Sinopower-Semicon-SM2001CSKC-TRG

Part #Sinopower-Semicon-SM2001CSKC-TRG
Download 
Sinopower-Semicon-SM2001CSKC-TRG
SM2001CSK  
®
Dual Enhancement Mode MOSFET (N- and P-Channel)  
Features  
Pin Description  
D1  
D1  
D2  
•
•
•
N-Channel  
20V/9.5A,  
D2  
R

DS(ON)

=14m
Ω
(max.) @ V

GS

= 4.5V  
R

DS(ON)

=18m
Ω
(max.) @ V

GS

= 2.5V  
P-Channel  
-20V/-6A,  
R

DS(ON)

=45m
Ω
(max.) @ V

GS

=-4.5V  
S1  
G1  
S2  
G2  
T
o
p View of SOP
−
8  
R

DS(ON)

=65m
Ω
(max.) @ V

GS

=-2.5V  
(8) (7)  
D1 D1  
(6) (5)  
D2 D2  
100% UIS + R

g

T
e
sted  
•
•
Reliable and Rugged  
Lead Free and Gree
n
D
evices Available  
(RoHS Compliant)  
(4)  
G2  
(2)  
G1  
Applications  
S1  
(1)  
S2  
(3)  
•
Power Management in Notebook Computer,  
Portable Equipment and Battery Powered  
Systems.  
P-Channe
l
M
OSFET  
N-Channe
l
M
OSFET  
Ordering and Marking Information  
Package Code  
K : SOP-8  
SM2001CS  
Operating Junction Temperature Range  
Assembly Material  
Handling Code  
C : -55
 
to 150

o

C  
Handling Code  
Temperature Range  
TR : Tape & Reel  
Assembly Material  
Package Code  
G : Halogen and Lead Free Device  
2001  
XXXXX  
SM2001CS K
 
:  
XXXXX – Lot Code  
Note : SINOPOWER lead-free products contain molding compounds/die attach materials and 100% matte tin plate  
termination finish; which are fully compliant with RoHS. SINOPOWER lead-free products meet or exceed the lead-  
free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. SINOPOWER  
defines
“
Green
”
to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight  
in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight).  
SINOPOWER reserves the right to make changes to improve reliability or manufacturability without notice, and  
advise customers to obtain the latest version of relevant information to verify before placing orders.  
1
Copyright
Sinopower Semiconductor, Inc.  
Rev. A.4 – March, 2018  

®
SM2001CSK  
Absolute Maximum Ratings
(T

A

= 25
°
C unless otherwise noted)  
Symbol  
Parameter  
Channel 1
 
Channel 2
 
Unit  
Common Ratings
(T

A

=25
°
C Unless Otherwise Noted)  
V

DSS  

V

GSS  

Drain-Source Voltage  
Gate-Source Voltage  
20  
-20  
V
±
12  
±
12  
150  
-55 to 150  
T

J  

T

STG  

I

S  

Maximum Junction
T
e
m
p
erature  
Storage
T
e
m
perature Range  
Diode Continuous Forward Current  
Continuous Drain Current  
°
C  
T

A

=
2
5
°
C  
T

A

=
2
5
°
C  
T

A

=
2
5
°
C  
T

A

=
2
5
°
C  
T

A

=
7
0
°
C  
t
≤
10s  
1
.
8  
9
.
5  
30  
2
-1.2  
-6  
I

D  

A
W
a
I

DM  

Pulsed Drain Current  
-20  
2
P

D  

Power Dissipation  
1
.
3  
45  
1.3  
45  
Thermal Resistance-Junction to Ambient  
R

θ
JA  

R

θ
JL  

S
t
eady
S
t
ate  
S
t
eady
S
t
ate  
62.5  
20  
62.5  
20  
°
C/W  
Thermal Resistance-Junction to Lead  
b
I

AS  

Avalanche Current, Single pulse (L=0.1mH)  
Avalanche Energ
y
,
S
ingle pulse (L=0.1mH)  
16  
-15  
11  
A
b
E

AS  

12  
mJ  
Note a
:
Pulse width limited by max. junction temperature.  
Note b
:
UIS tested and pulse width limited by maximum junction temperature 150

o

C (initial temperature Tj=25

o

C).  
2
Copyright
Sinopower Semiconductor, Inc.  
Rev. A.4 – March, 2018  

®
SM2001CSK  
Electrical Characteristics
 
(T

A

= 25
°
C unless otherwise noted)  
Channel 1  
Symbol  
Parameter  
Test Conditions  
Unit  
Min. Typ. Max.  
Static Characteristics  
BV

DSS

Drain-Source Breakdown Voltage  
20  
–
–
–
1
V
V

GS

=0V, I

DS

=250
µ
A  
V

DS

=16V, V

GS

=0V  
–
I

DSS

Zero Gate Voltage Drain Current  
µ
A  
T

J

=85
°
C  
–
–
30  
V

GS(th)

Gate Threshold Voltage  
I

GSS

Gate Leakage Current  
0.5  
0.7  
–
1.0  
±
100  
14  
V
V

DS

=V

G
S

, I

DS

=250
µ
A  
V

GS

=
±
12V, V

DS

=0V  
V

GS

=4.5V, I

DS

=9A  
V

GS

=2.5V, I

DS

=6A  
–
–
–
nA  
12  
13.5  
R

DS(ON)

Drain-Source On-state Resistance  
m
Ω  
18  
Diode Characteristics  
V

SD  

t

rr  

Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
I

SD

=1.5A, V

GS

=0V  
–
–
–
0.67  
11.8  
3.6  
1.1  
V
–
–
ns  
nC  
I

DS

=6A, dl

SD

/dt=100A/
µ
s  
Q

rr  

Dynamic Characteristics  
R

G  

C

iss  

C

oss  

C

rss  

t

d(ON)  

t

r  

Gate Resistance  
V

GS

=0V,V

DS

=0V,F=1MHz  
–
–
–
–
–
–
–
–
0.7  
795  
160  
118  
10.2  
16.1  
16.6  
3.6  
–
–
Ω
Input Capacitance  
V

GS

=0V,  
V

DS

=10V,  
Frequency=1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-on Delay Time  
Turn-on Rise Time  
–
pF  
–
19  
30  
31  
7
V

DD

=10V, R

L

=10
Ω
,  
I

DS

=1A, V

GEN

=4.5V,  
R

G

=1
Ω  
ns  
t

d(OFF)

Turn-off Delay Time  
Turn-off Fall Time  
Gate Charge Characteristics  
t
f
Q

g  

Q

gs  

Q

gd  

Q

gth  

Total Gate Charge  
–
–
–
–
8.7  
1.25  
3
–
–
–
–
Gate-Source Charge  
Gate-Drain Charge  
Threshold Gate Charge  
V

DS

=10V, V

GS

=4.5V,  
I

DS

=6A  
nC  
0.54  
3
Copyright
Sinopower Semiconductor, Inc.  
Rev. A.4 – March, 2018  

®
SM2001CSK  
Electrical Characteristics (Cont.)
(T

A

= 25
°
C unless otherwise noted)  
Channel 2  
Symbol  
Parameter  
Test Conditions  
Unit  
Min. Typ. Max.  
Static Characteristics  
BV

D
S
S

Drain-Source Breakdown Voltage
 
V

GS

=0V, I

DS

=-250
μ
A  
-20  
–
–
–
-1  
V
V

DS

=-16V, V

GS

=0V  
–
µ
A  
uA  
V
I

DSS  

Zero Gate Voltage Drain Current  
T

J

=85
°
C  
V

DS

=V

GS

, I

DS

=-250
µ
A  
–
–
-30  
-1  
V

GS(th)

Gate Threshold Voltage  
I

GSS

Gate Leakage Current  
-0.5  
-0.7  
–
V

GS

=
±
12V, V

DS

=0V  
V

GS

=-4.5V, I

DS

=-6A  
V

GS

=-2.5V, I

DS

=-4A  
–
–
–
±
100  
45  
nA  
36  
50  
R

DS(ON)

Drain-Source On-state Resistance  
m
Ω  
65  
Diode Characteristics  
V

SD  

t

rr  

Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
I

S
D

=-1.2A, V

GS

=0V  
–
–
–
-0.7  
12  
-1  
–
V
ns  
nC  
I

sd

=-6A, dl

SD

/dt=100A/
µ
s  
Q

rr  

4.5  
–
Dynamic Characteristics  
R

G  

C

iss  

C

oss  

C

rss  

t

d(ON)  

t

r  

Gate Resistance  
V

GS

=0V,V

DS

=0V,F=1MHz  
–
–
–
–
–
–
–
–
3.5  
590  
122  
92  
–
–
Ω
Input Capacitance  
V

GS

=0V,  
V

DS

=-10V,  
Frequency=1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-on Delay Time  
Turn-on Rise Time  
–
pF  
–
8.4  
16  
26  
30  
20  
V

DD

=-10V, R

L

=10
Ω
,  
I

DS

=-1A, V

GEN

=-4.5V,  
R

G

=1
Ω  
14.1  
16  
ns  
t

d
(
OFF)

Turn-off Delay Time  
t

f

Turn-off Fall Time  
Gate Charge Characteristics  
10.7  
Q

g  

Q

gs  

Q

gd  

Q

gth  

Total Gate Charge  
–
–
–
–
7.68  
0.66  
2.72  
0.3  
–
–
–
–
Gate-Source Charge  
Gate-Drain Charge  
Threshold Gate Charge  
V

DS

=-10V, V

GS

=-4.5V,  
I

DS

=-6A  
nC  
4
Copyright
Sinopower Semiconductor, Inc.  
Rev. A.4 – March, 2018  

®
SM2001CSK  
N Channel Typical Operating Characteristics  
Power Dissipation  
Drain Current  
2.4  
2.0  
1.6  
1.2  
0.8  
0.4  
0.0  
10  
8
6
4
2
T

A

=25

o

C  
T

A

=25

o

C,V

G

=4.5V  
0
0
20 40 60 80
 
100 120 140 160  
0
20 40 60 80
 
100 120 140 160  
T

J

– Junction
T
emperature (
°
C)  
T

J

– Junction
T
e
m
perature (
°
C)  
Safe Operation Area  
Thermal Transient Impedance  
100  
10  
2
1
Duty = 0.5  
0.2  
0.1  
0.05  
300
µ
s  
1ms  
1
10ms  
0.02  
0.1  
100ms  
0.01  
1s  
0.1  
DC  
Mounted on 1in

2

pad  
Single Pulse  
T

A

=25

o

C  
R

θ
JA

: 45

o

C/W  
0.01  
0.01  
0.01  
0.1  
1
10  
100  
1E-4 1E-3 0.01  
0.1  
1
10 60  
V

DS

– Drain – Source Voltage (V)  
Square Wave Pulse Duration (sec)  
5
Copyright
Sinopower Semiconductor, Inc.  
Rev. A.4 – March, 2018  

®
SM2001CSK  
N Channel Typical Operating Characteristics (Cont.)  
Output Characteristics  
Drain-Source On Resistance  
20  
18  
16  
14  
12  
10  
8
30  
25  
20  
15  
10  
5
V

GS

=2,3,4,5,6,7,8,9,10V  
V

GS

=2.5V  
V

GS

=4.5V  
1.5V  
6
0
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
0
5
10  
15  
20  
25  
30  
V

DS

– Drain-Source Voltage (V)  
I

D

– Drain Current (A)  
Transfer Characteristics  
Gate Threshold Voltage  
50  
40  
30  
20  
10  
0
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
I

DS

=9A  
I

DS

=250
µ
A  
0
1
2
3
4
5
6
7
8
9
10  
-50 -25  
0
25 50 75
 
100 125 150  
V

GS

– Gate – Source Voltage (V)  
T

J

– Junction
T
e
mperature (
°
C)  
6
Copyright
Sinopower Semiconductor, Inc.  
Rev. A.4 – March, 2018  

®
SM2001CSK  
N Channel Typical Operating Characteristics (Cont.)  
Drain-Source On Resistance  
Source-Drain Diode Forward  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
30  
10  
V

GS

= 4.5V  
I

DS

= 9A  
T

j

=150

o

C  
T

j

=25

o

C  
1
R

ON

@T

j

=25

o

C: 12m
Ω  
0.1  
-50 -25  
0
25 50 75
 
100 125 150  
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4  
T

J

– Junction
T
e
mperature (
°
C)  
V

SD

– Source – Drain Voltage (V)  
Capacitance  
Gate Charge  
1200  
1050  
900  
750  
600  
450  
300  
150  
0
10  
Frequency=1MHz  
V

DS

=10V  
I

DS

=6A  
9
8
7
6
5
4
3
2
1
0
Ciss  
Coss  
Crss  
0
4
8
12  
16  
20  
0
4
8
12  
16  
20  
Q

G

– Gate Charge (nC)  
V

DS

– Drain – Source Voltage (V)  
7
Copyright
Sinopower Semiconductor, Inc.  
Rev. A.4 – March, 2018  

®
SM2001CSK  
N Channel Typical Operating Characteristics (Cont.)  
Transfer Characteristics  
20  
T

J

=-55

o

C  
T

J

=25

o

C  
T

J

=125

o

C  
15  
10  
5
0
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
V

GS

– Gate-Source Voltage (V)  
8
Copyright
Sinopower Semiconductor, Inc.  
Rev. A.4 – March, 2018  

®
SM2001CSK  
P Channel Typical Operating Characteristics  
Power Dissipation  
Drain Current  
2.4  
2.0  
1.6  
1.2  
0.8  
0.4  
0.0  
7
6
5
4
3
2
1
0
T

A

=25

o

C  
T

A

=25

o

C,V

G

=-4.5V  
0
20 40 60 80
 
100 120 140 160  
0
20 40 60 80
 
100 120 140 160  
T

J

– Junction
T
emperature (
°
C)  
T

J

– Junction Temperature (
°
C)  
Safe Operation Area  
Thermal Transient Impedance  
100  
10  
2
1
Duty =
 
0.5  
0.2  
0.1  
300
µ
s  
0.05  
1ms  
1
0.02  
0.01  
10ms  
0.1  
100ms  
1s  
0.1  
0.01  
DC  
Single Pulse  
Mounted on 1in

2

pad  
T

A

=25

o

C  
R

θ
JA

: 45

o

C/W  
0.01  
0.01  
0.1  
1
10  
100  
1E-4 1E-3 0.01  
0.1  
1
10 60  
-V

DS

– Drain – Source Voltage (V)  
Square Wave Puls
e
D
uration (sec)  
9
Copyright
Sinopower Semiconductor, Inc.  
Rev. A.4 – March, 2018  

®
SM2001CSK  
P Channel Typical Operating Characteristics (Cont.)  
Output Characteristics  
Drain-Source On Resistance  
90  
80  
70  
60  
50  
40  
30  
20  
10  
20  
18  
16  
14  
12  
10  
8
V

GS

=-2.5,-3,-4,-5,-6,  
-7,-8,-9,-10V  
V

GS

=-2.5V  
V

GS

=-4.5V  
-2V  
6
4
-1.5V  
2
0
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
0
4
8
12  
16  
20  
-V

DS

– Drain – Source Voltage (V)  
-I

D

– Drain Current (A)  
Transfer Characteristics  
Gate Threshold Voltage  
140  
120  
100  
80  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
I

DS

=-6A  
I

DS

= -250
µ
A  
60  
40  
20  
0
-50 -25  
0
25 50 75
 
100 125 150  
1
2
3
4
5
6
7
8
9
10  
-V

GS

– Gate – Source Voltage (V)  
T

J

– Junction
T
e
mperature (
°
C)  
10  
Copyright
Sinopower Semiconductor, Inc.  
Rev. A.4 – March, 2018  

®
SM2001CSK  
P Channel Typical Operating Characteristics (Cont.)  
Drain-Source On Resistance  
Source-Drain Diode Forward  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
20  
10  
V

GS

= -4.5V  
I

DS

= -6A  
T

j

=150

o

C  
T

j

=25

o

C  
1
R

ON

@T

j

=25

o

C: 36m
Ω  
0.1  
0.0  
-50 -25  
0
25 50 75
 
100 125 150  
0.3  
0.6  
0.9  
1.2  
1.5  
T

J

– Junction
T
e
m
perature (
°
C)  
-V

SD

– Source – Drain Voltage (V)  
Capacitance  
Gate Charge  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
10  
9
8
7
6
5
4
3
2
1
0
Frequency=1MHz  
V

DS

=-10V  
I

DS

=-6A  
Ciss  
Coss  
Crss  
0
4
8
12  
16  
20  
0
4
8
12  
16  
Q

G

– Gate Charge (nC)  
-V

DS

– Drain – Source Voltage (V)  
11  
Copyright
Sinopower Semiconductor, Inc.  
Rev. A.4 – March, 2018  

®
SM2001CSK  
P Channel Typical Operating Characteristics (Cont.)  
Transfer Characteristics  
10  
T

j

=-55

o

C  
8
T

j

=25

o

C  
6
T

j

=125

o

C  
4
2
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5  
-V

GS

– Gate-Source Voltage (V)  
12  
Copyright
Sinopower Semiconductor, Inc.  
Rev. A.4 – March, 2018  

®
SM2001CSK  
Avalanche Test Circuit and Waveforms  
N Channel  
V
DS  
L
V
DSX(SUS)  
t
p  
DUT  
V
DS  
I
AS  
R
G  
V
DD  
V
DD  
I
L  
tp  
E
AS  
0.01
Ω
 
t
AV  
t
AV  
P Channel  
V
DS  
L
DUT  
E
AS  
V
DD  
R
G  
V
DD  
I
AS  
tp  
I
L  
V
DS  
0.01
Ω  
t
p  
V
DSX(SUS)  
Switching Time Test Circuit and Waveforms  
N Channel  
V
DS  
R
D  
V
DS  
90%  
DUT  
V
GS  
R
G  
V
DD  
10%  
V
GS  
tp  
t
d
(on)
t
r  
t
d
(off)
t
f  
P Channel  
V
DS  
R
D  
t
d
(off)
t
f  
t
d
(on)
t
r  
DUT  
V
GS  
10%  
V
GS  
R
G  
V
DD  
tp  
90%  
V
DS  
13  
Copyright
Sinopower Semiconductor, Inc.  
Rev. A.4 – March, 2018  

®
SM2001CSK  
Disclaimer  
Sinopower Semiconductor, Inc. (hereinafter
“
Sinopower
”
) has been making  
great efforts to development high quality and better performance products to  
satisfy all customers
’
needs. However, a product may fail to meet customer
’
s  
expectation or malfunction for various situations.  
All information which is shown in the datasheet is based on Sinopower
’
s  
research and development result, therefore, Sinopower shall reserve the right  
to adjust the content and monitor the production.  
In order to unify the quality and performance, Sinopower has been following  
JEDEC while defines assembly rule. Notwithstanding all the suppliers  
basically follow the rule for each product, different processes may cause  
slightly different results.  
The technical information specified herein is intended only to show the typical  
functions of and examples of application circuits for the products. Sinopower  
does not grant customers explicitly or implicitly, any license to use or exercise  
intellectual property or other rights held by Sinopower and other parties.  
Sinopower shall bear no responsible whatsoever for any dispute arising from  
the use of such technical information.  
The products are not designed or manufactured to be used with any  
equipment, device or system which requires an extremely high level of  
reliability, such as the failure or malfunction of which any may result in a direct  
threat to human life or a risk of human injury. Sinopower shall bear no  
responsibility in any way for use of any of the products for the above special  
purposes. If a product is intended to use for any such special purpose, such  
as vehicle, military, or medical controller relevant applications, please contact  
Sinopower sales representative before purchasing.  
14  
Copyright
Sinopower Semiconductor, Inc.  
Rev. A.4 – March, 2018  

®
SM2001CSK  
Classification Profile  
15  
Copyright
Sinopower Semiconductor, Inc.  
Rev. A.4 – March, 2018  

®
SM2001CSK  
Classification Reflow Profiles  
Profile Feature  
Preheat & Soak  
Sn-Pb Eutectic Assembly  
Pb-Free Assembly  
150 C  
100 C  
°
°
Temperature min (T

smin  

)
Temperature max (T

smax  

Time (T

smin

to T

smax

) (t

s

)  
150 C  
200 C  
°
°
)
60-120 seconds  
60-120 seconds  
Average ramp-up rate  
(T

smax

to T

P

)  
3 C/second
 
max.  
°
3 C/second max.  
°
Liquidous temperature (T

L

)  
Time at liquidous (t

L

)  
183 C  
60-150 seconds  
217 C  
60-150 seconds  
°
°
Peak package body Temperature  
(T

p

)*  
See Classification Temp in table 1  
See Classification Temp in table 2  
30** seconds  
Time (t )** within 5 C of the specified  
°
P
20** seconds  
classification temperature (T

c

)  
Average ramp-down rate (T

p

to T

smax  

)
6 C/second
 
max.  
°
6 C/second
 
max.  
°
6 minutes max.  
8 minutes max.  
Time 25 C to peak temperature  
°
* Tolerance for peak profile Temperature (T

p

) is defined as a supplier minimum and a user maximum.  
** Tolerance for time at peak profile temperature (t

p

) is defined as a supplier minimum and a user maximum.  
Table 1. SnPb Eutectic Process
–
Classification Temperatures (Tc)  
Volume mm

3  

350  
Package  
Volume mm

3  

<350  
Thickness  
≥
<2.5 mm  
235 C  
220 C  
°
°
2.5 mm  
≥
220 C  
220 C  
°
°
Table 2. Pb-free Process
–
Classification Temperatures (Tc)  
Package  
Volume mm

3  

Volume mm

3  

Volume mm

3  

T
h
ickness  
<1.6 mm  
<350  
350-2000  
260
°
C  
250
°
C  
245
°
C  
>2000  
260
°
C  
245
°
C  
245
°
C  
260
°
C  
260
°
C  
250
°
C  
1.6 mm
–
2.5 mm  
≥
2.5 mm  
Reliability Test Program  
T
e
st item  
Method  
JESD-22, B102  
JESD-22, A108  
Description  
SOLDERABILITY  
HTRB  
5 Sec, 245
°
C  
1000 Hrs, 80% of VDS max @ Tjmax  
1000 Hrs, 100% of VGS max @ Tjmax  
168 Hrs, 100
%
RH, 2atm, 121
°
C  
500 Cycles, -65
°
C~150
°
C  
HTGB  
JESD-22, A108  
JESD-22, A102  
JESD-22, A104  
PCT  
TCT  
Customer Service  
Sinopower Semiconductor, Inc.  
5
F
,
N
o. 6, Dusing 1St Rd., Hsinchu Science Park,  
Hsinchu, 30078, Taiwan  
TEL: 886-3-5635818
 
Fax: 886-3-5635080  
16  
Copyright
Sinopower Semiconductor, Inc.  
Rev. A.4 – March, 2018