ST-Semtech-2SD2391U
| Part # | ST-Semtech-2SD2391U |
Download  | ST-Semtech-2SD2391U |
2SD2391U
NPN Silicon Epitaxial Planar Transistor
Absolute Maximum Ratings (T
a
= 25
℃
)
Parameter
Symbol
V
CBO
V
CEO
V
EBO
I
C
Value
Unit
V
Collector Base Voltage
Collector Emitter Voltage
Emitter Base Voltage
60
60
6
V
V
Collector Current
2
A
Peak Collector Current (P
W
= 10 ms)
I
CP
6
A
0.5
1)
P
tot
W
Total Power Dissipation
2
2)
Junction Temperature
T
j
150
℃
℃
Storage Temperature Range
T
stg
– 55 to + 150
Thermal Characteristics
Parameter
Symbol
R
θJA
Max.
Unit
250
1)
Thermal Resistance from Junction to Ambient
62.5
2)
℃
/W
1)
Device mounted on FR-4 substrate PC board, with minimum recommended pad layout.
2)
Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate.
1 / 5
®
Dated: 20/09/2022 Rev: 04
2SD2391U
Characteristics at T
a
= 25
℃
Parameter
Symbol
Min.
Typ.
Max.
Unit
DC Current Gain
at V
CE
= 2 V, I
C
= 500 mA
at V
CE
= 2 V, I
C
= 1.5 A
h
FE
h
FE
120
45
–
–
270
–
–
–
Collector Base Cutoff Current
at V
CB
= 50 V
I
CBO
I
EBO
–
–
–
100
nA
nA
V
Emitter Base Cutoff Current
at V
EB
= 5 V
–
100
Collector Base Breakdown Voltage
at I
C
= 50 μA
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
V
CE(sat)
f
T
60
60
6
–
–
–
–
Collector Emitter Breakdown Voltage
at I
C
= 1 mA
–
V
Emitter Base Breakdown Voltage
at I
E
= 50 μA
–
–
V
Collector Emitter Saturation Voltage
at I
C
= 1 A, I
B
= 50 mA
–
0.35
V
Transition Frequency
at V
CE
= 2 V, -I
E
= 500 mA, f = 100 MHz
–
120
12
–
–
MHz
pF
Collector Output Capacitance
at V
CB
= 10 V, f = 1 MHz
C
ob
–
2 / 5
®
Dated: 20/09/2022 Rev: 04
2SD2391U
Electrical Characteristics Curves
Fig. 1 Output Characteristics Curve
Fig. 2 Collector Current vs. Base to Emitter Voltage
Fig. 4 V
BESAT
vs. Collector Current
Fig. 3 DC Current Gain vs. Collector Current
3 / 5
®
Dated: 20/09/2022 Rev: 04
2SD2391U
Electrical Characteristics Curves
Fig. 6 Output Capacitance
Fig. 5 V
CESAT
vs. Collector Current
Fig. 7 Power Derating Curve
2.4
2.0
Device mounted on FR-4
substrate PC board, 2oz
copper, with 1-inch square
copper plate layout
1.6
1.2
0.8
0.4
Device mounted on
FR-4 substrate PC
board, with minimum
recommended pad
0
0
25
100
125
50
75
150
( )
℃
Ta, Ambient Temperature
4 / 5
®
Dated: 20/09/2022 Rev: 04
2SD2391U
Package Outline (Dimensions in mm)
SOT-89
D
bp
E
L
HE
1
2
3
F
F
C
L1
e
e
A
Unit
mm
A
bp
C
D
E
F
HE
e
L
L1
1.6
1.4
1.60
1.50
0.5
0.3
4.6
4.4
2.6
2.4
0.45
0.35
4.25
3.75
1.5
typ.
1.05
0.95
0.51
0.41
1.8
Recommended Soldering Footprint
90°
90°
1.0
3.0
1.0
Packing information
Pitch
Reel Size
Tape Width
Package
Per Reel Packing Quantity
(mm)
mm
inch
mm
inch
7
178
330
1,000
4,000
SOT-89
12
8 ± 0.1
0.315 ± 0.004
13
Marking information
” 2SD2391U ” = Part No.
” YM ” = Date Code Marking
” Y ” = Year
2SD2391U
” M ” = Month
Font type: Arial
5 / 5
®
Dated: 20/09/2022 Rev: 04
