STMicroelectronics-BTB08-600BWRG
| Part # | STMicroelectronics-BTB08-600BWRG |
Download  | STMicroelectronics-BTB08-600BWRG |
BTA08, BTB08, T810
T835, T850
Datasheet
Snubberless™, logic level and standard 8 A Triacs
A2
A1
Features
•
•
•
On-state rms current, I
T(RMS)
8 A
G
Repetitive peak off-state voltage, V
DRM
/ V
RRM
600 V to 800 V
Triggering gate current, I
GT
5 to 50 mA
A2
Description
G
G
Available either in through-hole and surface-mount packages, these devices are
suitable for general purpose AC switching. They can be used as an ON/OFF function
in applications such as static relays, heating regulation, induction motor starting
circuits or for phase control operation in light dimmers and motor speed controllers,
etc.
A2
A2
A1
A1
TO-220AB
TO-220AB Ins.
A2
The Snubberless versions (BTA, BTB08_xxxxW and T8 series) are specially
recommended for use on inductive loads, thanks to their high commutation
performance.
G
A2
A1
D²PAK
A2
A2
Logic level versions are designed to interface directly with low power drivers such as
Microcontrollers.
G
A2
A1
By using an internal ceramic pad, the BTA series provide voltage insulated tab (rated
at 2500 V
RMS
) in compliance with UL standards (file ref.: E81734).
G
A2
A1
IPAK
DPAK
Product status link
DS2114
–
Rev 14
–
May 2018
For further information contact your local STMicroelectronics sales office.
BTA08, BTB08, T810, T835, T850
Characteristics
1
Characteristics
Table 1.
Absolute maximum ratings (T
j
= 25 °C unless otherwise stated)
Symbol
Parameter
IPAK, DPAK,TO-220AB, D²PAK
Value
Unit
T =
110 °C
c
I
RMS on-state current (full sine wave)
8
A
T(RMS)
T =
100 °C
c
TO-220AB Ins.
f = 50 Hz
t = 20 ms
80
84
36
Non repetitive surge peak on-state current (full
I
A
TSM
cycle, T
initial = 25 °C)
j
t =
16.7 ms
p
f = 60 Hz
2
2
2
t =
10 ms
p
I t
I t
value for fusing
A s
Critical rate of rise of on-state current I
= 2 x
G
T =
125 °C
j
dl/dt
f = 120 Hz
50
A/µs
I
, tr ≤ 100 ns
GT
I
t =
20 µs
p
T =
125 °C
Peak gate current
4
1
A
GM
j
P
T =
125 °C
j
Average gate power dissipation
Storage junction temperature range
Operating junction temperature range
W
G(AV)
T
-40 to +150
°C
-40 to +125
°C
stg
T
j
Table 2.
Electrical characteristics (T
j
= 25 °C, unless otherwise specified) Snubberless and logic level (3
quadrants)
T8
10 35
BTA08/BTB08
Symbol
Parameter
Quadrant
Unit
50
TW SW CW BW
I
I – II – III
I – II – III
I – II – III
Max. 10
35
Max.
50
5
10
35
50
mA
V
GT
V
V
= 12
V
, R
=
3
0 Ω
D
L
V
1.2
0.2
GT
V
= V
, R
= 3.3 kΩ, T
= 125 °C
Min.
V
GD
D
DRM
L
j
I =
100 mA
I
I – II – III
I – III
II
Max. 15
35
Max. 25
50
Max. 30
60
75
70
10
10
15
15
25
30
35
50
60
50
70
80
mA
T
H
I
I =
1.2 x I
G GT
mA
L
110
V
= 67% V
, gate open, T
= 125 °C
Max. 40 400 1000 20
40 400
1000 V/µs
3.5 5.4
1.5 2.98
D
DRM
j
(dV/dt)c = 0.1 V/µs, T
= 125 °C
Min. 5.4
Min. 2.8
Min.
j
(dV/dt)c = 10 V/µs, T
= 125 °C
A/ms
j
Without snubber, T
= 125 °C
4.5
7
4.5
7
j
1. Minimum
I is
guaranteed at 5 % of I
max.
GT
GT
2. For
both polarities of A2 referenced to A1
DS2114
–
Rev 14
page 2/21
BTA08, BTB08, T810, T835, T850
Characteristics
Table 3.
Standard (4 quadrants)
BTA08/BTB08
Symbol
Parameter
Quadrant
Unit
C
B
I – II – III
IV
25
50
50
I
Max.
mA
GT
V
V
= 12
V
, R
=
3
3 Ω
100
D
D
L
V
All
Max.
Min.
Max.
1.3
0.2
V
V
GT
V
= V
, R
= 33 Ω, T
= 125 °C
All
GD
DRM
L
j
I =
500 mA
T
I
I – II – III
I – III – IV
II
25
40
80
200
5
50
50
mA
H
I
I =
1.2 I
G GT
Max.
mA
L
100
400
10
V
= 67 % V
gate open, T
= 125 °C
Min.
Min.
V/µs
D
DRM
j
(dI/dt)c = 3.5 A/ms, T
= 125 °C
A/ms
j
1. Minimum
I is
guaranteed at 5 % of I
max.
GT
GT
2. For
both polarities of A2 referenced to A1
Table 4.
Static electrical characteristics
Test conditions
Symbol
Value
Unit
V
V
I
= 11 A, t
= 380 µs
T =
25 °C
j
Max.
Max.
Max.
Max.
Max.
1.55
0.85
50
5
TM
p
TM
V
T =
125 °C
threshold on-state voltage
Dynamic resistance
V
j
TO
T =
125 °C
j
R
D
mΩ
µA
mA
T =
25 °C
j
I
I
V
= V
DRM RRM
DRM RRM
T =
125 °C
j
1
1. For
both polarities of A2 referenced to A1
Table 5.
Thermal resistance
Parameter
Symbol
Value
Unit
IPAK / D2PAK / DPAK / TO-220AB
1.6
2.5
45
R
Max. junction to case thermal resistance (AC)
°C/W
th(j-c)
TO-220AB Insulated
D²PAK
S = 2 cm²
Junction to ambient (typ.)
S = 1 cm²
DPAK
70
R
°C/W
th(j-a)
TO-220AB / TO-220AB Insulated
IPAK
60
Junction to ambient (typ.)
100
1. S
= Copper surface under tab.
DS2114
–
Rev 14
page 3/21
BTA08, BTB08, T810, T835, T850
Characteristics (curves)
1.1
Characteristics (curves)
Figure 1.
Maximum power dissipation versus on-state
RMS current (full cycle)
Figure 2.
RMS on-state current versus temperature (full
cycle)
P(W)
I
(A)
T(RMS)
10
10
9
9
8
7
6
5
4
3
2
1
BTB/T8
8
BTA
7
6
5
4
3
2
1
T
(°C)
c
I
(A)
T
(RMS)
0
0
0
25
50
75
100
125
0
1
2
3
4
5
6
7
8
Figure 3.
RMS on-state current versus ambient
temperature (full cycle)
Figure 4.
Relative variation of thermal impedance versus
pulse duration
I
(A)
T(RMS)
K = [Z
/R
]
th th
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1E+0
1E-1
1E-2
1E-3
D²PAK
(S = 1 cm²)
Z
th(j-c)
Printed circuit board FR4, copper thickness: 35 µm
DPAK/IPAK
Z
th(j-a)
TO-220AB/D²PAK
Z
th(j-a)
DPAK
(S = 0.5 cm²)
T
(°C)
c
t
(s)
p
1E-3
1E-2
1E-1
1E+0
1E+1
1E+2
5E+2
0
25
50
75
100
125
DS2114
–
Rev 14
page 4/21
BTA08, BTB08, T810, T835, T850
Characteristics (curves)
Figure 6.
Surge peak on-state current versus number of
cycles
Figure 5.
On-state characteristics (maximum values)
I
(A)
TM
I
TSM
(A)
100
90
T max.
T =
T max.
j
j
j
V
= 0.85 V
= 50 mΩ
to
80
R
d
t = 16.66 ms
70
Non repetitive
One cycle
T
j
initial = 25 °C
60
50
40
30
20
10
0
10
T =
25 °C
j
Repetitive
T
C
= 110 °C
V
(V)
3.0
TM
1
Number of cycles
1000
0.5
1.0
1.5
2.0
2.5
3.5
4.0
4.5
5.0
1
10
100
Figure 7.
Non repetitive surge peak on-state current for a
sinusoidal pulse (t
p
< 10 ms)
Figure 8.
Relative variation of gate trigger current
I
,I ,I [T
] / I
,I ,I [T =
25 °C]
GT
GT
H
L
j
H L
j
I
(A)
TSM
2.5
2.0
1.5
1.0
0.5
0.0
1000
Holding current and latching current versus junction temperature (typical values)
I
GT
T
j
initial=25°C
dI/dt limitation:
50A/µs
I
TSM
360°
100
I
H
and I
L
α
T (°C)
j
t (ms)
p
10
0.01
-40
-20
0
20
40
60
80
100
120
140
0.10
1.00
10.00
Figure 9.
Relative variation of critical rate of decrease of
Figure 10.
Relative variation of critical rate of decrease of
main current versus (dV/dt)c (typical values)
main current versus (dV/dt)c (typical values)
(dl/dt)c [(dV/dt)c / specified (dl/dt)c
(dl/dt)c [(dV/dt)c] / specified (dl/dt)c
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Snubberless and logic level types
TW
Standard types
C
T835/T850/CW/SW/BW
T810/SW
B
(dV/dt)c (V/µs)
(dV/dt)c (V/µs)
0.1
1.0
10.0
100.0
0.1
1.0
10.0
100.0
DS2114
–
Rev 14
page 5/21
BTA08, BTB08, T810, T835, T850
Characteristics (curves)
Figure 11.
Relative variation of critical rate of decrease of
Figure 12.
DPAK and D2PAK thermal resistance junction
main current versus junction temperature
to ambient versus copper surface under tab
(dl/dt)c [T ] / [T
]
R (°C/W)
th(j-a)
j
j specified
6
5
4
3
2
100
90
80
70
60
50
40
30
20
10
0
Printed circuit board FR4, copper thickness: 35 µm
DPAK
D²PAK
1
T (°C)
j
S(cm²)
20
0
0
4
8
12
16
24
28
32
36
40
0
25
50
75
100
125
DS2114
–
Rev 14
page 6/21
BTA08, BTB08, T810, T835, T850
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions
DS2114
–
Rev 14
page 7/21
BTA08, BTB08, T810, T835, T850
DPAK package information
2.1
[Package name] package information
•
•
•
Epoxy meets UL94, V0
Lead-free package
Recommended torque: 0.4 to 0.6 N·m
Figure 13.
DPAK package outline
E
b4
c2
E1
A1
e
b
c
e1
L
DS2114
–
Rev 14
page 8/21
BTA08, BTB08, T810, T835, T850
DPAK package information
Table 6.
DPAK package mechanical data
Dimensions
Typ.
Ref.
Millimeters
Typ.
Min.
2.18
0.90
0.03
0.64
4.95
0.46
0.46
5.97
5.10
6.35
4.32
Max.
2.40
1.10
0.23
0.90
5.46
0.61
0.60
6.22
Min.
Max.
A
A1
A2
b
0.0858
0.0354
0.0012
0.0252
0.1949
0.0181
0.0181
0.2350
0.2008
0.2500
0.1701
0.0945
0.0433
0.0091
0.354
b4
c
0.2150
0.0240
0.0236
0.2449
c2
D
D1
E
6.73
0.2650
E1
e
2.29
4.57
0.0900
0.1800
e1
H
9.35
1.00
10.40
1.78
1.27
1.02
+8°
0.3681
0.0394
0.4094
0.0701
0.0500
0.0402
+8°
L
L2
L4
V2
0.60
0°
0.0236
0°
1. Dimensions
in inches are given for reference only
Note:
This package drawing may slightly differ from the physical package. However, all the specified dimensions are
guaranteed.
Figure 14.
DPAK recommended footprint (dimensions are in mm)
12.7
6.7
3.0
3.0
A
4.572
6.7
B
1.6
0.05
A
B
The device must be positioned within
DS2114
–
Rev 14
page 9/21
BTA08, BTB08, T810, T835, T850
IPAK package information
2.2
IPAK package information
Figure 15.
IPAK package outline
E
b4
A
c2
V1
L2
D
L
L1
H
A1
b2
b
e
B5
c
e1
Note:
This package drawing may slightly differ from the physical package. However, all the specified dimensions are
guaranteed.
DS2114
–
Rev 14
page 10/21
BTA08, BTB08, T810, T835, T850
IPAK package information
Table 7.
IPAK package mechanical data
Dimensions
Typ.
Ref.
Millimeters
Typ.
Min.
2.20
0.90
0.64
Max.
2.40
1.10
0.90
0.95
5.43
Min.
Max.
A
A1
b
0.0866
0.0354
0.0252
0.0945
0.0433
0.0354
0.0374
0.2138
b2
b4
B5
c
5.20
0.2047
0.30
0.0118
0.45
0.46
6.00
6.40
0.60
0.60
6.20
6.65
0.0177
0.0181
0.2362
0.2520
0.0236
0.0236
0.2441
0.2618
c2
D
E
e
2.28
0.0898
0.6339
e1
H
4.40
4.60
0.1732
0.1811
16.10
L
9.00
0.80
9.60
1.20
1.25
0.3545
0.0315
0.3780
0.0472
0.0492
L1
L2
V1
0.80
10°
0.0315
10°
1. Inch
dimensions are for reference only.
DS2114
–
Rev 14
page 11/21
BTA08, BTB08, T810, T835, T850
TO-220AB Insulated package information
2.3
TO-220AB Insulated package information
Figure 16.
TO-220AB Insulated package outline
C
B
b2
I
Resin gate 0.5 mm
max. protusion
(1)
L
F
A
I4
l3
l2
c2
a1
a2
M
c1
Resin gate 0.5 mm
max. protusion
(1)
b1
e
(1)Resin gate position accepted in one of the two positions or in the symmetrical opposites.
DS2114
–
Rev 14
page 12/21
BTA08, BTB08, T810, T835, T850
TO-220AB Insulated package information
Figure 17.
TO-220AB Insulated package outline
Table 8.
TO-220AB Insulated package mechanical data
Dimensions
Ref.
Millimeters
Typ.
Inches
Min.
Max.
Min.
Typ.
Max.
A
a1
a2
B
15.20
15.90
0.5984
0.6260
3.75
0.1476
13.00
10.00
0.61
1.23
4.40
0.49
2.40
2.40
6.20
3.73
2.65
1.14
1.14
15.80
14.00
10.40
0.88
1.32
4.60
0.70
2.72
2.70
6.60
3.88
2.95
1.70
1.70
16.80
0.5118
0.3937
0.0240
0.0484
0.1732
0.0193
0.0945
0.0945
0.2441
0.1469
0.1043
0.0449
0.0449
0.6220
0.5512
0.4094
0.0346
0.0520
0.1811
0.0276
0.1071
0.1063
0.2598
0.1528
0.1161
0.0669
0.0669
0.6614
b1
b2
C
c1
c2
e
F
I
L
I2
I3
I4
M
16.40
2.6
0.6457
0.1024
1. Inch
dimensions are for reference only.
DS2114
–
Rev 14
page 13/21
BTA08, BTB08, T810, T835, T850
D²PAK package information
2.4
D²PAK package information
Figure 18.
D²PAK package outline
A
E1
E2
E
c2
b2
Resin gate
0.5 mm max.
protrusion(1)
e
b
G
A1
A2
A3
R
Gauge Plane
(1) Resin gate position accepted in one of the two positions or in the symmetrical opposites
DS2114
–
Rev 14
page 14/21
BTA08, BTB08, T810, T835, T850
D²PAK package information
Table 9.
D²PAK package mechanical data
Dimensions
Ref.
Millimeters
Typ.
Inches
Typ.
Min.
4.30
2.49
0.03
Max.
4.60
2.69
0.23
Min.
Max.
A
A1
A2
A3
b
0.1693
0.0980
0.0012
0.1811
0.1059
0.0091
0.25
0.0098
0.70
1.25
0.45
1.21
8.95
7.50
1.30
2.54
10.00
8.30
6.85
4.88
15
0.93
1.7
0.0276
0.0492
0.0177
0.0476
0.3524
0.2953
0.0512
0.1
0.0366
0.0669
0.0236
0.0535
0.3681
0.3150
0.0669
b2
c
0.60
1.36
9.35
8.00
1.70
c2
D
D1
D2
e
E
10.28
8.70
7.25
5.28
15.85
2.28
1.40
1.75
0.3937
0.3268
0.2697
0.1921
0.5906
0.0701
0.0500
0.0551
0.4047
0.3425
0.2854
0.2079
0.6240
0.0898
0.0551
0.0689
E1
E2
G
H
L
1.78
1.27
1.40
L2
L3
R
0.40
0.0157
V2
0°
8°
0°
8°
1. Dimensions
in inches are given for reference only
DS2114
–
Rev 14
page 15/21
BTA08, BTB08, T810, T835, T850
D²PAK package information
Figure 19.
D²PAK recommended footprint (dimensions are in mm)
16.90
10.30
5.08
1.30
3.70
8.90
DS2114
–
Rev 14
page 16/21
BTA08, BTB08, T810, T835, T850
Ordering information
3
Ordering information
Figure 20.
Ordering information scheme (BTA08 and BTB08 series)
BT A
08 –
600 BW
(RG)
Triac
Insulation
A = Insulated
B = Non-insulated
Current
08 = 8A
Voltage
60
0
=
6
00 V
80
0
=
8
00 V
Sensitivity and type
B = 50 mA
BW = 50 mA Snubberless™
C = 25 mA standard
SW = 10 mA logic level
Packing mode
CW = 35 mA Snubberless™
TW = 5 mA logic level
RG = Tube
Figure 21.
Ordering information scheme (T8 series)
T
8 10
– 600
B (-TR)
Triac series
Current
08 = 8A
Sensitivity
10 = 10 mA
35 = 35 mA
50 = 50 mA
Voltage
60
0
=
6
00 V
80
0
=
8
00 V
Package
B = DPAK
H = IPAK
G = D²PAK
Packing mode
Blank =
Tube
TR =
T
a
pe and reel
DS2114
–
Rev 14
page 17/21
BTA08, BTB08, T810, T835, T850
Ordering information
Table 10.
Product selector
Voltage (xxx)
600 800
Part Number
Sensitivity
Type
Package
T810-xxxB
T835-xxxH
T810-xxxG
X
X
10 mA
35 mA
10 mA
Logic Level
Snubberless™
Logic Level
DPAK
IPAK
X
X
X
2
D PAK
2
T835-xxxG
X
X
35 mA
Snubberless™
D PAK
2
T850-xxxG
BTA08-xxxS
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
50 mA
10 mA
35 mA
50 mA
5 mA
Snubberless™
Logic Level
Standard
D PAK
TO-220AB Ins.
TO-220AB Ins.
TO-220AB Ins.
TO-220AB Ins.
TO-220AB Ins.
TO-220AB Ins.
TO-220AB Ins.
TO-220AB
BTA08-xxxC
BTA08-xxxB
X
Standard
BTA08-xxxTW
BTA08-xxxSW
BTA08-xxxCW
BTA08-xxxBW
BTB08-xxxS
BTB08-xxxC
BTB08-xxxB
BTB08-xxxTW
BTB08-xxxSW
BTB08-xxxCW
BTB08-xxxBW
Logic Level
Logic Level
Snubberless™
Snubberless™
Logic Level
Standard
10 mA
35 mA
50 mA
10 mA
35 mA
50 mA
5 mA
X
TO-220AB
Standard
TO-220AB
X
X
Logic Level
Logic Level
Snubberless™
Snubberless™
TO-220AB
10 mA
35 mA
50 mA
TO-220AB
TO-220AB
TO-220AB
DS2114
–
Rev 14
page 18/21
BTA08, BTB08, T810, T835, T850
Ordering information
Table 11.
Ordering information
Order code
T810-600B
Marking
T8 1060
Package
Weight
Base qty.
Delivery mode
T835-600B
T8 3560
75
Tube
T835-800B
T8 3580
T810-600B-TR
T810-800B-TR
T835-600B-TR
T835-800B-TR
T835-600H
T8 1060
DPAK
0.30
T8 1080
2500
75
T
a
pe&Reel 13″
Tube
T8 3560
T8 3580
T8 3560
IPAK
0.40
T835-600G
T835-600G
T835-8G
T835-8G
50
Tube
T850-6G
T850-6G
T850-8G
T850-8G
2
T810-600G-TR
T835-600G-TR
T835-8G-TR
T810-600G
T835-600G
T835-8G
1.50
D PAK
1000
T
a
pe&Reel 13″
T850-6G-TR
T850-6G
T850-8G-TR
T850-8G
BTA08-600SRG
BTA08-600BRG
BTA08-600CRG
BTA08-800CRG
BTA08-600BWRG
BTA08-600CWRG
BTA08-600SWRG
BTA08-600TWRG
BTA08-800BWRG
BTB08-600BRG
BTB08-600CRG
BTB08-600SRG
BTB08-600BWRG
BTB08-600CWRG
BTB08-600SWRG
BTB08-600TWRG
BTB08-800CWRG
BTB08-800TWRG
BTA08-600S
BTA08-600B
BTA08-600C
BTA08-800C
BTA08-600BW
BTA08-600CW
BTA08-600SW
BTA08-600TW
BTA08-800BW
BTB08-600B
BTB08-600C
BTB08-600S
BTB08-600BW
BTB08-600CW
BTB08-600SW
BTB08-600TW
BTB08-800CW
BTB08-800TW
TO-220AB Ins.
2.30
50
Tube
TO-220AB
DS2114
–
Rev 14
page 19/21
BTA08, BTB08, T810, T835, T850
Table 12.
Document revision history
Date
Revision
Changes
Apr-2002
5A
6
Last update.
13-Feb-2006
10-Mar-2010
02-Jun-2014
07-Nov-2016
TO-220AB delivery mode changed from bulk to tube. ECOPACK statement added.
Updated ECOPACK statement and Figure 26
7
8
Updated DPAK and IPAK package information and reformatted to current standard.
Updated
T
a
ble 1 and reformatted to current standard.
9
Updated Figure 20: “Ordering information scheme (T8 series)”,
T
a
ble 10: “Product selector” and
T
a
ble 11: “Ordering information”.
06-Jan-2017
09-Feb-2017
10
11
Added T850 package information.
Updated Figure 6..
24-Apr-2017
12
Minor text changes to improve readability.
logic level (3 quadrants), cover image, Figure 9. Relative variation of critical rate of decrease of
14-Mar-2018
14-May-2018
13
14
Updated product status links.
DS2114
–
Rev 14
page 20/21
BTA08, BTB08, T810, T835, T850
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of S
T
.
A
ll other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2018 STMicroelectronics – All rights reserved
DS2114
–
Rev 14
page 21/21
