ROHM-Semicon-2SC2413KT146P
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2SC2413K
High-Frequenc
y
A
mplifer Transistor (25V, 50mA, 300MHz)
Datasheet
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l
Outline
SO
T
-346
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ꢀ
ꢀ
Parameter
Value
25V
SC-59
ꢀ
V
CEO
ꢀ
I
C
50mA
ꢀ
SMT3
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Features
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Inner circuit
1)Low collector capacitance. (Cob:Typ.1.3pF)
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Application
HIGH FREQUENC
Y
A
MPLIFIER, FREQUENCY CO
RTER
RF AMPLIFIER, LOCAL OSC
LL
TOR
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Packaging sp
ications
Basic
ordering Marking
unit.(pcs)
Package
size
Taping Reel
size Tape
width
Part No
Packa
code
(mm)
(mm)
SOT-346
(SMT3)
C2413K
2928
T146
180
8
3000
A
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© 2016 ROH
M
C
o., Ltd. All rights reserved.
1/6
20161028 – Rev.001
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2SC2413K
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Datasheet
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Absolute maximum ratings
(T
a
= 25°C)
Parameter
Symbol
V
CBO
V
CEO
V
EBO
I
C
Values
Unit
V
Collector-base voltage
Collector-emitter voltage
Emitter-base voltage
40
25
V
5
50
V
Collector current
mA
mW
℃
*1
P
D
Power dissipation
20
T
j
Junction temperature
Range of storage temperature
150
T
stg
–
o +150
℃
l
l
Electrical characteristics
(T
a
= 25°C)
V
ues
Parameter
Symbol
Condition
Unit
Min.
Typ.
Max.
Collector-base breakdown
voltage
BV
CBO
BV
CEO
I =
50
–
–
–
V
V
C
Collector-emitter breakdown
voltage
I =
1mA
25
–
BV
EB
O
Emitter-base breakdown voltage
Collector cut-off current
Emitter cut-off current
I =
50μA
5
–
–
–
V
nA
nA
mV
–
E
V
CB
V
EB
=
= 3V
–
500
500
300
270
I
EBO
–
–
100
–
Collector-emitter saturation v
ge
DC current gain
V
I
10mA, I
= 1mA
C
–
CE(sat)
B
h
FE
= 6
V
, I
=
1
mA
82
CE
CE
C
V
= 6
V
, I
= -1mA,
E
f
Transition frequency
O
tpu
acitance
150
–
300
1.3
–
MHz
pF
T
f = 100MHz
V
CB
= 6
V
, I
=
0
A,
E
C
ob
2.2
f = 1MHz
hFE values are calssified as follows :
rank
P
Q
–
–
–
–
h
FE
82-180
120-270
–
–
*1 Each terminal mounted on a reference land.
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2/6
20161028 – Rev.001
© 2016 ROH
M
C
o., Ltd. All rights reserved.
Datasheet
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2SC2413K
l
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Electrical characteristic curves
(T =
25°C)
a
Fig.1 Ground Emitter Propagation
Fig.2 Grounded Emitter Output
ꢀꢀꢀꢀ
Characteristics
ꢀꢀꢀꢀ
Characteristics
Fig.3 DC Current Gain vs. Co
tor
ig.4 DC Current Gain vs. Collector
ꢀꢀꢀꢀ
Current (I)
ꢀꢀꢀꢀ
Current (lI)
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3/6
20161028 – Rev.001
© 2015 ROH
M
C
o., Ltd. All rights reserved.
Datasheet
ꢀ ꢀ ꢀ
2SC2413K
l
l
Electrical characteristic curves
(T =
25°C)
a
Fig.5 Collector-Emitter Saturation Voltage
Fig.6 Collector-Emitter Saturation Voltage
ꢀꢀꢀꢀ
vs. Collector Current(l)
ꢀꢀꢀꢀ
vs. Collector Current(ll)
Fig.7 Base-Emitter Saturation
ltage
ig.8 Gain Bandwith Product vs.
ꢀꢀꢀꢀ
vs. Collector Current (
ꢀꢀꢀꢀ
Emitter Current
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4/6
20161028 – Rev.001
© 2016 ROH
M
C
o., Ltd. All rights reserved.
Datasheet
ꢀ ꢀ ꢀ
2SC2413K
l
l
Electrical characteristic curves
(T =
25°C)
a
Fig.9 Collector Output Capacitance vs.
ꢀꢀꢀꢀꢀ
Collector-Base Voltage
ꢀꢀꢀꢀꢀ
Emitter Input Capacitance vs.
ꢀꢀꢀꢀꢀ
Emitter-Base Voltage
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5/6
20161028 – Rev.001
© 2016 ROH
M
C
o., Ltd. All rights reserved.
Datasheet
2SC2413K
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Dimensions
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© 2016 ROH
M
C
o., Ltd. All rights reserved.
6/6
20161028 – Rev.001
Notice
Precaution on using ROHM Products
1. Our
Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.).
If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
(Note 1)
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (
“
Specific Applications
”
), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or
able for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM
’
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or Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
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b
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designs and manufactures its Products subject to strict quality cont
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products can fail or malfunction at a certain rate. Please be sure to implemen
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ury, damage to any property, which
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of safety measures:
[a] Installation of protection circuits or other protective devices to im
system safety
[b] Installation of redundant circuits to reduce the impact of sing
r multiple circuit fai
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d not under any special or
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isi
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f you intend to u
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elow), you
inde
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st
necessary:
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luding water, oils, chem
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c
where the Produc
a
e
xposed to direct sunlight or dust
[c] Use of our Products in places wh
the Products are exposed to sea wind or corrosive gases, including Cl
2
,
H
2
S, NH
3
, SO
2
, and NO
2
[d] Use of our Products in places whe
the Products are
o
ed to static electricity or electromagnetic waves
[e] Use of our Products in pro
to heat-prod
mponents, plastic cords, or other flammable items
[f] Sealing or coating our Pro
with resin or
ing materials
[g] Use of our Products without cleaning residue o
(even if you use no-clean type fluxes, cleaning residue of
flux is recommende
; or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the P
cts in places subjec
d
w condensation
4. The
Produc
not subject to radiation-proof design.
5. Please
verify a
confirm cha
cteri
s
f the final or mounted products in using the Products.
6. In
p
ular, if a transien
ad
arge amount of load applied in a short period of time, such as pulse. is applied,
confirma
n of performance
haracteristics after on-board mounting is strongly recommended. Avoid applying power
ding normal rated power
exceeding the power rating under steady-state loading condition may negatively affect
ct performance and reliability.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm
that operation temperature is within the specified range described in the product specification.
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shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
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Precaution for Mounting / Circuit board design
1. When
a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In
principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If
change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You
agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use.
Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document.
ROHM shall not be in any way responsible or liable for any damages, expenses or losses
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Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge.
e take proper
caution in your manufacturing process and storage so that voltage exceeding the Products m
imu
ng will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body
uipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control
Precaution for Storage / Transportation
1. Product
performance and soldered connections may deteriorate if the Products are st
n the places where:
[a] the
Products are exposed to sea winds or corrosive gases, including Cl
2S, NH3, SO2, and NO2
[b] the
temperature or humidity exceeds those recommended by ROHM
[c] the
Products are exposed to direct sunshine or condensation
[d] the
Products are exposed to high Electrostatic
2. Even
under ROHM recommended storage condition, solderability o
ducts out of recommen
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may be degraded. It is strongly recommended to confirm solder
lity
fore using Products o
which storage time is
exceeding the recommended storage time period.
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/ transport cartons in the correct direction, which is i
ca
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symbol. Otherwise bent leads
may occur due to excessive stress applied when dropp
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aking i
required before using Products of
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orage time period
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Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
D
a
a
t
t
a
a
s
s
h
h
e
e
e
e
t
t
General Precaution
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you use our Pro
ducts, you are requested to
care fully
read this document and fully understand its contents.
ROHM shall
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o
t be in an y way responsible or liab
l
e
f
or f
a
i
lure, malfunction or acc
i
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ent arising from the use of a
ny
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ect to change without any prior
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la test
information with a
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amages, expenses or losses incurred
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ou or third parties resulting from inaccu
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Notice – WE
Rev.001
© 201
5
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