ROHM-Semicon-RF4E075ATTCR
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RF4E075AT
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Pch -30V -7.5A Middle Power MOSFET
Datasheet
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Outline
HUML2020L8
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V
DSS
-30V
21.7mΩ
±7.5A
2W
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R
DS(on)
(Max.)
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I
D
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P
D
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Inner circuit
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Features
1) Low on – resistance.
2) High Power small mold Package
(HUML2020L8).
3) Pb-free lead plating ; RoHS compliant.
4) Halogen Free.
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Packaging specifications
Embossed
Tape
Packing
Reel size (mm)
180
8
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Application
Switching
Tape width (mm)
Type
Basic ordering unit (pcs)
Taping code
3000
TCR
JT
Load switch
Marking
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Absolute maximum ratings
(T
a
= 25°C)
Parameter
Symbol
Value
-30
Unit
V
V
DSS
I
D
Drain – Source voltage
Continuous drain current
Pulsed drain current
±7.5
A
*1
I
D,pulse
V
G
SS
±30
A
Gate – Source voltage
Avalanche energ
y
,
s
ingle pulse
Avalanche current
±20
V
*2
E
A
S
10.6
-2.7
mJ
A
*2
I
A
S
*3
P
D
Power dissipation
2
W
℃
℃
T
j
Junction temperature
150
T
stg
Range of storage temperature
-55 to +150
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© 2015 ROH
M
C
o., Ltd. All rights reserved.
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1/11
20150218 – Rev.001
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RF4E075
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T
Datasheet
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Thermal resistance
Values
Unit
Parameter
Symbol
Min.
–
Typ. Max.
*3
R
thJA
Thermal resistance, junction – ambient
–
62.5
℃
/W
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Electrical characteristics (T
a
= 25°C)
Values
Parameter
Symbol
Conditions
Unit
V
Min.
-30
Typ. Max.
Drain – Source breakdown
voltage
V
(BR)DSS
V
GS
= 0
V
, I
= -1mA
D
–
–
Δ
V
I =
-1mA
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(BR)DSS
D
Breakdown voltage
–
–
-22
–
–
mV/
℃
temperature coefficient
ΔT
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referenced to 25
℃
j
Zero gate voltage
drain current
I
DSS
V
DS
= -30V, V
= 0V
-1
μA
GS
I
G
SS
V
G
S(th)
Δ
V
V
V
= ±20V, V
= 0V
Gate – Source leakage current
Gate threshold voltage
–
–
–
±100
-2.5
nA
V
GS
DS
= V
, I
= -1mA
-1.0
DS
GS
D
I =
-1mA
D
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GS(th)
Gate threshold voltage
temperature coefficient
–
2.9
–
mV/
℃
mΩ
S
ΔT
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referenced to 25
℃
j
V
= -10V, I
= -7.5A
–
–
16.7 21.7
24.4 31.7
GS
GS
D
Static drain – source
on – state resistance
*4
R
DS(on)
V
= -4.5V, I
= -7.5A
D
Forward Transfer
Admittance
|Y |
*4
V
DS
= -5.0V, I
= -7.5A
6.5
–
–
fs
D
*1 Pw
≦
10μs, Duty cycle
≦
1%
*2 Tr1: L
⋍
2mH, V
= -15V, R
= 25Ω, STARTING T
= 25
℃
Fig.3-1,3-2
DD
G
ch
*3 MOUNTED ON 40mm×40mm Cu BOARD
*4 Pulsed
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© 2015 ROH
M
C
o., Ltd. All rights reserved.
2/11
20150218 – Rev.001
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RF4E075
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T
Datasheet
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Electrical characteristics
(T
a
= 25°C)
Values
Parameter
Input capacitance
Symbol
Conditions
= 0V
Unit
pF
Min.
Typ.
1000
180
140
10
Max.
C
iss
C
oss
C
rss
V
V
–
–
–
–
–
–
–
–
–
–
–
–
–
–
GS
= -15V
Output capacitance
Reverse transfer capacitance
Turn – on delay time
Rise time
DS
f = 1MHz
*4
V
DD
⋍
-15
V
,
V =
-10V
GS
t
d(on)
t
r
*4
I =
-3.75A
18
D
ns
*4
t
d(off)
R
⋍
4Ω
Turn – off delay time
Fall time
60
L
t
f
*4
R =
10Ω
35
G
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Gate charge characteristics
(T
a
= 25°C)
Values
Typ.
22
Parameter
Symbol
Conditions
Unit
nC
Min.
Max.
V
= -10V
= -4.5V
–
–
–
–
–
–
–
–
GS
GS
*4
Q
g
T
o
tal gate charge
11
V
⋍
-15V
I =
-7.5A
DD
*4
V
Q
gs
Gate – Source charge
Gate – Drain charge
3.4
D
*4
Q
gd
4.2
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Body diode electrical characteristics
(Source-Drain) (T
a
= 25°C)
Values
Typ.
Parameter
Symbol
I
S
Conditions
Unit
A
Min.
–
Max.
Body diode continuous
forward current
–
-1.67
T =
25
℃
a
Body diode
pulse current
*1
I
SP
–
–
–
–
-30
A
V
*4
V
SD
Forward voltage
V
GS
= 0
V
, I
= -1.67A
-1.2
S
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© 2015 ROH
M
C
o., Ltd. All rights reserved.
3/11
20150218 – Rev.001
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RF4E075
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T
Datasheet
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Electrical characteristic curves
Fig.1 Power Dissipation Derating Curve
Fig.2 Maximum Safe Operating Area
Fig.3 Normalized Transient Thermal
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Resistance vs. Pulse Width
Fig.4 Single Pulse Maximum Power
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dissipation
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© 2015 ROH
M
C
o., Ltd. All rights reserved.
4/11
20150218 – Rev.001
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RF4E075
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T
Datasheet
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Electrical characteristic curves
Fig.5 Typical Output Characteristics(I)
Fig.6 Typical Output Characteristics(II)
Fig.7 Breakdown Voltage vs. Junction
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T
e
mperature
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© 2015 ROH
M
C
o., Ltd. All rights reserved.
5/11
20150218 – Rev.001
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RF4E075
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T
Datasheet
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Electrical characteristic curves
Fig.8 Typical Transfer Characteristics
Fig.9 Gate Threshold Voltage vs. Junction
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T
e
mperature
Fig.10 Transconductance vs. Drain Current
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© 2015 ROH
M
C
o., Ltd. All rights reserved.
6/11
20150218 – Rev.001
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RF4E075
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T
Datasheet
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Electrical characteristic curves
Fig.11 Drain Current Derating Curve
Fig.12 Static Drain – Source On – State
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Resistance vs. Gate Source Voltage
Fig.13 Static Drain – Source On – State
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Resistance vs. Junction Temperature
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© 2015 ROH
M
C
o., Ltd. All rights reserved.
7/11
20150218 – Rev.001
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RF4E075
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T
Datasheet
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Electrical characteristic curves
Fig.14 Static Drain – Source On – State
Fig.15 Static Drain – Source On – State
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Resistance vs. Drain Current(I)
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Resistance vs. Drain Current(II)
Fig.16 Static Drain – Source On – State
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Resistance vs. Drain Current(III)
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© 2015 ROH
M
C
o., Ltd. All rights reserved.
8/11
20150218 – Rev.001
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RF4E075
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T
Datasheet
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Electrical characteristic curves
Fig.17 Typical Capacitance vs. Drain –
Fig.18 Switching Characteristics
ꢀ
Source Voltage
Fig.19 Dynamic Input Characteristics
Fig.20 Source Current vs. Source Drain
ꢀ
Voltage
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© 2015 ROH
M
C
o., Ltd. All rights reserved.
9/11
20150218 – Rev.001
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RF4E075
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Datasheet
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Measurement circuits
Fig.1-1 Switching
T
i
me Measurement Circuit
Fig.1-2 Switching Waveforms
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform
Fig.3-1 Avalanche Measurement Circuit
Fig.3-2 Avalanche Waveform
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Notice
This product might cause chip aging and breakdown under the large electrified environment.
Please consider to design ESD protection circuit.
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© 2015 ROH
M
C
o., Ltd. All rights reserved.
10/11
20150218 – Rev.001
RF4E075
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T
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Datasheet
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Dimensions
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© 2015 ROH
M
C
o., Ltd. All rights reserved.
11/11
20150218 – Rev.001
