5T RF Switch
