Shenzhen-JingYang-JY10220

Part #Shenzhen-JingYang-JY10220
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Shenzhen-JingYang-JY10220
JY10220  
100V N-Channel MOSFET  
Applications  
Features  
•
DC/DC converter  
•
2.6 A, 100 V  
R

DS(ON)

= 90 m
 
Ω
@ V

GS

= 10 V  
R

DS(ON)

= 85 m
 
Ω
@ V

GS

= 4.5 V  
•
High performance trench technology for extremely  
low R

DS(ON)  

•
Low gate charge (14nC typ)  
•
High power and current handling capability  
•
Fast switching speed  
Pin Configuration  
D
D
D
S
1
6
5
4
D
G
2
3
SOT23-6  
L
Absolute Maximum Ratings
 
T

A

=25

o

C unless otherwise noted  
Symbol  
V

DSS  

Parameter  
Drain-Source Voltage  
Ratings  
Units  
V
100  
V

GSS  

Gate-Source Voltage  
Drain Current
 
– Continuous  
– Pulsed  
V
±
20  
I

D  

(Note 1a)  
2.6  
20  
A
P

D  

Maximum Power Dissipation  
(Note 1a)  
(Note 1b)  
1.6  
W
0.8  
T

J

, T

STG  

Operating and Storage Junction Temperature Range  
–55 to +125  
°
C  
Thermal Characteristics  
Thermal Resistance, Junction-to-Ambient  
(Note 1a)  
(Note 1)  
78  
30  
R

θ
JA  

°
C/W  
°
C/W  
Thermal Resistance, Junction-to-Case  
R

θ
JC  

Package Marking and Ordering Information  
Device Marking  
Device  
Reel Size  
Tape width  
Quantity  
3000 units  
8mm  
7”  
JY10220  
JY10220  
Revision A
4
 
1

JY10220  
100V N-Channel MOSFET  
Electrical Characteristics  
T

A

= 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min Typ Max
 
Units  
Drain-Source Avalanche Ratings

(Note 2)  

W

DSS  

I

AR  

Drain-Source Avalanche Energy  
Drain-Source Avalanche Current  
Single Pulse, V

DD

= 50 V, I

D

=2.6 A  
90  
mJ  
A
2.6  
Off Characteristics  
BV

DSS  

Drain–Source Breakdown Voltage  
100  
V
V

GS

= 0 V, I

D

= 250
µ
A  
∆
BV

DSS  

∆
T

J  

Breakdown Voltage Temperature  
Coefficient  
99  
I

D

= 250
µ
A, Referenced to 25
°
C  
mV/
°
C  
I

DSS  

Zero Gate Voltage Drain Current  
Gate–Body Leakage, Forward  
Gate–Body Leakage, Reverse  
V
V

DS

= 80 V,
 
V

GS

= 0 V  

GS

= 20 V, V

DS

= 0 V  
10  
µ
A  
nA  
nA  
I

GSSF  

I

GSSR  

100  
V

GS

= –20 V, V

DS

= 0 V  
–100  
On Characteristics  
(Note 2)  
V

GS(th)  

Gate Threshold Voltage  
1
2.3  
– 6  
3
V
V

DS

= V

GS

, I

D

= 250
µ
A  
∆
V

GS(th)  

∆
T

J  

Gate Threshold Voltage  
Temperature Coefficient  
I

D

= 250
µ
A, Referenced to 25
°
C  
mV/
°
C  
Vg
s
=
1
0 V,
 
Id = 1 A  
Vgs = 4.5 V,
 
Id = 1 A  
85  
90  
110  
125  
Static Drain–Source  
On Resistance  
m
Ω  
R

DS(on)  

I

D(on)  

g

FS  

On–State Drain Current  
V

GS

= 10 V,
 
V

DS

= 5 V  
10  
A
S
Forward Transconductance  
V

DS

= 10 V,
 
I

D

= 2.6 A  
10  
Dynamic Characteristics  
C

iss  

C

oss  

C

rss  

Input Capacitance  
660  
55  
pF  
pF  
pF  
V

DS

= 50 V,  
f = 1.0 MHz  
V

GS

= 0 V,  
Output Capacitance  
Reverse Transfer Capacitance  
40  
Switching Characteristics
 

(Note 2)  

t

d(on)  

t

r  

t

d(off)  

t

f  

Turn–On Delay Time  
Turn–On Rise Time  
Turn–Off Delay Time  
Turn–Off Fall Time  
Total Gate Charge  
Gate–Source Charge  
Gate–Drain Charge  
6
11  
7
ns  
ns  
V

DD

= 50 V,  
V

GS

= 10
 
V,  
I

D

= 1 A,  
R

GEN

= 6
Ω  
3.5  
23  
37  
7.4  
20  
ns  
3.7  
14  
ns  
Q

g  

Q

gs  

Q

gd  

nC  
nC  
nC  
V

DS

= 50 V,  
I

D

= 2.6 A,  
V

GS

= 10 V  
2.3  
3.6  
Drain–Source Diode Characteristics and Maximum Ratings  
I

S  

Maximum Continuous Drain–Source Diode Forward Current  
1.3  
1.2  
A
V
Drain–Source Diode Forward  
Voltage  
V

SD  

V

GS

= 0 V,
 
I

S

= 1.3 A  
(Note 2)  
(Note 2)  
0.76  
t

rr  

Diode Reverse Recovery Time  
31  
56  
nS  
nC  
I

F

= 2.6 A  
d

iF

/d

t

= 100 A/µs  
Q

rr  

Diode Reverse Recovery Charge  
Notes:  
1.
R

θ
JA

is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the solder mounting surface of the drain  
pins. R

θ
JC

is guaranteed by design while R

θ
CA

is determined by the user’s board design.  
a. 78°C/W
 
when mounted on a 1in

2

pad of 2oz copper on FR-4 board.  
b. 156°C/W
 
when mounted on a minimum pad.  
2.
Pulse Test: Pulse Width
≤
300
µ
s, Duty Cycle  
Revision A
4
 
2

JY10220  
100V N-Channel MOSFET  
Typical Characteristics  
1.8  
1.6  
1.4  
1.2  
1
20  
V

GS

= 10V  
4.5V  
5.0V  
16  
V

GS

= 3.5V  
4.0V  
12  
8
4.0V  
4.5V  
5.0V  
6.0V  
10V  
3.5V  
4
0.8  
0
0
4
8
12  
16  
20  
0
2
4
6
8
I

D

, DRAIN CURRENT (A)  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 1. On-Region Characteristics.  
Figure 2. On-Resistance Variation with  
Drain Current and Gate Voltage.  
0.26  
0.23  
0.2  
2.2  
1.8  
1.4  
1
I

D

= 2.6A  

GS

= 10V  
I

D

= 1.3A  
V
T

A

= 125

o

C  
0.17  
0.14  
0.11  
0.08  
0.05  
0.6  
0.2  
T

A

= 25

o

C  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
2
4
6
8
10  
T

J

, JUNCTION TEMPERATURE (

o

C)  
V

GS

, GATE TO SOURCE VOLTAGE (V)  
Figure 3. On-Resistance Variation with  
Temperature.  
Figure 4. On-Resistance Variation with  
Gate-to-Source Voltage.  
100  
20  
16  
12  
8
V

GS

= 0V  
V

DS

= 5V  
10  
T

A

= 125

o

C  
1
25

o

C  
0.1  
-55

o

C  
T

A

= 125

o

C  
0.01  
0.001  
25

o  

4
-55

o

C  
0.0001  
0
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
2
2.5  
3
3.5  
4
4.5  
V

SD

, BODY DIODE FORWARD VOLTAGE (V)  
V

GS

, GATE TO SOURCE VOLTAGE (V)  
Figure 5. Transfer Characteristics.  
Figure 6. Body Diode Forward Voltage Variation  
with Source Current and Temperature.  
Revision A
4
 
3

JY10220  
100V N-Channel MOSFET  
Typical Characteristics  
10  
1000  
800  
600  
400  
200  
0
f = 1MHz  
I

D

= 2.6A  
V

DS

= 25V  
V

GS

= 0 V  
50V  
8
6
4
2
0
75V  
C

ISS  

C

OSS  

C

RSS  

0
3
6
9
12  
15  
0
20  
40  
60  
80  
100  
Q

g

, GATE CHARGE (nC)  
V

DS

, DRAIN TO SOURCE VOLTAGE (V)  
Figure 7. Gate Charge Characteristics.  
Figure 8. Capacitance Characteristics.  
100  
40  
30  
20  
10  
0
SINGLE PULSE  
R

θ
JA

= 156°C/W  
T

A

= 25°C  
100µs  
R

DS(ON)

LIMIT  
10  
1
1ms  
10ms  
100ms  
1s  
10s  
DC  
0.1  
V

GS

= 10V  
SINGLE PULSE  
R

θ
JA

= 156

o

C/W  
0.01  
0.001  
T

A

= 25

o

C  
0.1  
1
10  
100  
1000  
0.001  
0.01  
0.1  
1
10  
100  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
t

1

, TIME (sec)  
Figure 9. Maximum Safe Operating Area.  
Figure 10. Single Pulse Maximum  
Power Dissipation.  
1
D = 0.5  
R

θ
JA

(t) = r(t) + R

θ
JA  

R

θ
JA

= 156 °C/W  
0.2  
P(pk)  
0.1  
0.1  
t

1  

0.05  
t

2  

T

J

– T

A

= P * R

θ
JA

(t)  
Duty Cycle, D = t

1

/ t

2  

0.02  
0.01  
SINGLE PULSE  
0.01  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Figure 11. Transient Thermal Response Curve.  
Thermal characterization performed using the conditions described in Note 1b.  
Transient thermal response will change depending on the circuit board design.  
Revision A
4
 
4

JY10220  
100V N-Channel MOSFET  
Package Outline  
SOT23-6L package  
Revision A
4
 
5

JY10220  
100V N-Channel MOSFET  
Tape and Reel Specification  
P0  
P2  
Φ2: 1.50±0.1  
Device Orientation in Tape  
T
E
F
Top  
Cover  
Tape  
A0  
W
B0  
5° Max  
Pin1 Location  
Φ: 1.0±0.1  
K0  
P
Symbol  
W
A0  
B0  
K0  
E
F
P
P0  
P2  
T
Dimensions 8.00+0.3  
(mm) -0.1  
3.23±0.05 3.17±0.05 1.37±0.05 1.75±0.1 3.5±0.05 4.0±0.1 4.0±0.1 2.0±0.05 0.25±0.02  
W1  
S
K
M
N
R
H
W
Symbol  
Reel Size  
Φ178  
M
N
W
W1  
H
S
K
R
Dimensions  
(mm)  
178.0±1.0 60.0±1.0 11.5±0.5 9.0±0.5 13.0±0.5 2.0±0.1 11.0±0.2 1.0±0.05  
Revision A
4
 
6

JY10220  
100V N-Channel MOSFET  
Marking Codes  
6
5
4
10220  
XXXY  
1
2
3
Note:  
(1)
“10220” is the part number,fixed.  
(2) “XXX”
 
is the last 3 characters of the wafer’s Lot No.,  
“Y” is the internal code.  
Footprint: SOT23-6L  
A
Dimensions  
Symbol  
Millimeters  
Inches  
0.024  
0.043  
0.037  
0.055  
0.098  
0.141  
A
B
C
D
E
F
0.60  
1.10  
0.95  
1.40  
2.50  
3.60  
E
D
B
F
C
Revision A
4
 
7