Sine-Microelectronics-ASM6115

Part #Sine-Microelectronics-ASM6115
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Sine-Microelectronics-ASM6115
A
SM
6115  
P-Ch 60V Fast Switching MOSFETs  
Super Low Gate Charge  
100% EAS Guaranteed  
Green Device Available  
Excellent CdV/dt effect decline  
Advanced high cell density Trench  
technology  
Product Summary  
BVDSS  
RDSON  
ID  
-60V  
25m
Ω  
-35A  
TO252 Pin Configuration  
Description  
The
A
SM
6115 is the high cell density trenched  
P-ch MOSFE
T
s, which provide excellent  
RDSON and gate charge for most of  
th
e
s
ynchronous buck converter applications.  
The
A
SM
6115 meet the RoHS and Green  
Product requirement, 100% EAS guaranteed  
with full function reliability approved.  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
-60  
Units  
V

DS  

Drain-Source Voltage  
Gate-Sou
r
ce Voltage  
Continuous Drain Current, -V

GS

@ -10V

1  

Continuous Drain Current, -V

GS

@ -10V

1  

Pulsed Drain Current

2  

V
V
V

GS  

I

D

@T

C

=25
℃
 
I

D

@T

C

=100
℃  
I

DM  

±
20  
-35  
-27  
A
A
-70  
A
EAS  
Single Pulse Avalanche Energy

3  

113  
mJ  
A
I

AS  

Avalanche Current  
47.6  
P

D

@T

C

=25
℃  
T

STG  

Total Power Dissipation

4  

52.1  
W
℃
℃
Storage
T
e
mperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
T

J  

Thermal Data  
Symbol  
R

θ
JA  

Parameter  
Typ.  
—  
Max.  
62  
Unit  
℃
/W  
℃
/W  
Thermal Resistance Junction-Ambient

1  

Thermal Resistance Junction-Case

1  

R

θ
JC  

—  
2.4  
1

A
SM
6115  
P-Ch 60V Fast Switching MOSFETs  
Electrical Characteristics (T

J

=25
℃
, unless otherwise noted)  
Symbol  
BV

DSS  

Parameter  
Conditions  
V

GS

=0V , I

D

=-250uA  
Min.  
-60  
—  
—  
—  
-1.0  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
Typ.  
—  
Max.  
—  
Unit  
V
Drain-Source Breakdown Voltage  
BV

DSS

Temperature Coefficient  
△
BV

DSS

/
△
T

J  

Reference to 25
℃
, I

D

=-1mA  
V

GS

=-10V , I

D

=-18A  
-0.035  
—  
—  
V/
℃  
25  
33  
-2.5  
—  
R

DS(ON)  

Static Drain-Source On-Resistance

2  

m
 
V

GS

=-4.5V , I

D

=-12A  
—  
V

GS(th)  

Gate Threshold Voltage  
—  
V
V

GS

=V

DS

, I

D

=-250uA  
△
V

GS(th)  

V

GS(th)

Temperature Coefficient  
4.28  
—  
mV/
℃  
V

DS

=-48V , V

GS

=0V , T

J

=25
℃  
V

DS

=-48V , V

GS

=0V , T

J

=55
℃  
1
I

DSS  

Drain-Source Leakage Current  
uA  
—  
5
V

GS

=
±
20V , V

DS

=0V  
I

GSS  

gfs  
Gate-Source Leakage Current  
Forward Transconductance  
Gate Resistance  
—  
±
100  
—  
nA  
S
V

DS

=-10V , I

D

=-18A  
23  
R

g  

V

DS

=0V , V

GS

=0V , f=1MHz  
7
—  
Q

g  

Total Gate Charge (-4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
25  
—  
V

DS

=-20V , V

GS

=-4.5V , I

D

=-12A  
nC  
ns  
Q

gs  

Q

gd  

T

d(on)  

T

r  

6.7  
5.5  
38  
—  
—  
—  
V

DD

=-15V , V

GS

=-10V , R

G

=3.3
,  
23.6  
100  
6.8  
3635  
224  
141  
—  
I

D

=-1A  
T

d(off)  

T

f  

Turn-Off Delay Time  
Fall Time  
—  
—  
C

iss  

C

oss  

C

rss  

Input Capacitance  
—  
V

DS

=-15V , V

GS

=0V , f=1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
—  
—  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
V

G

=V

D

=0V , Force Current  
V

GS

=0V , I

S

=-1A , T

J

=25
℃  
Min.  
—  
Typ.  
—  
Max.  
-35  
-70  
-1  
Unit  
A
I

S  

Continuous Source Current

1,5  

Pulsed Source Current

2,5  

Diode Forward Voltage

2  

I

SM  

V

SD  

—  
—  
A
—  
—  
V
Note :  
1.The data tested by surface mounted on a 1 inch

2

FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width
 
≦
300us , duty cycle
 
≦
2%  
3.The EAS data shows Max. rating . The test condition is V

DD

=-25V,V

GS

=-10V,L=0.1mH,I

AS

=-47.6A  
4.The power dissipation is limited by 150
℃
junction temperature  
5.The data is theoretically the same as I

D

and I

DM

, in real applications , should be limited by total power dissipation.  
2

A
SM
6115  
P-Ch 60V Fast Switching MOSFETs  
Typical Characteristics  
30  
28  
26  
24  
22  
20  
12  
10  
8
I

D

=-12A  
V

GS

=-10V  
V

GS

=-7V  
V

GS

=-5V  
6
V

GS

=-4.5V  
4
V

GS

=-3V  
2
0
0
0.25  
0.5  
0.75  
1
2
4
6
8
10  
-V

DS

Drain-to-Source Voltage (V)  
-V

GS

(V)  
Fig.1 Typical Output Characteristics  
Fig.2 On-Resistance v.s Gate-Source  
12  
10  
8
10  
V

DS

=-20V  
I

D

=-12A  
8
6
4
2
0
6
T

J

=150
℃
 
T

J

=25
℃  
4
2
0
0
20  
40  
60  
0.2  
0.4  
0.6  
0.8  
1
-V

SD

, Source-to-Drain Voltage (V)  
Q

G

, Total Gate Charge (nC)  
Fig.3 Forward Characteristics Of Reverse  
Fig.4 Gate-Charge Characteristics  
2.0  
1.5  
1.0  
0.5  
1.5  
1
0.5  
0
-50  
0
50  
100  
150  
-50  
0
50  
100  
150  
T

J

,Junction Temperature (
℃
)  
T

J

, Junction Temperature (
℃
)  
Fig.5 Normalized V

GS(th)

v.s T

J  

Fig.6 Normalized R

DSON

v.s T

J  

3

A
SM
6115  
P-Ch 60V Fast Switching MOSFETs  
10000  
1000  
100  
100.00  
10.00  
1.00  
F=1.0MHz  
Ciss  
100us  
1ms  
10ms  
Coss  
Crss  
100ms  
DC  
0.10  
Tc=25

o

C  
Single Pulse  
0.01  
10  
0.1  
1
10  
-V

DS

(V)  
100  
1000  
1
5
9
13  
17  
21  
25  
-V

DS

Drain to Source Voltage(V)  
Fig.7 Capacitance  
Fig.8 Safe Operating Area  
1
DUTY=0.5  
0.3  
0.1  
0.1  
0.05  
0.02  
P

DM  

T

ON  

T
0.01  
D = T

ON

/T  
S
I
NGLE PULSE  
T

J

peak = T

C

+ P

DM

x R

θJC  

0.01  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
t , Pulse Width (s)  
Fig.9 Normalized Maximum Transient Thermal Impedance  
Fig.10 Switching Time Waveform  
Fig.11 Unclamped Inductive Waveform  
4