ROHM-Semicon-BM60016FV-CE2
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D
a
tasheet
Gate Driver Providing Galvanic isolation Series
Isolation voltage 2500Vrms
1ch Gate Driver Providing Galvanic Isolation
BM60016FV-C
General Description
Key Specifications
The BM60016FV-C is a gate driver with an isolation
voltage of 2500Vrms, I/O delay time of 75ns, and
minimum input pulse width of 60ns. It incorporates the
Under-voltage Lockout (UVLO) function and Miller clamp
function.
¢
¢
¢
¢
Isolation voltage:
2500Vrms
24V
75ns(Max)
60ns
Maximum gate drive voltage:
I/O delay time:
Minimum input pulse width:
Features
¢
Providing Galvanic Isolation
¢
Active Miller Clamping
¢
Under-voltage Lockout function
¢
UL1577(pending)
Package
W(Typ) x D(Typ) x H(Max)
3.5mm x10.2mm x 1.9mm
SSOP-B10W
¢
AEC-Q100 Qualified
(Note1)
(Note 1:Grade1)
Applications
¢
IGBT Gate Driver
¢
MOSFET Gate Driver
SSOP-B10W
Typical Application Circuits
GND2
VCC2
OUT
MC
GND1
UVLO1
VCC1
UVLO2
S
R
Pre-
driver
INA
INB
Pulse
Generator
Q
C
VCC2
C
VCC1
–
+
GND1
GND2
1pin
2V
Figure 1. Application Circuits (IGBT Gate Driver)
GND2
VCC2
OUT
MC
GND1
VCC1
INA
UVLO1
UVLO2
S
R
Pre-
driver
Pulse
Generator
Q
INB
C
VCC2
C
VCC1
–
+
GND2
1pin
GND1
2V
Figure 2. Application Circuits (MOSFET Gate Driver)
〇
Product structure : Silicon integrated circuit
〇
This product has no designed protection against radioactive rays
© 2015 ROHM Co., Ltd. All rights reserved.
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Datasheet
BM60016FV-C
Contents
General Description
………………………………………………………………………………………………………………………………………………….1
Features
…………………………………………………………………………………………………………………………………………………………………..1
Applications
…………………………………………………………………………………………………………………………………………………………….1
Key Specification
s
……………………………………………………………………………………………………………………………………………………1
Package
…………
…………………………………………………………………………………………………………………………………………………………1
Typical Application Circuit
s
………………………………………………………………………………………………………………………………………1
Contents
………………………………………………………………………………………………………………………………………………………………….2
Recommended Range of External Constants
…………………………………………………………………………………………………………….3
Pin Configurations
……………………………………………………………………………………………………………………………………………………3
Pin Descriptions
………………………………………………………………………………………………………………………………………………………3
Description of pins and cautions on layout of board
………………………………………………………………………………………………….4
Description of functions and examples of constant settin
g
………………………………………………………………………………………..5
Absolute Maximum Ratings
………………………………………………………………………………………………………………………………………8
Thermal Resistanc
e
………………………………………………………………………………………………………………………………………………….8
Recommended Operating Rating
s
…………………………………………………………………………………………………………………………….9
Insulation Related Characteristic
s
…………………………………………………………………………………………………………………………….9
Electrical Characteristic
s
………………………………………………………………………………………………………………………………………..10
Typical Performance Curves
…………………………………………………………………………………………………………………………………..
.
1
1
Figure 9.
Input Side Circuit Current
1
.
……………………………………………………………………………………………………………………
.
1
1
Figure 10. Input Side Circuit Current
1
.
……………………………………………………………………………………………………………………
.
1
1
Figure 11. input Side Circuit Current 2
(at INA=10kHz, Duty=50%) …………………………………………………………………………..
.
1
1
Figure 12. Input Side Circuit Current 2
(at INA=10kHz, Duty=50%) …………………………………………………………………………..
.
1
1
Figure 13. Input Side Circuit Current 3
(at INA=20kHz, Duty=50%) ……………………………………………………………………………12
Figure 14. Input Side Circuit Current 3
(at INA=20kHz, Duty=50%) ……………………………………………………………………………12
Figure 15. Output Side Circuit Current 1 (at OUT=L) ………………………………………………………………………………………………….12
Figure 16. Output Side Circuit Current 1 (at OUT=L
）
………………………………………………………………………………………………..12
Figure 17. Output Side Circuit Current 2 (at OUT=H)………………………………………………………………………………………………….13
Figure 18. Output Side Circuit Current 2 (at OUT=H)
………………………………………………………………………………………………..13
Figure 19. Logic (INA/INB) High/Low Level Voltag
e
.
…………………………………………………………………………………………………..13
Figure 20. OUT vs Logic (INA) Input Voltage
（
VCC1=5
V
,
V
CC2=15
V
, T
a
=25°C
）
…………………………………………………………13
Figure 21. Logic Pull-down Resistance …………………………………………………………………………………………………………………….14
Figure 22. Logic (INA) Input Minimum Pulse Width…………………………………………………………………………………………………….14
Figure 23. OUT ON Resistance (Source
)
.
…………………………………………………………………………………………………………………14
Figure 24. OUT ON Resistance (Sink) ……………………………………………………………………………………………………………………..14
Figure 25. Turn ON Time
（
INA=PWM, INB=L
）
………………………………………………………………………………………………………..15
Figure 26. Turn OFF Time
（
INA=PWM, INB=L
）
………………………………………………………………………………………………………15
Figure 27. Turn ON Time
（
INA=H, INB=PWM
）
……………………………………………………………………………………………………….15
Figure 28. Turn OFF Time
（
INA=H, INB=PWM
）
……………………………………………………………………………………………………..15
Figure 29. MC ON Resistance ………………………………………………………………………………………………………………………………..16
Figure 30. MC ON Threshold Voltage ………………………………………………………………………………………………………………………16
Figure 31. Input Side UVLO ON/OFF Voltage……………………………………………………………………………………………………………16
Figure 32. Input Side UVLO Mask Tim
e
.
…………………………………………………………………………………………………………………..16
Figure 33. Output Side UVLO ON/OFF voltage …………………………………………………………………………………………………………17
Figure 34. Output Side UVLO Mask Time …………………………………………………………………………………………………………………17
Selection of Components Externally Connected
………………………………………………………………………………………………………18
I/O Equivalent Circuits
…………………………………………………………………………………………………………………………………………….20
Operational Note
s
…………………………………………………………………………………………………………………………………………………..21
Ordering Informatio
n
………………………………………………………………………………………………………………………………………………23
Marking Diagrams
…………………………………………………………………………………………………………………………………………………..23
Physical Dimension, Tape and Reel Information
………………………………………………………………………………………………………24
Revision History
…………………………………………………………………………………………………………………………………………………….25
© 2015 ROHM Co., Ltd. All rights reserved.
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Datasheet
BM60016FV-C
Recommended Range of External Constants
Recommended Value
Pin Name
Symbol
Unit
Min.
0.1
Typ.
1.0
–
Max.
VCC1
VCC2
C
VCC1
C
VCC2
–
–
µF
µF
0.01
Pin Configurations
(TOP VIEW)
GND1
VCC1
5
6
7
GND2
VCC2
OUT
4
3
2
1
8
INA
INB
9
MC
10
GND1
GND2
Pin Descriptions
Pin No.
Pin Name
GND2
MC
Function
1
2
Output-side ground pin
Miller Clamp pin
Output pin
3
OUT
4
VCC2
GND2
GND1
VCC1
INA
Output-side power supply pin
Output-side ground pin
Input-side ground pin
Input-side power supply pin
Control input pin A
5
6
7
8
9
INB
Control input pin B
10
GND1
Input-side ground pin
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Datasheet
BM60016FV-C
Description of pins and cautions on layout of board
1) VCC1 (Input-side power supply pin)
The VCC1 pin is a power supply pin on the input side.
T
o
s
uppress voltage fluctuations due to the current to drive internal
transformers, connect a bypass capacitor between the VCC1 and the GND1 pins.
2) GND1 (Input-side ground pin)
The GND1 pin is a ground pin on the input side.
3) VCC2 (Output-side power supply pin)
The VCC2 pin is a power supply pin on the output side.
T
o
r
educe voltage fluctuations due to OUT pin output current,
connect a bypass capacitor between the VCC2 and the GND2 pins.
4) GND2 (Output-side ground pin)
The GND2 pin is a ground pin on the output side.
5) INA, INB (Control input terminal)
The INA and INB pins are used to determine output logic.
INB
H
INA
L
OUT
L
L
H
H
L
L
L
L
H
H
6) OUT (Output pin)
The OUT pin is used to drive the gate of a power device.
7) MC (Miller Clamp pin)
The MC pin is for preventing the increase in gate voltage due to the Miller current of the power device connected to the
OUT pin. If the Miller Clamp function is not used, short-circuit the MC pin to the GND2 pin.
© 2015 ROHM Co., Ltd. All rights reserved.
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Datasheet
BM60016FV-C
Description of functions and examples of constant setting
1) Miller Clamp function
When INA=L and OUT pin voltage < V
MCON
(typ 2V), the internal MOSFET of the MC pin is turned ON.
INA
L
MC
Internal MOSFET of the MC pin
less than V
MCON
X
ON
H
OFF
VCC2
OUT
PREDRIVER
PREDRIVER
GATE
S
R
Q
MC
PREDRIVER
V
MCON
GND2
Figure 3. Block diagram of Miller Clamp function.
t
POFFA
t
PONA
H
INA
L
H
OUT
L
H
GATE
MC
V
MCON
L
Hi-Z
L
Figure 4. Timing chart of Miller Clamp function
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Datasheet
BM60016FV-C
2) Under-voltage Lockout (UVLO) function
The BM60016FV-C incorporates the Under-voltage Lockout (UVLO) function both on the low and the high voltage sides.
When the power supply voltage drops to the UVLO ON voltage (low voltage side typ 3.4V, high voltage side voltage typ
8.5V), the OUT pin will output the “L” signal. In addition, to prevent malfunctions due to noises, a mask time of t
UVLO1MSK
(typ 2.5µs) and t
UVLO2MSK
(typ 2.9µs) are set on both the low and the high voltage sides.
A
fter the UVLO is released, the input signal will take effect from the time after the input signal switches.
H
INA
INB
L
H
L
V
UVLO1H
V
UVLO1L
VCC1
H
L
OUT
Figure 5. Input-side UVLO Function Operation Timing Chart
H
INA
INB
L
H
L
V
UVLO2H
V
UVLO2L
VCC2
H
Hi-Z
L
OUT
Figure 6. Output-side UVLO Function Operation Timing Chart
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Datasheet
BM60016FV-C
3) I/O condition table
Input
Output
V
C
C
1
V
C
C
2
No.
Status
I
N
B
I
N
A
O
U
T
M
C
1
2
3
4
5
VCC1UVLO
VCC2UVLO
UVLO
X
X
X
X
H
L
X
X
X
L
L
L
L
L
H
L
L
UVLO
○
INB Active
○
L
Normal operation L input
Normal operation H input
○
○
L
○
○
L
H
Hi-Z
○
: VCC1 or VCC2 > UVLO, X:Don’t care
4) Power supply startup / shutoff sequence
INA
H
L
H
INB
L
V
UVLO1L
V
UVLO1L
V
UVLO1H
V
UVLO1H
V
UVLO2H
VCC1
VCC2
V
UVLO2H
V
UVLO2L
V
UVLO2L
H
Hi-Z
L
OUT
MC
Hi-Z
L
: Since the VCC2 to GND2 pin voltage is low and the output MOS does not turn ON, the
output pins become Hi-Z.
Figure 7. Power Supply Startup / Shutoff Sequence
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Datasheet
BM60016FV-C
Absolute Maximum Ratings
Parameter
Symbol
Limits
Unit
Input-side Supply Voltage
Output-side Supply Voltage
INA Pin Input Voltage
V
CC1
V
CC2
-0.3
～
+7.0
(Note 2)
-0.3
～
+30.0
(Note 3)
-0.3
～
+VCC1+0.3 or +7.0
(Note 2)
-0.3
～
+VCC1+0.3 or +7.0
(Note2)
5.0
(Note 4)
V
V
V
INA
V
INB Pin Input Voltage
V
INB
V
OUT Pin Output Current (Peak 10µs)
Operating
T
e
mperature Range
Storage
T
e
mperature Range
Junction
T
e
mperature Range
I
OUTPEAK
T
o
pr
A
-40
～
+125
°C
°C
°C
T
s
tg
-55
～
+150
Tjmax
+150
(Note 2)
Relative to GND1.
(Note 3)
Relative to GND2.
(Note 4)
Should not exceed Tj=150°C
Caution:
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Thermal Resistance
(Note 5)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s
(Note 7)
2s2p
(
Note 8)
SSOP-B10W
Input-side Junction to Ambient
θ
JA1
θ
JA2
Ψ
JT1
Ψ
JT2
172.1
180.2
32
101.8
108.9
27
°C/W
°C/W
°C/W
°C/W
Output-side Junction to Ambient
Input-side Junction to
T
o
p Characterization Parameter
(Note 6)
Input-side Junction to
T
o
p Characterization Parameter
(Note 6)
82
60
(Note 5)
Based on JESD51-2A(Still-Air)
(Note 6)
The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
(Note 7)
Using a PCB board based on JESD51-3.
(Note 8)
Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3mm x 76.2mm x 1.57mmt
T
o
p
Copper Pattern
Thickness
Footprints and Traces
70
µ
m
Layer Number of
Measurement Board
Material
FR-4
Board Size
114.3mm x 76.2mm x 1.6mmt
2 Internal Layers
4 Layers
T
o
p
Copper Pattern
Bottom
Copper Pattern
74.2mm x 74.2mm
Thickness
Copper Pattern
Thickness
Thickness
Footprints and Traces
70
µ
m
74.2mm x 74.2mm
35
µ
m
70
µ
m
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Datasheet
BM60016FV-C
Recommended Operating Ratings
(Ta= -40°C to +125°C)
Parameter
Input-side Supply Voltage
Output-side Supply Voltage
Symbol
Min.
4.5
10
Max.
5.5
Units
V
(Note 9)
V
CC1
(Note 10)
V
CC2
24
V
(Note 9)
Relative to GND1.
(Note 10)
Relative to GND2.
Insulation Related Characteristics
Parameter
Symbol
R
S
Characteristic
Units
Ω
Insulation Resistance (V
IO
=500V)
Insulation Withstand Voltage / 1min
Insulation
T
e
st Voltage / 1sec
>10
9
2500
3000
V
ISO
Vrms
Vrms
V
ISO
© 2015 ROHM Co., Ltd. All rights reserved.
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Datasheet
BM60016FV-C
Electrical Characteristics
（
Unless otherwise specified T
Parameter
a
=-40°C to 125°C, V
CC1
=4.5V to 5.5
V
,
V
CC2
=10V to 24V
）
Symbol
Min.
Typ.
Max.
Unit
Conditions
General
Input side circuit current 1
Input side circuit current 2
Input side circuit current 3
Output side circuit current 1
I
CC11
I
CC12
I
CC13
I
CC21
I
CC22
0.06
0.10
0.15
0.28
0.24
0.14
0.20
0.30
0.46
0.42
0.22
0.30
0.45
0.64
0.60
mA
mA
mA
mA
mA
INA =10kHz, Duty=50%
INA =20kHz, Duty=50%
OUT=L
Output side circuit current 2
Logic block
OUT=H
Logic high level input voltage
V
INH
V
INL
2.0
0
–
–
V
CC1
0.8
100
–
V
V
INA, INB
INA, INB
INA, INB
INA, INB
Logic low level input voltage
Logic pull-down resistance
R
IND
t
INMIN
25
60
50
–
k
Ω
ns
Logic input minimum pulse width
Output
0.4
0.2
0.9
0.6
2.0
1.3
I
I
OUT
=-40mA
OUT
=40mA
OUT ON resistance (Source)
OUT ON resistance (Sink)
R
ONH
R
ONL
Ω
Ω
VCC2=15
V
,
Guaranteed by design
VCC2=15
V
,
Guaranteed by design
OUT maximum current (Source)
OUT maximum current (Sink)
I
OUTMAXH
I
OUTMAXL
3.0
3.0
4.5
3.9
–
–
A
A
t
PONA
t
PONB
t
POFFA
t
POFFB
t
PDISTA
t
PDISTB
t
RISE
35
35
35
35
-25
-25
–
55
55
55
55
0
75
75
75
75
25
25
–
ns
ns
ns
ns
ns
ns
ns
ns
Ω
INA=PWM, INB=L
INA=H, INB=PWM
INA=PWM, INB=L
INA=H, INB=PWM
t
POFFA
– t
PONA
Turn ON time
Turn OFF time
Propagation distortion
0
t
POFFB
– t
PONB
Rise time
50
50
0.65
10nF between OUT-GND2
10nF between OUT-GND2
I
MC
=40mA
Fall time
t
FALL
–
–
0.20
1.40
MC ON resistance
R
ONMC
V
MCON
CM
MC ON threshold voltage
Common Mode Transient Immunity
Protection functions
VCC1 UVLO OFF voltage
VCC1 UVLO ON voltage
VCC1 UVLO mask time
VCC2 UVLO OFF voltage
VCC2 UVLO ON voltage
VCC2 UVLO mask time
1.8
2
–
2.2
–
V
100
kV/µs Guaranteed
by design
V
UVLO1H
V
UVLO1L
t
UVLO1MSK
V
UVLO2H
V
UVLO2L
t
UVLO2MSK
3.35
3.25
1.0
3.50
3.40
2.5
3.65
3.55
5.0
V
V
µs
V
9.0
9.5
10.0
9.0
8.0
8.5
V
1.00
2.9
5.00
µs
50%
50%
t
PONA
INA
t
POFFA
90%
90%
50%
50%
10%
OUT
10%
t
FALL
t
RISE
Figure 8. IN-OUT Timing Chart
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Datasheet
BM60016FV-C
Typical Performance Curves
0.22
0.20
0.18
0.16
0.14
0.12
0.10
0.22
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
T
a
=125
°
C
VCC1=5.0V
VCC1=5.5V
T
a
=25
°
C
VCC1=4.5V
0.08
T
a
=-40
°
C
0.06
-40 -20
0
20
40
Ta
[
°C]
60
80 100
120
4.50
4.75
5.00
VCC1[V]
5.25
5.50
Figure 9. Input Side Circuit Current 1
Figure 10. Input Side Circuit Current 1
0.30
0.26
0.22
0.18
0.14
0.10
0.30
0.26
0.22
0.18
0.14
0.10
T
a
=125
°
C
VCC1=5.5V
VCC1=5.0V
VCC1=4.5V
T
a
=25
°
C
T
a
=-40
°
C
4.50
4.75
5.00
5.25
5.50
-40 -20
0
20
40
60
80 100
120
Ta
[
°C]
VCC1 [V]
Figure 11. input Side Circuit Current 2
(at INA=10kHz, Duty=50%)
Figure 12. Input Side Circuit Current 2
（
at INA=10kHz, Duty=50%
）
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Datasheet
BM60016FV-C
Typical Performance Curves
– continued
0.45
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.40
T
a
=125°C
0.35
0.30
0.25
VCC1=5.5V
T
a
=25°C
0.20
0.15
0.10
T
a
=-40°C
VCC1=5.0V
VCC1=4.5V
4.50
4.75
5.00
5.25
5.50
-40 -20
0
20
40
60
80 100
120
VCC1 [V]
Ta
[
°C]
Figure 14. Input Side Circuit Current 3
（
at INA=20kHz, Duty=50%
）
Figure 13. Input Side Circuit Current 3
(at INA=20kHz, Duty=50%)
0.64
0.60
0.56
0.52
0.48
0.44
0.40
0.36
0.32
0.28
0.64
0.60
0.56
0.52
0.48
0.44
0.40
0.36
0.32
0.28
T
a
=125°C
VCC2=24V
VCC2=15V
VCC2=10V
T
a
=25°C
T
a
=-40°C
10
12
14
16
18
20
22
24
-40 -20
0
20
40
60
80 100
120
Ta
[
°C]
VCC2 [V]
Figure 15. Output Side Circuit Current 1
(at OUT=L)
Figure 16. Output Side Circuit Current 1
（
at OUT=L
）
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
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30.May.2016 Rev.001
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Datasheet
BM60016FV-C
Typical Performance Curves
– continued
0.60
0.60
0.54
0.48
0.42
0.36
0.30
0.24
T
a
=125
°
C
0.54
VCC2=24V
0.48
0.42
0.36
VCC2=15V
T
a
=25
°
C
0.30
VCC2=10V
T
a
=-40
°
C
0.24
10
12
14
16
18
20
22
24
-40 -20
0
20
40
60
80 100
120
VCC2 [V]
Ta
[
°C]
Figure 18. Output Side Circuit Current 2
(at OUT=H)
Figure 17. Output Side Circuit Current 2
(at OUT=H)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
24
20
16
12
8
T
a
=-40
°
C
T
a
=25
°
C
T
a
=125
°
C
Vcc1=5V
H level
L level
T
a
=-40
°
C
T
a
=25
°
C
T
a
=125
°
C
4
0
0
1
2
3
4
5
4.50
4.75
5.00
5.25
5.50
INA [V]
VCC1 [V]
Figure 19. Logic (INA/INB) High/Low Level Voltage
Figure 20. OUT vs Logic (INA) Input Voltage
（
VCC1=5
V
,
V
CC2=15
V
, T
a
=25°C
）
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
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30.May.2016 Rev.001
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Datasheet
BM60016FV-C
Typical Performance Curves
– continued
50
40
30
20
10
0
100
75
Vcc1=4.5V
Vcc1=5.0V
Vcc1=5.5V
50
25
0
Vcc1=4.5V
Vcc1=5.0V
Vcc1=5.5V
-40 -20
0
20
40
60
80 100
120
-40 -20
0
20
40
60
80 100
120
Ta
[
°C]
Ta
[
°C]
Figure 22. Logic (INA) Input Minimum Pulse Width
Figure 21. Logic Pull-down Resistance
2.0
1.6
1.2
0.8
0.4
1.2
1.0
0.8
0.6
0.4
0.2
Vcc2=10V
Vcc2=15V
Vcc2=24V
Vcc2=10V
Vcc2=15V
Vcc2=24V
-40 -20
0
20
40
60
80 100
120
-40 -20
0
20
40
60
80 100
120
Ta
[
°C]
Ta
[
°C]
Figure 23. OUT ON Resistance (Source)
Figure 24. OUT ON Resistance (Sink)
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
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30.May.2016 Rev.001
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Datasheet
BM60016FV-C
Typical Performance Curves
– continued
90
80
70
60
50
40
30
20
90
80
Vcc2=10V
Vcc2=15V
Vcc2=24V
Vcc2=10V
Vcc2=15V
Vcc2=24V
70
60
50
40
30
20
-40 -20
0
20
40
60
80 100
120
-40 -20
0
20
40
60
80 100
120
Ta
[
°C]
Ta
[
°C]
Figure 26. Turn OFF Time
Figure 25. Turn ON Time
（
INA=PWM, INB=L
）
（
INA=PWM, INB=L
）
90
80
70
60
50
40
30
20
90
80
70
60
50
40
30
20
Vcc2=10V
Vcc2=15V
Vcc2=24V
Vcc2=10V
Vcc2=15V
Vcc2=24V
-40 -20
0
20
40
60
80 100
120
-40 -20
0
20
40
60
80 100
120
Ta
[
°C]
Ta
[
°C]
Figure 27. Turn ON Time
Figure 28. Turn OFF Time
(INA=H, INB=PWM
）
（
INA=H, INB=PWM
）
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
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30.May.2016 Rev.001
15/25
Datasheet
BM60016FV-C
Typical Performance Curves
– continued
2.2
2.1
2.0
1.9
1.8
1.0
Vcc2=10V
Vcc2=15V
Vcc2=24V
0.8
0.6
0.4
Vcc2=10V
Vcc2=15V
Vcc2=24V
-40 -20
0
20
40
60
80 100
120
-40 -20
0
20
40
60
80 100
120
Ta
[
°C]
Ta
[
°C]
Figure 30. MC ON Threshold Voltage
Figure 29. MC ON Resistance
5
4
3
2
1
0
3.65
3.60
3.55
3.50
3.45
3.40
3.35
3.30
3.25
VUVLO1H
VUVLO1L
-40 -20
0
20
40
60
80 100
120
-40 -20
0
20 40 60 80
100 120
Ta
[
°C]
Ta
[
°C]
Figure 31. Input Side UVLO ON/OFF Voltage
Figure 32. Input Side UVLO Mask Time
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0818ABH00150-1-2
30.May.2016 Rev.001
16/25
Datasheet
BM60016FV-C
Typical Performance Curves
– continued
10.0
9.5
5
4
3
2
1
0
VUVLO2H
9.0
8.5
VUVLO2L
-40 -20
0
20
40
60
80 100
120
8.0
-40 -20
0
20
40
60
80 100
120
Ta
[
°C]
Ta
[
°C]
Figure 34. Output Side UVLO Mask Time
Figure 33. Output Side UVLO ON/OFF voltage
TSZ02201-0818ABH00150-1-1
30.May.2016 Rev.001
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17/25
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BM60016FV-C
Selection of Components Externally Connected
GND1
GND2
VCC2
OUT
MC
UVLO1
UVLO2
VCC1
INA
Pre-
driver
S
Q
R
Pulse
Generator
INB
Recommended
ROHM
MCR100EZP
GND1
+
GND2
1pin
–
Figure 35. For Driving IGBT
Recommended
ROHM
2SCR542P
GND1
VCC1
INA
GND2
VCC2
OUT
MC
Recommended
ROHM
MCR100EZP
UVLO1
UVLO2
Pre-
S
Q
R
driver
Pulse
Generator
INB
Recommended
ROHM
MCR100EZP
GND1
+
–
GND2
1pin
Recommended
ROHM
Figure 36. For Driving IGBT with Buffer Circuits
2SAR542P
Recommended
ROHM
MCR100EZP
GND1
VCC1
INA
GND2
UVLO1
UVLO2
VCC2
OUT
MC
Pre-
driver
S
Q
R
Pulse
Generator
Recommended
ROHM
INB
MCR03EZP
GND1
+
GND2
1pin
–
Recommended
ROHM
TDZTR5.1
Figure 37. For Driving IGBT with Negative Power Supply
Recommended
ROHM
2SCR542P
Recommended
ROHM
MCR100EZP
GND1
VCC1
INA
GND2
UVLO1
UVLO2
VCC2
OUT
MC
Pre-
driver
S
Q
R
Recommended
ROHM
MCR100EZP
Pulse
Generator
INB
GND1
+
GND2
1pin
Recommended
ROHM
2SAR542P
Recommended
ROHM
MCR03EZP
Figure 38. For Driving IGBT with Buffer Circuits & Negative Power Supply
Recommended
ROHM
TDZTR5.1
TSZ02201-0818ABH00150-1-1
30.May.2016 Rev.001
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Datasheet
BM60016FV-C
GND1
VCC1
INA
GND2
VCC2
OUT
MC
UVLO1
UVLO2
Pre-
driver
S
Q
R
Pulse
Generator
INB
Recommended
ROHM
MCR100EZP
GND1
+
GND2
1pin
–
Figure 39. For Driving MOSFET
Recommended
ROHM
2SCR542P
GND1
VCC1
INA
GND2
VCC2
OUT
MC
Recommended
ROHM
MCR100EZP
UVLO1
UVLO2
Pre-
S
Q
R
driver
Pulse
Generator
INB
Recommended
ROHM
MCR100EZP
GND1
+
–
GND2
1pin
Recommended
ROHM
Figure 40. For Driving MOSFET with Buffer Circuits
2SAR542P
Recommended
ROHM
MCR100EZP
GND1
VCC1
INA
GND2
UVLO1
UVLO2
VCC2
OUT
MC
Pre-
driver
S
Q
R
Pulse
Generator
Recommended
ROHM
INB
MCR03EZP
GND1
+
GND2
1pin
–
Recommended
ROHM
TDZTR5.1
Figure 41. For Driving MOSFET with Negative Power Supply
Recommended
ROHM
2SCR542P
Recommended
ROHM
MCR100EZP
GND1
VCC1
INA
GND2
UVLO1
UVLO2
VCC2
OUT
MC
Pre-
driver
S
Q
R
Recommended
ROHM
MCR100EZP
Pulse
Generator
INB
GND1
+
GND2
1pin
Recommended
ROHM
2SAR542P
Figure 42. For Driving MOSFET with Buffer Circuits & Negative Power Supply
Recommended
ROHM
MCR03EZP
Recommended
ROHM
TDZTR5.1
TSZ02201-0818ABH00150-1-1
30.May.2016 Rev.001
© 2015ROHM Co., Ltd. All rights reserved.
19/25
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Datasheet
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I/O Equivalent Circuits
Name
Pin No
I/O equivalence circuits
Function
VCC2
OUT
OUT
Output pin
MC
1
GND2
VCC2
2
MC
Miller clamp pin
GND2
VCC1
INA
Control input pin A
INB
INA
INB
3
1.0K
Ω
(typ)
GND1
Control input pin B
TSZ02201-0818ABH00150-1-1
30.May.2016 Rev.001
© 2015ROHM Co., Ltd. All rights reserved.
20/25
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Datasheet
BM60016FV-C
Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC.
T
a
ke precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6.
7.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current
may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more
than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring,
width of ground wiring, and routing of connections.
8.
9.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process.
T
o
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
10. Inter-pin
Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
TSZ02201-0818ABH00150-1-1
30.May.2016 Rev.001
© 2015ROHM Co., Ltd. All rights reserved.
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Datasheet
BM60016FV-C
Operational Notes – continued
11. Unused
Input Terminals
Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the
power supply or ground line.
12. Regarding
Input Pins of the IC
This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N
junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or
transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Figure 43. Examp
struct
13. Ceramic
Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area
of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
TSZ02201-0818ABH00150-1-1
30.May.2016 Rev.001
© 2015ROHM Co., Ltd. All rights reserved.
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Datasheet
BM60016FV-C
Ordering Information
B M 6
0 0 1 6
F
V –
CE2
Part Number
Package
FV:SSOP-B10W
Product class
C : for Automotive applications
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
SSOP-B10W(TOP VIEW)
1PIN MARK
Part Number Marking
LOT Number
B M 6 0 0 1 6
TSZ02201-0818ABH00150-1-1
30.May.2016 Rev.001
© 2015ROHM Co., Ltd. All rights reserved.
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Datasheet
BM60016FV-C
Physical Dimension, Tape and Reel Information
Package Name
SSOP-B10W
© 2015ROHM Co., Ltd. All rights reserved.
TSZ22111
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・
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30.May.2016 Rev.001
24/25
Datasheet
BM60016FV-C
Revision History
Date
Revision
Changes
30.May.2015
001
New Release
TSZ02201-0818ABH00150-1-1
30.May.2016 Rev.001
© 2015ROHM Co., Ltd. All rights reserved.
25/25
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Notice
Precaution on using ROHM Products
(Note 1)
1. If
you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (
“
Specific Applications
”
), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM
’
s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASS
Ⅲ
CLASS
Ⅳ
CLASS
Ⅱ
b
CLASS
Ⅲ
CLASS
Ⅲ
CLASS
Ⅲ
2. ROHM
designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our
Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s
Products under any special or extraordinary environments or conditions.
If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl
2
,
H
2
S, NH
3
, SO
2
, and NO
2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The
Products are not subject to radiation-proof design.
5. Please
verify and confirm characteristics of the final or mounted products in using the Products.
6. In
particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate
Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm
that operation temperature is within the specified range described in the product specification.
9. ROHM
shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When
a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In
principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If
change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You
agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use.
Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document.
ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product
performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the
Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the
temperature or humidity exceeds those recommended by ROHM
[c] the
Products are exposed to direct sunshine or condensation
[d] the
Products are exposed to high Electrostatic
2. Even
under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store
/ transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use
Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM
’
s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All
information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM
shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No
license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This
document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The
Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In
no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The
proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
D
a
a
t
t
a
a
s
s
h
h
e
e
e
e
t
t
General Precaution
1. Before
you use our Pro
ducts, you are requested to
care fully
read this document and fully understand its contents.
ROHM shall
n
o
t be in an y way responsible or liab
l
e
f
or f
a
i
lure, malfunction or acc
i
d
ent arising from the use of a
ny
ROHM’s Products against warning, caution or note contained in this document.
2. All
information contained in this docume nt is current as
of the issuing date and subj
ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the
la test
information with a
ROHM sale
s
representative.
3. The
information contained in this
doc ument
is provi ded
on an “as is” basis
and ROHM
does not warrant that all
information contained in this
document is accurate an d/or error-free. ROHM shall not
be in an y way responsible or
liable for a
n
y
d
amages, expenses or losses incurred
b
y
y
ou or third parties resulting from inaccu
r
a
cy or errors of or
concerning such information.
Notice – WE
Rev.001
© 201
5
ROHM Co., Ltd. All rights reserved.
Datasheet
BM60016FV-C – Web Page
Part Number
Package
Unit Quantity
BM60016FV-C
SSOP-B10W
1500
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
1500
Taping
inquiry
Yes
