ROHM-Semicon-RF4E075ATTCR

Part #ROHM-Semicon-RF4E075ATTCR
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ROHM-Semicon-RF4E075ATTCR
RF4E075AT  
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Pch -30V -7.5A Middle Power MOSFET  
Datasheet  
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Outline  
HUML2020L8  
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V

DSS  

-30V  
21.7mΩ  
±7.5A  
2W  
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R

DS(on)

(Max.)  
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I

D  

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P

D  

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Inner circuit  
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Features  
1) Low on – resistance.  
2) High Power small mold Package  
(HUML2020L8).  
3) Pb-free lead plating ; RoHS compliant.  
4) Halogen Free.  
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Packaging specifications  
Embossed  
Tape  
Packing  
Reel size (mm)  
180  
8
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Application  
Switching  
Tape width (mm)  
Type  
Basic ordering unit (pcs)  
Taping code  
3000  
TCR  
JT  
Load switch  
Marking  
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Absolute maximum ratings
(T

a

= 25°C)  
Parameter  
Symbol  
Value  
-30  
Unit  
V
V

DSS  

I

D  

Drain – Source voltage  
Continuous drain current  
Pulsed drain current  
±7.5  
A
*1  
I

D,pulse  

V

G
SS  

±30  
A
Gate – Source voltage  
Avalanche energ
y
,
s
ingle pulse  
Avalanche current  
±20  
V
*2  
E

A
S  

10.6  
-2.7  
mJ  
A
*2  
I

A
S  

*3  
P

D  

Power dissipation  
2
W
℃
℃
T

j  

Junction temperature  
150  
T

stg  

Range of storage temperature  
-55 to +150  
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© 2015 ROH
M
C
o., Ltd. All rights reserved.  
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1/11  
20150218 – Rev.001  

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RF4E075
A
T  
Datasheet  
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Thermal resistance  
Values  
Unit  
Parameter  
Symbol  
Min.  
–
Typ. Max.  
*3  
R

thJA  

Thermal resistance, junction – ambient  
–
62.5
℃
/W  
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Electrical characteristics (T

a

= 25°C)  
Values  
Parameter  
Symbol  
Conditions  
Unit  
V
Min.  
-30  
Typ. Max.  
Drain – Source breakdown  
voltage  
V

(BR)DSS  

V
GS  
= 0
V
, I
 
= -1mA  
D
–
–
Δ
V  
I =
 
-1mA  
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(BR)DSS  
D
Breakdown voltage  
–
–
-22  
–
–
mV/
℃  
temperature coefficient  
ΔT  
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referenced to 25
℃  
j
Zero gate voltage  
drain current  
I

DSS  

V
DS  
= -30V, V
 
= 0V  
-1  
μA  
GS  
I

G
SS  

V

G
S(th)  

Δ
V  
V
V
= ±20V, V
 
= 0V  
Gate – Source leakage current  
Gate threshold voltage  
–
–
–
±100  
-2.5  
nA  
V
GS  
DS  
= V
 
, I
 
= -1mA  
-1.0  
DS  
GS  
D
I =
 
-1mA  
D
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GS(th)  
Gate threshold voltage  
temperature coefficient  
–
2.9  
–
mV/
℃  
mΩ  
S
ΔT  
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referenced to 25
℃  
j
V
= -10V, I
 
= -7.5A  
–
–
16.7 21.7  
24.4 31.7  
GS  
GS  
D
Static drain – source  
on – state resistance  
*4  
R

DS(on)  

V
= -4.5V, I
 
= -7.5A  
D
Forward Transfer  
Admittance  
|Y |

*4  

V
DS  
= -5.0V, I
 
= -7.5A  
6.5  
–
–
fs  
D
*1 Pw
≦
10μs, Duty cycle
≦
1%  
*2 Tr1: L
⋍
2mH, V
 
= -15V, R
 
= 25Ω, STARTING T
 
= 25
℃
Fig.3-1,3-2  
DD  
G
ch  
*3 MOUNTED ON 40mm×40mm Cu BOARD  
*4 Pulsed  
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© 2015 ROH
M
C
o., Ltd. All rights reserved.  
2/11  
20150218 – Rev.001  

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RF4E075
A
T  
Datasheet  
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Electrical characteristics
(T

a

= 25°C)  
Values  
Parameter  
Input capacitance  
Symbol  
Conditions  
= 0V  
Unit  
pF  
Min.  
Typ.  
1000  
180  
140  
10  
Max.  
C

iss  

C

oss  

C

rss  

V
V
–
–
–
–
–
–
–
–
–
–
–
–
–
–
GS  
= -15V  
Output capacitance  
Reverse transfer capacitance  
Turn – on delay time  
Rise time  
DS  
f = 1MHz  
*4  
V
DD  
⋍
-15
V
,
V =
 
-10V  
GS  
t

d(on)  

t

r

*4  

I =
 
-3.75A  
18  
D
ns  
*4  
t

d(off)  

R
⋍
4Ω  
Turn – off delay time  
Fall time  
60  
L
t

f

*4  

R =
 
10Ω  
35  
G
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Gate charge characteristics
(T

a

= 25°C)  
Values  
Typ.  
22  
Parameter  
Symbol  
Conditions  
Unit  
nC  
Min.  
Max.  
V
= -10V  
= -4.5V  
–
–
–
–
–
–
–
–
GS  
GS  
*4  
Q

g  

T
o
tal gate charge  
11  
V
⋍
-15V  
I =
 
-7.5A  
DD  
*4  
V
Q

gs  

Gate – Source charge  
Gate – Drain charge  
3.4  
D
*4  
Q

gd  

4.2  
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Body diode electrical characteristics
(Source-Drain) (T

a

= 25°C)  
Values  
Typ.  
Parameter  
Symbol  
I

S  

Conditions  
Unit  
A
Min.  
–
Max.  
Body diode continuous  
forward current  
–
-1.67  
T =
 
25
℃  
a
Body diode  
pulse current  
*1  
I

SP  

–
–
–
–
-30  
A
V
*4  
V

SD  

Forward voltage  
V
GS  
= 0
V
, I
 
= -1.67A  
-1.2  
S
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© 2015 ROH
M
C
o., Ltd. All rights reserved.  
3/11  
20150218 – Rev.001  

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RF4E075
A
T  
Datasheet  
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Electrical characteristic curves  
Fig.1 Power Dissipation Derating Curve  
Fig.2 Maximum Safe Operating Area  
Fig.3 Normalized Transient Thermal
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Resistance vs. Pulse Width  
Fig.4 Single Pulse Maximum Power
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dissipation  
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© 2015 ROH
M
C
o., Ltd. All rights reserved.  
4/11  
20150218 – Rev.001  

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RF4E075
A
T  
Datasheet  
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Electrical characteristic curves  
Fig.5 Typical Output Characteristics(I)  
Fig.6 Typical Output Characteristics(II)  
Fig.7 Breakdown Voltage vs. Junction  
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T
e
mperature  
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© 2015 ROH
M
C
o., Ltd. All rights reserved.  
5/11  
20150218 – Rev.001  

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RF4E075
A
T  
Datasheet  
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Electrical characteristic curves  
Fig.8 Typical Transfer Characteristics  
Fig.9 Gate Threshold Voltage vs. Junction  
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T
e
mperature  
Fig.10 Transconductance vs. Drain Current  
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© 2015 ROH
M
C
o., Ltd. All rights reserved.  
6/11  
20150218 – Rev.001  

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RF4E075
A
T  
Datasheet  
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Electrical characteristic curves  
Fig.11 Drain Current Derating Curve  
Fig.12 Static Drain – Source On – State  
ꢀ
Resistance vs. Gate Source Voltage  
Fig.13 Static Drain – Source On – State  
ꢀ
Resistance vs. Junction Temperature  
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© 2015 ROH
M
C
o., Ltd. All rights reserved.  
7/11  
20150218 – Rev.001  

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RF4E075
A
T  
Datasheet  
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Electrical characteristic curves  
Fig.14 Static Drain – Source On – State  
Fig.15 Static Drain – Source On – State  
ꢀ
Resistance vs. Drain Current(I)  
ꢀ
Resistance vs. Drain Current(II)  
Fig.16 Static Drain – Source On – State  
ꢀ
Resistance vs. Drain Current(III)  
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© 2015 ROH
M
C
o., Ltd. All rights reserved.  
8/11  
20150218 – Rev.001  

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RF4E075
A
T  
Datasheet  
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Electrical characteristic curves  
Fig.17 Typical Capacitance vs. Drain –  
Fig.18 Switching Characteristics  
ꢀ
Source Voltage  
Fig.19 Dynamic Input Characteristics  
Fig.20 Source Current vs. Source Drain  
ꢀ
Voltage  
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© 2015 ROH
M
C
o., Ltd. All rights reserved.  
9/11  
20150218 – Rev.001  

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RF4E075
A
T  
Datasheet  
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Measurement circuits  
Fig.1-1 Switching
T
i
me Measurement Circuit  
Fig.1-2 Switching Waveforms  
Fig.2-1 Gate Charge Measurement Circuit  
Fig.2-2 Gate Charge Waveform  
Fig.3-1 Avalanche Measurement Circuit  
Fig.3-2 Avalanche Waveform  
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Notice  
This product might cause chip aging and breakdown under the large electrified environment.  
Please consider to design ESD protection circuit.  
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© 2015 ROH
M
C
o., Ltd. All rights reserved.  
10/11  
20150218 – Rev.001  

RF4E075
A
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Datasheet  
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Dimensions  
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© 2015 ROH
M
C
o., Ltd. All rights reserved.  
11/11  
20150218 – Rev.001