RENESAS-UPC3224TB-E3-A
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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µ
PC3224TB
5 V,
SILICON MMIC
WIDEBAND AMPLIFIER
DESCRIPTION
The
µ
PC3224TB is a silicon monolithic IC designed as IF amplifier for DBS tuners.
This IC is manufactured using
our 30 GHz f
max
UHS0 (Ultra High Speed Process) silicon bipolar process.
FEATURES
•
•
•
Wideband response
: f
u
= 3.2 GHz TYP. @ 3 dB bandwidth
Low current
Power gain
: I
CC
= 9.0 mA TYP.
: G
P
= 21.5 dB TYP. @ f = 1.0 GHz
: G
P
= 21.5 dB TYP. @ f = 2.2 GHz
: V
CC
= 4.5 to 5.5 V
•
•
Supply voltage
Port impedance
: input/output 50
Ω
APPLICATION
•
IF amplifiers in DBS converters etc.
ORDERING INFORMATION
Part Number
Package
6-pin super minimold
Marking
C3K
Supplying Form
•
Embossed tape 8 mm wide
µ
PC3224TB-E3
•
1, 2, 3 pins face the perforation side of tape
•
Qty 3 kpcs/reel
Remark
To order evaluation samples, contact your nearby sales office.
Part number for sample order:
µ
PC3224TB
Caution Observe
precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
Document No.
PU10490EJ01V0DS (1st edition)
Date Published
May 2004
CP(K)
Printed in Japan
NEC Compound Semiconductor Devices 2004
µ
PC3224TB
PIN CONNECTIONS
Pin No.
Pin Name
INPUT
GND
(Top View)
(Bottom View)
1
2
3
4
5
6
3
2
1
4
5
6
4
5
6
3
2
1
GND
OUTPUT
GND
V
CC
PRODUCT LINE-UP OF 5
V-BIAS SILICON MMIC MEDIUM WIDEBAND AMPLIFIER
(T
A
= +25
°
C, f = 1 GHz, V
CC
= V
out
= 5.0 V, Z
S
= Z
L
= 50
Ω
)
f
u
P
O (sat)
G
P
NF
I
CC
Part No.
Package
Marking
(GHz)
(dBm)
(dB)
(dB)
(mA)
µ
PC2711TB
µ
PC2712TB
µ
PC3215TB
Note
µ
PC3224TB
2.9
2.6
2.9
3.2
+1.0
+3.0
+3.5
+4.0
13
20
5.0
4.5
2.3
4.3
12
12
14
9.0
6-pin super minimold
C1G
C1H
C3H
C3K
20.5
21.5
Note
µ
PC3215TB is f = 1.5 GHz
Remark
Typical performance.
Please refer to
ELECTRICAL CHARACTERISTICS
in detail.
2
Data Sheet
PU10490EJ01V0DS
µ
PC3224TB
PIN EXPLANATIONS
PIN
Applied
Pin Voltage
Pin Name
Function and Applications
Note
(V)
No.
Voltage (V)
1
INPUT
–
0.91
Signal input pin.
A internal matching circuit, configured with resistors, enables 50
Ω
connection over a wide band.
A multi-feedback circuits is designed to cancel the deviations of h
FE
and
resistance.
This pin must be coupled to signal source with capacitor for DC cut.
4
6
OUTPUT
–
4.42
Signal output pin.
A internal matching circuit, configured with resistors, enables 50
Ω
connection over a wide band.
This pin must be coupled to next stage with capacitor for DC cut.
V
CC
4.5 to 5.5
–
–
Power suplly pin.
This pin should be externally equipped with bypass capacitor to minimize
its impedance.
2
3
5
GND
0
Ground pin.
This pin should be connected to system ground with minimum
inductance. Ground pattern on the board should be formed as wide as
possible.
All the ground pins must be connected together with wide ground pattern
to decrease impedance difference.
Note
Pin Voltage is measured at V
CC
= 5.0 V
3
Data Sheet
PU10490EJ01V0DS
µ
PC3224TB
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply Voltage
Symbol
Conditions
Ratings
6.0
Unit
V
V
CC
I
CC
P
D
T
A
= +25
°
C
T
A
= +25
°
C
T
A
= +85
°
C
Total Circuit Current
Power Dissipation
25
mA
mW
°
C
Note
270
Operating Ambient Temperature
Storage Temperature
Input Power
T
A
−
40 to +85
−
55 to +150
+10
T
stg
P
in
°
C
T
A
= +25
°
C
dBm
Note
Mounted on double-sided copper-clad 50
×
50
×
1.6 mm epoxy glass PWB
RECOMMENDED OPERATING RANGE
Parameter
Supply Voltage
Operating Ambient Temperature
Symbol
V
CC
Conditions
MIN.
4.5
TYP.
5.0
MAX.
Unit
V
5.5
T
A
−
40
+25
+85
°
C
ELECTRICAL CHARACTERISTICS
(T
A
= +25
°
C, V
CC
= 5.0 V, Z
S
= Z
L
= 50
Ω
)
Parameter
Symbol
I
CC
Test Conditions
No input signal
MIN.
7.0
TYP.
9.0
MAX.
12.0
24.0
24.5
−
Unit
mA
dB
Circuit Current
Power Gain
G
P
f = 1.0 GHz, P
in
=
−
30 dBm
f = 2.2 GHz, P
in
=
−
30 dBm
f = 1.0 GHz, P
in
=
−
5 dBm
f = 2.2 GHz, P
in
=
−
5 dBm
19.0
18.5
+1.5
−
1.5
−
6.5
−
8.5
−
21.5
21.5
+4.0
+1.5
−
3.5
−
5.5
4.3
Saturated Output Power
P
O (sat)
dBm
dBm
dB
−
Gain 1 dB Compression Output
Power
P
O (1 dB)
f = 1.0 GHz
f = 2.2 GHz
−
−
Noise Figure
NF
f = 1.0 GHz
5.8
5.8
−
f = 2.2 GHz
−
4.3
Upper Limit Operating Frequency
Isolation
f
u
3 dB down below flat gain at f = 0.1 GHz
f = 1.0 GHz, P
in
=
−
30 dBm
f = 2.2 GHz, P
in
=
−
30 dBm
f = 1.0 GHz, P
in
=
−
30 dBm
f = 2.2 GHz, P
in
=
−
30 dBm
f = 1.0 GHz, P
in
=
−
30 dBm
f = 2.2 GHz, P
in
=
−
30 dBm
f = 0.1 to 2.2 GHz
2.8
3.2
GHz
dB
ISL
35.0
37.0
9.0
40.0
42.0
12.0
14.0
17.0
12.0
±
0.8
−
−
Input Return Loss
Output Return Loss
Gain Flatness
RL
in
RL
out
∆
G
P
−
dB
dB
dB
10.0
11.0
8.0
−
−
−
−
−
4
Data Sheet
PU10490EJ01V0DS
µ
PC3224TB
OTHER CHARACTERISTICS,
FOR REFERENCE PURPOSES ONLY
(T
A
= +25
°
C, V
CC
= 5.0 V, Z
S
= Z
L
= 50
Ω
)
Parameter
Symbol
OIP
3
Test Conditions
Reference Value
Unit
Output Intercept Point
f = 1.0 GHz
f = 2.2 GHz
+7.0
+5.5
dBm
5
Data Sheet
PU10490EJ01V0DS
µ
PC3224TB
TEST CIRCUIT
V
CC
C
4
1 000 pF
1 000 pF
C
3
6
50
Ω
IN
50
Ω
C
1
C
2
4
1
OUT
100 pF
100 pF
2, 3, 5
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
COMPONENTS OF TEST CIRCUIT FOR
MEASURING ELECTRICAL CHARACTERISTICS
Type
Value
100 pF
C
1
, C
2
C
3
Chip Capacitor
Chip Capacitor
1 000 pF
1 000 pF
C
4
Feed-through Capacitor
CAPACITORS FOR THE V
CC
, INPUT AND OUTPUT PINS
Capacitors of 1000 pF are recommendable as the bypass capacitor for the V
CC
pin and the coupling capacitors for
the input and output pins.
The bypass capacitor connected to the V
CC
pin is used to minimize ground impedance of V
CC
pin. So,
stable bias
can be supplied against V
CC
fluctuation.
The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial
impedance. Their
capacitances are therefore selected as lower impedance against a 50
Ω
load. The
capacitors thus
perform as high pass filters, suppressing low frequencies to DC.
To obtain a flat gain from 100 MHz upwards, 1 000 pF capacitors are used in the test circuit.
In the case of under
10 MHz operation, increase the value of coupling capacitor such as 10 000 pF.
Because the coupling capacitors are
determined by equation, C = 1/(2
π
Rfc).
6
Data Sheet
PU10490EJ01V0DS
µ
PC3224TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
AMP-2
IN
OUT
C1
C2
C3
V
CC
C4
COMPONENT LIST
Notes
Value
1. 30
×
30
×
0.4 mm double sided copper clad polyimide board.
2. Back
side: GND
pattern
C
1
, C
2
C
3
, C
4
100 pF
1 000 pF
3. Solder
plated on pattern
4.
: Through
holes
7
Data Sheet
PU10490EJ01V0DS
µ
PC3224TB
TYPICAL CHARACTERISTICS
(T
A
= +25
°
C , unless otherwise specified)
CIRCUIT CURRENT vs.
OPERATING AMBIENT TEMPERATURE
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
16
12
No input signal
No input signal
V
CC
= 5.0 V
14
12
11
10
9
T
A
=
+
85
˚C
10
8
T
A
=
+
25
˚C
6
8
4
7
2
T
A
=
−
40
˚C
6
0
0
1
2
3
4
5
6
−
60
−
40
−
20
0
+
20
+
40
+
60
+
80
+
100
Supply Voltage
V
CC
(V)
Operating Ambient Temperature
T (
°
C)
A
INPUT RETURN LOSS vs. FREQUENCY
POWER GAIN vs. FREQUENCY
25
23
21
19
17
15
T =
+
25
˚C
A
T
A
=
+
25
˚C
10
0
V
CC
= 5.5 V
−
10
−
20
−
30
V
CC
= 5.5 V
V
CC
= 5.0 V
V
CC
= 5.0 V
V
CC
= 4.5 V
V
CC
= 4.5 V
0.1
1.1
2.1
3.1
4.1
5.1
0.1
1.1
2.1
3.1
4.1
5.1
Frequency f
(GHz)
Frequency f
(GHz)
ISOLATION vs. FREQUENCY
OUTPUT RETURN LOSS vs. FREQUENCY
0
−
20
T
A
=
+
25
˚C
T
A
=
+
25
˚C
10
0
−
40
−
10
−
20
−
30
V
CC
= 4.5 V
−
60
V
CC
= 4.5 to 5.5 V
−
80
V
CC
= 5.0 to 5.5 V
−
100
0.1
1.1
2.1
3.1
4.1
5.1
0.1
1.1
2.1
3.1
4.1
5.1
Frequency f
(GHz)
Frequency f
(GHz)
Remark
The graphs indicate nominal characteristics.
8
Data Sheet
PU10490EJ01V0DS
µ
PC3224TB
POWER GAIN vs. FREQUENCY
INPUT RETURN LOSS vs. FREQUENCY
25
23
21
19
17
15
V
CC
= 5.0 V
V
CC
= 5.0 V
10
0
T =
−
40
˚C
A
T
A
=
+
25 to
+
85
˚C
−
10
−
20
−
30
T
A
=
+
85
˚C
T
A
=
−
40
˚C
T
A
=
+
25
˚C
0.1
1.1
2.1
3.1
4.1
5.1
0.1
1.1
2.1
3.1
4.1
5.1
Frequency f
(GHz)
Frequency f
(GHz)
ISOLATION vs. FREQUENCY
OUTPUT RETURN LOSS vs. FREQUENCY
0
−
20
V
CC
= 5.0 V
V
CC
= 5.0 V
10
0
−
40
−
10
−
20
−
30
T =
+
85
˚C
A
−
60
T =
−
40 to
+
85
˚C
A
−
80
T
A
=
+
25
˚C
T
A
=
−
40
˚C
−
100
0.1
1.1
2.1
3.1
4.1
5.1
0.1
1.1
2.1
3.1
4.1
5.1
Frequency f
(GHz)
Frequency f
(GHz)
Remark
The graphs indicate nominal characteristics.
9
Data Sheet
PU10490EJ01V0DS
µ
PC3224TB
OUTPUT POWER vs. INPUT POWER
OUTPUT POWER vs. INPUT POWER
10
5
10
5
f = 1.0 GHz
f = 1.0 GHz
CC
= 5.0 V
T
A
=
+
25 to
+
85
˚C
T
A
=
+
25
˚C
V
V
CC
= 5.5 V
0
0
V
CC
= 5.0 V
T
A
=
−
40
˚C
V
CC
= 4.5 V
−
5
−
10
−
15
−
5
−
10
−
15
−
20
−
2
0
40
−
−
35
−
30
−
25
−
20
−
15
−
10
−
5
0
5
10
−
40
−
35
−
30
−
25
−
20
−
15
−
10
−
5
0
5
10
Input Power
P
in
(dBm)
Input Power
P
in
(dBm)
OUTPUT POWER vs. INPUT POWER
OUTPUT POWER vs. INPUT POWER
10
5
10
f = 2.2 GHz
f = 2.2 GHz
T
A
=
+
25
˚C
T
A
=
+
25 to
+
85
˚C
V
CC
= 5.0 V
5
0
0
V
CC
= 5.5 V
V
CC
= 5.0 V
V
−
5
−
10
−
15
−
5
T
A
=
−
40
˚C
CC
= 4.5 V
−
10
−
15
−
2
0
40
−
2
0
40
−
−
35
−
30
−
25
−
20
−
15
−
10
−
5
0
5
10
−
−
35
−
30
−
25
−
20
−
15
−
10
−
5
0
5
10
Input Power
P
in
(dBm)
Input Power
P
in
(dBm)
OUTPUT POWER (2 tones), IM
3
OUTPUT POWER (2 tones), IM
3
vs. INPUT POWER
vs. INPUT POWER
10
10
f
f
1
= 1 000 MHz
= 1 001 MHz
f
f
1
= 2 200 MHz
= 2 201 MHz
V
CC
= 5.5 V
5.0 V
V
CC
= 5.5 V
5.0 V
P
out
P
out
2
2
0
−
10
−
20
−
30
−
40
−
50
−
60
−
70
0
−
10
−
20
−
30
−
40
−
50
−
60
−
70
4.5 V
5.0 V
4.5 V
4.5 V
5.5 V
5.5 V
5.0 V
4.5 V
IM
3
IM
3
V
CC
= 4.5 V
V
CC
= 5.5 V
CC
= 5.0 V
35 30
V
−
8
0
50
−
8
0
50
− −
−
−
45
−
40
−
−
−
25
−
20
−
15
−
10
−
5
0
45
−
40
−
35
−
30
−
25
−
20
−
15
−
10
−
5
0
Input Power
P
in
(dBm)
Input Power
P
in
(dBm)
Remark
The graphs indicate nominal characteristics.
10
Data Sheet
PU10490EJ01V0DS
µ
PC3224TB
S-PARAMETERS (T
A
= +25
°
C, V
CC
= 5.0 V)
S
11
−
FREQUENCY
2.2 GHz
1.0 GHz
S
22
−
FREQUENCY
1.0 GHz
2.2 GHz
11
Data Sheet
PU10490EJ01V0DS
µ
PC3224TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD
(UNIT: mm)
2.1±0.1
1.25±0.1
0.1 MIN.
12
Data Sheet
PU10490EJ01V0DS
µ
PC3224TB
NOTES ON CORRECT USE
(1) Observe
precautions for handling because of electro-static sensitive devices.
(2) Form
a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The
bypass capacitor should be attached to V
CC
line.
(4) The
DC cut capacitor must be each attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Soldering Conditions
Condition Symbol
IR260
Peak temperature (package surface temperature)
Time at peak temperature
: 260
°
C or below
: 10 seconds or less
: 60 seconds or less
: 120
±
30 seconds
: 3 times
Time at temperature of 220
°
C or higher
Preheating time at 120 to 180
°
C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Wave Soldering
Partial Heating
Peak temperature (molten solder temperature)
Time at peak temperature
: 260
°
C or below
WS260
HS350
: 10 seconds or less
Preheating temperature (package surface temperature)
: 120
°
C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (pin temperature)
: 350
°
C or below
Soldering time (per side of device)
: 3 seconds or less
: 0.2%(Wt.) or below
Maximum chlorine content of rosin flux (% mass)
Caution Do
not use different soldering methods together (except for partial heating).
13
Data Sheet
PU10490EJ01V0DS
µ
PC3224TB
•
The information in this document is current as of May, 2004. The information is subject to change
without notice.
For actual design-in, refer to the latest publications of NEC’s data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products.
Not all products
and/or types are available in every country.
Please check with an NEC sales representative for
availability and additional information.
•
•
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC.
NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products.
No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
•
•
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer’s equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely.
To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
“Standard”, “Special” and “Specific”.
The “Specific” quality grade applies only to semiconductor products
developed based on a customer-designated “quality assurance program” for a specific application.
The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
“Standard”: Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
“Special”: Transportation
equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
“Specific”: Aircraft,
aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is “Standard” unless otherwise expressly specified in NEC’s
data sheets or data books, etc.
If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC’s willingness
to support a given application.
(Note)
(1) “NEC” as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) “NEC semiconductor products” means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00.
4
–
0
110
14
Data Sheet
PU10490EJ01V0DS
µ
PC3224TB
For further information, please contact
NEC Compound Semiconductor Devices, Ltd.
E-mail: salesinfo@ml.ncsd.necel.com (sales and general)
techinfo@ml.ncsd.necel.com (technical)
5th Sales Group, Sales Division
TEL: +81-44-435-1588
FAX: +81-44-435-1579
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general)
TEL: +852-3107-7303
TEL: +886-2-8712-0478
FAX: +886-2-2545-3859
TEL: +82-2-558-2120
FAX: +82-2-558-5209
FAX: +852-3107-7309
Hong Kong Head Office
T
a
ipei Branch Office
Korea Branch Office
NEC Electronics (Europe) GmbH
TEL: +49-211-6503-0
FAX: +49-211-6503-1327
California Eastern Laboratories, Inc.
TEL: +1-408-988-3500
FAX: +1-408-988-0279
0401
