Sanken-Elec-GKI04031
| Part # | Sanken-Elec-GKI04031 |
Download  | Sanken-Elec-GKI04031 |
40 V, 40 A, 2.9 m
Ω
Low R
DS(ON)
N ch Trench Power MOSFET
GKI04031
Features
Package
V
(BR)DSS
——————————— 40 V (I
D
= 100
µ
A)
I
D
———————————————————
–
4
0 A
R
DS(ON)
———-3.9
mΩ max
. (V
GS
= 10 V, I
D
= 51.0 A)
Q
g
——26.4 nC (V
GS
= 4.5 V, V
DS
= 20 V, I
D
= 58.5 A)
DFN 5 × 6 (L)
8pin
8pin
D
D
D
D
D
D
D D
Low Total Gate Charge
High Speed Switching
Low On-Resistance
Capable of 4.5 V Gate Drive
100 % UIL Tested
S
S
S
G
G
S
S
S
1pin
RoHS Compliant
1pin
Not to scale
Applications
Equivalent circuit
DC-DC converters
Synchronous Rectification
Power Supplies
D(5)(6)(7)(8)
G(4)
S(1)(2)(3)
Absolute Maximum Ratings
Unless otherwise specified, T
A
= 25 °C
Parameter
Drain to Source Voltage
Gate to Source Voltage
Symbol
V
D
Test conditions
Rating
40
Unit
V
V
GS
V
± 20
T
C
= 25 °C,
with infinite heatsink
T
A
= 25 °C,
mounted on PCB*
PW
≤
100µs
A
A
A
A
40
17
80
40
Continuous Drain Current
I
D
Pulsed Drain Current
I
DM
I
S
Duty cycle
≤
1 %
Continuous Source Current
(Body Diode)
Pulsed Source C
rrent
(Body Diode)
PW
≤
100µs
Duty cycle
≤
1 %
I
SM
A
80
V
DD
= 20V, L = 1 mH,
I
AS
= 11.2 A, unclamped,
R
G
= 4.7
Ω
,
Single Pulse Avalanche Energy
Avalanche Current
E
AS
I
AS
P
D
mJ
126
Refer to Figure 1
A
23.3
77
T
C
= 25 °C,
with infinite heatsink
T
A
= 25 °C,
mounted on PCB*
W
Power Dissipation
W
3.1
150
Operating Junction Temperature
Storage Temperature Range
T
J
°C
°C
T
STG
−
55 to 150
* 1 inch square 2 oz copper pad on 1.5 × 1.5 inch PCB.
GKI04031-DS Rev.1.6
Mar. 30, 2015
SANKEN ELECTRIC CO.,LTD.
1
GKI04031
Thermal Characteristics
Unless otherwise specified, T
A
= 25 °C
Parameter
Symbol
R
θJC
Test Conditions
Mounted on PCB*
Min.
Typ.
Max.
1.6
Unit
Thermal Resistance
(
Junction to Case)
Thermal Resistance
(
Junction to Ambient)
−
−
°C/W
R
θJA
−
−
°C/W
40.3
* 1 inch square 2 oz copper pad on 1.5 × 1.5 inch PCB.
Electrical Characteristics
Unless otherwise specified, T
A
= 25 °C
Parameter
Symbol
V
(BR)DSS
Test Conditions
Min.
40
Typ.
Max.
Unit
V
Drain to Source Breakdown
Voltage
I
D
= 100
μA,
V
GS
= 0 V
−
−
V
DS
= 40 V, V
GS
= 0 V
V
GS
= ± 20 V
Drain to Source Leakage Current
Gate to Source Leakage Current
Gate Threshold Voltage
I
DSS
I
GSS
−
−
−
−
100
± 100
2.5
3.9
5.5
−
µA
nA
V
V
DS
= V
GS
, I
D
= 1 mA
I
D
= 51.0 A, V
GS
= 10 V
I
D
= 25.5 A, V
GS
= 4.5 V
f = 1 MHz
V
GS(th)
1.0
−
2.0
2.9
mΩ
mΩ
Ω
Static Drain to Source
On-Resistance
R
DS(ON)
−
3.7
Gate Resistance
R
G
C
iss
C
oss
C
rss
Q
g1
Q
g2
Q
gs
Q
gd
t
d(on)
t
r
−
1.1
Input Capacitance
−
3910
620
360
56.1
26.4
9.0
−
V
DS
= 25 V
V
GS
= 0
f = 1 MH
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge (V
GS
= 10 V)
Total Gate Charge (V
GS
= 4.5 V)
Gate to Source Charge
Gate to Drain Charge
Turn-On Delay Time
Rise Time
−
−
pF
−
−
−
−
−
−
V
DS
= 20 V
I
D
= 58.5 A
nC
−
−
−
9.7
−
−
6.2
−
V
DD
= 20 V
I
D
= 58.5 A
V
GS
= 10 V, R
G
= 4.7
Ω
Refer to Figure 2
−
8.4
−
ns
Turn-Off Delay Time
Fall Time
t
d(off)
t
f
−
28.9
17.9
−
−
−
Source to Drain Diode Forward
Voltage
Source to Drain Diode Reverse
Recovery Time
Source to Drain Diode Reverse
Recovery Charge
I
S
= 51.0 A, V
GS
= 0 V
−
−
−
0.9
1.5
−
V
ns
V
SD
t
r
r
38.7
37.2
I
F
= 58.5 A
di/dt = 100 A/µs
Refer to Figure 3
Q
r
r
−
nC
GKI04031-DS Rev.1.6
Mar. 30, 2015
SANKEN ELECTRIC CO.,LTD.
2
GKI04031
Test Circuits and Waveforms
V
1
2
(BR)DSS
E
AS
L
I
AS
2
L
V
V
DD
(BR)DSS
V
(BR)DSS
I
D
V
DS
I
AS
R
G
V
DD
V
GS
V
DS
I
D
V
DD
0 V
(a) Test Circuit
(b) Wavefor
Figure 1 Unclamped Inductive Switching
R
L
90%
V
GS
V
DS
10%
90%
R
G
V
DD
V
GS
V
DS
0 V
10%
t
d(on)
t
r
t
d(off)
t
f
t
off
P.W. = 10
μ
s
Duty cycle
≤
1 %
t
on
(a) Test Circuit
(b) Waveform
Figure 2 Switching Time
D.U.T.
L
I
F
I
F
V
DD
t
rr
R
G
0 V
I
RM
× 90 %
V
GS
0 V
di/dt
I
RM
(a) Test Circuit
(b) Waveform
Figure 3 Diode Reverse Recovery Time
GKI04031-DS Rev.1.6
Mar. 30, 2015
SANKEN ELECTRIC CO.,LTD.
3
GKI04031
RDS(ON)-ID characteristic
s
(
typical)
VGS=10V
RDS(ON)-ID characteristic
s
(
typical)
VGS=4.5V
ID-VGS characteristics (typical)
VDS=5V
8
7
6
5
4
3
2
1
0
8
7
6
5
4
3
2
1
0
80
70
60
50
40
30
20
10
0
Tc
=
1
25
℃
Tc
=
1
25
℃
75
℃
25
℃
75
℃
25
℃
Tc =125
℃
75
℃
25
℃
0
10 20 30 40 50 60 70 80
ID (A)
0
10 20 30 40 50 60 70 80
ID (A)
0
1
2
3
4
5
VGS (
)
IDR-VSD characteristics (typical)
IDR-VSD character
tics (typical)
VDS=0V
VDS-VGS characteristics (typical)
T
c
=25
℃
Tc=25
℃
80
70
60
50
40
30
20
10
0
80
0.4
70
60
40
30
20
10
0
VGS=10V
4.5V
0.3
0.2
0.1
0.0
Tc =125
℃
75
℃
3V
0V
ID=51.0A
ID=29.3A
ID=25.5A
25
℃
0
5
10
15
0
0.5
1.5
0
0.5
1
1.5
V
D (V)
VGS (V)
VSD (V)
Capacitance-VDS characteristics (typical)
Vth-Tc characteristics (typical)
VGS – Q
haracteristics (typical)
15
3
10000
1000
100
Ciss
2
1
0
Coss
10
5
Crss
I
D
=1mA
VGS=VDS
Tc=25
℃
VDS=20V
ID=58.5A
Ta=25
℃
VGS=0V
f=1MHz
0
10
0
10
20
30
40
25
50
75
100
125
150
0
20
40
60
Qg (nC)
Tc (
℃
)
VDS (V)
RDS(ON)-Tc characteristics (typical)
RDS(ON)-Tc characteristics (typical)
BVDSS-Tc characteristics (typical)
10
8
7
6
5
4
3
2
1
50
8
6
4
2
0
48
46
44
42
40
I
D
=1mA
VGS=0V
I
D
=51A
VGS=10V
I
D
=25.5A
VGS=4.5V
0
25
50
75
100
125
150
25
50
75
100
125
150
25
50
75
100
125
150
Tc (
℃
)
Tc (
℃
)
Tc (
℃
)
GKI04031-DS Rev.1.6
Mar. 30, 2015
SANKEN ELECTRIC CO.,LTD.
4
GKI04031
PD-Ta Derating
SAFE OPERATING AREA
80
60
40
20
0
1000
100
10
ID(pulse) MAX
PT=100μs
PT=1ms
1
1 shot
Tc=25
℃
0.1
0.1
1
10
VDS (V)
100
0
50
100
Ta (
℃
)
150
TRANSIEN
T
T
HERMAL RESISTANCE – PULSE WIDTH
1.E+01
1.E+00
1.E-01
1.E-02
Tc = 25
℃
1shot
VDS < 10V
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
P.
T
. (sec)
GKI04031-DS Rev.1.6
Mar. 30, 2015
SANKEN ELECTRIC CO.,LTD.
5
GKI04031
Package Outline
DFN 5 × 6 (L)
NOTES:
1) Dimension
is in millimeters
2) Pb-free.
Device composition compliant with the RoHS directive
Marking Diagram
SK
GKI××
××
Part Number
YMDDXXXB
Lot Number
Y is the Last digit of the year (0 to 9)
M is the Month (1 to 9, O, N or D)
DD is the Date (two digit of 01 to 31)
XXX is the suffix No.
B expresses Pb free pins
GKI04031-DS Rev.1.6
Mar. 30, 2015
SANKEN ELECTRIC CO.,LTD.
6
GKI04031
OPERATING PRECAUTIONS
In the case that you use Sanken products or design your products by using Sanken products, the reliability largely
depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation
range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to
assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage, electric
current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused
due to self-heating of semiconductor products. For these stresses, instantaneous values, maximum values and minimum
values must be ta
ken into consideration. In addition, it should be noted that since power devices or IC’s including power
devices have large self-heating value, the degree of derating of junction temperature affects the reliability significantly.
Because reliability can be affected adversely by improper storage environments and handling methods, please
observe the following cautions.
Cautions for Storage
Ensure that storage conditions comply with the standard temperature (5 to 35°C) and the standard r
lative humidity
(around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity.
Avoid locations where dust or harmful gases are present and avoid direct sunlight.
Reinspect for rust on leads and solderability of the products that have been stored f
ong time.
Cautions for
T
e
sting and Handling
When tests are carried out during inspection testing and other standard test periods, protect the products from power
surges from the testing device, shorts between the product pins, and wrong co
nections. Ensure all test parameters are
within the ratings specified by Sanken for the products.
Remarks About Using Thermal Silicone Grease
When thermal silicone grease is used, it shall be applied evenly and thinly. If more silicone grease than required is
applied, it may produce excess stress.
The thermal silicone grease that has been stored for a long period of time may cause cracks of the greases, and it
cause low radiation performance. In addition, the old gr
se may cause cracks in the resin mold when screwing the
products to a heatsink.
Fully consider preventing foreign materials from
tering into the thermal silicone grease. When foreign material
is immixed, radiation performance may be degraded or an insulation failure may occur due to a damaged insulating
plate.
The thermal silicone greases that are recommended for the resin molded semiconductor should be used.
Our recommended thermal silicone grease is the following, and equivalent of these.
Type
G746
Suppliers
Shin-Etsu Chemical Co., Ltd.
YG6260 Momentive
Performance Materials Japan LLC
SC102 Dow
Corning Toray Co., Ltd.
Soldering
When soldering the products, please be sure to minimize the working time, within the following limits:
・
Reflow
Preheat ; 180 °C / 90 ± 30 s
Solder heating ; 250 °C / 10 ± 1s (260 °C peak, 2 times)
・
Soldering iron ; 380 ± 10 °C / 3.5 ± 0.5s (1 time)
Electrostatic Discharge
When handling the products, the operator must be grounded. Grounded wrist straps worn should have at least 1M
Ω
of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator.
Workbenches where the products are handled should be grounded and be provided with conductive table and floor
mats.
When using measuring equipment such as a curve tracer, the equipment should be grounded.
When soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent
leak voltages generated by them from being applied to the products.
The products should always be stored and transported in Sanken shipping containers or conductive containers, or
be wrapped in aluminum foil.
GKI04031-DS Rev.1.6
Mar. 30, 2015
SANKEN ELECTRIC CO.,LTD.
7
GKI04031
IMPORTANT NOTES
The contents in this document are subject to changes, for improvement and other purposes, without notice. Make
sure that this is the latest revision of the document before use.
Application examples, operation examples and recommended examples described in this document are quoted for
the sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any
infringement of industrial property rights, intellectual property rights, life, body, property or any other rights of
Sanken or any third party which may result from its use.
Unless otherwise agreed in writing by Sanken, Sanken makes no warranties of any kind, whether express or
implied, as to the products, including product merchantability, and fitness for a particular purpose and special
environment, and the information, including its accuracy, usefulness, and reliability, included in this document.
Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and
defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are r
quested to take, at
their own risk, preventative measures including safety design of the equipment or systems against any possible
injury, death, fires or damages to the society due to device failure or malfunction.
Sanken products listed in this document are designed and intended for the use as
ponents in general purpose
electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring
equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required (transportation
equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various
safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment
or apparatus, please contact your nearest Sanken sales representative to discuss, prior to the use of the products
herein.
The use of Sanken products without the written consent of
anken in the applications where extremely high
reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly
prohibited.
When using the products specified herein by ei
her (i) combining other products or materials therewith or (ii)
physically, chemically or otherwise processing o
eating the products, please duly consider all possible risks that
may result from all such uses in advance and proceed therewith at your own responsibility.
Anti radioactive ray design is not considered for the products listed herein.
Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of
Sanken’s distribution network.
The contents in this documen
ust not be transcribed or copied without Sanken’s written consent.
GKI04031-DS Rev.1.6
Mar. 30, 2015
SANKEN ELECTRIC CO.,LTD.
8
