SGMICRO-SGMPM21330TTEN6G-TR
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PRODUCT IN DEVELOPMENT MAY HAVE CHANGE IN BEHAVIOR/PERFORMANCE.
ADVANCE DATASHEET
SGMPM21330
30
V
,
P
ower, Single P-Channel,
TDFN Package, MOSFET
GENERAL DESCRIPTION
PRODUCT SUMMARY
The SGMPM21330 is a power MOSFET with a low
on-state resistance and low gate charge. This feature
makes it a good choice for a load switch application.
R
DS(ON)
(TYP)
I
D
(MAX)
16.7
mΩ
-7.5A
FEATURES
PIN CONFIGURATIONS
●
Low On-State Resistance
●
High-Speed Switching
(TOP VIEW)
(TOP VIEW)
1
6
D
D
G
D
D
S
1
●
Halogen-Free/RoHS Compliant
D
G
D
D
S
D
2
3
5
4
2
5
APPLICATIONS
S
S
Load Switch Applications
High-Speed Line Driver
TDFN-2
6BL
TDFN-2×2-6CL
Relay Driver Applications
Handheld and Mobile Applications
Usb Connector Vbus Power
witch
ABSOLUTE M
XIMUM RATINGS
EQUIVALENT CIRCUIT
PARAMETER
Drain-to-Source Voltage
Gate-to-Source Voltage
SYMBO
VA
E
-30
UNITS
V
D
V
GS
±20
V
Continuous Drain Current (DC)
Continuous Drain Current
se)
Total Dissipation
-7.5
A
I
D
A
P
D
2
W
Junction Temperature
T
J
0
℃
℃
Storage Temperature Range
Lead Temperature (Soldering, 10s)
T
STG
to +150
+260
G
Stresses beyond those listed in Absolute Maximum Ratings may
cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect reliability.
S
SG Micro Corp
AUGUS
T
2
5
,
2
022
PRODUCT IN DEVELOPMENT MAY HAVE CHANGE IN BEHAVIOR/PERFORMANCE.
30V, Power, Single, P-Channel,
TDFN Package, MOSFET
SGMPM21330
PACKAGE/ORDERING INFORMATION
SPECIFIED
PACKAGE
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
TEMPERATURE
RANGE
DESCRIPTION
TDFN-2×2-6BL
TDFN-2×2-6CL
MEL
XXXX
SGMPM21330TTEN6G/TR
SGMPM21330TTEO6G/TR
Tape and Reel, 3000
Tape and Reel, 3000
-55
℃
to +150
℃
-55
℃
to +150
℃
SGMPM21330
MEM
XXXX
MARKING INFORMATION
NOTE: XXXX = Date Code, Trace Code and Vendor Code.
X X X X
Vendor Code
Trace Code
Date Code – Year
Green (RoHS & HSF): SG Micro Corp defines “Green” to m
Pb-Free (RoHS com
le) and free of halogen substances. If
you have additional comments or questions, please conta
GMICRO repr
enta
e directly.
DISCLAIMER
SG Micro Corp reserves the right to make any chan
in c
cuit design
or speci
ations without p
notice.
THERMAL RESISTAN
E MAXIMU
RATINGS
PARAMETER
OL
VALUE
UNITS
Junction-to-Ambient Thermal Resist
ce
A
62.5
℃
/W
SG Micro Corp
AUGUST 2022
2
PRODUCT IN DEVELOPMENT MAY HAVE CHANGE IN BEHAVIOR/PERFORMANCE.
30V, Power, Single, P-Channel,
TDFN Package, MOSFET
SGMPM21330
ELECTRICAL CHARACTERISTICS
(T
A
= +25
℃
, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX UNITS
Static OFF Characteristics
Drain-to-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-to-Source Leakage Current
Static ON Characteristics
V
(BR)DSS
I
D
= -250µA, V
GS
= 0V
-30
V
I
DSS
I
GSS
V
DS
= -30V, V
GS
= 0V
V
GS
= ±20V, V
DS
= 0V
-1
µA
nA
±100
Gate-to-Source Threshold Voltage
V
GS(TH)
R
DS(ON)
g
FS
V
GS
= V
DS
, I
D
= -250µA
I
D
= -7.5A, V
GS
= -10V
I
D
= -7.5A, V
GS
= -4.5V
V
DS
= -5V, I
D
= -7.5A
-1.4
16.7
24.4
—
V
mΩ
S
Static Drain-to-Source
On-State Resistance
Forward Transconductance
Diode Characteristics
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Dynamic Characteristics
Input Capacitance
V
F(SD)
t
RR
V
GS
= 0V, I
S
= -1A
-1.2
V
13.5
ns
nC
I
S
= -7.5A,
0
i/dt =
100A
μ
s
Q
RR
C
ISS
C
O
SS
1927
200
166
32.8
.3
6.6
Output Capacitance
V
D
-15V, V
GS
= 0V,
1MH
pF
nC
Reverse Transfer Capacitance
V
GS
-4.5V
T
o
tal Gate Charge
Q
G
V
DS
= -1
= –
Gate-to-Source Charge
Gate-to-Drain Charge
Switch Characteristics
Turn-On Delay Time
Rise Time
Q
GS
Q
GD
V
D
-15
V
GS
= -4.5V,
D
= -7.
4.6
t
D
R
t
FF)
t
F
8
17
38
30
V
DS
= -15
V
GS
=
0V, I
D
= -3.75 A
ns
Turn-Off Delay Time
Fall Time
SG Micro Corp
AUGUST 2022
3
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TDFN-2×2-6BL
D
e
N6
k1
L
D1
D2
E
E1
L2
E2
L1
L3
k2
k
N1
PIN 1#
b
DETAIL A
BOTTOM VIEW
TOP VIEW
A
0.47
0.7
0.15
0.95
1
0.36
1.9
1.15
SIDE
IEW
0.365
ALTERN
A-1
ALTERNA
A-2
0.65
0
DETAIL A
LTERNATE TE
INA
CONSTRUCT
RECOMM
NDED LAN
N
(Unit: mm)
mensions In M
s
Symbol
MIN
MOD
0.750
MAX
0.800
0.050
A2
b
0.700
000
.020
0.2
REF
0.300
0.250
1.900
1.90
0.850
1.050
0.315
0.650
0.350
2.100
2.100
1.050
1.250
0.415
0.750
D
2.000
E
2.000
D1
E1
D2
E2
e
0.950
1.150
0.365
0.700
0.650 BSC
0.370 REF
0.150 REF
0.360 REF
0.275
k
k1
k2
L
0.225
0.325
L1
L2
L3
0.125 REF
0.200 REF
0.200 REF
NOTE: This drawing is subject to change without notice.
SG Micro Corp
TX00228.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TDFN-2×2-6CL
D
D3
D1
L1
b
N6
L
D2
E
E2
E1
k
k1
N1
e
PIN 1#
DETAIL A
e1
BOTTOM V
W
TOP VIEW
0.30
0.45
A
0.89
1.50
.30
1
2
45
SIDE
IEW
0.35
0.445
A
TERN
A-1
ALTERN
A-2
0.65
DETAIL A
1.30
ALTERNATE T
INA
CONSTRUCT
RECOMM
NDED LAN
N
(Unit: mm)
Dimensions In Mil
rs
Sy
MIN
MOD
0
750
MAX
0.800
0.050
A1
A2
b
700
0.000
0
0
200 REF
0.300
0.250
1.900
1.900
0.790
1.400
0.200
0.500
0.350
2.100
2.100
0.990
1.600
0.400
0.700
D
2.000
E
2.000
D1
E1
D2
E2
D3
e
0.890
1.500
0.300
0.600
0.950 REF
0.650 BSC
1.300 BSC
0.350 REF
0.445 REF
0.255
e1
k
k1
L
0.180
0.355
L1
0.200 REF
NOTE: This drawing is subject to change without notice.
SG Micro Corp
TX00229.000
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECT
N OF FEED
NOTE: The picture is only for re
renc
Please make
ect as the sta
dard.
KEY PARAMETER LIS
OF TAPE AN
REEL
Ree
idth
Reel
Diameter
A0
0
K0
P0
P1
P2
W
Pin1
Package Type
W
mm)
(m
) (mm)
) (mm) (mm) (mm) Quadrant
TDFN-2×2-6BL
TDFN-2×2-6CL
9.5
9
2.
2.30
2.30
2.3
1.00
1.00
.0
4.0
4.0
4.0
2.0
2.0
8.0
8.0
Q1
Q1
SG Micro Corp
TX10000.000
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the
the standard.
KEY PARAMETER LIST OF CART
N BOX
Length
(mm)
idt
(
m)
H
igh
(
)
Reel Type
Pizza/C
7″ (Option)
7″
36
227
4
0
24
224
18
SG Micro Corp
TX20000.000
