SMC-Sangdest-Microelectronicstronic–Nanjing-S2M0016120D

Part #SMC-Sangdest-Microelectronicstronic–Nanjing-S2M0016120D
Download 
SMC-Sangdest-Microelectronicstronic–Nanjing-S2M0016120D
S2M0016120D  
Technical Data  
Data Sheet N2538, REV.-  
S2M0016120D  
1200V SIC POWER MOSFET  
Description  
S2M0016120D is single SiC Power MOSFET packaged in  
TO-247AD case.
 
The device is a high voltage n-channel  
enhancement mode MOSFET that has very low total  
conduction losses and very stable switching  
V

DS

= 1200 V  
I

DS

= 140 A  
characteristics over temperature extremes. The  
S2M0016120D is ideal for energy sensitive, high  
frequency applications in challenging environments.  
R

DS

(on) = 16 m
Ω
 
Features  
Circuit Diagram  
•
Positive temperature characteristics, easy to parallel.  
•
Low on-resistance Typ. RDS(on) = 16m
Ω
.  
•
Fast switching speed and low switching losses.  
•
Very fast and robust intrinsic body diode.  
•
Process of non-bright Tin electroplatin  
Applications  
•
EV Fast Charging Modules  
•
EV On Board Chargers  
•
Solar Inverters  
•
Online UPS/Industrial UPS  
•
SMPS (Switch Mode Power Supplies)  
•
DC-DC Converters  
•
ESS (Energy Storage Systems)  
Maximum Ratings(T=25
℃
unless otherwise specified)  
Characteristics  
Drain Source Voltage  
Gate Source Voltage  
Sym
bol  
V

DSS  

Condition  
Max.  
1200  
Units  
V
V
V

GS

= 0V, I

DS

= 100uA, T

C

= 25
C  
V

GSS  

-10 to +25  
T

C

= 25
 
C, Absolute maximum values, AC  
(f>1Hz)  
Gate Source Voltage  
V

GSOP  

-5 to +20  
V
T

C

= 25
C Recommended Operational Values  
Continuous Drain Current  
I

D  

I

D  

140  
100  
314  
714  
A
A
V

GS

= 20V,
 
T

C

= 25
C  
V

GS

= 20V,
 
T

C

= 100
C  
T

C

=25˚C  
Pulsed Drain Current  
Power Dissipation  
I

D,pulse  

P

D  

A
T

C

=25˚C  
W
China – Germany – Korea – Singapore – United
 
States
  

S2M0016120D  
Technical Data  
Data Sheet N2538, REV.-  
Electrical Characteristics(T=25
℃
unless otherwise specified)  
Unit  
Characteristics  
Symbol  
Condition  
Min.  
Typ.  
Max.  
s
Drain Source Breakdown Voltage
 
V

(BR)DSS  

V

GS

= 0V, I

D

= 100uA  
1200  
1.8  
V
V

DS

= V

GS

, I

D

= 23mA  
2.3  
1.5  
2
3.6  
V
V
Gate Threshold Voltage  
V

GS(th)  

V

DS

= V

GS

, I

D

= 23mA, T

J

= 175
C  
V

DS

= 1200V, V

GS

= 0V  
V

GS

= 20V, V

DS

= 0V  
Zero Gate Voltage Drain Current  
Gate Source Leakage Current  
I

DSS  

I

GSS  

50  
uA  
nA  
mΩ  
mΩ  
mΩ  
mΩ  
S
10  
250  
22.3  
V

GS

= 20V, I

D

= 75A  
11.2  
16  
V

GS

= 15V, I

D

= 75A  
23  
Drain Source On-State  
Resistance  
R

DS(on)  

29  
V

GS

= 20V, I

D

= 75A, T

J

= 175
C  
V

GS

= 15V, I

D

= 75A, T

J

= 175
C  
V

DS

= 20 V, I

D

= 75 A  
30.5  
45  
Transconductance  
Input Capacitance  
gfs  
40  
S
V

DS

= 20 V, I

D

= 75 A,
 
T

J

= 175
C  
V

GS

= 0V,  
6680  
C

ISS  

C

OSS  

C

RSS  

E

OSS  

E

ON  

361  
32  
V

DS

= 1000V  
Output Capacitance  
pF  
uJ  
V

AC

= 25mV  
Reverse Transfer Capacitance  
C

OSS

Stored Energy  
204  
f = 200kHz  
V

DS

= 800V, V

GS

= -5/+20V  
ID =75A, RG(ext)=2.5Ω  
Turn-On Switching Energy  
0.92  
0.78  
L=65.7uH  
, T
 
= 175
 
C  
J
mJ  
ns  
Turn-Off Switching Energy  
E

OFF  

FWD= Internal
 
Body Diode of  
MOSFET  
Turn-On Delay Time  
Rise Time  
t

d(on)  

t

r  

t

d(off)  

t

f  

V

DS

= 800V, V

GS

= -5/20V  
20  
29  
I

D

= 75A, R

G(ext)

= 2.5Ω, L=67.5uH  
Inductive Load Timing relative to  
VDS Per IEC60747-8-4 pg 83  
Turn-Off Delay Time  
Fall Time  
52  
19  
Internal Gate Resistance  
Gate to Source Charge  
Gate to Drain Charge  
Total Gate Charge  
R

G(int)  

Q

gs  

Q

gd  

Q

g  

f = 1MHz, VAC = 25 mV, D-S short  
V

DS

= 800V, V

GS

= -4/15V  
I

D

= 75A  
2.0  
78  
Ω
73  
nC  
224  
China – Germany – Korea – Singapore – United
 
States
  

S2M0016120D  
Technical Data  
Data Sheet N2538, REV.-  
Reverse Diode Characteristics:  
Characteristics  
Symbol  
Condition  
V

GS

= -5V, I

SD

= 37.5A  
Typ.  
Max.  
Units  
3.4  
Diode Forward Voltage  
V

SD  

V
V
V

GS

= -5V, I

SD

= 37.5A, T

J

= 175°C  
3.0  
V

SD  

I

S  

Continuous Diode Forward Current  
Reverse Recovery Time  
157  
V

GS

= -5V, T

C

= 25
℃
 
A
t

rr  

37  
1.2  
53  
V

GS

= -5V, I

SD

= 75A, T

J

= 175°C  
V

R

= 800V  
ns  
Reverse Recovery Charge  
Q

rr  

μ
C  
Peak Reverse
 
Recovery Current  
I

mm  

dif/dt= 4000A/µs  
A
Thermal-Mechanical Specifications:  
Characteristics  
Junction Temperature  
Symbol  
T

J  

Condition  
Specification Units  
–
-55 to +175  
-55 to +175  
0.21  
C  
C  
Storage Temperature  
T

stg  

–
Typical Thermal Resistance Junction to Case  
Typical Thermal Resistance Junction to Ambient  
DC operation  
R

JC  

R

JA  

C/W  
C/W  
32  
Ordering Information:  
Device  
Package  
TO-247AD  
Shipping  
S2M0016120D  
25pcs/tube  
Marking Diagram  
Where XXXXX is YYWWL  
S2M  
0016  
120  
D
= Device Type  
= R

DS

(on)  
= Reverse Voltage (1200V)  
= Package  
SSG  
YY  
= SSG  
= Year  
WW  
L
= Week  
= Lot Number  
Cautions
:
Molding resin  
Epoxy resin UL:94V-0  
China – Germany – Korea – Singapore – United
 
States
  

S2M0016120D  
Technical Data  
Data Sheet N2538, REV.-  
Ratings and Characteristics Curves  
Figure 2. Output Characteristics T

J

= 25
º
C  
Figure 1. Output Characteristics T

J

= -55
º
C  
Figure 4. Normalized On-Resistance vs. Temperature  
Figure 3. Output Characteristics T

J

= 175
º
C  
Figure 6. On-Resistance vs. Temperature  
For Various Gate Voltage  
Figure 5. On-Resistance vs. Drain Current  
For Various Temperatures  
China – Germany – Korea – Singapore – United
 
States
  

S2M0016120D  
Technical Data  
Data Sheet N2538, REV.-  
Figure 7. Transfer Characteristic for  
Various Junction Temperatures  
Figure 8. Body Diode Characteristic at T

J

= -55
º
C  
Figure 10. Body Diode Characteristic at T

J

= 175
º
C  
Figure 9. Body Diode Characteristic at T

J

= 25
º
C  
Figure 11. Threshold Voltage vs. Temperature  
Figure 12. Gate Charge Characteristic  
China – Germany – Korea – Singapore – United
 
States
  

S2M0016120D  
Technical Data  
Data Sheet N2538, REV.-  
Figure 14. 3rd Quadrant Characteristic at T

J

= 25
º
C  
Figure 13. 3rd Quadrant Characteristic at T

J

= -55
º
C  
Figure 15. 3rd Quadrant Characteristic at T

J

= 175
º
C  
Figure 16. Output Capacitor Stored Energy  
Figure 18. Capacitances vs. Drain-Source  
Voltage (0 – 1000V)  
Figure 17. Capacitances vs. Drain-Source  
Voltage (0 – 200V)  
China – Germany – Korea – Singapore – United
 
States
  

S2M0016120D  
Technical Data  
Data Sheet N2538, REV.-  
Figure 20. Maximum Power Dissipation Derating vs. Case  
Temperature  
Figure 19. Continuous Drain Current Derating vs.  
Case Temperature  
Figure 21. Transient Thermal Impedance (Junction – Case)  
Figure 22. Safe Operating Area  
Figure 24. Clamped Inductive Switching Energy vs. Drain  
Current (V

DD

= 800V)  
Figure 23. Clamped Inductive Switching Energy vs. Drain  
Current (V

DD

= 600V)  
China – Germany – Korea – Singapore – United
 
States
  

S2M0016120D  
Technical Data  
Data Sheet N2538, REV.-  
Figure 26. Clamped Inductive Switching Energy vs.  
Temperature  
Figure 25. Clamped Inductive Switching Energy vs. R

G(ext)  

Figure 27. Switching Times vs. R

G(ext)  

Figure 28. Switching Times Definition  
China – Germany – Korea – Singapore – United
 
States
  

S2M0016120D  
Technical Data  
Data Sheet N2538, REV.-  
Mechanical Dimensions TO-247AD  
Millimeters  
SYMBOL  
MIN.  
TYP.  
MAX.  
A
A1  
A2  
b
b1  
b2  
c
4.80  
2.00  
1.90  
1.00  
1.80  
2.80  
0.40  
5.20  
2.75  
2.10  
1.40  
2.40  
3.40  
0.75  
D
D1  
D2  
E
19.80  
21.20  
16.55  
1.20  
15.20  
16.00  
E1  
E2  
E3  
e
L
L1  
P
P1  
P2  
Q
13.30  
5.00  
2.50  
5.20  
13.90  
3.70  
3.50  
7.1  
5.70  
20.70  
4.30  
3.70  
7.40  
2.50  
5.80  
S
6.05  
6.25  
T
U
10.00  
6.20  
China – Germany – Korea – Singapore – United
 
States
  

S2M0016120D  
Technical Data  
Data Sheet N2538, REV.-  
DISCLAIMER:  
1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product  
characteristics. Before ordering, purchasers are advised to contact the SMC Diode Solutions sales department for the latest version of  
the datasheet(s).  
2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,  
medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by  
means of users’ fail-safe precautions or other arrangement .  
3- In no event shall
SMC Diode Solutions
be liable for any damages that may result from an accident or any other cause during  
operation of the user’s units according to the datasheet(s).
SMC Diode Solution
assumes no responsibility for any intellectual property  
claims or any other problems that may result from applications of information, products or circuits described in the datasheets.  
4- In no event shall
SMC Diode Solutions
be liable for any failure in a semiconductor device or any secondary damage resulting from use  
at a value exceeding the absolute maximum rating.  
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or
SMC Diode Solutions
.  
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of
SMC  
Diode Solutions
.  
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will  
hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third  
party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and  
regulations..  
China – Germany – Korea – Singapore – United
 
States
