Sinopower-Semicon-SM4024NSKPC-TRG

Part #Sinopower-Semicon-SM4024NSKPC-TRG
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Sinopower-Semicon-SM4024NSKPC-TRG
SM4024NSKP  
®
N-Channel Enhancement Mode MOSFET  
Features  
Pin Description  
D
•
40V/60A,  
D
D
D
R

DS(ON)

= 4.6m
Ω
(max.) @ V

GS

=10V  
R

DS(ON)

= 5.9m
Ω
(max.) @ V

GS

=4.5V  
G
S
Pin 1  
•
100% UIS + R

g

T
e
sted  
S
S
•
Reliable and Rugged  
DFN5x6A-8_EP  
•
Lead Free an
d
G
reen Device
s
A
vailable  
(5,6,7,8)  
DD D
 
D  
(RoH
S
C
ompliant)  
Applications  
(4)  
G
•
•
•
SMPS Synchronous Rectification  
Load Switch  
S S S  
( 1, 2, 3 )  
DC-DC Conversion  
N-Channe
l
M
OSFET  
Ordering and Marking Information  
Package Code  
KP : DFN5x6A-8_EP  
SM4024NS  
Operating Junction Temperature Range  
Assembly Material  
Handling Code  
C : -55
 
to 150

o

C  
Handling Code  
Temperature Range  
TR : Tape & Reel  
Assembly Material  
Package Code  
G : Halogen and Lead Free Device  
SM4024  
XXXXX  
SM4024NS KP
 
:  
XXXXX – Lot Code  
Note : SINOPOWER lead-free products contain molding compounds/die attach materials and 100% matte tin plate  
termination finish; which are fully compliant with RoHS. SINOPOWER lead-free products meet or exceed the lead-  
free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. SINOPOWER  
defines
“
Green
”
to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight  
in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight).  
SINOPOWER reserves the right to make changes to improve reliability or manufacturability without notice, and  
advise customers to obtain the latest version of relevant information to verify before placing orders.  
1
Copyright
Sinopower Semiconductor, Inc.  
Rev. A.4 – March, 2017  

SM4024NSKP  
®
Absolute Maximum Ratings
(T

A

= 25
°
C Unless Otherwise Noted)  
Symbol  
Parameter  
Rating  
Unit  
Common Ratings  
V

DSS  

V

GSS  

T

J  

Drain-Source Voltage  
Gate-Source Voltage  
40  
±
20  
150  
-55 to 150  
20  
V
Maximum Junction Temperature  
Storage Temperature Range  
°
C  
°
C  
A
T

STG  

I

S  

Diode Continuous Forward Current  
T

C

=25
°
C  
T

C

=100
°
C  
T

C

=25
°
C  
T

C

=100
°
C  
T

C

=25
°
C  
T

C

=100
°
C  
Steady State  
T

A

=25
°
C  
120  
80  
I

DP  

Pulse Drain Current Tested  
Continuous Drain Current  
A
A
60*  
38  
a
I

D  

50  
P

D  

R

θ
JC  

I

D  

Maximum Power Dissipation  
Thermal Resistance-Junction to Case  
Continuous Drain Current  
W
°
C/W  
A
20  
2.5  
18  
T

A

=70
°
C  
14  
17  
t
≤
10s  
Thermal Resistance-Junction to Ambient  
°
C/W  
R

θ
JA  

Steady State  
L=0.5mH  
L=0.5mH  
50  
b
I

AS  

Avalanche Current, Single pulse  
Avalanche Energ
y
,
S
ingle pulse  
30  
A
b
E

AS  

225  
mJ  
Note a,*
:
Current limited by bond wire.  
Note b
:
UIS tested and pulse width limited by maximum junction temperature 150

o

C (initial temperature T

j

=25

o

C).  
2
Copyright
Sinopower Semiconductor, Inc.  
Rev. A.4 – March, 2017  

SM4024NSKP  
®
Electrical Characteristics
(T

A

= 25
°
C unless otherwise noted)  
Symbol  
Parameter  
Test Conditions  
Min. Typ. Max.
 
Unit  
Static Characteristics  
BV

DSS

Drain-Source Breakdown Voltage  
40  
–
–
–
1
V
V

GS

=0V, I

D
S

=250
µ
A  
V

DS

=32V, V

GS

=0V  
–
I

DSS

Zero Gate Voltage Drain Current  
µ
A  
T

J

=85
°
C  
–
–
30  
2.5  
±
100  
4.6  
–
V

GS(th)

Gate Threshold Voltage  
I

GSS

Gate Leakage Current  
1.5  
1.9  
–
V
V

DS

=V

GS

, I

DS

=250
µ
A  
V

GS

=
±
20V, V

DS

=0V  
V

GS

=10V, I

DS

=30A  
–
–
–
–
–
nA  
3.9  
5.72  
4.75  
60  
c
R

DS(ON)

Drain-Source On-state Resistance  
T

J

=125
°
C  
m
Ω  
S
V

GS

=4.5V, I

DS

=15A  
V

DS

=5V, I

DS

=15A  
5.9  
–
Gfs  
Forward Transconductance  
Diode Characteristics  
c
V

SD  

t

rr  

Diode Forward Voltage  
I

SD

=20A, V

G
S

=0V  
–
–
–
–
–
0.75  
19.8  
11  
1.1  
V
Reverse Recovery Time  
Charge Time  
–
–
–
–
t

a  

ns  
nC  
Ω
I

DS

=30A, dl

SD

/dt=100A/
µ
s  
t

b  

Discharge Time  
8.8  
6
Q

rr  

Reverse Recovery Charge  
Dynamic Characteristics

d  

R

G  

C

i
s
s  

C

o
s
s  

C

rss  

Gate Resistance  
V

GS

=0V,V

DS

=0V,F=1MHz  
1
1.5  
2
Input Capacitance  
1944 2430 2916  
V

GS

=0V,  
V

DS

=15V,  
Frequency=1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
252  
360  
165  
17  
9
468  
231  
32  
pF  
79  
–
t

d(ON)

Turn-on Delay Time  
t

r

Turn-on Rise Time  
t

d
(
OFF)

Turn-off Delay Time  
t

f

Turn-off Fall Time  
Gate Charge Characteristics

d  

V

DD

=15V, R

L

=15
Ω
,  
I

DS

=1A, V

GEN

=10V,  
R

G

=6
Ω  
–
17  
ns  
–
52  
17  
95  
–
32  
V

DS

=15V, V

GS

=4.5V,  
I

DS

=30A  
Q

g  

Total Gate Charge  
–
19.4  
27  
Q

g  

Q

gth  

Q

gs  

Q

gd  

Total Gate Charge  
–
–
–
–
42  
4.4  
8.5  
6.2  
59  
6.2  
12  
nC  
Threshold Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
V

DS

=15V, V

GS

=10V,  
I

DS

=30A  
8.7  
Note c
:
Pulse test ; pulse width
≤
300
µ
s, duty cycle
≤
2%.  
Note d
:
Guaranteed by design, not subject to production testing.  
3
Copyright
Sinopower Semiconductor, Inc.  
Rev. A.4 – March, 2017  

SM4024NSKP  
®
Typical Operating Characteristics  
Power Dissipation  
Drain Current  
60  
70  
60  
50  
40  
30  
20  
10  
0
50  
40  
30  
20  
10  
T

C

=25

o

C,V

G

=10V  
T

C

=25

o

C  
0
0
20 40 60 80
 
100 120 140 160  
0
20 40 60 80
 
100 120 140 160  
T
j
– Junction
T
e
mperature (
°
C)  
T
j
– Junction
T
e
mperature  
Safe Operation Area  
Thermal Transient Impedance  
600  
100  
2
1
Duty = 0.5  
0.2  
1ms  
0.1  
0.05  
10ms  
0.1  
0.01  
1E-3  
0.02  
0.01  
10  
1
100ms  
1s  
DC  
Single Pulse  
Mounted on 1in

2

pad  
T

C

=25

O

C  
R

θ
JA

:17

o

C/W  
0.1  
0.01  
0.1  
1
10  
100 300  
1E-4 1E-3 0.01  
0.1  
1
10  
100  
V
DS
– Drain – Source Voltage (V)  
Square Wave Puls
e
D
uration (sec)  
4
Copyright
Sinopower Semiconductor, Inc.  
Rev. A.4 – March, 2017  

SM4024NSKP  
®
Typical Operating Characteristics (Cont.)  
Output Characteristics  
Drain-Source On Resistance  
120  
100  
80  
60  
40  
20  
0
7
6
5
4
3
2
V

GS

= 4,5,6,7,8,9,10V  
3.5V  
V

GS

=4.5V  
V

GS

=10V  
3V  
2.5V  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
0
20  
40  
60  
80  
100  
120  
V
DS
– Drain – Source Voltage (V)  
I
D
–
D
rain Current (A)  
Gate-Source On Resistance  
Gate Threshold Voltage  
14  
12  
10  
8
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
I

DS

=30A  
I

DS

=250
µ
A  
6
4
2
-50 -25  
0
25 50 75
 
100 125 150  
2
3
4
5
6
7
8
9
10  
V
GS
– Gate – Source Voltage (V)  
T
j
– Junction
T
e
mperature (
°
C)  
5
Copyright
Sinopower Semiconductor, Inc.  
Rev. A.4 – March, 2017  

SM4024NSKP  
®
Typical Operating Characteristics (Cont.)  
Source-Drain Diode Forward  
Drain-Source On Resistance  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
V

GS

= 10V  
I

DS

= 30A  
100  
10  
1
T

j

=150

o

C  
T

j

=25

o

C  
R

ON

@T

j

=25

o

C: 3.9m
Ω  
0.1  
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4  
-50 -25  
0
25 50 75
 
100 125 150  
T
j
– Junction
T
emperature (
°
C)  
V
SD
– Source – Drain Voltage (V)  
Capacitance  
Gate Charge  
10  
3500  
3000  
2500  
2000  
1500  
1000  
500  
Frequency=1MHz  
V

DS

= 15V  
I

DS

= 30A  
9
8
7
6
5
4
3
2
1
0
Ciss  
Coss  
Crss  
0
0
5
10  
15  
20  
25  
30  
0
7
14  
21  
28  
35  
42  
V
DS
–
D
rain-Source Voltage (V)  
Q
G
–
G
ate Charge (nC)  
6
Copyright
Sinopower Semiconductor, Inc.  
Rev. A.4 – March, 2017  

SM4024NSKP  
®
Avalanche Test Circuit and Waveforms  
V
DS  
L
V
DSX(SUS)  
t
p  
DUT  
V
DS  
I
AS  
R
G  
V
DD  
V
DD  
I
L  
tp  
E
AS  
0.01
Ω
 
t
AV  
Switching Time Test Circuit and Waveforms  
V
DS  
R
D  
V
DS  
90%  
DUT  
V
GS  
R
G  
V
DD  
10%  
V
GS  
tp  
t
d
(on)
t
r  
t
d
(off)
t
f  
7
Copyright
Sinopower Semiconductor, Inc.  
Rev. A.4 – March, 2017  

SM4024NSKP  
®
Disclaimer  
Sinopower Semiconductor, Inc. (hereinafter
“
Sinopower
”
) has been making  
great efforts to development high quality and better performance products to  
satisfy all customers
’
needs. However, a product may fail to meet customer
’
s  
expectation or malfunction for various situations.  
All information which is shown in the datasheet is based on Sinopower
’
s  
research and development result, therefore, Sinopower shall reserve the right  
to adjust the content and monitor the production.  
In order to unify the quality and performance, Sinopower has been following  
JEDEC while defines assembly rule. Notwithstanding all the suppliers  
basically follow the rule for each product, different processes may cause  
slightly different results.  
The technical information specified herein is intended only to show the typical  
functions of and examples of application circuits for the products. Sinopower  
does not grant customers explicitly or implicitly, any license to use or exercise  
intellectual property or other rights held by Sinopower and other parties.  
Sinopower shall bear no responsible whatsoever for any dispute arising from  
the use of such technical information.  
The products are not designed or manufactured to be used with any  
equipment, device or system which requires an extremely high level of  
reliability, such as the failure or malfunction of which any may result in a direct  
threat to human life or a risk of human injury. Sinopower shall bear no  
responsibility in any way for use of any of the products for the above special  
purposes. If a product is intended to use for any such special purpose, such  
as vehicle, military, or medical controller relevant applications, please contact  
Sinopower sales representative before purchasing.  
8
Copyright
Sinopower Semiconductor, Inc.  
Rev. A.4 – March, 2017  

SM4024NSKP  
®
Classification Profile  
9
Copyright
Sinopower Semiconductor, Inc.  
Rev. A.4 – March, 2017  

SM4024NSKP  
®
Classification Reflow Profiles  
Profile Feature  
Preheat & Soak  
Sn-Pb Eutectic Assembly  
Pb-Free Assembly  
150 C  
100 C  
°
°
Temperature min (T

smin  

)
Temperature max (T

smax  

Time (T

smin

to T

smax

) (t

s

)  
150 C  
200 C  
°
°
)
60-120 seconds  
60-120 seconds  
Average ramp-up rate  
(T

smax

to T

P

)  
3 C/second
 
max.  
°
3 C/second max.  
°
Liquidous temperature (T

L

)  
Time at liquidous (t

L

)  
183 C  
60-150 seconds  
217 C  
60-150 seconds  
°
°
Peak package body Temperature  
(T

p

)*  
See Classification Temp in table 1  
See Classification Temp in table 2  
30** seconds  
Time (t )** within 5 C of the specified  
°
P
20** seconds  
classification temperature (T

c

)  
Average ramp-down rate (T

p

to T

smax  

)
6 C/second
 
max.  
°
6 C/second
 
max.  
°
6 minutes max.  
8 minutes max.  
Time 25 C to peak temperature  
°
* Tolerance for peak profile Temperature (T

p

) is defined as a supplier minimum and a user maximum.  
** Tolerance for time at peak profile temperature (t

p

) is defined as a supplier minimum and a user maximum.  
Table 1. SnPb Eutectic Process
–
Classification Temperatures (Tc)  
Volume mm

3  

Package  
Volume mm

3  

Thickness  
<350  
≥
350  
<2.5 mm  
235
°
C  
220
°
C  
220
°
C  
220
°
C  
≥
2.5 mm  
T
a
ble 2. Pb-free Process
–
Classification Temperatures (Tc)  
Package  
Volume mm

3  

Volume mm

3  

Volume mm

3  

Thickness  
<1.6 mm  
<350  
350-2000  
260
°
C  
>2000  
260
°
C  
245
°
C  
245
°
C  
260
°
C  
260
°
C  
250
°
C  
1.6 mm
–
2.5 mm  
≥
2.5 mm  
250
°
C  
245
°
C  
Reliability Test Program  
T
e
st item  
Method  
JESD-22, B102  
JESD-22, A108  
Description  
SOLDERABILITY  
HTRB  
5 Sec, 245
°
C  
1000 Hrs, 80% of VDS max @ Tjmax  
1000 Hrs, 100% of VGS max @ Tjmax  
168 Hrs, 100
%
RH, 2atm, 121
°
C  
500 Cycles, -65
°
C~150
°
C  
HTGB  
JESD-22, A108  
JESD-22, A102  
JESD-22, A104  
PCT  
TCT  
Customer Service  
Sinopower Semiconductor, Inc.  
5
F
,
N
o. 6, Dusing 1St Rd., Hsinchu Science Park,  
Hsinchu, 30078, Taiwan  
TEL: 886-3-5635818
 
Fax: 886-3-5635080  
10  
Copyright
Sinopower Semiconductor, Inc.  
Rev. A.4 – March, 2017