SKYWORKS-SILICON-LABS-BGM220SC12WGA2R

Part #	SKYWORKS-SILICON-LABS-BGM220SC12WGA2R
Download	SKYWORKS-SILICON-LABS-BGM220SC12WGA2R

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

The BGM220S is a module designed and built to meet the per-

formance, security, and reliability requirements of battery-powered

KEY FEATURES

IoT products running on Bluetooth networks.

• Bluetooth

5.2

• Built-in

antenna or RF pin

• Up

to 6 dBm TX power

Based on the EFR32BG22 SoC, the BGM220S enables Bluetooth

Low Energy connec-

tivity while delivering best-in-class RF range and performance, future-proof capability for

feature and OTA firmware updates, enhanced security features, and low energy con-

sumption.

• -98.6

dBm BLE RX sensitivity at 1 Mbps

• 32-bit

ARM Cortex-M33 core at up to 76.8

MHz

BGM220S modules are a full solution that comes with fully-upgradeable, robust software

stacks, world-wide regulatory certifications, advanced development and debugging

tools, and support that will minimize and simplify the engineering and development of

your end-products helping to accelerate their time-to-market.

• 512/32

kB of Flash/RAM memory

• Optimal

selection of MCU peripherals

• 25

GPIO pins

• 6

mm × 6 mm × 1.1 mm

The BGM220S is intended for a broad range of applications, including:

• Asset

Tags and Beacons

• Portable

Medical

• Sports,

Fitness, and Wellness devices

• Connected

Home

• Industrial

and Building Automation

• Bluetooth

mesh Low Power Nodes

Crystals

38.4 MHz

Core / Memory

Clock Management

Energy

Management

Security

HF Crystal

Oscillator

ARM Cortex

M33 processor

RC Oscillator

Voltage

DC-DC

Flash Program

Memory

Crypto Acceleration

with DSP extensions,

FPU and TrustZone

Regulator

Converter

Fast Startup

RC Oscillator

Precision LF

RC Oscillator

Power-On

Reset

Brown-Out

Detector

True Random

Number Generator

LDMA

Controller

LF Crystal

Oscillator

Ultra LF RC

Oscillator

ETM

Debug Interface

RAM Memory

32-bit bus

Peripheral Reflex System

Radio Subsystem

DEMOD

Serial

Interfaces

I/O Ports

Timers and Triggers

Antenna

Analog I/F

Discrete

Antenna

ARM Cortex

M0+ Radio

Controller

RFSENSE

w/ OOK Detect

External

Interrupts

Timer/

Counter

Protocol

Timer

USART

PDM

ADC

Matching

IFADC

AGC

Watchdog

Timer

General

Purpose I/O

Low Energy

Timer

Temperature

Sensor

RX/TX Frontend

with Integrated PA

BUFC RAM

FRC

Real Time

Capture

Counter

Back-Up Real

Time Counter

EUART

Pin Reset

Frequency

Synthesizer

MOD

CRC

Pin Wakeup

Lowest power mode with peripheral operational:

EM0—Active

EM1—Sleep

EM2—Deep Sleep

EM3—Stop

EM4—Shutoff

silabs.com

| Building a more connected world.

Rev. 1.0

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Feature List

1. Feature

List

•

Supported Protocols

•

Wide Operating Range

• Bluetooth

Low Energy (Bluetooth 5.2)

• Direction

finding

• 1.8

to 3.8 V

• -40

to +105 °C and -40 to +85 °C Versions Available

•

Dimensions

• 1M,

2M, and LE Coded PHYs

• Bluetooth

Mesh Low Power Node

•

Wireless System-on-Chip

• 2.4

GHz radio

• 6

mm × 6 mm × 1.1 mm

•

Security Features

• Secure

Boot with Root of Trust and Secure Loader (RTSL)

• TX

power up to 6 dBm

• Hardware

Cryptographic Acceleration for AES128/256,

SHA-1, SHA-2 (up to 256-bit), ECC (up to 256-bit), ECDSA,

and ECDH

High-performance 32-bit ARM Cortex-M33

with DSP in-

•

struction and floating-point unit for efficient signal process-

ing

• True

Random Number Generator (TRNG) compliant with

NIST SP800-90 and AIS-31

• Up

to 512 kB flash program memory

• 32

kB RAM data memory

ARM

TrustZone

•

• Secure

Debug with lock/unlock

•

Wide Selection of MCU Peripherals

• Analog

to Digital Converter (ADC)

• 12-bit

@ 1 Msps

• Embedded

Trace Macrocell (ETM) for advanced debugging

•

High Receiver Performance

• -106.4

dBm sensitivity (0.1% BER) at 125 kbps GFSK

• -102.3

dBm sensitivity (0.1% BER) at 500 kbps GFSK

• -98.6

dBm sensitivity (0.1% BER) at 1 Mbps GFSK

• -95.9

dBm sensitivity (0.1% BER) at 2 Mbps GFSK

•

Low-Energy Consumption

• 16-bit

@ 76.9 ksps

• 25

General Purpose I/O pins with output state retention and

asynchronous interrupts

• 8

Channel DMA Controller

• 4.2

mA RX current at 1 Mbps GFSK

• 12

Channel Peripheral Reflex System (PRS)

• 4.6

mA TX current at 0 dBm output power

• 26

µA/MHz in Active Mode (EM0)

• 4

× 16-bit Timer/Counter with 3 Compare/Capture/PWM

channels

• 1.40

μA EM2 DeepSleep current (RTCC running from

LFXO, Full RAM retention)

• 1

× 32-bit Timer/Counter with 3 Compare/Capture/PWM

channels

Regulatory Certifications

• FCC

•

• 32-bit

Real Time Counter

• 24-bit

Low Energy Timer for waveform generation

• 1

× Watchdog Timer

• CE

• IC/ISEDC

• MIC/TELEC

• KCC

• 2

× Universal Synchronous/Asynchronous Receiver/Trans-

mitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I

• 1

× Enhanced Universal Asynchronous Receiver/Transmit-

ter (EUART)

2 × I

C interface with SMBus support

•

• Digital

microphone interface (PDM)

• RFSENSE

with selective OOK mode

1. Available at the BGM220S Full-Production release.

silabs.com

| Building a more connected world.

Rev. 1.0

| 2

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Ordering Information

2. Ordering

Information

Table 2.1.

Ordering Information

TX Power

Max CPU

Anten- RF

Flash RAM

Ordering Code

Protocol Stack

Rating

0 dBm

6 dBm

Speed

Shield

(kB)

352

512

(kB)

GPIO

Temp Range

-40 to 85 °C

-40 to 105 °C

BGM220SC12WGA2 Bluetooth

5.2

38.4 MHz

Built-in No

76.8 MHz

Built-in Yes

BGM220SC22HNA2

Bluetooth 5.2

• Direction

finding

BGM220SC22WGA2 Bluetooth

5.2

6 dBm

76.8 MHz

Built-in Yes

352

-40 to 85 °C

Note:

1. End-product

manufacturers must verify that the module is configured to meet regulatory limits for each region in accordance with

the formal certification test reports.

2. Devices are pre-programmed with BGAPI UART DFU bootloader v1.10.2.

3. Throughout

this document, the devices in the table above may be referred to by their product family name (e.g. BGM220S), by

model name (BGM220S12A for 0 dBm TX power, BGM220S22A for 6 dBm TX power), or by full ordering code.

4. LE Long Range (125 kbps and 500 kbps) PHYs are only supported on part numbers which include direction-finding capability.

5. In

accordance with the Bluetooth specification, the module operates over the following frequency range: 2402 – 2480 MHz. The

module is also capable of operating in a separate custom transmit-only mode where proprietary packets are sent over the channels

2401 MHz and 2481 MHz using the same 1 Mbps GFSK modulation.

silabs.com

| Building a more connected world.

Rev. 1.0

| 3

Table of Contents

1. Feature

List .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2. Ordering

Information . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3. System

Overview .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.1 Introduction .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.2 EFR32BG22

SoC .

. . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.3 Antenna

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.4 Power

Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4. Electrical

Characteristics .

. . . . . . . . . . . . . . . . . . . . . . . . . .

4.1 Absolute

Maximum Ratings.

. . . . . . . . . . . . . . . . . . . . . . . . .

4.2 General

Operating Conditions .

. . . . . . . . . . . . . . . . . . . . . . . .

4.2.1 DC-DC

Operating Limits

. . . . . . . . . . . . . . . . . . . . . . . . .10

4.3 MCU

Current Consumption with 3 V Supply

. . . . . . . . . . . . . . . . . . . .11

4.4 Radio

Current Consumption with 3 V Supply .

. . . . . . . . . . . . . . . . . . .12

4.5 RF

Transmitter General Characteristics for the 2.4 GHz Band

. . . . . . . . . . . . . .13

4.6 RF

Receiver General Characteristics for the 2.4 GHz Band

. . . . . . . . . . . . . . .13

4.7 RF

Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate .

. .14

4.8 RF

Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate .

. .15

4.9 RF

Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate

. .16

4.10 RF

Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate .

.17

4.11 High-Frequency

Crystal . . . . . . . . . . . . . . . . . . . . . . . . . .18

4.12 Low

Frequency Crystal Oscillator

. . . . . . . . . . . . . . . . . . . . . . .18

4.13 Precision

Low Frequency RC Oscillator (LFRCO) .

. . . . . . . . . . . . . . . . .19

4.14 GPIO

Pins .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

4.15 Microcontroller

Peripherals . . . . . . . . . . . . . . . . . . . . . . . . .21

4.16 Typical

Performance Curves .

. . . . . . . . . . . . . . . . . . . . . . . .21

4.16.1 Antenna

Typical Characteristics

. . . . . . . . . . . . . . . . . . . . . .22

5. Reference

Diagrams. . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.1 Network

Co-Processor (NCP) Application with UART Host

. . . . . . . . . . . . . . .24

5.2 SoC

Application .

. . . . . . . . . . . . . . . . . . . . . . . . . . . .25

6. Pin

Definitions .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

6.1 44-Pin

SiP Module Device Pinout.

. . . . . . . . . . . . . . . . . . . . . . .26

6.2 Alternate

Function Table.

. . . . . . . . . . . . . . . . . . . . . . . . . .28

6.3 Analog

Peripheral Connectivity

. . . . . . . . . . . . . . . . . . . . . . . .28

6.4 Digital

Peripheral Connectivity .

. . . . . . . . . . . . . . . . . . . . . . . .29

7. Design

Guidelines

. . . . . . . . . . . . . . . . . . . . . . . . . . . .

silabs.com

| Building a more connected world.

Rev. 1.0 |

7.1 Layout

and Placement

. . . . . . . . . . . . . . . . . . . . . . . . . . .32

7.2 Best

Design Practices

. . . . . . . . . . . . . . . . . . . . . . . . . . .35

7.3 Radio

Performance vs. Carrier Board Size

. . . . . . . . . . . . . . . . . . . .37

7.4 Proximity

to Other Materials

. . . . . . . . . . . . . . . . . . . . . . . . .38

7.5 Proximity

to Human Body

. . . . . . . . . . . . . . . . . . . . . . . . . .38

8. Package

Specifications

. . . . . . . . . . . . . . . . . . . . . . . . .

8.1 Package

Dimensions .

. . . . . . . . . . . . . . . . . . . . . . . . . . .39

8.2 Recommended

PCB Land Pattern

. . . . . . . . . . . . . . . . . . . . . . .41

8.3 Top

Marking .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42

9. Soldering

Recommendations

. . . . . . . . . . . . . . . . . . . . . . . .

10. Tape

and Reel

. . . . . . . . . . . . . . . . . . . . . . . . . . . . .44

11. Certifications .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

11.1 Regulatory

Certifications .

. . . . . . . . . . . . . . . . . . . . . . . . .46

11.1.1 Qualified

Antennas. . . . . . . . . . . . . . . . . . . . . . . . . . .46

11.1.2 EU

– CE

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46

11.1.3 USA

– FCC

. . . . . . . . . . . . . . . . . . . . . . . . . . . . .47

11.1.4 ISED

Canada . . . . . . . . . . . . . . . . . . . . . . . . . . . .49

11.1.5 Proximity

to Human Body

. . . . . . . . . . . . . . . . . . . . . . . .52

11.1.6 Japan

– MIC

. . . . . . . . . . . . . . . . . . . . . . . . . . . . .53

11.1.7 South

Korea – KC

. . . . . . . . . . . . . . . . . . . . . . . . . . .54

11.2 Standards-Based

Certifications .

. . . . . . . . . . . . . . . . . . . . . . .54

11.2.1 Bluetooth

Qualification . . . . . . . . . . . . . . . . . . . . . . . . .54

12. Revision

History. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

silabs.com

| Building a more connected world.

Rev. 1.0 |

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

System Overview

3. System

Overview

3.1 Introduction

The BGM220S module combines an energy-friendly MCU with a highly integrated radio transceiver in a SiP module with a robust, inte-

grated antenna. This section gives a short introduction to the features of the module.

The block diagram for the BGM220S module is shown in the figure below. The wireless module includes the EFR32BG22 wireless Sys-

tem on a Chip (SoC), required decoupling capacitors and inductors, 38.4 MHz crystal, RF matching circuit, and integrated antenna.

2400 – 2483.5 MHz

External

Antenna

1.8 – 3.8 V

2400 – 2483.5 MHz

VREGVDD

ANT_OUT

IOVDD

VREG

Integral

Antenna

Supply Decoupling

and DC-DC Support

ANT_IN

DECOUPLE

0 Ohm

RF Match

RF_2G4

Silicon Labs

EFR32BG22

(up to 25)

GPIO

HF XTAL

38.4 MHz

GND

Figure 3.1.

BGM220S Block Diagram

A simplified internal schematic for the BGM220S module is shown in the figure below.

EFR32BG22

VREGVDD

IOVDD

VREGVDD

AVDD

Integral

Antenna

ANT_OUT

ANT_IN

4.7µF

IOVDD

Matching

Network

VREGSW

RF2G4_IO

RF_2G4

2.2µH

PA0x

PB0x

PC0x

PD0x

PAx (0-8)

PBx (0-4)

PCx (0-6)

PDx (0-3)

VREG

DVDD

RFVDD

PAVDD

HFXTAL_I

4.7µF

38.4 MHz

DECOUPLE

HFXTAL_O

2.2µF

Figure 3.2.

BGM220S Module Schematic

silabs.com

| Building a more connected world.

Rev. 1.0

| 6

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

System Overview

3.2 EFR32BG22

SoC

The EFR32BG22 SoC features a 32-bit ARM Cortex M33 core, a 2.4 GHz high-performance radio, 512 kB of flash memory, a rich set

of MCU peripherals, and various clock management and serial interfacing options. Consult the

EFR32xG22 Wireless Gecko Reference

Manual

and the

EFR32BG22 Data Sheet

for details.

3.3 Antenna

BGM220S modules include an integral antenna on board with the characteristics detailed in the tables below.

Table 3.1.

Antenna Efficiency and Peak Gain (BGM220S12A)

Parameter

Efficiency

Peak gain

With optimal layout

Note

-1.4 to -2.6 dB

1.5 dBi

Antenna efficiency, gain and radiation pattern are highly depend-

ent on the application PCB layout and mechanical design. Refer

7. Design Guidelines

for recommendations to achieve optimal

antenna performance.

Table 3.2.

Antenna Efficiency and Peak Gain (BGM220S22A)

With optimal layout

Note

Parameter

Efficiency

Peak gain

-1 to -2 dB

2.3 dBi

Antenna efficiency, gain and radiation pattern are highly depend-

ent on the application PCB layout and mechanical design. Refer

7. Design Guidelines

for recommendations to achieve optimal

antenna performance.

3.4 Power

Supply

The BGM220S requires a single nominal supply level of 3.0 V to operate. All necessary decoupling and filtering components are inclu-

ded in the module, and the supply is fully regulated internally.

silabs.com

| Building a more connected world.

Rev. 1.0

| 7

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Electrical Characteristics

4. Electrical

Characteristics

All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:

• Typical

values are based on T

=25 °C and VREGVDD supply at 3.0 V, by production test and/or technology characterization.

• Minimum

and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature,

unless stated otherwise.

4.1 Absolute

Maximum Ratings

Stresses beyond those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of

the devices at those or any other conditions beyond those indicated in the operation listings of this specification is not implied. Exposure

to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and relia-

bility data, see the Quality and Reliability Monitor Report at

http://www.silabs.com/support/quality/pages/default.aspx

Table 4.1.

Absolute Maximum Ratings

Parameter

Symbol

STG

Test Condition

Min

-50

-0.3

—

Typ

—

Max

+150

3.8

Unit

°C

Storage temperature range

Voltage on any supply pin

Junction temperature

DDMAX

JMAX

—

-G grade

-N grade

—

+105

1.0

°C

—

°C

Voltage ramp rate on any

supply pin

DDRAMPMAX

—

V / µs

DC voltage on any GPIO pin

DIGPIN

-0.3

—

IOVDD

0.3

dBm

Input RF level on RF pin

RF_2G4

RFMAX2G4

+10

Absolute voltage on RF pin

RF_2G4

MAX2G4

-0.3

—

VREG

0.3

Total current into VDD power

VDDMAX

lines

Source

Sink

200

Total current into VSS

ground lines

VSSMAX

—

200

Current per I/O pin

IOMAX

Sink

—

Source

Sink

Current for all I/O pins

IOALLMAX

200

Source

silabs.com

| Building a more connected world.

Rev. 1.0

| 8

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Electrical Characteristics

4.2 General

Operating Conditions

This table specifies the general operating temperature range and supply voltage range for all supplies. The minimum and maximum

values of all other tables are specifed over this operating range, unless otherwise noted.

Table 4.2.

General Operating Conditions

Parameter

Symbol

Test Condition

Min

-40

Typ

—

Max

+85

+105

3.8

Unit

°C

Operating ambient tempera-

ture range

-G temperature grade

-N temperature grade

-40

—

IOVDDx operating supply

voltage (All IOVDD pins)

IOVDDx

1.71

3.0

DCDC in regulation

DCDC in bypass

VSCALE2, MODE = WS1

VSCALE2, MODE = WS0

VSCALE2

VREGVDD operating supply

VREGVDD

voltage

2.2

3.0

3.8

1.8

—

3.0

—

3.8

76.8

HCLK and SYSCLK frequen-

HCLK

MHz

—

PCLK frequency

PCLK

—

VSCALE1

—

EM01 Group A clock fre-

quency

EM01GRPACLK

EM01GRPBCLK

RHCLK

VSCALE2

—

76.8

VSCALE1

—

EM01 Group B clock fre-

quency

VSCALE2

—

76.8

VSCALE1

—

Radio HCLK frequency

VSCALE2 or VSCALE1

38.4

—

Note:

1. The supported maximum V

VREGVDD

in regulation mode is a function of temperature and 10-year lifetime average load current.

See more details in

4.2.1 DC-DC Operating Limits

2. The recommended radio crystal frequency is 38.4 MHz. Any crystal frequency other than 38.4 is expressly not supported.

silabs.com

| Building a more connected world.

Rev. 1.0

| 9

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Electrical Characteristics

4.2.1 DC-DC

Operating Limits

The maximum supported voltage on the VREGVDD supply pin is limited under certain conditions. Maximum input voltage is a function

of temperature and the average load current over a 10-year lifetime.

Figure 4.1 Lifetime average load current limit vs. Maximum input

voltage on page 10

shows the safe operating region under specific conditions. Exceeding this safe operating range may impact the

reliability and performance of the DC-DC converter.

The average load current for an application can typically be determined by examining the current profile during the time the device is

powered. For example, an application that is continuously powered which spends 99% of the time asleep consuming 2 µA and 1% of

the time active and consuming 10 mA has an average lifetime load current of about 102 µA.

≤

105 °C

3.3

Maximum V

VREGVDD

(V)

3.8

Figure 4.1.

Lifetime average load current limit vs. Maximum input voltage

The minimum input voltage for the DC-DC in EM0/EM1 mode is a function of the maximum load current, and the peak current setting.

Figure 4.2 Transient maximum load current vs. Minimum input voltage on page 10

shows the max load current vs. input voltage for

different DC-DC peak inductor current settings.

PEAK

= 150 mA

PEAK

= 90 mA

1.8

2.2

Minimum V

VREGVDD

(V)

Figure 4.2.

Transient maximum load current vs. Minimum input voltage

silabs.com

| Building a more connected world.

Rev. 1.0

| 10

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Electrical Characteristics

4.3 MCU

Current Consumption with 3 V Supply

Unless otherwise indicated, typical conditions are: Module supply voltage = 3.0 V. Voltage scaling level = VSCALE1. T

= 25 °C. Mini-

mum and maximum values in this table represent the worst conditions across process variation at T

= 25 °C.

Table 4.3.

MCU Current Consumption with 3 V Supply

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Current consumption in EM0

ACTIVE

mode with all peripherals dis-

abled

76.8 MHz HFRCO w/ DPLL refer-

enced to 38.4 MHz crystal, CPU

running while loop from flash,

VSCALE2

—

µA/MHz

76.8 MHz HFRCO w/ DPLL refer-

enced to 38.4 MHz crystal, CPU

running CoreMark loop from flash,

VSCALE2

—

µA/MHz

38.4 MHz crystal, CPU running

Prime from flash

—

µA/MHz

38.4 MHz crystal, CPU running

while loop from flash

38.4 MHz crystal, CPU running

CoreMark loop from flash

38 MHz HFRCO, CPU running

while loop from flash

76.8 MHz HFRCO w/ DPLL refer-

enced to 38.4 MHz crystal, CPU

running Prime from flash,

VSCALE2

Current consumption in EM1

EM1

mode with all peripherals dis-

abled

76.8 MHz HFRCO w/ DPLL refer-

enced to 38.4 MHz crystal,

VSCALE2

—

µA/MHz

38.4 MHz crystal

38 MHz HFRCO

—

µA/MHz

µA

Current consumption in EM2

EM2_VS

mode, VSCALE0

Full RAM retention and RTC run-

ning from LFXO

1.40

Full RAM retention and RTC run-

ning from LFRCO

—

1.40

1.75

—

µA

Full RAM retention and RTC run-

ning from LFRCO in precision

mode

24 kB RAM retention and RTC

running from LFXO

—

1.32

1.66

—

µA

24 kB RAM retention and RTC

running from LFRCO in precision

mode

8 kB RAM retention and RTC run-

ning from LFXO

—

1.21

1.20

1.05

—

µA

8 kB RAM retention and RTC run-

ning from LFRCO

Current consumption in EM3

EM3_VS

mode, VSCALE0

8 kB RAM retention and RTC run-

ning from ULFRCO

silabs.com

| Building a more connected world.

Rev. 1.0

| 11

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Electrical Characteristics

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Current consumption in EM4

EM4

mode

No BURTC, No LF Oscillator,

DCDC bypassed

—

0.17

—

µA

Additional current in EM2 or

PD0B_VS

EM3 when any peripheral in

PD0B is enabled

—

0.37

—

µA

Note:

1. Extra current consumed by power domain. Does not include current associated with the enabled peripherals. See for a list of the

peripherals in each power domain.

4.4 Radio

Current Consumption with 3 V Supply

RF current consumption measured with MCU in EM1, HCLK = 38.4 MHz, and all MCU peripherals disabled. Unless otherwise indica-

ted, typical conditions are: VREGVDD = 3.0 V. T

= 25 °C. Minimum and maximum values in this table represent the worst conditions

across process variation at T

= 25 °C.

Table 4.4.

Radio Current Consumption with 3 V Supply

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

System current consumption

RX_ACTIVE

in receive mode, active pack-

et reception

125 kbit/s, 2GFSK, f = 2.4 GHz,

Bluetooth stack running

—

4.2

—

500 kbit/s, 2GFSK, f = 2.4 GHz,

Bluetooth stack running

—

4.3

4.2

4.8

4.3

4.2

4.7

4.6

8.8

—

1 Mbit/s, 2GFSK, f = 2.4 GHz,

Bluetooth stack running

2 Mbit/s, 2GFSK, f = 2.4 GHz,

Bluetooth stack running

System current consumption

RX_LISTEN

in receive mode, listening for

packet

125 kbit/s, 2GFSK, f = 2.4 GHz,

Bluetooth stack running

500 kbit/s, 2GFSK, f = 2.4 GHz,

Bluetooth stack running

1 Mbit/s, 2GFSK, f = 2.4 GHz,

Bluetooth stack running

2 Mbit/s, 2GFSK, f = 2.4 GHz,

Bluetooth stack running

System current consumption

in transmit mode

f = 2.4 GHz, CW, 0 dBm output

power

f = 2.4 GHz, CW, 6 dBm output

power

silabs.com

| Building a more connected world.

Rev. 1.0

| 12

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Electrical Characteristics

4.5 RF

Transmitter General Characteristics for the 2.4 GHz Band

Unless otherwise indicated, typical conditions are: T

= 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz.

Table 4.5.

RF Transmitter General Characteristics for the 2.4 GHz Band

Parameter

Symbol

RANGE

Test Condition

Min

2400

—

Typ

—

Max

2483.5

—

Unit

MHz

dBm

RF tuning frequency range

Maximum TX power

POUT

MAX

6 dBm output power

0 dBm output power

6.0

—

-0.5

-27

0.04

—

Minimum active TX Power

POUT

MIN

—

Output power variation vs

VREGVDD supply voltage

variation, frequency = 2450

MHz

POUT

VAR_V

6 dBm output power with

VREGVDD voltage swept from

1.8 V to 3.0 V

—

0 dBm output power, with

VREGVDD voltage swept from

1.8 to 3.0 V

—

0.04

—

Output power variation vs

temperature, Frequency =

2450 MHz

POUT

VAR_T

6 dBm output power, (-40 to +105

°C)

—

0.2

1.3

0.1

1.0

—

0 dBm output power, (-40 to +105

°C)

6 dBm output power, (-40 to +85

°C)

0 dBm output power, (-40 to +85

°C)

Output power variation vs RF

POUT

VAR_F

frequency

6 dBm output power

0 dBm output power

—

0.09

0.15

—

Note:

1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov-

ered in this data sheet can be found in the Max TX Power column of the Ordering Information Table.

4.6 RF

Receiver General Characteristics for the 2.4 GHz Band

Unless otherwise indicated, typical conditions are: T

= 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz.

Table 4.6.

RF Receiver General Characteristics for the 2.4 GHz Band

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

RF tuning frequency range

RANGE

2400

—

2483.5

MHz

silabs.com

| Building a more connected world.

Rev. 1.0

| 13

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Electrical Characteristics

4.7 RF

Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate

Unless otherwise indicated, typical conditions are: T

= 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz.

Table 4.7.

RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Signal is reference signal

Max usable receiver input

level

SAT

—

dBm

Sensitivity

SENS

Signal is reference signal, 37 byte

payload

—

-98.6

-97.2

—

dBm

Signal is reference signal, 255

byte payload

With non-ideal signals

3 1

(see notes)

1 4

—

-96.6

8.7

—

dBm

Signal to co-channel interfer-

C/I

N ± 1 Adjacent channel se-

lectivity

C/I

Interferer is reference signal at +1

MHz offset

1 5 4 6

—

-6.6

-6.5

—

Interferer is reference signal at -1

MHz offset

1 5 4 6

N ± 2 Alternate channel se-

lectivity

Interferer is reference signal at +2

MHz offset

1 5 4 6

-40.9

-39.9

-45.9

-46.2

-23.5

Interferer is reference signal at -2

MHz offset

1 5 4 6

N ± 3 Alternate channel se-

lectivity

Interferer is reference signal at +3

MHz offset

1 5 4 6

Interferer is reference signal at -3

MHz offset

1 5 4 6

Selectivity to image frequen-

C/I

Interferer is reference signal at im-

age frequency with 1 MHz preci-

sion

1 6

Selectivity to image frequen-

C/I

IM_1

cy ± 1 MHz

Interferer is reference signal at im-

age frequency +1 MHz with 1

—

-40.9

-6.6

—

MHz precision

1 6

Interferer is reference signal at im-

age frequency -1 MHz with 1 MHz

precision

1 6

n = 3 (see note

)

Intermodulation performance

-17.1

dBm

Note:

1. 0.017% Bit Error Rate.

2. 0.1% Bit Error Rate.

3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1

4. Desired signal -67 dBm.

5. Measured frequency is 2401 MHz ≤ Fc ≤ 2481 MHz.

6. With allowed exceptions.

7. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4

silabs.com

| Building a more connected world.

Rev. 1.0

| 14

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Electrical Characteristics

4.8 RF

Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate

Unless otherwise indicated, typical conditions are: T

= 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz.

Table 4.8.

RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Signal is reference signal

Max usable receiver input

level

SAT

—

dBm

Sensitivity

SENS

Signal is reference signal, 37 byte

payload

—

-95.9

-94.3

—

dBm

Signal is reference signal, 255

byte payload

With non-ideal signals

3 1

(see notes)

1 4

—

-94.0

8.8

—

dBm

Signal to co-channel interfer-

C/I

N ± 1 Adjacent channel se-

lectivity

C/I

Interferer is reference signal at +2

MHz offset

1 5 4 6

—

-9.2

-6.6

—

Interferer is reference signal at -2

MHz offset

1 5 4 6

N ± 2 Alternate channel se-

lectivity

Interferer is reference signal at +4

MHz offset

1 5 4 6

-43.3

-44.0

-48.6

-50.7

-23.8

Interferer is reference signal at -4

MHz offset

1 5 4 6

N ± 3 Alternate channel se-

lectivity

Interferer is reference signal at +6

MHz offset

1 5 4 6

Interferer is reference signal at -6

MHz offset

1 5 4 6

Selectivity to image frequen-

C/I

Interferer is reference signal at im-

age frequency with 1 MHz preci-

sion

1 6

Selectivity to image frequen-

C/I

IM_1

cy ± 2 MHz

Interferer is reference signal at im-

age frequency +2 MHz with 1

—

-43.3

-9.2

—

MHz precision

1 6

Interferer is reference signal at im-

age frequency -2 MHz with 1 MHz

precision

1 6

n = 3 (see note

)

Intermodulation performance

-18.8

dBm

Note:

1. 0.017% Bit Error Rate.

2. 0.1% Bit Error Rate.

3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1

4. Desired signal -64 dBm.

5. Measured frequency is 2401 MHz ≤ Fc ≤ 2481 MHz.

6. With allowed exceptions.

7. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4

silabs.com

| Building a more connected world.

Rev. 1.0

| 15

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Electrical Characteristics

4.9 RF

Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate

Unless otherwise indicated, typical conditions are: T

= 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz.

Table 4.9.

RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Signal is reference signal

Max usable receiver input

level

SAT

—

dBm

Sensitivity

SENS

Signal is reference signal, 37 byte

payload

—

-102.3

-100.9

—

dBm

Signal is reference signal, 255

byte payload

With non-ideal signals

3 1

(see notes)

1 4

—

-99.8

2.7

—

dBm

Signal to co-channel interfer-

C/I

N ± 1 Adjacent channel se-

lectivity

C/I

Interferer is reference signal at +1

MHz offset

1 5 4 6

—

-8.0

-7.9

—

Interferer is reference signal at -1

MHz offset

1 5 4 6

N ± 2 Alternate channel se-

lectivity

Interferer is reference signal at +2

MHz offset

1 5 4 6

-46.5

-49.9

-48.9

-53.8

-48.3

Interferer is reference signal at -2

MHz offset

1 5 4 6

N ± 3 Alternate channel se-

lectivity

Interferer is reference signal at +3

MHz offset

1 5 4 6

Interferer is reference signal at -3

MHz offset

1 5 4 6

Selectivity to image frequen-

C/I

Interferer is reference signal at im-

age frequency with 1 MHz preci-

sion

1 6

Selectivity to image frequen-

C/I

IM_1

cy ± 1 MHz

Interferer is reference signal at im-

age frequency +1 MHz with 1

—

-49.9

-46.5

—

MHz precision

1 6

Interferer is reference signal at im-

age frequency -1 MHz with 1 MHz

precision

1 6

Note:

1. 0.017% Bit Error Rate.

2. 0.1% Bit Error Rate.

3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1

4. Desired signal -72 dBm.

5. Measured frequency is 2401 MHz ≤ Fc ≤ 2481 MHz.

6. With allowed exceptions.

silabs.com

| Building a more connected world.

Rev. 1.0

| 16

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Electrical Characteristics

4.10 RF

Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate

Unless otherwise indicated, typical conditions are: T

= 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz.

Table 4.10.

RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Signal is reference signal

Max usable receiver input

level

SAT

—

dBm

Sensitivity

SENS

Signal is reference signal, 37 byte

payload

—

-106.4

-106.0

—

dBm

Signal is reference signal, 255

byte payload

With non-ideal signals

3 1

(see notes)

1 4

—

-105.6

0.9

—

dBm

Signal to co-channel interfer-

C/I

N ± 1 Adjacent channel se-

lectivity

C/I

Interferer is reference signal at +1

MHz offset

1 5 4 6

—

-13.6

-13.4

-52.6

-55.8

-53.7

-59.0

-52.7

—

Interferer is reference signal at -1

MHz offset

1 5 4 6

N ± 2 Alternate channel se-

lectivity

Interferer is reference signal at +2

MHz offset

1 5 4 6

Interferer is reference signal at -2

MHz offset

1 5 4 6

N ± 3 Alternate channel se-

lectivity

Interferer is reference signal at +3

MHz offset

1 5 4 6

Interferer is reference signal at -3

MHz offset

1 5 4 6

Selectivity to image frequen-

C/I

Interferer is reference signal at im-

age frequency with 1 MHz preci-

sion

1 6

Selectivity to image frequen-

C/I

IM_1

cy ± 1 MHz

Interferer is reference signal at im-

age frequency +1 MHz with 1

—

-53.7

-52.6

—

MHz precision

1 6

Interferer is reference signal at im-

age frequency -1 MHz with 1 MHz

precision

1 6

Note:

1. 0.017% Bit Error Rate.

2. 0.1% Bit Error Rate.

3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1

4. Desired signal -79 dBm.

5. Measured frequency is 2401 MHz ≤ Fc ≤ 2481 MHz.

6. With allowed exceptions.

silabs.com

| Building a more connected world.

Rev. 1.0

| 17

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Electrical Characteristics

4.11 High-Frequency

Crystal

Table 4.11.

High-Frequency Crystal

Parameter

Symbol

Test Condition

Min

—

Typ

38.4

+/-5

—

Max

—

Unit

MHz

ppm

Crystal frequency

Initial calibrated accuracy

Temperature drift

HFXTAL

ACC

HFXTAL

DRIFT

HFXTAL

-10

-20

Across specified temperature

range

4.12 Low

Frequency Crystal Oscillator

Table 4.12.

Low Frequency Crystal Oscillator

Parameter

Symbol

Test Condition

Min

Typ

32.768

—

Max

—

Unit

kHz

kΩ

Crystal Frequency

LFXO

—

Supported Crystal equivalent

ESR

LFXO

series resistance (ESR)

GAIN = 0

GAIN = 1 to 3

GAIN = 0

GAIN = 1

GAIN = 2

—

100

Supported range of crystal

load capacitance

LFXO_CL

—

12.5

—

12.5

GAIN = 3 (see note

)

—

Current consumption

Startup Time

CL12p5

ESR = 70 kOhm, CL = 12.5 pF,

GAIN

= 2, AGC

= 1

—

357

—

STARTUP

ESR = 70 kOhm, CL = 7 pF,

GAIN

= 1, AGC

= 1

—

On-chip tuning cap step size

LFXO

—

0.26

—

On-chip tuning capacitor val-

LFXO_MIN

ue at minimum setting

CAPTUNE = 0

On-chip tuning capacitor val-

LFXO_MAX

ue at maximum setting

CAPTUNE = 0x4F

—

24.5

—

Note:

1. Total load capacitance seen by the crystal

2. Crystals with a load capacitance of greater than 12 pF require external load capacitors.

3. In LFXO_CAL Register

4. In LFXO_CFG Register

5. The effective load capacitance seen by the crystal will be C

LFXO

/2. This is because each XTAL pin has a tuning cap and the two

caps will be seen in series by the crystal

silabs.com

| Building a more connected world.

Rev. 1.0

| 18

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Electrical Characteristics

4.13 Precision

Low Frequency RC Oscillator (LFRCO)

Table 4.13.

Precision Low Frequency RC Oscillator (LFRCO)

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Nominal oscillation frequen-

LFRCO

—

32.768

—

kHz

Frequency accuracy

LFRCO_ACC

Normal mode

-3

—

Precision mode

, across operat-

ing temperature range

-500

500

ppm

Startup time

STARTUP

Normal mode

—

204

—

µs

Precision mode

Normal mode

11.7

Current consumption

LFRCO

—

175

655

—

Precision mode

, T = stable at 25

°C

Note:

1. The LFRCO operates in high-precision mode when CFG_HIGHPRECEN is set to 1. High-precision mode is not available in EM4.

2. Includes ± 40 ppm frequency tolerance of the HFXO crystal.

3. Includes periodic re-calibration against HFXO crystal oscillator.

silabs.com

| Building a more connected world.

Rev. 1.0

| 19

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Electrical Characteristics

4.14 GPIO

Pins

Unless otherwise indicated, typical conditions are: IOVDD = 3.0 V.

Table 4.14.

GPIO Pins

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Leakage current

LEAK_IO

MODEx = DISABLED, IOVDD =

1.71 V

—

1.9

—

MODEx = DISABLED, IOVDD =

3.0 V

—

2.5

—

Input low voltage

Any GPIO pin

RESETn

—

0.3*IOVDD

—

0.3*DVDD

Input high voltage

Any GPIO pin

RESETn

0.7*IOVDD

0.7*DVDD

—

Hysteresis of input voltage

HYS

Any GPIO pin

0.05*IOVD

RESETn

0.05*DVDD

—

Output high voltage

Output low voltage

GPIO rise time

Sourcing 20mA, IOVDD = 3.0 V

0.8 *

IOVDD

Sourcing 8mA, IOVDD = 1.71 V

Sinking 20mA, IOVDD = 3.0 V

Sinking 8mA, IOVDD = 1.71 V

0.6 *

IOVDD

—

0.2 *

IOVDD

—

0.4 *

IOVDD

GPIO_RISE

IOVDD = 3.0 V, C

load

= 50pF,

SLEWRATE = 4, 10% to 90%

8.4

—

kΩ

IOVDD = 1.71 V, C

load

= 50pF,

SLEWRATE = 4, 10% to 90%

GPIO fall time

GPIO_FALL

IOVDD = 3.0 V, C

load

= 50pF,

SLEWRATE = 4, 90% to 10%

7.1

11.9

IOVDD = 1.71 V, C

load

= 50pF,

SLEWRATE = 4, 90% to 10%

Pull up/down resistance

PULL

Any GPIO pin. Pull-up to IOVDD:

MODEn = DISABLE DOUT=1.

Pull-down to VSS: MODEn =

WIREDORPULLDOWN DOUT =

RESETn pin. Pull-up to DVDD

MODE = INPUT, DOUT = 1

—

kΩ

Maximum filtered glitch width

Note:

1. GPIO input thresholds are proportional to the IOVDD pin. RESETn input thresholds are proportional to DVDD.

2. GPIO pull-ups connect to IOVDD supply, pull-downs connect to VSS. RESETn pull-up connects to DVDD.

silabs.com

| Building a more connected world.

Rev. 1.0

| 20

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Electrical Characteristics

4.15 Microcontroller

Peripherals

The MCU peripherals set available in BGM220S modules includes:

• ADC:

12-bit at 1 Msps, 16-bit at 76.9 ksps

• 16-bit

and 32-bit Timers/Counters

• 24-bit

Low Energy Timer for waveform generation

• 32-bit

Real Time Counter

• USART

(UART/SPI/SmartCards/IrDA/I2S)

• EUART

(UART/IrDA)

C peripheral interfaces

•

• PDM

interface

• 12

Channel Peripheral Reflex System

For details on their electrical performance, consult the relevant portions of Section 4 in the SoC datasheet.

To learn which GPIO ports provide access to every peripheral, consult Analog Peripheral Connectivity and Digital Peripheral Connectiv-

ity.

4.16 Typical

Performance Curves

Typical performance curves indicate typical characterized performance under the stated conditions.

silabs.com

| Building a more connected world.

Rev. 1.0

| 21

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Electrical Characteristics

4.16.1 Antenna

Typical Characteristics

Typical BGM220S radiation patterns for the on-board chip antenna under optimal operating conditions are plotted in the figures that

follow. Antenna gain and radiation patterns have a strong dependence on the size and shape of the application PCB the module is

mounted on, as well as on the proximity of any mechanical design to the antenna.

Top Left: Phi 0

, Top Right: Phi 90

, Bottom Left: Theta 90

Figure 4.3.

BGM220S12A Typical 2D Antenna Radiation Patterns on 50 mm x 30 mm board

silabs.com

| Building a more connected world.

Rev. 1.0

| 22

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Electrical Characteristics

Top Left: Phi 0

, Top Right: Phi 90

, Bottom Left: Theta 90

Figure 4.4.

BGM220S22A Typical 2D Antenna Radiation Patterns on 55 mm x 20 mm board

silabs.com

| Building a more connected world.

Rev. 1.0

| 23

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Reference Diagrams

5. Reference

Diagrams

5.1 Network

Co-Processor (NCP) Application with UART Host

The BGM220S can be controlled over the UART interface as a peripheral to an external host processor. Typical power supply, pro-

gramming/debug interface, and host interface connections are shown in the figure below. For more details, refer to

AN958: Debugging

and Programming Interfaces for Custom Designs

Antenna Loop

RESETn

0.1 µF

(optional)

PTI_FRAME

PTI_DATA

(recommended)

PC02

PC01

0 Ohm

ANT_IN

RF_2G4

GND

PC00

BGM220S

PD00

32.768 kHz

(optional)

GND

PD01

PB04

PB03

PB02

PB01

PB00

PD02

VDD

PD03

VDD

IOVDD

VREGVDD

VREG

RESETn

SWO (PA03)

SWDIO (PA02)

SWCLK (PA01)

PTI_FRAME (PC05)

PTI_DATA (PC04)

GPIO

RESETn

RTS

CTS

Mini Simplicity Debug Connector

Host CPU

Figure 5.1.

UART NCP Configuration

silabs.com

| Building a more connected world.

Rev. 1.0

| 24

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Reference Diagrams

5.2 SoC

Application

The BGM220S can be used in a stand-alone SoC configuration without an external host processor. Typical power supply and program-

ming/debug interface connections are shown in the figure below. For more details, refer to

AN958: Debugging and Programming Inter-

faces for Custom Designs

Antenna Loop

RESETn

0.1 µF

(optional)

PTI_FRAME

PTI_DATA

(recommended)

PC02

PC01

0 Ohm

ANT_IN

RF_2G4

GND

PC00

BGM220S

PD00

32.768 kHz

(optional)

GND

PD01

PB04

PB03

PB02

PB01

PB00

PD02

PD03

IOVDD

VREGVDD

VREG

VDD

RESETn

SWO (PA03)

SWDIO (PA02)

SWCLK (PA01)

PTI_DATA (PC04)

PTI_FRAME (PC05)

Mini Simplicity Debug Connector

Figure 5.2.

Stand-Alone SoC Configuration

silabs.com

| Building a more connected world.

Rev. 1.0

| 25

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Pin Definitions

6. Pin

Definitions

6.1 44-Pin

SiP Module Device Pinout

Figure 6.1.

44-Pin SiP Module Device Pinout

The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the sup-

ported features for each GPIO pin, see

6.2 Alternate Function Table

6.3 Analog Peripheral Connectivity

, and

6.4 Digital Peripheral

Connectivity

Table 6.1.

44-Pin SiP Module Device Pinout

Pin Name

Pin(s) Description

Pin Name

ANT_IN

GND

Pin(s) Description

Do not connect

2.4 GHz RF input/output

Ground

Antenna In

Ground

GPIO

RF_2G4

GND

PB04

PB03

GPIO

PB02

GPIO

PB01

GPIO

PB00

GPIO

silabs.com

| Building a more connected world.

Rev. 1.0

| 26

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Pin Definitions

Pin Name

Pin(s) Description

Pin Name

Pin(s) Description

PA00

GPIO

PA01

GPIO

Decouple output for on-chip voltage

regulator. This pin is internally decou-

pled, and should be left disconnected.

PA02

GPIO

DECOUPLE

PA03

PA05

PA07

GPIO

PA04

PA06

PA08

GPIO

Regulated supply voltage. This pin is in-

ternally connected to the SoC DVDD,

RFVDD, and PAVDD supply lines. It is

not intended to power external circuitry.

Module input power supply. This pin is

internally connected to the SoC AVDD

and VREGVDD supply lines.

VREG

VREGVDD

IOVDD

PD02

PD00

PC01

PC03

PC05

I/O power supply

GPIO

PD03

PD01

PC00

PC02

PC04

PC06

GPIO

Reset Pin. The RESETn pin is internally

pulled up to VREG (DVDD).

RESETn

GND

Ground

Do not connect

Ground

ANT_OUT

GND

Do not connect

Antenna Out

Ground

GND

Ground

GND

Ground

silabs.com

| Building a more connected world.

Rev. 1.0

| 27

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Pin Definitions

6.2 Alternate

Function Table

A wide selection of alternate functionality is available for multiplexing to various pins. The following table shows what functions are

available on each device pin.

Table 6.2.

GPIO Alternate Function Table

GPIO

Alternate Functions

PB03

PB01

PB00

PA00

PA01

PA02

GPIO.EM4WU4

GPIO.EM4WU3

IADC0.VREFN

IADC0.VREFP

GPIO.SWCLK

GPIO.SWDIO

GPIO.SWV

PA03

GPIO.TDO

GPIO.TRACEDATA0

GPIO.TDI

PA04

GPIO.TRACECLK

GPIO.EM4WU0

GPIO.EM4WU9

PA05

PD02

LFXO.LFXTAL_I

LFXO.LF_EXTCLK

LFXO.LFXTAL_O

PD01

PD00

PC00

PC05

GPIO.EM4WU6

GPIO.THMSW_EN

GPIO.EM4WU7

6.3 Analog

Peripheral Connectivity

Many analog resources are routable and can be connected to numerous GPIO’s. The table below indicates which peripherals are avali-

able on each GPIO port. When a differential connection is being used Positive inputs are restricted to the EVEN pins and Negative

inputs are restricted to the ODD pins. When a single ended connection is being used positive input is avaliable on all pins. See the

device Reference Manual for more details on the ABUS and analog peripherals.

Table 6.3.

ABUS Routing Table

Peripheral

Signal

ODD

EVEN

Yes

EVEN

Yes

EVEN

Yes

EVEN

Yes

IADC0

ANA_NEG

ANA_POS

Yes

silabs.com

| Building a more connected world.

Rev. 1.0

| 28

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Pin Definitions

6.4 Digital

Peripheral Connectivity

Many digital resources are routable and can be connected to numerous GPIO’s. The table below indicates which peripherals are avalia-

ble on each GPIO port.

Table 6.4.

DBUS Routing Table

Peripheral.Resource

PORT

CMU.CLKIN0

Available

CMU.CLKOUT0

CMU.CLKOUT1

CMU.CLKOUT2

EUART0.CTS

Available

EUART0.RTS

EUART0.RX

EUART0.TX

FRC.DCLK

FRC.DFRAME

FRC.DOUT

I2C0.SCL

Available

I2C0.SDA

I2C1.SCL

I2C1.SDA

LETIMER0.OUT0

LETIMER0.OUT1

MODEM.ANT0

Available

MODEM.ANT1

MODEM.ANT_ROLL_OVER

MODEM.ANT_RR0

MODEM.ANT_RR1

MODEM.ANT_RR2

MODEM.ANT_RR3

MODEM.ANT_RR4

MODEM.ANT_RR5

MODEM.ANT_SW_EN

MODEM.ANT_SW_US

MODEM.ANT_TRIG

MODEM.ANT_TRIG_STOP

MODEM.DCLK

Available

silabs.com

| Building a more connected world.

Rev. 1.0

| 29

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Pin Definitions

Peripheral.Resource

PORT

MODEM.DIN

Available

MODEM.DOUT

PDM.CLK

Available

PDM.DAT0

PDM.DAT1

PRS.ASYNCH0

PRS.ASYNCH1

PRS.ASYNCH10

PRS.ASYNCH11

PRS.ASYNCH2

PRS.ASYNCH3

PRS.ASYNCH4

PRS.ASYNCH5

PRS.ASYNCH6

PRS.ASYNCH7

PRS.ASYNCH8

PRS.ASYNCH9

PRS.SYNCH0

PRS.SYNCH1

PRS.SYNCH2

PRS.SYNCH3

TIMER0.CC0

TIMER0.CC1

TIMER0.CC2

TIMER0.CDTI0

TIMER0.CDTI1

TIMER0.CDTI2

TIMER1.CC0

TIMER1.CC1

TIMER1.CC2

TIMER1.CDTI0

TIMER1.CDTI1

TIMER1.CDTI2

TIMER2.CC0

TIMER2.CC1

TIMER2.CC2

Available

silabs.com

| Building a more connected world.

Rev. 1.0

| 30

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Pin Definitions

Peripheral.Resource

PORT

TIMER2.CDTI0

TIMER2.CDTI1

TIMER2.CDTI2

TIMER3.CC0

TIMER3.CC1

TIMER3.CC2

TIMER3.CDTI0

TIMER3.CDTI1

TIMER3.CDTI2

TIMER4.CC0

TIMER4.CC1

TIMER4.CC2

TIMER4.CDTI0

TIMER4.CDTI1

TIMER4.CDTI2

USART0.CLK

USART0.CS

Available

USART0.CTS

USART0.RTS

USART0.RX

USART0.TX

USART1.CLK

USART1.CS

USART1.CTS

USART1.RTS

USART1.RX

USART1.TX

silabs.com

| Building a more connected world.

Rev. 1.0

| 31

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Design Guidelines

7. Design

Guidelines

7.1 Layout

and Placement

For optimal performance of the BGM220S the following guidelines are recommended:

• Place

the module 1.50 mm from the edge of the copper “keep-in” area at the middle of the long edge of the application PCB, as

illustrated in

Figure 7.1 Recommended Layout for BGM220S on page 32

• Copy

the exact antenna design from

Figure 7.2 Antenna Layout With Coordinates on page 33

with the values for coordinates A to

L given in

Table 7.1 Antenna Polygon Coordinates, Referenced to Center of BGM220S on page 33

• Make

a cutout in all lower layers aligned with the right edge and the bottom edge of the antenna as indicated by the yellow box in

Figure 7.3 Antenna Clearance in Inner and Bottom Layers on page 34

• Connect

all ground pads directly to a solid ground plane in the top layer.

• Connect

RF_2G4 to ANT_IN through a 0-ohm resistor.

• The

0-ohm gives the ability to test conducted and to evaluate the antenna impedance in the design.

• Place

ground vias as close to the ground pads of the BGM220S as possible.

• Place

ground vias along the antenna loop right and bottom side.

• Place

ground vias along the edges of the application board.

• Do

not place plastic or any other dielectric material in contact with the antenna.

• A

minimum clearance of 0.5 mm is advised.

• Solder

mask, conformal coating and other thin dielectric layers are acceptable directly on top of the antenna region.

Figure 7.1.

Recommended Layout for BGM220S

silabs.com

| Building a more connected world.

Rev. 1.0

| 32

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Design Guidelines

Figure 7.2.

Antenna Layout With Coordinates

Table 7.1.

Antenna Polygon Coordinates, Referenced to Center of BGM220S

Point

BGM220SC12WGA2

BGM220SC22WGA2

BGM220SC22HNA2

(2.87, 2.13)

(2.54, 2.13)

(2.54, 3.69)

(3.36, 4.51)

(7.75, 4.51)

(7.75, 4.15)

(6.84, 4.15)

(6.21, 3.52)

(4.26, 3.52)

(3.97, 3.81)

(3.10, 3.81)

(2.87, 3.58)

4.88

(2.87, 2.13)

(2.54, 2.13)

(2.54, 3.69)

(3.36, 4.51)

(8.85, 4.51)

(8.85, 4.15)

(6.84, 4.15)

(6.21, 3.52)

(4.26, 3.52)

(3.97, 3.81)

(3.10, 3.81)

(2.87, 3.58)

5.98

loop

4.15

Note:

1. All coordinates and dimensions listed in mm.

silabs.com

| Building a more connected world.

Rev. 1.0

| 33

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Design Guidelines

Figure 7.3.

Antenna Clearance in Inner and Bottom Layers

silabs.com

| Building a more connected world.

Rev. 1.0

| 34

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Design Guidelines

7.2 Best

Design Practices

The design of a good RF system relies on thoughtful placement and routing of the RF signals. The following guidelines are recommen-

ded:

• Place

the BGM220S and antenna close to the center of the longest edge of the application board.

• Do

not place any circuitry between the board edge and the antenna.

• Make

sure to tie all GND planes in the application board together with as many vias as can be fitted.

• Generally

ground planes are recommended in all areas of the application board except in the antenna keep-out area shown in

Fig-

ure 7.3 Antenna Clearance in Inner and Bottom Layers on page 34

• Open-ended

stubs of copper in the outer layer ground planes must be removed if they are more than 5 mm long to avoid radiation of

spurious emissions.

• The

width of the GND plane to the sides of the BGM220S will impact the efficiency of the on-board chip antenna.

• To

achieve optimal performance, a GND plane width of 50 mm for BGM220S12A or 55 mm for BGM220S22A is recommended

as seen on

Figure 7.4 Illustration of Recommended Board Width on page 35

• See

4.16.1 Antenna Typical Characteristics

for reference.

Figure 7.5 Non-Optimal Layout Examples on page 36

illustrates layout scenarios that will lead to severely degraded RF performance

for the application board.

Figure 7.4.

Illustration of Recommended Board Width

silabs.com

| Building a more connected world.

Rev. 1.0

| 35

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Design Guidelines

Figure 7.5.

Non-Optimal Layout Examples

silabs.com

| Building a more connected world.

Rev. 1.0

| 36

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Design Guidelines

7.3 Radio

Performance vs. Carrier Board Size

For many applications, the carrier board size is determined by the overall form factor or size of the additional circuitry. The recommen-

ded carrier board width of 50 mm for the BGM220S12A and 55 mm for the BGM220S22A is thus not always possible in the end-appli-

cation. If another form factor is required, the antenna performance of the integrated antenna will be compromised but it may still be

sufficiently good for providing the required link quality and range of the end-application.

Figure 7.6 Efficiency of the Integrated Antenna

as Function of the Carrier Board Size for BGM220S12A on page 37

and

Figure 7.7 Efficiency of the Integrated Antenna as Function

of the Carrier Board Size for BGM220S22A on page 38

show the total efficiency of the integrated antenna for different carrier board

sizes. As can be seen the best performance is achieved for the carrier board size of 50 mm x 30 mm for the BGM220S12A and 55 mm

x 25 mm for the BGM220S22A, with relatively constant performance for larger boards and rapidly declining performance for smaller

boards.

The performance of all the sizes tested will be adequate for more than 15 m line-of-sight range and all of the sizes are thus usable.

WARNING: Any antenna tuning or change of the loop dimensions will void the modular certification of modules with modular

certification. In that case, a Permissive Change to the modular approval is required.

Figure 7.6.

Efficiency of the Integrated Antenna as Function of the Carrier Board Size for BGM220S12A

silabs.com

| Building a more connected world.

Rev. 1.0

| 37

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Design Guidelines

Figure 7.7.

Efficiency of the Integrated Antenna as Function of the Carrier Board Size for BGM220S22A

7.4 Proximity

to Other Materials

Placing plastic or any other dielectric material directly in contact with the antenna may cause performance degradation. A clearance of

minimum 0.5 mm is recommended to avoid excessive detuning of the antenna. Solder mask, conformal coating, and other thin dielec-

tric layers are acceptable directly on top of the antenna region. Any metallic objects in close proximity to the antenna will prevent the

antenna from radiating freely. The minimum recommended distance of metallic and/or conductive objects is 10 mm in any direction

from the antenna except in the directions of the application PCB ground planes.

7.5 Proximity

to Human Body

Placing the module in contact with or very close to the human body will negatively impact antenna efficiency and reduce range. Further-

more, additional certification may be required if the module is used in a wearable device.

silabs.com

| Building a more connected world.

Rev. 1.0

| 38

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Package Specifications

8. Package

Specifications

8.1 Package

Dimensions

The package dimensions are shown in

Figure 8.1 Package Dimensions – Full on page 39

and

Figure 8.2 Package Dimensions – Detail

on page 39

Figure 8.1.

Package Dimensions – Full

Figure 8.2.

Package Dimensions – Detail

silabs.com

| Building a more connected world.

Rev. 1.0

| 39

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Package Specifications

Table 8.1.

Package Dimensions

Dimension

MIN

NOM

MAX

1.280

0.220

1.050

0.300

1.080

0.140

0.950

0.200

1.180

0.180

1.000

0.250

6.000 BSC

4.500 BSC

0.500 BSC

6.000 BSC

4.500 BSC

0.350

0.300

0.125

0.575

0.450

0.400

0.225

0.675

0.550

0.175

0.625

0.500

eD1

eD2

eE1

eE2

aaa

bbb

ccc

ddd

eee

0.450 BSC

0.900 BSC

0.450 BSC

0.900 BSC

0.100

Note:

1. The dimensions in parenthesis are reference.

2. All dimensions in millimeters (mm).

3. Unless otherwise specified, tolerances are:

a. Decimal: X.X = +/- 0.1

X.XX = +/- 0.05

X.XXX = +/- 0.03

b. Angular: +/- 0.1 (In Deg)

4. Hatching lines means package shielding area.

silabs.com

| Building a more connected world.

Rev. 1.0

| 40

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Package Specifications

8.2 Recommended

PCB Land Pattern

The recommended PCB Land Pattern is shown in

Figure 8.3 Module Land Pattern on page 41

Figure 8.3.

Module Land Pattern

Table 8.2.

PCB Land Pattern Dimensions

Dimension

Typ (mm)

4.50

2.65

4.50

2.25

eD1

0.45

eD2

0.90

0.25

0.50

0.35

0.50

Note:

1. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05mm is assumed.

2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.

3. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.

4. The stencil thickness should be 0.100 mm (4 mils).

5. The stencil aperture to land pad size recommendation is 80% paste coverage.

Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use

different parameters and fine tune their SMT process as required for their application and tooling.

silabs.com

| Building a more connected world.

Rev. 1.0

| 41

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Package Specifications

8.3 Top

Marking

Figure 8.4.

BGM220S Top Marking

Table 8.3.

Top Marking Definition

OPN

Line 1 Marking

Line 2 Marking

SC12WGA2

SC22HNA2

Line 3 Marking

See note below

BGM220SC12WGA2

BGM220SC22HNA2

BGM220SC22WGA2

BGM220S12A

BGM220S22A

SC22WGA2

Note:

YY = Year. WW = Work Week, TTTTTTT = Trace Code

silabs.com

| Building a more connected world.

Rev. 1.0

| 42

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Soldering Recommendations

9. Soldering

Recommendations

It is recommended that final PCB assembly of the BGM220S follows the industry standard as identified by the Institute for Printed Cir-

cuits (IPC). This product is assembled in compliance with the J-STD-001 requirements and the guidelines of IPC-AJ-820. Surface

mounting of this product by the end user is recommended to follow IPC-A-610 to meet or exceed class 2 requirements.

CLASS 1 General Electronic Products

Includes products suitable for applications where the major requirement is function of the completed assembly.

CLASS 2 Dedicated Service Electronic Products

Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but not

critical. Typically the end-use environment would not cause failures.

CLASS 3 High Performance/Harsh Environment Electronic Products

Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated,

end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical

systems.

Note:

General SMT application notes are provided in the AN1223 document.

silabs.com

| Building a more connected world.

Rev. 1.0

| 43

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Tape and Reel

10. Tape

and Reel

BGM220S modules are delivered to the customer in tray (490 pcs / tray) or reel (2500 pcs / reel) packaging with the dimensions below.

All dimensions are given in mm unless otherwise indicated.

Figure 10.1.

Carrier Tape Dimensions

silabs.com

| Building a more connected world.

Rev. 1.0

| 44

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Tape and Reel

Figure 10.2.

Reel Dimensions

silabs.com

| Building a more connected world.

Rev. 1.0

| 45

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Certifications

11. Certifications

This section details the regulatory certification status of the module in various regions.

The address for the module manufacturer and certification applicant is:

SILICON LABORATORIES FINLAND OY

Alberga Business Park, Bertel Jungin aukio 3,

02600 Espoo, Finland

11.1 Regulatory

Certifications

11.1.1 Qualified

Antennas

BGM220S modules have been tested and certified both with the on-board antennas and with external antennas attached to the RF pin

(RF_2G4). Performance characteristics for the integral antennas are presented in

Table 3.1 Antenna Efficiency and Peak Gain

(BGM220S12A) on page 7

Table 3.2 Antenna Efficiency and Peak Gain (BGM220S22A) on page 7

and

4.16.1 Antenna Typical Char-

acteristics

. Details for the external qualified reference antennas are summarized in the table below.

Table 11.1.

Qualified External Antennas for BGM220S

Model

Antenna Type

Maximum Gain

3.2 dBi

Impedance

50 Ω

BGM220S12A

BGM220S22A

Connectorized Coaxial Dipole

2.8 dBi

50 Ω

Any external antenna of the same general type and of equal or less directional gain as listed in the above table, and having similar in-

band and out-of-band characteristics, can be used in the regulatory areas that have a full modular radio approval, such as USA and

Canada, as long as spot-check testing is performed to verify that no performance changes compromising compliance have been intro-

duced. In the particular FCC case, in order to comply with e-CFR Title 47, Part 15, Subpart C, Section 15.203 the module integrator

using an external antenna must ensure it has a unique connector or it is undetachable. In countries applying the ETSI standards, like

the EU countries, the radiated emissions are always tested with the end-product and the antenna type is not critical, but antennas with

higher gain may violate some of the regulatory limits.

When using instead an external antenna of a different type (such as a chip antenna, a PCB trace antenna or a patch) or having non-

similar in-band and out-of-band characteristics, but still with a gain less than or equal to the maximum gain listed in the table above, it

can be added as a permissive change to the existing grant/certificate. In most of these cases, some radiated emission testing is deman-

ded, but no modular or end-product re-certification is required.

On the other hand, all products with antennas having more gain than the maximum gain listed in the table above are very likely to re-

quire a full new end-product certification. Since the exact permissive change procedure is chosen on a case by case basis, please con-

sult your test house and/or a certification body for understanding the correct approach based on your unique design. You might also

want or need to get in touch with Silicon Labs for any authorization letter that your certification body might ask for.

11.1.2 EU

– CE

The BGM220S modules have been tested against the relevant harmonized standards and are in conformity with the essential require-

ments and other relevant requirements of the Radio Equipment Directive (RED) (2014/53/EU).

Please note that every application using the BGM220S module will need to perform the radio EMC tests on the end product, according

to EN 301 489-17.

It is ultimately the responsibility of the manufacturer to ensure the compliance of the end-product as a whole. The specific product as-

sembly may have an impact to RF radiated characteristics, and manufacturers should carefully consider RF radiated testing with the

end-product assembly.

A formal Declaration of Conformity (DoC) is available at the product web page which is reachable starting from

https://www.silabs.com/

silabs.com

| Building a more connected world.

Rev. 1.0

| 46

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Certifications

11.1.3 USA

– FCC

This device complies with FCC’s e-CFR Title 47, Part 15, Subpart C, Section 15.247 (and related relevant parts of the ANSI

C63.10.2013 standard) when operating with the embedded antenna or with the antenna type(s) listed in

11.1.1 Qualified Antennas

Operation is subject to the following two conditions:

1. This device may not cause harmful interference, and

2. This device must accept any interference received, including interference that may cause undesirable operation.

Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment.

FCC RF Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specif-

ic operating instructions for satisfying RF exposure compliance.

This transmitter meets the Mobile requirements at a distance of 20 cm and above from the human body, in accordance to the limit(s)

exposed in the RF Exposure Analysis.

This transmitter also meets the Portable requirements at distances equal or above those listed for convenience in

Table 11.2 Minimum

Separation Distances for SAR Evaluation Exemption (BGM220S12A) on page 52

and

Table 11.3 Minimum Separation Distances for

SAR Evaluation Exemption (BGM220S22A) on page 52

This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC

multi-transmitter product procedures.

OEM Responsibilities to comply with FCC Regulations

This module has been tested for compliance to FCC Part 15.

OEM integrators are responsible for testing their end-product for any additional compliance requirements needed with this module in-

stalled (for example, digital device emissions, PC peripheral requirements, etc.). Additionally, investigative measurements and spot

checking are strongly recommended to verify that the full system compliance is maintained when the module is integrated, in accord-

ance to the “Host Product Testing Guidance” in FCC’s KDB 996369 D04 Module Integration Guide V01.

•

General Considerations

This transmitter module is tested as a subsystem and its certification does not cover the FCC Part 15 Subpart B (unintentional radia-

tor) rule requirement, which is applicable to the final host. The final host will need to be assessed for compliance to this portion of

rule requirements, if applicable.

•

Manual Information to the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module, or

how to change RF related parameters, in the user’s manual of the end product which integrates this module.

The end user manual shall include all required regulatory information/warnings as shown in this manual.

•

OEM / Host Manufacturer Responsibilities

OEM/Host manufacturers are ultimately responsible for the compliance of the host system.

The BGM220S12A has a limited single-modular transmitter approval due to the radio portion of the module not being contained in its

own RF shielding. Consequently, each new host will require a reassessment of radiated spurious emissions and a Class I Permis-

sive Change to the grant. The final product must be reassessed against all the essential requirements of the FCC rule such as FCC

Part 15 Subpart B before it can be placed on the US market. This includes reassessing the transmitter module for compliance with

the Radio and EMF essential requirements of the FCC rules. This module must not be incorporated into any other radio device or

system without retesting for compliance as multi-radio and combined equipment.

The BGM220S22A is a shielded design, and comes with full modular approval.

silabs.com

| Building a more connected world.

Rev. 1.0

| 47

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Certifications

Separation

• To

meet the SAR exemption for portable conditions, the minimum separation distance indicated in

Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption (BGM220S12A) on page 52

and

Table 11.3 Minimum

Separation Distances for SAR Evaluation Exemption (BGM220S22A) on page 52

must be maintained between the human body

and the radiator (antenna) at all times.

• This

transmitter module is tested in a standalone mobile RF exposure condition, and in case of any co-located radio transmitter be-

ing allowed to transmit simultaneously, or in case of portable use at closer distances from the human body than those allowing the

exceptions rules to be applied, a separate additional SAR evaluation will be required, ultimately leading to a Class II Permissive

Change, or more rarely to a new grant.

•

Important Note:

In the event that these conditions cannot be met, the final product will have to undergo additional testing to evalu-

ate the RF exposure in order for the FCC authorization to remain valid, and a permissive change will have to be applied. The evalua-

tion (SAR) is in the responsibility of the end-product’s manufacturer, as well as the permissive change that can be carried out with

the help of the customer’s own Telecommunication Certification Body as the grant holder’s agent.

End Product Labeling

BGM220S modules are not labeled with their own FCC ID due to their size. Instead, the packaging label contains the FCC ID. In all

cases when the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the

module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a

visible area with the following:

For BGM220S12A

“Contains Transmitter Module FCC ID: QOQ-BGM220S”

“Contains FCC ID: QOQ-BGM220S”

For BGM220S22A

“Contains Transmitter Module FCC ID: QOQ-BGM220S2”

“Contains FCC ID: QOQ-BGM220S2”

Final note

: As long as all the conditions in this and all the above sections are met, further RF testing of the transmitter with full modular

approval is not required. However, OEMs are still supposed to follow the good practice and the FCC recommendation to ensure the

compliance of the host by spot checking.

Nevertheless, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements which

might be mandatory with this module installed.

Class B Device Notice – BGM220S22A Only

Note:

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC

Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equip-

ment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may

cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular in-

stallation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the

equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient

or relocate the receiving antenna.

• Increase

the separation between the equipment and receiver.

• Connect

the equipment into an outlet on a circuit different from that to which the receiver is connected.

• Consult

the dealer or an experienced radio / TV technician for help.

silabs.com

| Building a more connected world.

Rev. 1.0

| 48

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Certifications

11.1.4 ISED

Canada

ISED

This radio transmitter (IC: 5123A-BGM220S for the BGM220S12A and IC: 5123A-BGM220S2 for the BGM220S22A) has been ap-

proved by

Innovation, Science and Economic Development Canada (ISED Canada, formerly Industry Canada

) to operate with the em-

bedded antenna and with the antenna type(s) listed in

11.1.1 Qualified Antennas

, with the maximum permissible gain indicated. Anten-

na types not included in this list, having a gain greater than the maximum gain listed, are strictly prohibited for use with this device.

This device complies with ISED’s license-exempt RSS standards. Operation is subject to the following two conditions:

1. This device may not cause interference; and

2. This device must accept any interference, including interference that may cause undesired operation of the device

RF Exposure Statement

Exception from routine SAR evaluation limits are given in RSS-102 Issue 5.

For the Portable use case, RF exposure or SAR evaluation is not required in all cases, at any distance from the human body, except

when the BGM220S22A is used at full power with the external reference dipole antenna, in which case the separation distance from the

human body must be of 13 mm or more for the exemption.

For more details, refer to the values stated in

Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption

(BGM220S12A) on page 52

and

Table 11.3 Minimum Separation Distances for SAR Evaluation Exemption (BGM220S22A) on page

: if the separation distances from the human body are less than the distances mentioned in the tables, then the OEM integrator is

responsible for evaluating the SAR.

The module meets the requirements for Mobile use cases when the minimum separation distance from the human body is 20 cm or

greater, in accordance to the limit(s) exposed in the RF Exposure Analysis.

OEM Responsibilities to comply with IC Regulations

The module has been certified for integration into products only by OEM integrators under the following conditions:

• The

antenna must be installed such that a minimum separation distance as stated above is maintained between the radiator (anten-

na) and all persons at all times.

• The

transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter.

Important Note:

In the event that these conditions cannot be met, the final product will have to undergo additional testing to evaluate

the RF exposure in order for the ISED authorization to remain valid, and a permissive change will have to be applied with the help of

the customer’s own Telecommunication Certification Body typically acting as the certificate holder’s agent.

In the case of the BGM220S12A, this variant has a limited approval due to the radio portion of the module not being contained in its

own RF shielding: consequently, each new host will require a reassessment of the radiated spurious emissions, and the ISED will have

to be notified with a Class IV Permissive Change.

In the case of the BGM220S22A, this variant is a shielded design, and consequently comes with a full modular approval.

End Product Labeling

The BGM220S modules are not labeled with their own IC ID due to their size. Instead, the packaging label contains the IC ID. In all

cases when the IC ID is not visible when the module is installed inside another device, then the outside of the device into which the

module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a

visible area with the following:

For BGM220S12A

“

Contains Transmitter Module IC: 5123A-BGM220S

”

“

Contains IC: 5123A-BGM220S”

For BGM220S22A

“

Contains Transmitter Module IC: 5123A-BGM220S2

”

“

Contains IC: 5123A-BGM220S2”

silabs.com

| Building a more connected world.

Rev. 1.0

| 49

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Certifications

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or

change RF related parameters in the user manual of the end product.

Final note:

As long as all the conditions above are met, further RF testing of the transmitter with full modular approval is not required.

However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with

this module installed (for example, digital device emissions, PC peripheral requirements, etc.).

CAN ICES-003 (B) – BGM220S22A Only

This Class B digital apparatus complies with Canadian ICES-003.

silabs.com

| Building a more connected world.

Rev. 1.0

| 50

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Certifications

ISEDC (Français)

Le présent émetteur radio (IC: 5123A-BGM220S pour le BGM220S12A and IC: 5123A-BGM220S2 pour le BGM220S22A) a été appro-

uvé par Innovation, Sciences et Développement Économique Canada (ISED Canada, anciennement Industrie Canada) pour fonction-

ner avec l’antenne intégrée et le ou les types d’antenne énumérés à la section

11.1.1 Qualified Antennas

, avec le gain maximal admis-

sible indiqué. Les types d’antenne non inclus dans cette liste, ayant un gainsupérieur au gain maximal indiqué, sont strictement interdits

d’utilisation avec cet appareil. .

Ce composant est conforme aux normes RSS, exonérées de licence d’ISED. Son mode de fonctionnement est soumis aux deux condi-

tions suivantes:

1. Ce composant ne doit pas générer d’interférences.

2. Ce composant doit pouvoir être soumis à tout type de perturbation y compris celle pouvant nuire à son bon fonctionnement.

Déclaration d’exposition RF

L’exception tirée des limites courantes d’évaluation SAR est donnée dans le document RSS-102 Issue 5.

Pour le cas d’utilisation Portable, l’exposition RF ou l’évaluation SAR n’est pas nécessaire dans tous les cas, à n’importe quelle dis-

tance du corps humain, sauf lorsque le BGM220S22A est utilisé à pleine puissance avec l’antenne dipôle de référence externe, auquel

cas la distance de séparation du le corps humain doit être de 13 mm ou plus pour l’exemption.

Pour plus de détails, reportez-vous aux valeurs indiquées dans

Table 11.2 Minimum Separation Distances for SAR Evaluation Exemp-

tion (BGM220S12A) on page 52

Table 11.3 Minimum Separation Distances for SAR Evaluation Exemption (BGM220S22A) on

page 52

: si les distances de séparation du corps humain sont inférieures aux distances mentionnées dans les tableaux, alors l’inté-

grateur OEM est responsable de l’évaluation du SAR.

Le module répond aux exigences des cas d’utilisation mobile lorsque la distance de séparation minimale du corps humain est de 20 cm

ou plus, conformément aux limites exposées dans l’analyse d’exposition RF.

Responsabilités des OEM pour une mise en conformité avec le Règlement du Circuit Intégré

Le module a été approuvé pour l’intégration dans des produits finaux exclusivement réalisés par des OEM sous les conditions sui-

vantes:

• L’antenne

doit être installée de sorte qu’une distance de séparation minimale indiquée ci-dessus soit maintenue entre le radiateur

(antenne) et toutes les personnes avoisinante, ce à tout moment.

• Le

module émetteur ne doit pas être localisé ou fonctionner avec une autre antenne ou un autre transmetteur que celle indiquée

plus haut.

Tant que les deux conditions ci-dessus sont respectées, il n’est pas nécessaire de tester ce transmetteur de façon plus poussée. Ce-

pendant, il incombe à l’intégrateur OEM de s’assurer de la bonne conformité du produit fini avec les autres normes auxquelles il pour-

rait être soumis de fait de l’utilisation de ce module (par exemple, les émissions des périphériques numériques, les exigences de pé-

riphériques PC, etc.).

Remarque Importante:

Dans le cas où ces conditions ne peuvent être satisfaites (pour certaines configurations ou co-implantation

avec un autre émetteur), l’autorisation ISED n’est plus considérée comme valide et le numéro d’identification ID IC ne peut pas être

apposé sur le produit final. Dans ces circonstances, l’intégrateur OEM sera responsable de la réévaluation du produit final (y compris le

transmetteur) et de l’obtention d’une autorisation ISED distincte.

Dans le cas du BGM220S12A, l’approbation de cette variante est limitée car la partie radio du module n’est pas incluse dans son

propre blindage RF: par conséquent, chaque nouvel hôte est requis dans tous les cas pour réévaluer les émissions rayonnées et le

bureau doit être informé par un C4PC.

Dans le cas du BGM220S22A, cette variante est une conception blindée et est par conséquent livrée avec une approbation modulaire

complète.

Étiquetage des produits finis

Les modules BGM220S ne sont pas étiquetés avec leur propre ID IC en raison de leur taille. Au lieu de cela, l’étiquette d’emballage

contient l’ID IC. Dans tous les cas, lorsque l’ID IC n’est pas visible lorsque le module est intégré au sein d’un autre produit, cet autre

produit dans lequel le module est installé devra porter une étiquette faisant apparaitre les référence du module intégré. Dans un tel cas,

sur le produit final doit se trouver une étiquette aisément lisible sur laquelle figurent les informations suivantes:

Pour le BGM220S12A

“

Contient le module transmetteur: 5123A-BGM220S

”

“

Contient le circuit: 5123A-BGM220S”

silabs.com

| Building a more connected world.

Rev. 1.0

| 51

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Certifications

Pour le BGM220S12A

“

Contient le module transmetteur: 5123A-BGM220S2

”

“

Contient le circuit: 5123A-BGM220S2”

Note finale:

L’intégrateur OEM doit être conscient qu’il ne doit pas fournir, dans le manuel d’utilisation, d’informations relatives à la

façon d’installer ou de d’enlever ce module RF ainsi que sur la procédure à suivre pour modifier les paramètres liés à la radio.

CAN ICES-003 (B) – BGM220S22A uniquement

Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.

11.1.5 Proximity

to Human Body

When using the BGM220S modules in an application where the radio is located close to the human body, the human RF exposure must

be taken into account. FCC, ISED, and CE all have different standards and rules for evaluating the RF exposure. In particular, each

regulator has different requirements when it comes to the exemption from having to perform RF exposure and SAR (Specific Absorption

Rate) measurements, and the minimum separation distances between the module and human body varies accordingly. The properties

of the BGM220S modules allows for the minimum separation distances detailed in the tables below for SAR evaluation exemption in

portable use cases (less than 20 cm from human body). The module is approved for the Mobile use case (more than 20 cm) without

any need for RF Exposure evaluation.

Table 11.2.

Minimum Separation Distances for SAR Evaluation Exemption (BGM220S12A)

Certification

FCC

BGM220S12A

0 mm

ISED

The RF exposure must always be evaluated using the end-product when transmitting with power

levels higher than 20 mW (13 dBm).

Table 11.3.

Minimum Separation Distances for SAR Evaluation Exemption (BGM220S22A)

Certification

FCC

BGM220S22A

0 mm

ISED

13 mm with the reference external antenna

12 mm for integral antenna

The RF exposure must always be evaluated using the end-product when transmitting with power

levels higher than 20 mW (13 dBm).

For FCC and ISED, using the module in end-products where the separation distance from the human body is smaller than that listed

above is allowed but requires evaluation of the RF exposure in the final assembly and applying for a

Class 2 Permissive Change

Change of ID

to be applied to the existing FCC/ISED approvals of the module. For CE, RF exposure must be evaluated using the end-

product in all cases when transmitting at more than the power level indicated in the table.

Note:

Placing the module in touch or very close to the human body will have a negative impact on the efficiency of the antenna thus a

reduced range is to be expected.

silabs.com

| Building a more connected world.

Rev. 1.0

| 52

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Certifications

11.1.6 Japan

– MIC

The BGM22S12A are certified in Japan with certification number 203-JN1080.

The BGM22S22A are certified in Japan with certification number 209-J00429.

It is the end-product manufacturer’s responsibility to ensure that the module is configured to meet the limits documented in the formal

certification test report available at

https://www.silabs.com/

. If needed, refer to the API reference manual(s) to learn how to configure

the maximum RF TX power for the normal operations.

Since September 1, 2014 it is allowed (and highly recommended) that a manufacturer who integrates a radio module in their host

equipment places the certification mark and certification number on the outside of the host equipment. This combination of mark and

number, and their relative placement, is depicted in figure 11.1, and depending on the size of the module it might also appear on the top

shield markings of the radio module. The certification mark and certification number must be placed close to the text in the Japanese

language which is provided below. This change in the Radio Law has been made in order to enable users of the combination of host

and radio module to verify if they are actually using a radio device which is approved for use in Japan

Certification Text to be Placed on the Outside Surface of the Host Equipment:

Translation of the text:

“This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under

the Radio Law.”

The “Giteki” marking shown in the figures below must be affixed to an easily noticeable section of the specified radio equipment.

Note that additional information may be required if the device is also subject to a telecom approval.

Figure 11.1.

GITEKI Mark and ID (BGM220S12A)

Figure 11.2.

GITEKI Mark and ID (BGM220S22A)

silabs.com

| Building a more connected world.

Rev. 1.0

| 53

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Certifications

Figure 11.3.

GITEKI Mark

11.1.7 South

Korea – KC

The BGM220S22A modules have a RF certification for import and use in South-Korea.

Certification number is: R-R-BGT-BGM220S2

When integrating the RF-certified module, an end-product is exempted from doing the RF emission testing, as long as the recommen-

ded design guidance is followed, and the approved antennas are used.

EMC testing, and any other relevant test, might still be required for full compliance.

11.2 Standards-Based

Certifications

11.2.1 Bluetooth

Qualification

The BGM220S modules come at launch with a pre-qualified Bluetooth Low Energy RF-PHY Tested Component having Declaration ID

of D044526 and QDID of 155407, and having a listing date of 2020-09-04.

Because the validity set by the SIG for Tested Components is currently of 3 years, during the product lifetime Silicon Labs will renew

this Component as it expires, whenever applicable. Renewed Tested Components will come with new DIDs and QDIDs, and these will

be then referred to in end-product listings. Such new DIDs and QDIDs can be discovered starting from the original ones.

This module’s RF-PHY Tested Component should be combined with the latest Wireless Gecko Link Layer and Host pre-qualified Com-

ponents by Silicon Labs, when in the process of qualifying an end-product embedding the BGM220S via the SIG’s Launch Studio.

silabs.com

| Building a more connected world.

Rev. 1.0

| 54

BGM220S Wireless Gecko Bluetooth

Module Data Sheet

Revision History

12. Revision

History

Revision 1.0

September, 2020

• Various

wording updates to

11.1 Regulatory Certifications

to introduce BGM220S22A model.

• Updated

wording for

11.2.1 Bluetooth Qualification

Revision 0.7

July, 2020

• Updated

2. Ordering Information

with devices for model BGM220S22A.

• Added

Table 3.2 Antenna Efficiency and Peak Gain (BGM220S22A) on page 7

for model BGM220S22A.

• Updated

4. Electrical Characteristics

with additional specifications for model BGM220S22A and latest characterization data.

• Added

Figure 4.4

BGM220S22A Typical 2D Antenna Radiation Patterns on 55 mm x 20 mm board on page 23

for model

BGM220S22A.

• Updated

7. Design Guidelines

with guidelines and information covering model BGM220S22A.

• Added

marking information for model BGM220S22A to

Table 8.3 Top Marking Definition on page 42

• Added

section to note pending certification for model BGM220S22A.

Revision 0.6

June, 2020

• Updated

4.2.1 DC-DC Operating Limits

to relax lifetime safe operating region.

• Updated

5. Reference Diagrams

to mark PTI interface as recommended in figures.

• Updated

4. Electrical Characteristics

with latest characterization results and limits.

• Updated

11. Certifications

with additional certification details.

Revision 0.5

March, 2019

• In

the front page block diagram, updated the lowest energy mode for LETIMER.

• Updated

part numbers in

2. Ordering Information

to reflect new ordering code scheme.

• In

2. Ordering Information

, added note about referencing by family, model, or ordering code.

• Added

4.13 Precision Low Frequency RC Oscillator (LFRCO)

• Added

supply voltage, crystal frequencies and RF frequencies to

Figure 3.1 BGM220S Block Diagram on page 6

• Updated

4. Electrical Characteristics

with latest characterization details.

• Updated

5. Reference Diagrams

• Added

section

11. Certifications

• Added

section

5. Reference Diagrams

• Added

section

10. Tape and Reel

Revision 0.1

September, 2019

Initial release.

silabs.com

| Building a more connected world.

Rev. 1.0

| 55

Simplicity Studio

One-click access to MCU and wireless

tools, documentation, software, source

code libraries & more. Available for

Windows, Mac and Linux!

IoT Portfolio

www.silabs.com/IoT

SW/HW

www.silabs.com/simplicity

Quality

www.silabs.com/quality

Support & Community

www.silabs.com/community

Disclaimer

Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or

intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and “Typical”

parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes

without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information.

Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons.

Such changes will not alter the specifications or

the performance of the product.

Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly

grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA

premarket approval is required, or Life Support Systems without the specific written consent of Silicon Labs. A “Life Support System” is any product or system intended to support or

sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military

applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or

missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of

a Silicon Labs product in such unauthorized applications.

Trademark Information

Silicon Laboratories Inc.®, Silicon Laboratories®, Silicon Labs®, SiLabs® and the Silicon Labs logo®, Bluegiga®, Bluegiga Logo®, ClockBuilder®, CMEMS®, DSPLL®, EFM®,

EFM32®, EFR, Ember®, Energy Micro, Energy Micro logo and combinations thereof, “the world’s most energy friendly microcontrollers”, Ember®, EZLink®, EZRadio®, EZRadioPRO®,

Gecko®, Gecko OS, Gecko OS Studio, ISOmodem®, Precision32®, ProSLIC®, Simplicity Studio®, SiPHY®, Telegesis, the Telegesis Logo®, USBXpress®, Zentri, the Zentri logo and

Zentri DMS,

Z-Wave®, and others are trademarks or registered trademarks of Silicon Labs.

ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM

Holdings. Keil is a registered trademark of ARM Limited. Wi-Fi is a registered trademark of the Wi-Fi Alliance.

All other products or brand names mentioned herein are trademarks of

their respective holders.

Silicon Laboratories Inc.

400 West Cesar Chavez

SKYWORKS-SILICON-LABS-BGM220SC12WGA2R

Related Posts

CUI-CPE-171

DB-Unlimited-TP243408-1

DB-Unlimited-TE054003-2