Slkor-SLKORMICRO-Elec–SL4N65F
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SL4N65
N-CHANNEL MOSFET
主要参数
MAIN CHARACTERISTICS
4A
I
D
650V
2.6Ω
18nC
V
DSS
DS(ON)
(
V
GS
=10V
)
Q
G
R
用途
APPLICATIONS
高频开关电源
电子整流器
LED
电源
High efficiency switch mode power supplies
Electronic lamp ballasts based on half bridge
LED power supplies
产品特性
FEATURES
低栅极电荷
1 Gate
Low gate charge
Low C
RSS
(typical 50pF)
Fast switching
低
C
RSS
(
典型值
50pF)
开关速度快
2 Drain
3 Source
100%
雪崩测试
高抗
dv/dt
能力
RoHS
产品
100% avalanche tested
Improved dv/dt capability
RoHS product
订货信息
ORDER MESSAGE
订货型号
印记
封装
无卤素
包装
器件重量
Order codes
Marking
Package
Halogen Free
Packaging
Device Weight
SL4N65F
SL4N65F
TO-220FT
IPAK
否
NO
否
NO
否
NO
条管
Tube
条管
Tube
条管
Tube
2.2g(typ)
0.35g(typ)
0.3g(typ)
SL4N65I
SL4N65I
SL4N65D
DPAK
SL4N65D
1
SL4N65
绝对值
ABSOLUTE RATINGS
(T
C
=25
℃
,unless otherwise specified)
数值
Ratings
项目
Parameter
符号
Symbol
单位
Unit
IPAK
DPAK
650
TO-220FT
漏极-源极击穿电压
Drain-Source Breakdown Voltage
V
DSS
I
D
V
4
*
A
A
T
C
=25
℃
T
C
=100°
℃
漏极连续电流
Continuous Drain Current
2.5
*
漏极脉冲电流(注
1
)
Drain Current pulsed
(
note 1
)
最高栅源电压
I
DM
V
GSS
E
AS
16
*
±30
184
15
A
V
Gate-Source Voltage
单脉冲雪崩能量(注
2
)
mJ
mJ
V/ns
Single Pulsed Avalanche Energy
(
note 2
)
重复雪崩能量(注
1
)
Repetitive Avalanche Current
(
note 1
)
二极管反向恢复最大电压变化速率(注
3
)
Peak Diode Recovery dv/dt
(
note 3
)
E
AR
dv/dt
5
T
C
=25
℃
157.1
1.26
144.4
1.15
23.3
0.19
W
耗散功率
P
D
Total Power Dissipation
Derate above 25
℃
W/
℃
最高结温
℃
℃
℃
T
J
T
STG
T
L
150
-55
~
+150
300
Operating Junction Temperature
存储温度
Storage Temperature
焊接温度
Maximum Temperature for Soldering Leads
*
漏极电流由最高结温限制。
* Drain current is limited by junction temperature.
电特性
ELECTRICAL CHARACTERISTICS
(
T
J
=25
℃
,unless otherwise specified
)
项目
符号
测试条件
最小值
典型值
最大值
单位
Parameter
Symbol
Test conditions
Min
Typ
Max
Unit
断态特性
Off Characteristics
漏-源击穿电压
BV
DSS
I
D
=250
μ
A, V
GS
=0V
650
–
–
–
–
V
Drain-Source Breakdown Voltage
击穿电压温度特性
I
D
=250
μ
A,
referenced to 25
℃
V/
℃
ΔBV
DSS
/ΔT
J
0.48
Breakdown Voltage Temperature
Coefficient
V
DS
=650V,V
GS
=0V
V
DS
=520V,T
C
=125
℃
V
DS
=0V,V
GS
=30V
–
–
–
–
–
–
1
μA
μA
nA
漏源极漏电流
I
DSS
Drain-Source leakage Current
50
栅源极漏电流
正向
Forward
100
I
GSS
Gate-Source
leakage current
反向
Reverse
V
DS
=0V,V
GS
=-30V
–
–
-100
nA
2
SL4N65
项目
Parameter
符号
Symbol
测试条件
Test conditions
最小值 典型值
Typ
最大值
单位
Unit
Min
Max
通态特性
On Characteristics
阈值电压
Gate Threshold Voltage
V
GS(th)
R
DS(ON)
g
FS
V
DS
=V
GS
,
I
D
=250μA
V
GS
=10V,I
D
=2A
2.5
–
–
2
–
4.5
2.6
–
V
Ω
S
静态导通电阻
Static Drain-Source On-Resistance
正向跨导
Forward Transconductance
V
DS
=30V,I
D
=2A(note 4)
3.5
动态特性
Dynamic Characteristics
输入电容
C
ISS
C
OSS
C
RSS
–
–
–
531
60
–
–
–
Input capacitance
输出电容
V
DS
=25V,V
GS
=0V,
pF
f=1MH
B
Z
B
Output capacitance
反向传输电容
50
Reverse transfer capacitance
开关特性
Switching Characteristics
导通延迟时间
Turn on delay time
上升时间
t
d(ON)
t
r
t
d(off)
t
f
–
–
–
–
–
–
–
11
26
42
27
18
3
–
–
–
–
–
–
–
V
DD
=325V,I
D
=4A,
R
G
=25Ω
(
note 4
,
5
)
Rise time
ns
关断延迟时间
Turn off delay time
下降时间
Fall time
栅极电荷总量
Total Gate Charge
栅-源电荷
Gate-Source charge
栅-漏电荷
Q
G
Q
GS
Q
GD
V
DS
=520V,I
D
=4A,
V
GS
=10V
(
note 4
,
5
)
nC
9
Gate-Drain charge
源
–
漏二极管特性
Source-Drain Diode Characteristics
正向连续电流
Continuous Forward Current
I
S
–
–
–
–
–
–
–
4
16
1.5
–
A
A
正向脉冲电流
Pulsed Forward Current
I
SM
V
SD
正向压降
Forward Voltage
V
GS
=0V,I
S
=4A
–
V
反向恢复时间
Reverse recovery time
t
rr
229
1.6
ns
μC
V
GS
=0V,I
S
=4A,
dI
F
/dt=100A/
μ
s
(note 4)
反向恢复电荷
Reverse recovery charge
Q
rr
–
3
SL4N65
热特性
THERMAL CHARACTERISTICS
最大值
Max
项目
Parameter
符号
Symbol
单位
Unit
IPAK
0.8
DPAK
0.87
TO-220FT
结到管壳的热阻
Thermal Resistance,Junction to Case
℃
/W
℃
/W
R
th(j-c)
5.36
48.7
结到环境的热阻
Thermal Resistance,Junction to Ambient
R
th(j-a)
81.4
79.6
Notes:
注:
1:Pulse width limited by maximum junction temperature
2:L=22.8mH, I
AS
=4A, V
DD
=50V, R
G
=25 Ω,Starting
T
J
=25
℃
1:脉冲宽度由最高结温限制
2:L=22.8mH, I
AS
=4A, V
DD
=50V, R
G
=25
Ω
,起始结
温 T
J
=25℃
3:I
SD
≤4A,di/dt ≤100A/μs,V
DD
≤BV
DSS
, Starting
T
J
=25
℃
3:I
SD
≤4A,di/dt ≤100A/μs,V
DD
≤BV
DSS
,起始结温
T
J
=25℃
4:Pulse Test:Pulse Width ≤300μs,Duty Cycle≤2
%
5:Essentially independent of operating temperature
4:脉冲测试:脉冲宽度≤300μs,占空比≤2%
5:基本与工作温度无关
4
SL4N65
特征曲线
TYPICAL CHARACTERISTICS
(curves)
Fig.2. On-resistance variation vs.
drain current and gate voltage
Fig.1. On-state Characteristics
Fig.4. On state current vs.
Diode forward voltage
Fig.3. Gate charge characteristics
Fig.5. Breakdown voltage variation vs.
Junction temperation
Fig.6. On resistance variation vs.
Junction temperature
5
SL4N65
Fig.7. Maximum safe operating
area(TO-220FT)
Fig.8. Transient thermal response
curve(TO-220FT)
Fig.9. Maximum safe operating area(IPAK)
Fig.10. Transient thermal response
curve(IPAK)
Fig.11. Maximum safe operating
area(DPAK)
Fig.12. Transient thermal response
curve(DPAK)
6
SL4N65
Fig.13. Capacitance characteristics
Fig.14. Gate charge test circuit & waveform
Fig.15. Switching time test circuit & waveform
7
SL4N65
Fig.16. Unclamped inductive switching test circuit & waveform
Fig.17. Peak diode recovery dv/dt test circuit & waveform
8
