ROHM-Semicon-R6535ENZ4C13
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R6535ENZ4
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Nch 650V 35A Power MOSFET
Datasheet
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Outline
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TO-247G
V
DSS
650V
0.115Ω
±35A
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R
DS(on)
(Max.)
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I
D
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P
D
379W
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Features
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Inner circuit
1) Low on-resistance
2) Fast switching
3) Parallel use is easy
4) Pb-free plating ; RoHS compliant
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Application
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Packaging specifications
Switching
Packing
Tube
C13
Packing code
Marking
R6535ENZ4
600
Quantity (pcs)
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Absolute maximum ratings
(T =
25°C ,unless otherwise specified)
a
Parameter
Drain – Source voltage
Symbol
Value
Unit
V
V
DSS
650
±35
*1
Continuous drain current
(T
c
= 25°C)
Pulsed drain current
I
D
A
*2
I
DP
±105
±20
A
static
V
V
G
SS
Gate – Source voltage
AC(f
>
1Hz)
±30
V
*3
I
A
S
Avalanche current, single pulse
Avalanche energ
y
,
s
ingle pulse
Power dissipation
(T
c
= 25°C)
Junction temperature
6.6
A
*3
E
A
S
867
mJ
W
℃
℃
P
D
T
j
379
150
T
stg
Operating junction and storage temperature range
-55 to +150
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© 2019 ROH
M
C
o., Ltd. All rights reserved.
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1/11
20200108 – Rev.002
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R6535ENZ4
Datasheet
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Thermal resistance
Values
Unit
Min. Typ. Max.
Parameter
Symbol
*4
R
thJC
Thermal resistance, junction – case
–
–
–
–
–
–
0.33
℃
/W
R
thJA
T
sold
Thermal resistance, junction – ambient
Soldering temperature, wavesoldering for 10s
30
℃
/W
265
℃
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Electrical characteristics
(T
a
= 25°C)
Values
Parameter
Symbol
V
(BR)DSS
Conditions
Unit
V
Min. Typ. Max.
Drain – Source breakdown
voltage
V
V
= 0
V
, I
=
1
mA
650
–
–
GS
D
= 650
V
, V
=
0
V
ꢀ
ꢀ
ꢀ
100
1000
±100
4.0
DS
GS
Zero gate voltage
drain current
I
DSS
T = 25°C
–
–
μA
j
T = 125°C
–
–
j
I
G
SS
V
GS
V
DS
V
GS
= ±20V, V
= 0V
DS
Gate – Source leakage current
Gate threshold voltage
–
–
nA
V
V
G
S(th)
= V
, I
= 1.21mA
2.0
ꢀ
–
–
GS
D
= 10
V
, I
=
1
8.1A
ꢀ
ꢀ
D
Static drain – source
on – state resistance
*5
R
DS(on)
T = 25°C
0.098 0.115
Ω
Ω
j
T = 125°C
–
0.200
1.8
–
–
j
R
G
Gate resistance
f = 1MHz, open drain
–
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© 2019 ROH
M
C
o., Ltd. All rights reserved.
2/11
20200108 – Rev.002
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R6535ENZ4
Datasheet
Unit
l
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Electrical characteristics
(T
a
= 25°C)
Values
Parameter
Input capacitance
Symbol
Conditions
= 0V
Min. Typ. Max.
C
iss
C
oss
C
rss
V
V
–
–
–
–
–
–
–
2600
2800
280
35
–
–
–
–
–
–
–
GS
= 25V
Output capacitance
Reverse transfer capacitance
Turn – on delay time
Rise time
pF
ns
DS
f = 1MHz
⋍
300
V
, V
=
1
0V
*5
t
d(on)
V
DD
GS
t
r
*5
I =
17.5A
85
D
*5
t
d(off)
R
⋍
17.4Ω
Turn – off delay time
Fall time
220
90
L
t
f
*5
R =
10Ω
G
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Gate charge characteristics
(T
a
= 25°C)
Values
Parameter
Symbol
Conditions
⋍
300V
Unit
Min. Typ. Max.
*5
Q
g
T
o
tal gate charge
V
–
–
–
–
110
16
–
–
–
–
DD
*5
Q
gs
I =
35A
D
Gate – Source charge
Gate – Drain charge
Gate plateau voltage
nC
V
*5
Q
gd
V
GS
DD
= 10V
55
V
(plateau)
V
⋍
300
V
, I
=
3
5A
6.0
D
*1 Limited only by maximum channel temperature allowed.
*2 Pw ≤ 10μs, Duty cycle ≤ 1%
*3 L
≒
50mH, V
=50V, R
=25Ω, STARTING
T
=
25
℃
DD
G
j
*4 T
=25
℃
C
*5 Pulsed
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© 2019 ROH
M
C
o., Ltd. All rights reserved.
3/11
20200108 – Rev.002
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R6535ENZ4
Datasheet
Unit
l
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Body diode electrical characteristics
(Source-Drain) (T
a
= 25°C)
Values
Parameter
Source current
Symbol
Conditions
Min.
–
Typ.
–
Max.
35
*1
I
S
A
A
T =
25
℃
C
*2
I
SP
Pulsed source current
–
–
–
–
–
–
–
105
*5
V
SD
V
GS
= 0
V
, I
=
3
5A
S
Source-Drain voltage
1.5
V
*5
t
rr
Reverse recovery time
Reverse recovery charge
Peak reverse recovery current
660
14.5
44
–
–
–
ns
μC
A
I =
35A
di/dt = 100A/μs
S
*5
Q
rr
*5
I
rr
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© 2019 ROH
M
C
o., Ltd. All rights reserved.
4/11
20200108 – Rev.002
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R6535ENZ4
Datasheet
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Electrical characteristic curves
Fig.1 Power Dissipation Derating Curve
Fig.2 Drain Current Derating Curve
Fig.3 Normalized Transient Thermal
Fig.4 Maximum Safe Operating Area
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Resistance vs. Pulse Width
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© 2019 ROH
M
C
o., Ltd. All rights reserved.
5/11
20200108 – Rev.002
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R6535ENZ4
Datasheet
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Electrical characteristic curves
Fig.5 Avalanche Energy Derating Curve
Fig.6 Normalized Breakdown Voltage
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vs. Junction Temperature
Fig.7 Typical Output Characteristics(I)
Fig.8 Typical Output Characteristics(II)
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© 2019 ROH
M
C
o., Ltd. All rights reserved.
6/11
20200108 – Rev.002
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R6535ENZ4
Datasheet
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Electrical characteristic curves
Fig.9 Typical Transfer Characteristics
Fig.10 Gate Threshold Voltage
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vs. Junction Temperature
Fig.11 Static Drain – Source On – State
Fig.12 Static Drain – Source On – State
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Resistance vs. Drain Current
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Resistance vs. Gate – Source Voltage
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© 2019 ROH
M
C
o., Ltd. All rights reserved.
7/11
20200108 – Rev.002
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R6535ENZ4
Datasheet
l
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Electrical characteristic curves
Fig.13 Static Drain – Source On – State
Fig.14 Typical Capacitance
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Resistance vs. Junction Temperature
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vs. Drain – Source Voltage
Fig.15 Switching Characteristics
Fig.16 Typical Gate Charge
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© 2019 ROH
M
C
o., Ltd. All rights reserved.
8/11
20200108 – Rev.002
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R6535ENZ4
Datasheet
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Electrical characteristic curves
Fig.17 Source Current
Fig.18 Reverse Recovery Time
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vs. Source – Drain Voltage
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vs. Source Current
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© 2019 ROH
M
C
o., Ltd. All rights reserved.
9/11
20200108 – Rev.002
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R6535ENZ4
Datasheet
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Measurement circuits
Fig.1-1 Switching
T
i
me Measurement Circuit
Fig.2-1 Gate Charge Measurement Circuit
Fig.3-1 Avalanche Measurement Circuit
Fig.4-1 trr Measurement Circuit
Fig.1-2 Switching Waveforms
Fig.2-2 Gate Charge Waveform
Fig.3-2 Avalanche Waveform
Fig.4-2 trr Waveform
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© 2019 ROH
M
C
o., Ltd. All rights reserved.
10/11
20200108 – Rev.002
R6535ENZ4
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Datasheet
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Dimensions
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© 2019 ROH
M
C
o., Ltd. All rights reserved.
11/11
20200108 – Rev.002
Notice
Precaution on using ROHM Products
1. Our
Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.).
If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
(Note 1)
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASS
Ⅲ
CLASS
Ⅳ
CLASS
Ⅱ
b
CLASS
Ⅲ
CLASS
Ⅲ
CLASS
Ⅲ
2. ROHM
designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our
Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions.
If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl
2
,
H
2
S, NH
3
, SO
2
, and NO
2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The
Products are not subject to radiation-proof design.
5. Please
verify and confirm characteristics of the final or mounted products in using the Products.
6. In
particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate
Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm
that operation temperature is within the specified range described in the product specification.
9. ROHM
shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When
a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In
principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If
change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You
agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use.
Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document.
ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product
performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the
Products are exposed to sea winds or corrosive gases, including Cl
2
, H
2
S, NH
3
, SO
2
, and NO
2
[b] the
temperature or humidity exceeds those recommended by ROHM
[c] the
Products are exposed to direct sunshine or condensation
[d] the
Products are exposed to high Electrostatic
2. Even
under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store
/ transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use
Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All
information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM
shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No
license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This
document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The
Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In
no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The
proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
D
a
a
t
t
a
a
s
s
h
h
e
e
e
e
t
t
General Precaution
1. Before
you use our Pr
od
ucts, you are requested to
care
f
ully read this document and fully understand its contents.
ROHM shall n
o
t be in an
y
way responsible or liabl
e
for fa
i
lure, malfunction or acci
d
ent arising from the use of a
n
y
ROHM’s Products against warning, caution or note contained in this document.
2. All
information contained in this docum
en
t is current as of the issuing date and subj
e
ct to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the
la
t
est information with a
ROHM sale
s
representative.
3. The
information contained in this
doc
u
ment is
provi
d
ed on an “as is” basis
and ROHM
d
oes not warrant that all
information contained in this
document is accurate an
d
/or error-free.
ROHM shall not be in an
y
way responsible or
liable for a
n
y
d
amages, expenses or losses incurred
b
y
y
ou or third parties resulting from inaccur
a
cy or errors of or
concerning such information.
Notice – WE
Rev.001
© 201
5
ROHM Co., Ltd. All rights reserved.
