Shenzhen-ruichips-Semicon-RU1H150S

Part #Shenzhen-ruichips-Semicon-RU1H150S
Download 
Shenzhen-ruichips-Semicon-RU1H150S
RU1H150S  
N-Channel Advanced Power MOSFET  
Features  
Pin Description  
• 108V/150A,  
R

DS (ON)

=3.5m
Ω
(Typ.)@V

GS

=10V  
D
• Advanced HEFET

®

Technology  
• Ultra Low On-Resistance  
• Excellent Q

g

xR

DS(on)

Product  
• 100% avalanche tested  
• 175°C Operating Temperature  
• Lead Free and Green Devices Available (RoHS Compliant)  
G
S
TO263  
D
Applications  
• Motor Drives  
• Uninterruptible Power Supplies  
• DC/DC converter  
G
• General Purpose Applications  
S
N-Channel MOSFET  
Absolute Maximum Ratings  
Parameter  
Symbol  
Rating  
Unit  
Common Ratings
(T

C

=25°C Unless Otherwise Noted)  
V

DSS  

V

GSS  

T

J  

Drain-Source Voltage  
108  
±20  
V
Gate-Source Voltage  
Maximum Junction Temperature  
Storage Temperature Range  
Diode Continuous Forward Current  
175  
°C  
°C  
A
T

STG  

I

S  

-55 to 175  
150  
T

C

=25°C  
Mounted on Large Heat Sink  
①
300
μ
s Pulse Drain Current Tested  
T

C

=25°C  
T

C

=25°C  
T

C

=100°C  
T

C

=25°C  
T

C

=100°C  
600  
150  
106  
288  
144  
0.52  
62.5  
A
A
I

DP  

②
Continuous Drain Current(V

GS

=10V)  
Maximum Power Dissipation  
I

D  

P

D  

W
Thermal Resistance-Junction to Case  
Thermal Resistance-Junction to Ambient  
R

JC  

R

JA  

°C/W  
°C/W  
Drain-Source Avalanche Ratings  
③
E

AS  

Avalanche Energy, Single Pulsed  
625  
mJ  
Ruichips Semiconductor Co., Ltd  
Rev. A– DEC., 2015  
1

RU1H150S  
El t
 
i l
 
Ch t
 
i ti  
Electrical Characteristics
(T

C

=25°C Unless Otherwise Noted)  
RU1H150S  
Symbol  
Parameter  
Test Condition  
Unit  
Min.  
Typ.  
Max.  
Static Characteristics  
V

GS

=0V, I

DS

=250µA  
V

DS

=108V, V

GS

=0V  
BV

DSS  

I

DSS  

Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
108  
115  
V
1
30  
4
µA  
T

J

=125°C  
V

DS

=V

GS

, I

DS

=250µA  
V

GS

=±20V, V

DS

=0V  
V

GS

=10V, I

DS

=75A  
V

GS(th)  

I

GSS  

Gate Threshold Voltage  
2
V
Gate Leakage Current  
±100  
4
nA  
m
Ω  
④
R

DS(ON)  

Drain-Source On-state Resistance  
3.5  
Diode Characteristics  
④
V

SD  

I

SD

=75A, V

GS

=0V  
Diode Forward Voltage  
1.2  
V
t
rr  
Reverse Recovery Time  
60  
ns  
nC  
I

SD

=20A, dl
SD
/dt=100A/µs  
Q
rr  
Reverse Recovery Charge  
560  
⑤
Dynamic Characteristics  
V

GS

=0V,V

DS

=0V,F=1MHz  
R

G  

C

iss  

C

oss  

C

rss  

t

d(ON)  

t

r  

Gate Resistance  
2.6  
6900  
1250  
47  
Ω
V

GS

=0V,  
V

DS

=50V,  
Frequency=1.0MHz  
Input Capacitance  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-on Delay Time  
Turn-on Rise Time  
48  
56  
V

DD

=50V,I

DS

=75A,  
V

GEN

=10V,R

G

=2.5
Ω  
ns  
t

d(OFF)  

t

f  

Turn-off Delay Time  
75  
Turn-off Fall Time  
33  
⑤
Gate Charge Characteristics  
Q

g  

Q

gs  

Q

gd  

Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
117  
40  
V

DS

=50V, V

GS

=10V,  
I

DS

=20A  
nC  
37  
①
Pulse width limited by safe operating area.  
Notes:  
②
Calculated continuous current based on maximum allowable
 
junction temperature. The package  
limitation current is 75A.  
③
Limited by T

Jmax

, I

AS

=50A, V

DD

= 48V, R

G

= 50
Ω
, Starting T

J

= 25°C.  
④
Pulse test;Pulse width
≤
300µs, duty cycle
≤
2%.  
⑤
Guaranteed by design, not subject to production testing.  
Ruichips Semiconductor Co., Ltd  
Rev. A– DEC., 2015  
2

RU1H150S  
O d
 
i d
 
M ki
 
I f
 
ti  
Ordering and Marking Information  
Device  
Marking  
Package  
Packaging Quantity
 
Reel Size
 
Tape width  
RU1H150S  
RU1H150S  
TO263  
Tube  
50  
–
–
Ruichips Semiconductor Co., Ltd  
Rev. A– DEC., 2015  
3

RU1H150S  
T
T
i l
 
C
h
harac
t
t i
 
ti  
ypical eristics  
Power Dissipation  
Drain Current  
350  
300  
250  
200  
150  
100  
50  
160  
140  
120  
100  
80  
60  
40  
Limited By Package  
20  
V

GS

=10V  
50  
0
0
0
25  
50  
75  
100  
125  
150  
175  
25  
75  
100  
125  
150  
175  
T

J

– Junction Temperature (
°
C)  
T

J

– Junction Temperature (
°
C)  
Drain Current  
30  
25  
20  
15  
10  
5
Safe Operation Area  
10000  
1000  
100  
10  
I

DS

=75A  
10µs  
100µs  
1ms  
10ms  
DC  
1
T

C

=25°C  
0
0.1  
0
1
2
3
4
5
6
7
8
9
10  
0.01  
0.1  
1
10  
100  
V

GS

– Gate-Source Voltage (V)  
V

DS

– Drain-Source Voltage (V)  
Thermal Transient Impedance  
Duty=0.5, 0.2, 0.1, 0.05, 0.02, 0.01, Single Pulse  
1
0.1  
0.01  
Single Pulse  
R

θ
JC

=
0.52°C/W  
0.001  
1E-05  
0.0001  
0.001  
0.01  
0.1  
1
Square Wave Pulse Duration (sec)  
Ruichips Semiconductor Co., Ltd  
Rev. A– DEC., 2015  
4

RU1H150S  
Typical Characteristics  
Drain-Source On Resistance  
Output Characteristics  
20  
15  
10  
5
200  
150  
100  
50  
10V  
9V  
8V  
7V  
V

GS

=10V  
0
0
0
30  
60  
90  
120  
150  
0
1
2
3
4
5
I

D

– Drain Current (A)  
V

DS

– Drain-Source Voltage (V)  
Drain-Source On Resistance  
Source-Drain Diode Forward  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
100  
10  
1
V

GS

=10V  
I

D

=75A  
T

J

=175°C  
T

J

=25°C  
T

J

=25°C  
Rds(on)=3.5m
Ω
 
0.1  
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
-50 -25  
0
25  
50  
75 100
 
125 150 175  
V

SD

– Source-Drain Voltage (V)  
T

J

– Junction Temperature (
°
C)  
Capacitance  
Gate Charge  
10000  
10  
Frequency=1.0MHz  
V

DS

=50V  
I

DS

=20A  
9
8
7
6
5
4
3
2
1
0
8000  
6000  
4000  
2000  
0
Ciss  
Coss  
Crss  
1
10  
100  
1000  
0
50  
100  
150  
V

DS

– Drain-Source Voltage (V)  
Q

G

– Gate Charge (nC)  
Ruichips Semiconductor Co., Ltd  
Rev. A– DEC., 2015  
5

RU1H150S  
A l
 
h T
 
t Ci
 
it d
 
W f  
Avalanche Test Circuit and Waveforms  
Switching Time Test Circuit and Waveforms  
Ruichips Semiconductor Co., Ltd  
Rev. A– DEC., 2015  
6

RU1H150S  
P k
 
I f
 
ti  
Package Information  
TO263  
θ
1  
θ
1  
θ
2  
θ
θ
2  
MM  
NOM  
INCH  
NOM  
MM  
NOM  
INCH  
NOM  
SYMBOL  
SYMBOL  
MIN  
MAX  
4.72  
0.25  
2.79  
0.95  
1.40  
0.65  
1.40  
9.40  
10.28  
MIN  
0.169  
0.000  
0.102  
0.028  
0.045  
0.013  
0.045  
0.338  
0.380  
MAX  
MIN  
1.94  
1.02  
*
MAX  
MIN  
MAX  
0.110  
0.055  
0.067  
A
A1  
A2  
b
4.30  
0.00  
2.59  
0.70  
1.14  
0.33  
1.15  
8.59  
9.66  
4.55  
0.179  
0.186  
0.010  
0.110  
0.037  
0.055  
0.026  
0.055  
0.370  
0.405  
L
L3  
2.30  
2.79  
1.40  
1.70  
0.076  
0.040  
*
0.091  
0.10  
0.005  
1.29  
0.051  
2.69  
0.106  
L1  
*
*
0.25 BSC  
2.50 REF  
0.01 BSC  
0.098 REF  
*
*
*
*
*
*
*
*
*
*
L4  
b1  
c
L2  
0°  
5°  
*
8°  
9°  
0°  
5°  
*
8°  
9°  
θ
c1  
D
7°  
7°  
θ1  
θ2  
DEP  
Φp1  
1°  
3°  
5°  
1°  
3°  
5°  
E
*
*
0.05  
1.40  
0.10  
1.50  
0.20  
1.60  
0.002  
0.055  
0.004  
0.059  
0.008  
0.063  
2.54BSC  
0.100BSC  
e
H
14.70  
15.10  
15.79  
0.579  
0.594  
0.622  
Ruichips Semiconductor Co., Ltd  
Rev. A– DEC., 2015  
7

RU1H150S  
C t
 
S i  
Customer Service  
Worldwide Sales and Service:  
Technical Support:  
Investor Relations Contacts:  
Marcom Contact:  
Editorial Contact:  
HR Contact:  
Legal Contact:  
Shen Zhen RUICHIPS Semiconductor CO., LTD  
4th Floor, Block 8, Changyuan New Material Port, Keyuan Middle Road, Science & Industry Park,  
Nanshan District, Shenzhen, CHINA  
TEL:
(86-755) 8311-5334  
FAX:
(86-755) 8311-4278  
Ruichips Semiconductor Co., Ltd  
Rev. A– DEC., 2015  
8