Samwin-SW4N65

Part #Samwin-SW4N65
Download 
Samwin-SW4N65
SW4N65D  
N-channel Enhanced
 
mode TO-220F/TO-251N/TO-251S/TO-251M/TO-251U/  
TO-252/SOT-82/TO-263 /TO-220/TO-251MQ MOSFET  
Features  
TO-220F  
TO-251M TO-251U  
TO-251N TO-251S  
BV

DSS

: 650V  
I

D

: 4A  
High ruggedness  
Low R

DS(ON)

(Typ 2
Ω
)@V

GS

=10V  
Low Gate Charge (Typ 18nC)  
Improved dv/dt Capability  
100% Avalanche Tested  
Application: Charger,TV-POWER  
1
1
1
1
1
1
2
3
2
2
2
R

DS(ON)

: 2
Ω  
2
3
3
3
3
SOT-82  
TO-263  
TO-252  
TO-220  
TO-251MQ  
2
1
1
1
1
1
2
3
2
3
2
3
2
3
2
3
3
General Description  
1. Gate
 
2. Drain
 
3. Source  
This power MOSFET is produced with advanced technology of SAMWIN.  
This technology enable the power MOSFET to have better characteristics, including fast  
switching time, low on resistance, low gate charge and especially excellent avalanche  
characteristics.  
Order Codes  
Item  
1
2
3
4
5
6
7
8
Sales Type  
SW F 4N65D  
SW N 4N65D  
SW SI 4N65D  
SW MI 4N65D  
SW UI 4N65D  
SW D 4N65D  
SW S 4N65D  
SW B 4N65D  
SW P 4N65D  
SW MQI 4N65D  
Marking  
Package  
TO-220F  
TO-251N  
TO-251S  
TO-251M  
TO-251U  
TO-252  
SOT-82  
TO-263  
TO-220  
TO-251MQ  
Packaging  
SW4N65D  
SW4N65D  
SW4N65D  
SW4N65D  
SW4N65D  
SW4N65D  
SW4N65D  
SW4N65D  
SW4N65D  
SW4N65D  
TUBE  
TUBE  
TUBE  
TUBE  
TUBE  
REEL  
TUBE  
TUBE  
TUBE  
TUBE  
9
10  
Absolute maximum ratings  
Value  
Symbol  
Parameter  
Unit  
TO251N/S/M/U&TO252&  
TO220F  
SOT82 TO263 TO220  
TO-251MQ  
V

DSS  

I

D  

Drain to source voltage  
Continuous drain current (@T

C

=25

o

C)  
Continuous drain current (@T

C

=100

o

C)  
Drain current pulsed  
Gate to source voltage  
Single pulsed avalanche energy (note2)  
Repetitive avalanche energy  
Peak diode recovery dv/dt  
650  
4*  
2.5*  
16  
±
30  
246  
15  
V
A
A
A
V
mJ  
mJ  
V/ns  
I

DM  

V

GS  

E

AS  

E

AR  

dv/dt  
(note 1)  
(note 1)  
(note 3)  
5
Total power dissipation (@T

C

=25

o

C)  
Derating factor above 25

o

C  
23  
101  
145  
156  
167  
W
W/

o

C  
P

D  

T

STG

, T

J  

T

L  

0.19  
0.81  
1.16  
1.25  
1.33  
Operating junction temperature & storage  
temperature  
-55 ~ + 150  
300  

o

C  
Maximum lead temperature for soldering  
purpose, 1/8 from case for 5 seconds.  

o

C  
*. Drain current is limited by junction temperature.  
Thermal characteristics  
Value  
Symbol  
Parameter  
TO251N/S/M/U&TO252&  
TO-251MQ  
Unit  
TO220F  
SOT82 TO263
 
TO220  
R

thjc  

R

thja  

Thermal resistance, Junction to case  
Thermal resistance, Junction to ambient  
5.36  
49  
1.24  
66  
0.86  
81  
0.80  
0.75  
61  

o

C/W  

o

C/W  
Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved.  
Jun. 2018. Rev. 11  
1/8  

SW4N65D  
Electrical characteristic
( T

C

= 25

o

C unless otherwise specified )  
Symbol  
Parameter  
Test conditions  
Min.  
Typ.  
Max. Unit  
Off characteristics  
BV

DSS  

Drain to source breakdown voltage  
V

GS

=0V, I

D

=250uA  
650  
V
ΔBV

DSS

Breakdown voltage temperature  
I

D

=250uA, referenced to 25

o

C  
0.48  
V/

o

C  
/ ΔT

J  

coefficient  
V

DS

=650V, V

GS

=0V  
V

DS

=520V, T

C

=125

o

C  
V

GS

=30V, V

DS

=0V  
V

GS

=-30V, V

DS

=0V  
1
uA  
uA  
nA  
nA  
I

DSS  

Drain to source leakage current  
50  
100  
-100  
Gate to source leakage current, forward  
Gate to source leakage current, reverse  
I

GSS  

On characteristics  
V

GS(TH)  

R

DS(ON)  

G

fs  

Gate threshold voltage  
V

DS

=V

GS

, I

D

=250uA  
V

GS

=10V, I

D

=2A  
V

DS

=30V, I

D

=2A  
2.5  
4.5  
2.6  
V
Ω
S
Drain to source on state resistance  
Forward transconductance  
2
3.8  
Dynamic characteristics  
C

iss  

C

oss  

C

rss  

t

d(on)  

t

r  

Input capacitance  
758  
69  
8
Output capacitance  
Reverse transfer capacitance  
Turn on delay time  
Rising time  
V

GS

=0V, V

DS

=25V, f=1MHz  
pF  
ns  
15  
26  
43  
26  
18  
4
V

DS

=325V, V

GS

=10V, I

D

=4A,  
R

G

=25Ω  
t

d(off)  

t

f  

Turn off delay time  
Fall time  
(note 4,5)  
Q

g  

Total gate charge  
Gate-source charge  
Gate-drain charge  
Gate resistance  
V

DS

=520V, V

GS

=10V, I

D

=4A  
(note 4,5)  
Q

gs  

Q

gd  

R

g  

nC  
8
V

DS

=0V, Scan F mode  
3.2  
Ω
Source to drain diode ratings characteristics  
Symbol  
Parameter  
Continuous source current  
Pulsed source current  
Test conditions  
Min.  
Typ.  
Max. Unit  
I

S  

I

SM  

V

SD  

t

rr  

4
A
A
Integral reverse p-n Junction  
diode in the MOSFET  
16  
1.4  
Diode forward voltage drop.  
Reverse recovery time  
I

S

=4A, V

GS

=0V  
V
398  
2.1  
ns  
uC  
I

S

=4A, V

GS

=0V,  
dI

F

/dt=100A/us  
Q

rr  

Reverse recovery charge  
※
. Notes  
1.  
2.  
3.  
4.  
5.  
Repeatitive rating : pulse width limited by junction temperature.  
L = 30.8mH, I

AS

= 4A, V

DD

= 50V, R

G

=25Ω, Starting T

J

= 25

o

C  
I

SD

≤ 4A, di/dt = 100A/us, V

DD

≤ BV

DSS

, Staring T

J

=25

o

C  
Pulse Test : Pulse Width ≤ 300us, duty cycle ≤ 2%.  
Essentially independent of operating temperature.  
Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved.  
Jun. 2018. Rev. 11  
2/8  

SW4N65D  
Fig. 1. On-state characteristics  
Fig. 2. Transfer Characteristics  
Fig. 4. On-state current vs. diode  
forward voltage  
Fig. 3. On-resistance variation vs.  
drain current and gate voltage  
Fig. 6. On-resistance variation  
vs. junction temperature  
Fig 5. Breakdown voltage variation  
vs. junction temperature  
Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved.  
Jun. 2018. Rev. 11  
3/8  

SW4N65D  
Fig. 7. Gate charge characteristics  
Fig. 8. Capacitance Characteristics  
Fig. 10. Maximum safe operating area
(
TO-251N  
&TO-251S&TO-251M&TO-251U&TO-252&TO-251MQ
)  
Fig. 9. Maximum safe operating area
(
TO-220F
)  
Fig. 12. Maximum safe operating area
(
TO-263
)  
Fig. 11. Maximum safe operating area
(
SOT-82
)  
Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved.  
Jun. 2018. Rev. 11  
4/8  

SW4N65D  
Fig. 13. Maximum safe operating area
(
TO-220
)  
Fig. 14. Transient thermal response curve
(
TO-220F
)  
Fig. 15. Transient thermal response curve
(
TO-251N&TO-251S&TO-251M&  
TO-251U&TO-252&TO-251MQ
)  
Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved.  
Jun. 2018. Rev. 11  
5/8  

SW4N65D  
Fig. 16. Transient thermal response curve
(
SOT-82
)  
Fig. 17. Transient thermal response curve
(
TO-263
)  
Fig. 18. Transient thermal response curve
(
TO-220
)  
Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved.  
Jun. 2018. Rev. 11  
6/8  

SW4N65D  
Fig. 19. Gate charge test circuit & waveform  
Fig. 20. Switching time test circuit & waveform  
V

DS  

90%  
R

L  

V

DS  

R

GS  

V

DD  

10%  
10%  
t

d(on)  

V

IN  

t

f  

t

d(off)  

10V

IN  

DUT  
t

r  

t

ON  

t

OFF  

Fig. 21. Unclamped Inductive switching test circuit & waveform  
Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved.  
Jun. 2018. Rev. 11  
7/8  

SW4N65D  
Fig. 22. Peak diode recovery dv/dt test circuit & waveform  
DUT  
10V  
+
–
V

GS

(DRIVER)  
I

S

(DUT)  
V

DS  

L
di/dt  
I

S  

I

RM  

V

DS  

R

G  

Diode reverse current  
V

DD  

Diode recovery dv/dt  
Same type  
as DUT  
10V

GS  

V

DD  

V

DS

(DUT)  
V

F  

*. dv/dt controlled by RG  
*. Is controlled by pulse period  
Body diode forward voltage drop  
DISCLAIMER  
* All the data & curve in this document was tested in XI’AN SEMIPOWER TESTING & APPLICATION CENTE  
R.  
* This product has passed the PCT,TC,HTRB,HTGB,HAST,PC and Solderdunk reliability testing.  
* Qualification standards can also be found on the Web
site (

* Suggestions for improvement are appreciated, Please
send your suggestions to

Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved.  
Jun. 2018. Rev. 11  
8/8