ROHM-Semicon-RU1C002ZPTCL

Part #ROHM-Semicon-RU1C002ZPTCL
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ROHM-Semicon-RU1C002ZPTCL
RU1C002ZP  
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Pch -20V -200mA Small Signal MOSFET  
Datasheet  
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Outline  
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SOT-323FL  
V

DSS  

-20V  
1.2Ω  
SC-85  
R

DS(on)

(Max.)  
UMT3F  
I

D  

±200mA  
150mW  
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P

D  

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Inner circuit  
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Features  
1) Low on-resistance  
2) Low voltage drive(1.2V drive)  
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Packaging specifications  
Embossed  
Tape  
Packing  
Reel size (mm)  
180  
8
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Application  
Tape width (mm)  
Type  
Switching  
Basic ordering unit (pcs)  
Taping code  
3000  
TCL  
YK  
Marking  
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Absolute maximum ratings
(T =
 
25°C ,unless otherwise specified)  
a
Parameter  
Symbol  
V

DSS  

I

D  

Value  
-20  
Unit  
V
Drain – Source voltage  
Continuous drain current  
Pulsed drain current  
±200  
mA  
mA  
V
*1  
I

DP  

±800  
V

G
SS  

Gate – Source voltage  
±10  
*2  
P

D  

Power dissipation  
150  
mW  
℃
T

j  

Junction temperature  
150  
T

stg  

Operating junction and storage temperature range  
-55 to +150  
℃
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© 2016 ROH
M
C
o., Ltd. All rights reserved.  
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1/10  
20160722 – Rev.001  

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RU1C002ZP  
Datasheet  
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Thermal resistance  
Values  
Unit  
Parameter  
Symbol  
Min.  
–
Typ. Max.  
*2  
R

thJA  

Thermal resistance, junction – ambient  
–
833
℃
/W  
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Electrical characteristics (T

a

= 25°C)  
Values  
Parameter  
Symbol  
V

(BR)DSS  

Conditions  
Unit  
V
Min.  
-20  
Typ. Max.  
Drain – Source breakdown  
voltage  
V
GS  
= 0
V
, I
 
= -1mA  
–
–
D
Δ
V  
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I =
 
-1mA  
(BR)DSS  
D
Breakdown voltage  
–
–
-21.9  
–
–
mV/
℃  
temperature coefficient  
ΔT  
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referenced to 25
℃  
j
Zero gate voltage  
drain current  
I

DSS  

V
DS  
= -20V, V
 
= 0V  
GS  
-1  
μA  
I

G
SS  

V

G
S(th)  

Δ
V  
Gate – Source leakage current  
Gate threshold voltage  
V
V
= ±10V, V
 
= 0V  
–
–
–
±10  
-1.0  
μA  
V
GS  
DS  
= -10V, I
 
= -100μA  
-0.3  
DS  
D
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I =
 
-1mA  
GS(th)  
D
Gate threshold voltage  
temperature coefficient  
–
2.4  
–
mV/
℃  
ΔT  
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referenced to 25
℃  
j
V
GS  
V
GS  
V
GS  
V
GS  
V
GS  
= -4.5V, I
 
= -200mA  
–
–
–
–
–
0.8  
1.0  
1.3  
1.6  
2.4  
1.2  
1.5  
2.2  
3.5  
9.6  
D
= -2.5V, I
 
= -100mA  
D
Static drain – source  
on – state resistance  
*3  
R

DS(on)  

= -1.8V, I
 
= -100mA  
Ω
D
= -1.5V, I
 
= -40mA  
D
= -1.2V, I
 
= -10mA  
D
Forward Transfer  
Admittance  
|Y |

*3  

V
DS  
= -10V, I
 
= -200mA  
200  
–
–
mS  
fs  
D
*1 Pw
≦
10μs, Duty cycle
≦
1%  
*2 Each terminal mounted on a reference land.  
*3 Pulsed  
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© 2016 ROH
M
C
o., Ltd. All rights reserved.  
2/10  
20160722 – Rev.001  

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RU1C002ZP  
Datasheet  
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Electrical characteristics
(T

a

= 25°C)  
Values  
Parameter  
Input capacitance  
Symbol  
Conditions  
= 0V  
Unit  
pF  
Min.  
Typ.  
115  
10  
6
Max.  
C

iss  

C

oss  

C

rss  

V
V
–
–
–
–
–
–
–
–
–
–
–
–
–
–
GS  
= -10V  
Output capacitance  
Reverse transfer capacitance  
Turn – on delay time  
Rise time  
DS  
f = 1MHz  
*3  
t

d(on)  

V
⋍
-10
V
,
V =
 
-4.5V  
DD GS  
6
t

r

*3  

I =
 
-100mA  
4
D
ns  
*3  
t

d(off)  

R
⋍
100Ω  
Turn – off delay time  
Fall time  
17  
17  
L
t

f

*3  

R =
 
10Ω  
G
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Gate charge characteristics
(T

a

= 25°C)  
Values  
Typ.  
1.4  
Parameter  
Symbol  
Conditions  
Unit  
nC  
Min.  
Max.  
*3  
Q

g  

T
o
tal gate charge  
–
–
–
–
–
–
V
⋍
-10V,  
I =
 
-200mA,  
DD  
*3  
Q

gs  

Gate – Source charge  
Gate – Drain charge  
0.3  
D
V
GS  
= -4.5V  
*3  
Q

gd  

0.3  
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Body diode electrical characteristics
(Source-Drain) (T

a

= 25°C)  
Values  
Parameter  
Symbol  
Conditions  
Unit  
Min.  
Typ.  
Max.  
-100  
-800  
-1.2  
I

S  

Continuous forward current  
Pulse forward current  
Forward voltage  
–
–
–
–
–
–
mA  
mA  
V
T =
 
25
℃  
a
*1  
I

SP  

*3  
V

SD  

V
GS  
= 0
V
, I
 
= -200mA  
S
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© 2016 ROH
M
C
o., Ltd. All rights reserved.  
3/10  
20160722 – Rev.001  

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RU1C002ZP  
Datasheet  
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Electrical characteristic curves  
Fig.1 Power Dissipation Derating Curve  
Fig.2 Drain Current Derating Curve  
Fig.3 Typical Output Characteristics(I)  
Fig.4 Typical Output Characteristics(II)  
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© 2016 ROH
M
C
o., Ltd. All rights reserved.  
4/10  
20160722 – Rev.001  

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RU1C002ZP  
Datasheet  
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Electrical characteristic curves  
Fig.5 Breakdown Voltage vs.  
Fig.6 Typical Transfer Characteristics  
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Junction Temperature  
Fig.7 Gate Threshold Voltage vs.  
Fig.8 Forward Transfer Admittance vs.  
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Junction Temperature  
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Drain Current  
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© 2016 ROH
M
C
o., Ltd. All rights reserved.  
5/10  
20160722 – Rev.001  

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RU1C002ZP  
Datasheet  
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Electrical characteristic curves  
Fig.9 Static Drain – Source On – State  
Fig.10 Static Drain – Source On – State  
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Resistance vs. Gate Source Voltage  
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Resistance vs. Junction Temperature  
Fig.11 Static Drain – Source On – State  
Fig.12 Static Drain – Source On – State  
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Resistance vs. Drain Current (I)  
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Resistance vs. Drain Current (II)  
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© 2016 ROH
M
C
o., Ltd. All rights reserved.  
6/10  
20160722 – Rev.001  

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RU1C002ZP  
Datasheet  
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Electrical characteristic curves  
Fig.13 Static Drain – Source On – State  
Fig.14 Static Drain – Source On – State  
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Resistance vs. Drain Current (lII)  
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Resistance vs. Drain Current (IV)  
Fig.15 Static Drain – Source On – State  
Fig.16 Static Drain – Source On – State  
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Resistance vs. Drain Current (V)  
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Resistance vs. Drain Current (VI)  
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© 2016 ROH
M
C
o., Ltd. All rights reserved.  
7/10  
20160722 – Rev.001  

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RU1C002ZP  
Datasheet  
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Electrical characteristic curves  
Fig.17 Typical Capacitance vs.  
Fig.18 Switching Characteristics  
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Drain – Source Voltage  
Fig.19 Source Current vs.  
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Source Drain Voltage  
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© 2016 ROH
M
C
o., Ltd. All rights reserved.  
8/10  
20160722 – Rev.001  

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RU1C002ZP  
Datasheet  
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Measurement circuits  
Fig. 1-1 SWITCHING TIME MEASUREMENT CIRCUIT  
Fig. 2-1 GATE CHARGE MEASUREMENT CIRCUIT  
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Fig. 1-2 SWITCHING WAVEFORMS  
Fig. 2-2 GATE CHARGE WAVEFORM  
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Notice  
This product might cause chip aging and breakdown under the large electrified environment.  
Please consider to design ESD protection circuit.  
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© 2016 ROH
M
C
o., Ltd. All rights reserved.  
9/10  
20160722 – Rev.001  

RU1C002ZP  
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Datasheet  
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Dimensions  
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© 2016 ROH
M
C
o., Ltd. All rights reserved.  
10/10  
20160722 – Rev.001  

Notice  
Precaution on using ROHM Products  
1. Our
 
Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,  
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.).
 
If you  
intend to use our Products in devices requiring extremely high reliability (such as medical equipment

(Note 1)

, transport  
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car  
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or  
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.  
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any  
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific  
Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASS
Ⅲ
 
CLASS
Ⅳ  
CLASS
Ⅱ
b  
CLASS
Ⅲ  
CLASS
Ⅲ  
CLASS
Ⅲ  
2. ROHM
 
designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our
 
Products are designed and manufactured for use under standard conditions and not under any special or  
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any  
special or extraordinary environments or conditions.
 
If you intend to use our Products under any special or  
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of  
product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl
2
,  
H
2
S, NH
3
, SO
2
, and NO
2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The
 
Products are not subject to radiation-proof design.  
5. Please
 
verify and confirm characteristics of the final or mounted products in using the Products.  
6. In
 
particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate
 
Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in  
the range that does not exceed the maximum junction temperature.  
8. Confirm
 
that operation temperature is within the specified range described in the product specification.  
9. ROHM
 
shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When
 
a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In
 
principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must  
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,  
please consult with the ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice-PGA-E  
Rev.003  
© 2015 ROHM Co., Ltd. All rights reserved.  

Precautions Regarding Application Examples and External Circuits  
1. If
 
change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You
 
agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use.
 
Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document.
 
ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product
 
performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the
 
Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the
 
temperature or humidity exceeds those recommended by ROHM  
[c] the
 
Products are exposed to direct sunshine or condensation  
[d] the
 
Products are exposed to high Electrostatic  
2. Even
 
under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store
 
/ transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use
 
Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign  
trade act, please consult with ROHM in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All
 
information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data.  
2. ROHM
 
shall not have any obligations where the claims, actions or demands arising from the combination of the  
Products with other articles such as components, circuits, systems or external equipment (including software).  
3. No
 
license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM  
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to  
manufacture or sell products containing the Products, subject to the terms and conditions herein.  
Other Precaution  
1. This
 
document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The
 
Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In
 
no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The
 
proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice-PGA-E  
Rev.003  
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