ROHM-Semicon-RJU002N06T106
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2.5V Drive Nch MOSFET
RJU002N06
z
Structure
z
Dimensions
(Unit : mm)
Silicon N-channel MOS FET
UMT3
2.0
0.9
0.7
0.2
0.3
z
Features
( )
3
1) Low On-resistance.
2) Low voltage drive (2.5V drive).
( )
2
( )
1
0.6
5
0
.65
1.3
0.15
(1) Source
(2) Gate
Each lead has same dimensions
z
Applications
Switching
Abbreviated symbol : ML
(3) Drain
z
Packaging specifications
z
Inner circuit
(3)
Package
Taping
Type
Code
T106
3000
Basic ordering unit (pieces)
RJU002N06
(2)
∗
2
(1)
Source
(2)
Gate
(3)
Drain
∗
1
(1)
∗
1
ESD PROTECTION DIODE
∗
2
BODY DIODE
z
Absolute maximum ratings
(
T
a
=25
°
C)
Parameter
Drain-source voltage
Symbol
Limits
60
Unit
V
V
DSS
V
GSS
I
D
Gate-source voltage
12
V
Continuous
200
mA
mA
mW
°
C
Drain current
∗
1
∗
2
Pulsed
I
DP
800
Total power dissipation
Channel temperature
P
D
200
Tch
Tstg
150
Range of storage temperature
∗
1 Pw
≤
10
µ
s, Duty cycle
≤
1%
∗
2 Each terminal mounted on a recommended land
−
55 to
+
150
°
C
z
Thermal resistance
Parameter
Symbol
Limits
625
Unit
∗
Channel to ambient
∗
Each terminal mounted on a recommended land
Rth(ch-a)
°
C/W
c
2009.03 – Rev.A
○
2009 ROHM Co., Ltd. All rights reserved.
1/4
RJU002N06
Data Sheet
z
Electrical characteristics
(
T
a
=25
°
C)
Parameter
Symbol Min.
Typ. Max.
Conditions
µ
A V
GS
=±12V, V
DS
=0V
I
D
= 1mA, V
GS
=0V
µ
A V
DS
= 60V, V
GS
=0V
Unit
Gate-source leakage
I
GSS
−
−
−
±10
−
Drain-source breakdown voltage
V
(BR) DSS
60
V
Zero gate voltage drain current
Gate threshold voltage
I
DSS
−
0.5
−
−
−
−
−
1.6
1.7
2.2
−
1
V
GS (th)
1.5
2.3
2.4
3.1
−
V
V
DS
= 10V, I
D
= 1mA
I
D
= 200mA, V
GS
= 4.5V
I
D
= 200mA, V
GS
= 4V
I
D
= 200mA, V
GS
= 2.5V
V
DS
= 10V, I
D
= 200mA
V
DS
= 10V
Ω
Ω
Ω
S
Static drain-source on-state
resistance
∗
R
DS (on)
∗
Forward transfer admittance
Input capacitance
Y
fs
C
iss
0.1
−
18
−
pF
pF
pF
ns
ns
ns
ns
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
C
oss
C
rss
t
d (on)
−
−
−
−
−
−
7
−
−
−
−
−
−
V
GS
=0V
5
f=1MHz
∗
∗
∗
∗
7
V
DD
30
V
I
V
D
= 100mA
t
r
7
GS
= 4V
Turn-off delay time
t
d (off)
t
f
12
90
R
L
=300
Ω
Fall time
∗
Pulsed
R
G
=10
Ω
z
Body diode characteristics
(Source-drain) (
T
a
=25
°
C)
Parameter
Symbol Min.
Typ. Max.
Conditions
Unit
Forward voltage
V
SD
−
−
1.2
V
I
S
= 0.16A, V
GS
=0V
c
2009.03 – Rev.A
○
2009 ROHM Co., Ltd. All rights reserved.
2/4
RJU002N06
Data Sheet
z
Electrical characteristics curves
1
0.1
0.5
100
10
1
Ta=25°C
Pulsed
V
DS
= 10V
Pulsed
V
GS
= 4.0V
Ta= 25°C
Pulsed
V
V
GS
= 3.5V
GS
= 3.0V
0.4
0.3
0.2
0.1
0
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= – 25°C
V
GS
= 2.5V
V
V
GS
= 4.0V
GS
= 4.5V
0.01
0.001
V
GS
= 2.0V
V
GS
= 1.5V
0.1
0
0.2
0.4
0.6
0.8
1
0
0.5
1
1.5
2
2.5
0.01
0.1
DRAIN-CURRENT : I
D
[mA]
1
GATE-SOURCE VOLTAGE : V
GS
[V]
Fig.2 Typical
Transfer Characteristics
DRAIN-SOURCE VOLTAGE : V
DS
[V]
Fig.3 Static
Drain-Source On-State
Resistance vs. Drain Current(
Fig.1 Typical Output Characteristics(
)
Ⅰ
)
Ⅰ
100
10
1
100
10
1
100
10
1
V
GS
= 4.0V
V
GS
= 4.5V
Pulsed
V
GS
= 2.5V
Pulsed
Ta=125°C
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
Pulsed
Ta=75°C
Ta=25°C
Ta= -25°C
0.1
0.1
0
0.01
0.1
1
0.01
0.1
1
0.01
0.1
DRAIN-CURRENT : I
D
[mA]
1
DRAIN-CURRENT : I
D
[mA]
DRAIN-CURRENT : I
D
[mA]
Fig.6 Static
Drain-Source On-State
Resistance vs. Drain Current(
Fig.4 Static
Drain-Source On-State
Fig.5 Static
Drain-Source On-State
Resistance vs. Drain Current(
)
Ⅳ
Resistance vs. Drain Current(
)
Ⅱ
)
Ⅲ
10
8
1
10000
1000
100
10
V
GS
=0V
Pulsed
Ta=25°C
Ta=25°C
Pulsed
V
V
DD
= 30V
GS
=4.0V
I
D
= 0.2A
t
f
t
d
(off)
0.1
0.01
R
G
=10
Ω
6
Pulsed
I
D
= 0.1A
4
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
t
r
2
t
d
(on)
10
0
0.001
1
0
2
4
6
8
10
0
0.5
1
1.5
1
100
1000
SOURCE-DRAIN VOLTAGE : V
SD
[V]
GATE-SOURCE VOLTAGE : V
GS
[V]
Fig.8 Static
Drain-Source On-State
DRAIN-CURRENT : I
D
[A]
Fig.9 Switching Characteristics
Fig.7 Reverse Drain Current
vs. Sourse-Drain Voltage
Resistance vs. Gate Source Voltage
c
2009.03 – Rev.A
○
2009 ROHM Co., Ltd. All rights reserved.
3/4
RJU002N06
Data Sheet
1
0.1
100
Operation in this area is limited by R
DS(ON)
(V
GS
= 4.5V)
1ms 100us
Ciss
P
W
=10ms
10
DC operation
Coss
0.01
0.001
Crss
Ta=25°C
f=1MHz
Ta = 25°C
Single Pulse
V
GS
=0V
MOUNTED ON SERAMIC BOARD
1
0.1
1
10
DRAIN-SOURCE VOLTAGE : V
DS
[V]
Fig.11 Maximum Safe Operating Aera
100
0.01
0.1
1
10
100
DRAIN-SOURCE VOLTAGE : V
DS
[V]
Fig.10 Typical
Capacitance
vs. Drain-Source Voltage
1000
100
10
Ta = 25°C
Single Pulse
Rth(ch-a)(t) = r(t)×Rth(ch-a)
Rth(ch-a) = 625 °C/W
Mounted on a SERAMIC board
1
0.0001
0.001
0.01
0.1
1
10
100
1000
PULSE WIDTH : Pw(s)
Fig.12 Normalized Transient Thermal Resistance vs. Pulse
W
idth
c
2009.03 – Rev.A
○
2009 ROHM Co., Ltd. All rights reserved.
4/4
Appendix
Notes
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wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM
upon request.
Examples of application circuits, circuit constants and any other information contained herein illustrate the
standard usage and operations of the Products. The peripheral conditions must be taken into account
when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document. Howeve
r
,
s
hould
you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no re-
sponsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and examples
of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to
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sponsibility whatsoever for any dispute arising from the use of such technical information.
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Appendix-Rev4.1
