RENESAS-UPC2749TB-E3-A
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April 1
st
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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µ
PC2749TB
3 V,
SUPER MINIMOLD SILICON MMIC
AMPLIFIER FOR MOBILE COMMUNICATIONS
DESCRIPTION
The
µ
PC2749TB is a silicon monolithic integrated circuit designed as amplifier for mobile communications.
Due to
wideband response at 2.9 GHz, this IC is recommendable for GPS receiver, wireless communication systems.
This IC is manufactured using NEC’s 20 GHz f
T
NESAT
TM
lll silicon bipolar process.
This process uses silicon
nitride passivation film and gold electrodes.
These materials can protect chip surface from external pollution and
prevent corrosion/migration.
Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
•
•
•
•
•
•
•
Supply voltage
Circuit current
Noise figure
Power gain
Saturated output power
Upper limit operating frequency
High-density surface mounting
: V
CC
= 2.7 to 3.3 V
: I
CC
= 6.0 mA TYP. @V
CC
= 3.0 V
: NF
= 4.0 dB TYP. @f = 1.9 GHz
: G
P
= 16.0 dB TYP. @f = 1.9 GHz
: P
O(sat)
=
−
6.0 dBm TYP. @f = 1.9 GHz
: f
u
= 2.9 GHz TYP. @3 dB down below from gain at f = 0.9 GHz
: 6-pin
super minimold package (2.0
×
1.25
×
0.9 mm)
APPLICATIONS
•
•
GPS receiver
Wireless LAN
ORDERING INFORMATION
Part Number
Package
6-pin super minimold
Marking
C1U
Supplying Form
Embossed tape 8 mm wide
µ
PC2749TB-E3
•
•
•
1, 2, 3 pins face the perforation side of the tape
Qty 3 kpcs/reel
Remark
To order evaluation samples, please contact your local NEC sales office.
Part number for sample order:
µ
PC2749TB
Caution Electro-static
sensitive devices
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. P13489EJ3V0DS00 (3rd edition)
Date Published
March 2001 N
CP(K)
Printed in Japan
The mark
shows major revised points.
©
1998, 2001
µ
PC2749TB
PIN CONNECTIONS
Pin No.
Pin Name
INPUT
GND
(Top View)
(Bottom View)
1
2
3
4
5
6
3
2
1
4
5
6
4
5
6
3
2
1
GND
OUTPUT
GND
V
CC
PRODUCT LINE-UP (T
A
= +25
°
C
,
V
CC
= 3.0 V, Z
S
= Z
L
= 50
Ω
)
f
u
P
O(sat)
G
P
NF
I
CC
Part No.
Package
Marking
C1U
(GHz)
(dBm)
(dB)
(dB)
(mA)
µ
PC2749T
µ
PC2749TB
µ
PC2745T
µ
PC2745TB
µ
PC2746T
µ
PC2746TB
µ
PC2747T
µ
PC2747TB
µ
PC2748T
µ
PC2748TB
2.9
2.7
−
6.0
−
1.0
0
16
12
19
12
19
4.0
6.0
4.0
3.3
2.8
6.0
7.5
7.5
5.0
6.0
6-pin minimold
6-pin super minimold
6-pin minimold
C1Q
C1R
C1S
C1T
6-pin super minimold
6-pin minimold
1.5
6-pin super minimold
6-pin minimold
1.8
−
7.0
−
3.5
6-pin super minimold
6-pin minimold
0.2 to 1.5
6-pin super minimold
Remark
Typical performance.
Please refer to
ELECTRICAL CHARACTERISTICS
in detail.
Caution The
package size distinguishes between minimold and super minimold.
2
Data Sheet
P13489EJ3V0DS
µ
PC2749TB
SYSTEM APPLICATION EXAMPLE
EXAMPLE OF GPS RECEIVER
Pre Amp. Unit
RF Unit
RF Amp.
Mixer IF
Amp.
B.P.F.
B.P.F.
IF Filter
PLL
µ
µ
PC2749TB
PC2749TB
LNA
VCO
Loop Filter
:
µ
PC2749TB applicable
3
Data Sheet
P13489EJ3V0DS
µ
PC2749TB
PIN EXPLANATION
Pin
Pin
No.
Applied
Voltage
(V)
Note
Pin Name
INPUT
Function and Applications
Internal Equivalent Circuit
Voltage (V)
1
–
0.82
Signal input pin. A internal
matching circuit, configured
with resistors, enables 50
Ω
connection over a wide band.
This pin must be coupled to
signal source with capacitor
for DC cut.
2
3
5
GND
0
–
Ground pin.
This pin should
be connected to system
ground with minimum
6
4
inductance. Ground
pattern
on the board should be
formed as wide as possible.
All the ground pins must be
connected together with wide
ground pattern to decrease
impedance difference.
1
4
OUTPUT
–
2.87
Signal output pin. A internal
matching circuit, configured
with resistors, enables 50
Ω
connection over a wide band.
This pin must be coupled to
next stage with capacitor for
DC cut.
3
2
5
6
V
CC
2.7 to 3.3
–
Power supply pin.
This pin
should be externally equipped
with bypass capacity to
minimize ground impedance.
Note
Pin voltage is measured at V
CC
= 3.0 V.
4
Data Sheet
P13489EJ3V0DS
µ
PC2749TB
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply Voltage
Symbol
V
CC
Conditions
Ratings
Unit
V
T
A
= +25°C
T
A
= +25°C
4.0
15
Circuit Current
I
CC
mA
mW
Power Dissipation
P
D
Mounted on double-sided copper clad
50
×
50
×
1.6 mm epoxy glass PWB,
T
A
= +85°C
270
Operating Ambient Temperature
Storage Temperature
Input Power
T
A
T
stg
P
in
−
40 to +85
−
55 to +150
0
°C
°C
T
A
= +25°C
dBm
RECOMMENDED OPERATING RANGE
Parameter
Supply Voltage
Symbol
V
CC
MIN.
2.7
TYP.
3.0
MAX.
3.3
Unit
V
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, T
A
= +25
°
C
,
V
CC
= 3.0 V, Z
S
= Z
L
= 50
Ω
)
Parameter
Circuit Current
Symbol
I
CC
Test Conditions
MIN.
4.0
TYP.
6.0
MAX.
8.0
18.5
–
Unit
mA
dB
No Signal
Power Gain
G
P
f = 1.9 GHz
13.0
– 9.0
–
16.0
– 6.0
4.0
Saturated Output Power
Noise Figure
P
O(sat)
NF
f = 1.9 GHz, P
in
= –
6 dBm
f = 1.9 GHz
dBm
dB
5.5
–
Upper Limit Operating
Frequency
f
u
3 dB down below flat gain at
f = 0.9 GHz
2.5
2.9
GHz
Isolation
ISL
RL
in
RL
out
f = 1.9 GHz
f = 1.9 GHz
f = 1.9 GHz
25
7
30
10
–
–
–
dB
dB
dB
Input Return Loss
Output Return Loss
9.5
12.5
STANDARD CHARACTERISTICS FOR REFERENCE (T
A
= +25
°
C
,
V
CC
= 3.0 V, Z
S
= Z
L
= 50
Ω
)
Parameter
Power Gain
Symbol
G
P
Test Conditions
Reference Value
Unit
dB
f = 0.9 GHz
f = 0.9 GHz
14.5
3.2
Noise Figure
NF
dB
3rd Order Intermodulation
Distortion
IM
3
P
O(each)
= –
20 dBm
– 33
dBc
f
1
= 1.900 GHz, f
2
= 1.902 GHz
Gain 1 dB Compression Output
Power
P
O(1 dB)
f = 1.9 GHz
– 12.5
dBm
5
Data Sheet
P13489EJ3V0DS
µ
PC2749TB
TEST CIRCUIT
V
1 000 pF
CC
C
3
6
50
Ω
50
Ω
OUT
C
1
C
2
1
4
IN
1 000 pF
1 000 pF
2, 3, 5
EXAMPLE OF APPLICATION CIRCUIT
V
CC
1 000 pF
1 000 pF
C
3
C
5
6
6
50
Ω
50
Ω
C
1
C
4
C
2
1
4
1
4
IN
OUT
1 000 pF
1 000 pF
1 000 pF
2, 3, 5
2, 3, 5
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
CAPACITORS FOR THE V
CC
, INPUT AND OUTPUT PINS
1 000 pF capacitors are recommendable as bypass capacitor for V
CC
pin and coupling capacitors for input/output
pins.
Bypass capacitor for V
CC
pin is intended to minimize V
CC
pin’s ground impedance.
Therefore, stable bias can be
supplied against V
CC
fluctuation.
Coupling capacitors for input/output pins are intended to minimize RF serial impedance and cut DC.
To get a flat gain from 100 MHz up, 1 000 pF capacitors are assembled on the test circuit.
[Actually, 1 000 pF
capacitors give flat gain at least 10 MHz.
In the case of under 10 MHz operation, increase the value of coupling
capacitor such as 2 200 pF.
Because the coupling capacitors are determined by the equation of C = 1/(2
π
fZs).]
6
Data Sheet
P13489EJ3V0DS
µ
PC2749TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
AMP-2
Top View
IN
OUT
C
C
Mounting Direction
V
CC
C
Notes
COMPONENT LIST
1.
30
×
30
×
0.4 mm double-sided copper clad polyimide board.
2.
Back side:
GND pattern
Value
C
1 000 pF
3.
Solder plated on pattern
4.
: Through
holes
For more information on the use of this IC, refer to the following application note:
USAGE AND APPLICATIONS
OF 6-PIN MINI-MOLD, 6-PIN SUPER MINI-MOLD SILICON HIGH-FREQUENCY WIDEBAND AMPLIFIER MMIC
(P11976E)
.
7
Data Sheet
P13489EJ3V0DS
µ
PC2749TB
TYPICAL CHARACTERISTICS (Unless
otherwise specified, T
A
= +25°C)
CIRCUIT CURRENT vs.
OPERATING AMBIENT TEMPERATURE
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
10
10
No signal
CC
= 3.0 V
No signal
V
8
6
4
2
0
8
6
4
2
0
0
1
2
3
4
– 60 –
40 –
20
0
+20 +40 +60 +80
+100
(
°
C)
Supply Voltage
V
CC
(V)
Operating Ambient Temperature
T
A
POWER GAIN vs. FREQUENCY
POWER GAIN vs. FREQUENCY
25
20
15
10
5
25
20
15
10
5
V
CC
= 3.0 V
V
CC
= 3.3 V
T
A
= –
40
°
C
V
CC
= 3.0 V
T
A
= +25
°
C
V
CC
= 2.7 V
T
A
= +85
°
C
0
0
0.1
0.3
1.0
3.0
0.1
0.3
1.0
3.0
Frequency f
(GHz)
Frequency f
(GHz)
NOISE FIGURE vs. FREQUENCY
6
V
CC
= 2.7 V
5
4
3
2
1
V
CC
= 3.0 V
V
CC
= 3.3 V
0.1
0.3
1.0
3.0
Frequency f
(GHz)
8
Data Sheet
P13489EJ3V0DS
µ
PC2749TB
INPUT RETURN LOSS, OUTPUT RETURN
LOSS vs. FREQUENCY
ISOLATION vs. FREQUENCY
0
– 10
– 20
– 30
– 40
– 50
0
V
CC
= 3.0 V
V
CC
= 3.0 V
RL
out
– 10
– 20
– 30
– 40
– 50
RL
in
0.1
0.3
1.0
3.0
0.1
0.3
1.0
3.0
Frequency f
(GHz)
Frequency f
(GHz)
OUTPUT POWER vs. INPUT POWER
OUTPUT POWER vs. INPUT POWER
0
– 5
0
– 5
f = 1.9 GHz
f = 1.9 GHz
CC
= 3.0 V
V
CC
= 3.3 V
T
A
= +85
°
C
V
CC
= 3.0 V
V
T
A
= –
40
°
C
– 10
– 15
– 20
– 25
– 30
– 10
– 15
– 20
– 25
– 30
T
A
= –
40
°
C
= +25
°
C
T
A
V
CC
= 2.7 V
T
A
= +25
°
C
T =
+85
°
C
A
– 40 –
35 –
30 –
25 –
20 –
15 –
10 –
5
Input Power
P
in
(dBm)
0
– 40 –
35 –
30 –
25 –
20 –
15 –
10 –
5
Input Power
P
in
(dBm)
0
3RD ORDER INTERMODULATION DISTORTION
vs. OUTPUT POWER OF EACH TONE
SATURATED OUTPUT POWER vs.
FREQUENCY
0
– 50
f
f
1
2
= 1.900 GHz
= 1.902 GHz
P
in
= –
6 dBm
V
CC
= 3.3 V
– 45
– 40
– 35
– 30
– 25
– 20
– 15
– 10
– 5
V
CC
= 3.0 V
– 5
– 10
– 15
– 20
– 25
V
CC
= 3.3 V
V
CC
= 2.7 V
V
CC
= 3.0 V
V
CC
= 2.7 V
0
0.1
0.3
1.0
3.0
– 30 –
28 –
26 –
24 –
22 –
20 –
18 –
16 –
14 –
12 –
10
Output Power of Each Tone
P
O(each)
(dBm)
Frequency f
(GHz)
Remark
The graphs indicate nominal characteristics.
9
Data Sheet
P13489EJ3V0DS
µ
PC2749TB
S-PARAMETERS (T
A
= +25°C, V
CC
= 3.0 V)
S
11
-FREQUENCY
2.0 G
3.0 G
1.0 G
0.1 G
S
22
-FREQUENCY
1.0 G
2.0 G
0.1 G
3.0 G
10
Data Sheet
P13489EJ3V0DS
µ
PC2749TB
TYPICAL S-PARAMETER VALUES (T
A
= +25°C)
V
CC
= 3.0 V, I
CC
= 6.5 mA
FREQUENCY
MHz
S
21
S
12
S
22
K
S
11
MAG.
ANG.
MAG.
ANG.
MAG.
ANG.
MAG.
ANG.
100.0000
200.0000
300.0000
400.0000
500.0000
600.0000
700.0000
800.0000
900.0000
1000.0000
1100.0000
1200.0000
1300.0000
1400.0000
1500.0000
1600.0000
1700.0000
1800.0000
1900.0000
2000.0000
2100.0000
2200.0000
2300.0000
2400.0000
2500.0000
2600.0000
2700.0000
2800.0000
2900.0000
3000.0000
3100.0000
0.021
0.038
0.034
0.052
0.062
0.079
0.097
0.116
0.134
0.156
0.178
0.195
0.214
0.229
0.249
0.259
0.264
0.259
0.248
0.238
0.218
0.204
0.183
0.156
0.140
0.119
0.095
0.078
0.066
0.070
0.082
13.0
– 30.5
– 71.8
– 120.5
– 149.9
– 169.7
173.6
160.5
149.3
138.8
128.5
118.7
108.7
99.5
4.096
4.216
4.282
4.403
4.390
4.399
4.566
4.667
4.843
5.016
5.305
5.660
5.835
6.148
6.364
6.611
6.577
6.549
6.407
6.321
6.046
5.862
5.696
5.430
5.282
5.013
4.849
4.596
4.446
4.163
3.966
– 1.9
– 7.8
0.002
0.001
0.001
0.002
0.002
0.003
0.005
0.007
0.008
0.009
0.014
0.016
0.020
0.022
0.025
0.028
0.032
0.034
0.036
0.037
0.038
0.039
0.040
0.041
0.042
0.040
0.042
0.042
0.042
0.044
0.042
– 1.1
75.4
0.024
0.033
0.064
0.080
0.103
0.127
0.151
0.174
0.197
0.220
0.240
0.262
0.279
0.287
0.294
0.294
0.283
0.272
0.256
0.234
0.213
0.193
0.174
0.164
0.152
0.142
0.146
0.149
0.154
0.171
0.181
165.8
113.6
96.1
66.82
129.26
90.16
45.30
57.58
34.08
22.08
14.70
12.29
10.00
6.15
– 15.5
– 21.0
– 26.6
– 31.6
– 36.7
– 41.3
– 46.8
– 52.6
– 60.3
– 67.1
– 76.2
– 84.5
– 93.8
– 103.6
– 113.5
– 123.4
– 132.9
– 140.8
– 148.8
– 156.5
– 163.2
– 170.5
– 176.3
177.2
170.9
164.9
158.1
152.3
145.3
141.5
129.9
134.1
128.3
132.9
131.5
129.3
124.6
131.4
122.5
118.6
114.4
107.7
104.3
96.8
87.9
76.9
68.6
60.6
53.7
44.9
36.1
28.0
17.3
5.13
8.6
3.80
– 2.0
3.23
89.4
– 13.5
– 23.6
– 33.8
– 44.1
– 53.8
– 61.4
– 69.5
– 73.8
– 79.5
– 84.1
– 82.1
– 84.5
– 85.5
– 83.9
– 91.8
– 92.8
– 99.6
2.72
79.9
2.35
69.8
2.09
60.3
91.8
1.99
50.9
83.3
1.97
43.6
78.5
1.99
35.9
75.1
2.04
30.1
70.4
2.08
25.3
68.3
2.15
21.2
60.7
2.25
18.8
61.6
2.25
18.7
58.1
2.53
21.2
55.1
2.46
30.0
51.9
2.62
44.5
44.7
2.70
66.0
41.9
2.73
78.1
37.1
2.97
11
Data Sheet
P13489EJ3V0DS
µ
PC2749TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
2.1±0.1
1.25±0.1
0.1 MIN.
12
Data Sheet
P13489EJ3V0DS
µ
PC2749TB
NOTES ON CORRECT USE
(1) Observe
precautions for handling because of electro-static sensitive devices.
(2) Form
a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The
bypass capacitor should be attached to V
CC
line.
(4) The
DC cut capacitor must be attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions.
For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Infrared Reflow
Soldering Conditions
Recommended Condition Symbol
IR35-00-3
Package peak temperature:
235
°
C
o
r below
Time: 30
seconds or less (at 210
°
C
)
Count: 3, Exposure
limit: None
Note
VPS
Package peak temperature:
215
°
C
o
r below
Time: 40
seconds or less (at 200
°
C
)
Count: 3, Exposure
limit: None
Note
VP15-00-3
WS60-00-1
–
Wave Soldering
Partial Heating
Soldering bath temperature:
260
°
C
o
r below
Time: 10
seconds or less
Count: 1, Exposure
limit: None
Note
Pin temperature:
300
°
C
o
r below
Time: 3
seconds or less (per side of device)
Exposure limit:
None
Note
Note
After opening the dry pack, keep it in a place below 25
°
C
a
nd 65% RH for the allowable storage period.
Caution Do
not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E)
.
13
Data Sheet
P13489EJ3V0DS
µ
PC2749TB
[MEMO]
14
Data Sheet
P13489EJ3V0DS
µ
PC2749TB
[MEMO]
15
Data Sheet
P13489EJ3V0DS
µ
PC2749TB
NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.
•
The information in this document is current as of March, 2001. The information is subject to change
without notice.
For actual design-in, refer to the latest publications of NEC’s data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products.
Not all products
and/or types are available in every country.
Please check with an NEC sales representative for
availability and additional information.
•
•
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC.
NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products.
No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
•
•
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer’s equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely.
To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
“Standard”, “Special” and “Specific”.
The “Specific” quality grade applies only to semiconductor products
developed based on a customer-designated “quality assurance program” for a specific application.
The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
“Standard”: Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
“Special”: Transportation
equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
“Specific”: Aircraft,
aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is “Standard” unless otherwise expressly specified in NEC’s
data sheets or data books, etc.
If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC’s willingness
to support a given application.
(Note)
(1) “NEC”
as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) “NEC
semiconductor products” means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00.
4
