ROHM-Semicon-RJU002N06T106

Part #ROHM-Semicon-RJU002N06T106
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ROHM-Semicon-RJU002N06T106
2.5V Drive Nch MOSFET  
RJU002N06  
z
Structure  
z
Dimensions
(Unit : mm)  
Silicon N-channel MOS FET  
UMT3  
2.0  
0.9  
0.7  
0.2  
0.3  
z
Features  
( )  
3
1) Low On-resistance.  
2) Low voltage drive (2.5V drive).  
( )  
2
( )  
1
0.6
5
0
.65  
1.3  
0.15  
(1) Source  
(2) Gate  
Each lead has same dimensions  
z
Applications  
Switching  
Abbreviated symbol : ML  
(3) Drain  
z
Packaging specifications  
z
Inner circuit  
(3)  
Package  
Taping  
Type  
Code  
T106  
3000  
Basic ordering unit (pieces)  
RJU002N06  
(2)  
∗
2  
(1)
Source  
(2)
Gate  
(3)
Drain  
∗
1  
(1)  
∗
1
ESD PROTECTION DIODE  
∗
2
BODY DIODE  
z
Absolute maximum ratings
(
T
a
=25
°
C)  
Parameter  
Drain-source voltage  
Symbol  
Limits  
60  
Unit  
V
V

DSS  

V

GSS  

I

D  

Gate-source voltage  
12  
V
Continuous  
200  
mA  
mA  
mW  
°
C  
Drain current  
∗
1  
∗
2  
Pulsed  
I

DP  

800  
Total power dissipation  
Channel temperature  
P

D  

200  
Tch  
Tstg  
150  
Range of storage temperature  
∗
1 Pw
≤
10
µ
s, Duty cycle
≤
1%  
∗
2 Each terminal mounted on a recommended land  
−
55 to
+
150  
°
C  
z
Thermal resistance  
Parameter  
Symbol  
Limits  
625  
Unit  
∗
Channel to ambient  
∗
Each terminal mounted on a recommended land  
Rth(ch-a)  
°
C/W  
c
2009.03 – Rev.A  
○
2009 ROHM Co., Ltd. All rights reserved.  
1/4  

RJU002N06  
Data Sheet  
z
Electrical characteristics
(
T
a
=25
°
C)  
Parameter  
Symbol Min.
 
Typ. Max.  
Conditions  
µ
A V

GS

=±12V, V

DS

=0V  
I

D

= 1mA, V

GS

=0V  
µ
A V

DS

= 60V, V

GS

=0V  
Unit  
Gate-source leakage  
I

GSS  

−
−
−
±10  
−
Drain-source breakdown voltage
 
V

(BR) DSS
 

60  
V
Zero gate voltage drain current  
Gate threshold voltage  
I

DSS  

−
0.5  
−
−
−
−
−
1.6  
1.7  
2.2  
−
1
V

GS (th)  

1.5  
2.3  
2.4  
3.1  
−
V
V

DS

= 10V, I

D

= 1mA  
I

D

= 200mA, V

GS

= 4.5V  
I

D

= 200mA, V

GS

= 4V  
I

D

= 200mA, V

GS

= 2.5V  
V

DS

= 10V, I

D

= 200mA  
V

DS

= 10V  
Ω
Ω
Ω
S
Static drain-source on-state  
resistance  
∗
R

DS (on)  

∗
Forward transfer admittance  
Input capacitance  
Y

fs  

C

iss  

0.1  
−
18  
−
pF  
pF  
pF  
ns  
ns  
ns  
ns  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
C

oss  

C

rss  

t

d (on)  

−
−
−
−
−
−
7
−
−
−
−
−
−
V

GS

=0V  
5
f=1MHz  
∗
∗
∗
∗
7
V
DD
30
V  
I
V
D
= 100mA  
t
r
7
GS
= 4V  
Turn-off delay time  
t

d (off)  

t

f  

12  
90  
R
L
=300
Ω  
Fall time  
∗
Pulsed  
R
G  
=10
Ω  
z
Body diode characteristics
(Source-drain) (
T
a
=25
°
C)  
Parameter  
Symbol Min.
 
Typ. Max.  
Conditions  
Unit  
Forward voltage  
V
SD  
−
−
1.2  
V
I

S

= 0.16A, V

GS

=0V  
c
2009.03 – Rev.A  
○
2009 ROHM Co., Ltd. All rights reserved.  
2/4  

RJU002N06  
Data Sheet  
z
Electrical characteristics curves  
1
0.1  
0.5  
100  
10  
1
Ta=25°C  
Pulsed  
V

DS

= 10V  
Pulsed  
V

GS

= 4.0V  
Ta= 25°C  
Pulsed  
V
V

GS

= 3.5V  

GS

= 3.0V  
0.4  
0.3  
0.2  
0.1  
0
Ta= 125°C  
Ta= 75°C  
Ta= 25°C  
Ta= – 25°C  
V

GS

= 2.5V  
V
V

GS

= 4.0V  

GS

= 4.5V  
0.01  
0.001  
V

GS

= 2.0V  
V

GS

= 1.5V  
0.1  
0
0.2  
0.4  
0.6  
0.8  
1
0
0.5  
1
1.5  
2
2.5  
0.01  
0.1  
DRAIN-CURRENT : I

D

[mA]  
1
GATE-SOURCE VOLTAGE : V

GS

[V]  
Fig.2 Typical
 
Transfer Characteristics  
DRAIN-SOURCE VOLTAGE : V

DS

[V]  
Fig.3 Static
 
Drain-Source On-State  
Resistance vs. Drain Current(  
Fig.1 Typical Output Characteristics(  
)
Ⅰ
)
Ⅰ
100  
10  
1
100  
10  
1
100  
10  
1
V

GS

= 4.0V  
V

GS

= 4.5V  
Pulsed  
V

GS

= 2.5V  
Pulsed  
Ta=125°C  
Ta=125°C  
Ta=75°C  
Ta=25°C  
Ta= -25°C  
Ta=125°C  
Ta=75°C  
Ta=25°C  
Ta= -25°C  
Pulsed  
Ta=75°C  
Ta=25°C  
Ta= -25°C  
0.1  
0.1  
0
0.01  
0.1  
1
0.01  
0.1  
1
0.01  
0.1  
DRAIN-CURRENT : I

D

[mA]  
1
DRAIN-CURRENT : I

D

[mA]  
DRAIN-CURRENT : I

D

[mA]  
Fig.6 Static
 
Drain-Source On-State  
Resistance vs. Drain Current(  
Fig.4 Static
 
Drain-Source On-State  
Fig.5 Static
 
Drain-Source On-State  
Resistance vs. Drain Current(  
)
Ⅳ
Resistance vs. Drain Current(  
)
Ⅱ
)
Ⅲ
10  
8
1
10000  
1000  
100  
10  
V

GS

=0V  
Pulsed  
Ta=25°C  
Ta=25°C  
Pulsed  
V
V

DD

= 30V  

GS

=4.0V  
I

D

= 0.2A  
t

f  

t

d

(off)  
0.1  
0.01  
R

G

=10
Ω
 
6
Pulsed  
I

D

= 0.1A  
4
Ta=125°C  
Ta=75°C  
Ta=25°C  
Ta=-25°C  
t

r  

2
t

d

(on)  
10  
0
0.001  
1
0
2
4
6
8
10  
0
0.5  
1
1.5  
1
100  
1000  
SOURCE-DRAIN VOLTAGE : V

SD

[V]  
GATE-SOURCE VOLTAGE : V

GS

[V]  
Fig.8 Static
 
Drain-Source On-State  
DRAIN-CURRENT : I

D

[A]  
Fig.9 Switching Characteristics  
Fig.7 Reverse Drain Current  
vs. Sourse-Drain Voltage  
Resistance vs. Gate Source Voltage  
c
2009.03 – Rev.A  
○
2009 ROHM Co., Ltd. All rights reserved.  
3/4  

RJU002N06  
Data Sheet  
1
0.1  
100  
Operation in this area is limited by R

DS(ON)  

(V

GS

= 4.5V)  
1ms 100us  
Ciss  
P

W

=10ms  
10  
DC operation  
Coss  
0.01  
0.001  
Crss  
Ta=25°C  
f=1MHz  
Ta = 25°C  
Single Pulse  
V

GS

=0V  
MOUNTED ON SERAMIC BOARD  
1
0.1  
1
10  
DRAIN-SOURCE VOLTAGE : V

DS

[V]  
Fig.11 Maximum Safe Operating Aera  
100  
0.01  
0.1  
1
10  
100  
DRAIN-SOURCE VOLTAGE : V

DS

[V]  
Fig.10 Typical
 
Capacitance  
vs. Drain-Source Voltage  
1000  
100  
10  
Ta = 25°C  
Single Pulse  
Rth(ch-a)(t) = r(t)×Rth(ch-a)  
Rth(ch-a) = 625 °C/W  
Mounted on a SERAMIC board  
1
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
PULSE WIDTH : Pw(s)  
Fig.12 Normalized Transient Thermal Resistance vs. Pulse
W
idth  
c
2009.03 – Rev.A  
○
2009 ROHM Co., Ltd. All rights reserved.  
4/4  

Appendix  
Notes  
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The content specified herein is for the purpose of introducing ROHM’s products (hereinafter “Products”). If you  
wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM  
upon request.  
Examples of application circuits, circuit constants and any other information contained herein illustrate the  
standard usage and operations of the Products. The peripheral conditions must be taken into account  
when designing circuits for mass production.  
Great care was taken in ensuring the accuracy of the information specified in this document. Howeve
r
,
s
hould  
you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no re-  
sponsibility for such damage.  
The technical information specified herein is intended only to show the typical functions of and examples  
of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to  
use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no re-  
sponsibility whatsoever for any dispute arising from the use of such technical information.  
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tronic appliances and amusement devices).  
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Support System  
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:
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Copyright © 2009 ROHM Co.,Ltd.  
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Appendix-Rev4.1